TWM511110U - High frequency inductor - Google Patents

Description

High frequency inductor

The present invention relates to an inductor, and more particularly to a high frequency inductor.

Currently, inductors on the market are mainly classified into thin film, multilayer, and wire wound. A laminated inductor (not shown) disclosed in the TWI430300 certificate number invention patent (hereinafter referred to as the first case 1) of Taiwan, which comprises a plurality of insulating layers and a plurality of coil pattern layers, and the insulating layers and the coils The pattern layers are alternately stacked one on another, and the insulating layers and the coil pattern layers which are formed by stacking each other define a body and a coil of the laminated inductor, respectively.

In detail, the laminated inductor of the first embodiment 1 is correspondingly plated on each of the insulating layers; wherein each of the coil pattern layers plated on each of the insulating layers surrounds only the laminated inductor. 1+7/8 turns of one of the axes of the coil, and each of the coil pattern layers at its inner end and one of its outer ends still need to pass through the corresponding insulating layer at the inner end of each coil pattern layer Two through holes of the outer end portion and two inner wires filled in the through holes thereof, respectively, outside the inner end portion of the coil pattern layer on the insulating layer below and the coil pattern layer on the insulating layer above the insulating layer The end is turned on. In addition, in the production procedure of the insulating layer in which the coil pattern layer is plated, it is necessary to pass through three procedures of a coil pattern layer program, a through hole program, and a coil end conduction program. Change sentence In other words, when the number of turns required for the coil of the laminated inductor is up to 10 turns, the method of fabricating the laminated inductor needs to alternately stack up to six layers of the insulating layer coated with each coil pattern layer, and the total procedure There are also as many as eighteen. Therefore, the production process of the previous case 1 is rather cumbersome.

In order to further simplify the main body forming procedure of the laminated inductor, the Taiwan TW 201440090 A early publication invention patent case (hereinafter referred to as the previous case 2) is another laminated inductor 1 (see FIG. 1) disclosed and a manufacturing method thereof. (See Figures 2 to 7). The manufacturing method of the laminated inductor 1 includes the following steps: (A) sequentially laminating a first circuit ceramic mother substrate 110, a second circuit ceramic mother substrate 120, and a third circuit ceramic mother from bottom to top. a chip 130, and a fourth circuit ceramic mother chip 140 (shown in FIG. 2); (B) a surface coated with a carrier film 150 of an array of bonding pads 1501 facing the first circuit ceramic mother A first predetermined circuit pattern 1120 of the chip 110 is arranged in an array (as shown in FIG. 3); (C) an array of the pad electrode 1501 is transferred to the first predetermined circuit pattern 1120 on the first circuit ceramic mother substrate 110. Thereby forming an array of first circuit patterns 112 (as shown in FIG. 4); (D) stripping the carrier film 150 (as shown in FIG. 5); (E) sintering the circuit ceramic mother chips 110, 120, 130, 140 To form a collective substrate 100 (as shown in FIG. 6); and (F) to scribe the collective substrate 100 with a scribe 160, the collective substrate 100 is divided into a plurality of laminated bodies 10, and The array of first circuit patterns 112 in the collective substrate 100 is divided into a plurality of first circuit patterns 112 and constitutes a laminated inductor 1 as shown in FIG.

As shown in FIG. 1, the laminated inductor 1 delineated by the step (F) is sequentially included from bottom to top: a first circuit ceramic piece 11, a first A two-circuit ceramic piece 12, a third circuit ceramic piece 13, and a fourth circuit ceramic piece 14. The first circuit ceramic piece 11 has a non-magnetic body 111 and a first circuit pattern 112 disposed in the non-magnetic body 111 of the first circuit ceramic piece 11. The second circuit ceramic piece 12 and the third circuit ceramic piece 13 respectively have a magnetic body 121, 131, and a second circuit pattern 122 and a third circuit pattern 132 respectively disposed in the magnetic bodies 121, 131 thereof. The fourth circuit ceramic piece 14 has a non-magnetic body 141 and a fourth circuit pattern 142 disposed in the non-magnetic body 141 of the fourth circuit ceramic piece 14.

The laminated inductor 1 is formed by using the circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14 to form an inner winding type coil. However, in detail, before performing this step (A), a plurality of ceramic mother sheets (not shown) are sequentially formed to form a plurality of through holes for each ceramic mother sheet, and are filled in the respective through holes. The conductive paste is used to form a plurality of conductive conductors, and a conductive paste is applied on each of the ceramic mother sheets to form a plurality of circuits such as circuit patterns 112, 122, 132, and 142, so that the circuit ceramic mother sheets 110, 120, and 130 can be obtained. 140. Further, the appearance surface of the laminated body 10 of each laminated inductor 1 can be obtained after the sintering process of the step (E) and the drawing of the step (F) are performed.

In the case of the process surface, the coils constituting the inner winding type are subjected to four through-hole programs, four-way filling conductive paste programs, and four coated conductive pastes to form respective circuit patterns 112, 122, 132, and 142. The program, together with a step (E) of the sintering process and other 13 procedures, the procedure of the previous case 2 is slightly simplified compared to the previous case 1; however, the total procedure of the previous case 2 is as many as thirteen, quite cumbersome, The time cost associated with manufacturing is increased. Practical application In other words, since the laminated body 10 is obtained by stacking and sintering the circuit ceramic mother chips 110, 120, 130, and 140, the volume of the laminated inductor 1 is also increased, which is unfavorable. Arrange to the layout on the board. In addition, since the inner wound coil is composed of circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14, the circuit patterns 112, 122, 132, and 142 are different. Continuous interfaces tend to produce non-ohmic contacts or increase impedance to create additional Joule-heating, which is detrimental to the operation of the inductor.

It can be seen from the above description that simplifying the manufacturing method of the inductor to reduce the manufacturing cost and solving the problem that the impedance of the inductor is too high is a problem to be solved by those skilled in the technical field.

Therefore, the object of the present invention is to provide a high frequency inductor.

Thus, the novel high frequency inductor comprises: a body and a first coil. The body has a contoured surface, and the contoured surface of the body includes a first side edge and a second side edge disposed oppositely. The body is composed of a non-magnetic material and is unity. The first coil is disposed on the body and includes a plurality of top segments, a plurality of vertical segments, and a plurality of bottom segments. The top segments, the longitudinal segments, and the bottom segments are spaced apart from each other along a first direction from the first side edge of the body toward the second side edge. The top segment and the bottom segment are respectively disposed on a top surface region and a bottom surface region of the contour surface of the main body, and each of the top segments is opposite to the opposite end edges of the two longitudinal portions adjacent thereto One direction is electrically connected to each bottom segment in sequence.

The novel effect of the present invention is that the novel high-frequency inductor and the mass production method thereof are that the substrate is directly etched to form a main body having a high structural strength and an integral structure, and each of the first surfaces is formed on each of the contour surfaces of the main body. a precursor layer for further plating each of the first coils on each of the first precursor layers on each of the contoured faces in a three-dimensional state, the structural strength is high and there is no non-ohmic contact or The problem of increasing the impedance and generating the electrothermal effect reduces the time cost due to the simplification of the production process in terms of the process surface and the cost.

2‧‧‧High Frequency Inductors

20‧‧‧Substrate

200‧‧‧Base

201‧‧‧ upper surface

202‧‧‧lower surface

203‧‧‧ contour surface

204‧‧‧First side edge

205‧‧‧second side edge

21‧‧‧ Subject

210‧‧‧ contour surface

2101‧‧‧Top area

2102‧‧‧Bottom area

2103‧‧‧Left area

2104‧‧‧ right side area

2105‧‧‧ front area

2106‧‧‧Back area

211‧‧‧ first side edge

212‧‧‧Second side edge

213‧‧‧ trench

214‧‧‧Perforation

22‧‧‧Connecting Department

220‧‧‧ contour surface

221‧‧‧ first end

222‧‧‧ second end

2221‧‧‧ Groove

23‧‧‧First coil

231‧‧‧Top section

232‧‧‧Longitudinal section

233‧‧‧ bottom section

24‧‧‧Insulation

25‧‧‧second coil

3‧‧‧First photoresist layer

31‧‧‧Prescribed pattern

310‧‧‧ appearance shape

311‧‧‧Base section

312‧‧ ‧Bridge

3121‧‧ ‧ gap

313‧‧‧ Body Department

3131‧‧ ‧ gap

3132‧‧‧ hole

4‧‧‧First precursor layer

41‧‧‧Local area

5‧‧‧Second photoresist layer

51‧‧‧Line pattern area

6‧‧‧First metal layer

7‧‧‧Second precursor layer

71‧‧‧Local area

8‧‧‧ Third photoresist layer

81‧‧‧Line pattern area

9‧‧‧Second metal layer

X‧‧‧ first direction

Y‧‧‧second direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an exploded perspective view showing a layer disclosed by the Taiwan Patent Publication No. TW 201440090 A. Figure 2 is a cross-sectional view showing a step (A) of the method of manufacturing the laminated inductor; Figure 3 is a cross-sectional view showing a step (B) of the method of manufacturing the laminated inductor; 4 is a cross-sectional view showing a step (C) of the method of manufacturing the laminated inductor; FIG. 5 is a cross-sectional view showing a step (D) of the method of manufacturing the laminated inductor; A cross-sectional view illustrating a step (E) of the method of manufacturing the laminated inductor; and FIG. 7 is a cross-sectional view showing a method of manufacturing the laminated inductor Step (F); Fig. 8 is a perspective view showing a first embodiment of the novel high frequency inductor; Fig. 9 is a perspective view showing a second embodiment of the novel high frequency inductor; Fig. 10 is A three-dimensional diagram illustrating a third embodiment of the novel high frequency inductor; FIG. 11 is a perspective view showing a fourth embodiment of the novel high frequency inductor; and FIG. 12 is a line XII- along FIG. FIG. 13 is a top plan view showing one step (a) of the first mass production method of the novel high frequency inductor; FIG. 14 is a line taken along the line XIV-XIV of FIG. Figure 15 is a top plan view showing one step (b) of the first mass production method; Figure 16 is a cross-sectional view taken along line XVI-XVI of Figure 15; Figure 17 is a top view Schematic diagram showing a first step (c) of the first mass production method; FIG. 18 is a perspective view showing a step (d) of the first mass production method; FIG. 19 is a perspective view showing the first mass production One step of the method (e); FIG. 20 is a perspective view showing a step (f) of the first mass production method; FIG. 21 is a perspective view showing a step (h) of the first mass production method; FIG. 23 is a top plan view showing one step (a) of the second mass production method of the novel high frequency inductor; FIG. 24 is a top view Schematic diagram showing one step (a) of the third mass production method of the novel high frequency inductor; FIG. 25 is a perspective view showing one step (i1) of the fourth mass production method of the novel high frequency inductor Figure 26 is a perspective view showing a step (i2) of the fourth mass production method; Figure 27 is a perspective view showing a step (i3) of the fourth mass production method; Figure 28 is a perspective view, A step (i4) of the fourth mass production method will be described.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 8, a first embodiment of the novel high frequency inductor 2 includes a main body 21 and a first coil 23.

The body 21 has a contoured surface 210. The contoured surface 210 of the body 21 includes a first side edge 211 and a second side edge 212 disposed oppositely. The main body 21 is made of a non-magnetic material and is integrated.

The first coil 23 is disposed on the main body 21 and includes a plurality of top sections 231, a plurality of vertical sections 232, and a plurality of bottom sections 233. The top section 231, the longitudinal sections 232 and the bottom sections 233 are spaced apart from each other along a first direction X from the first side edge 211 of the body 21 toward the second side edge 212. The top section 231 and the bottom sections 233 are respectively disposed on one of the top surface area 2101 and the bottom surface area 2102 of the contour surface 210 of the main body 21, and each of the top sections 231 is through two adjacent vertical sections 232. The opposite end edges are electrically connected to the respective bottom segments 233 in the first direction X.

More specifically, in the first embodiment of the present invention, the contour surface 210 of the main body 21 is the top surface area 2101, the bottom surface area 2102, and the left side area of the main body 21 as shown in FIG. 2103, a right side area 2104, a front area 2105 and a back area 2106 are defined together. Moreover, in the first embodiment of the present invention, the top segments 231, the vertical segments 232, and the bottom segments 233 of the first coil 23 are as shown in FIG. The direction clips extend in an extending direction of less than or equal to 90 degrees, and the longitudinal sections 232 of the first coil 23 are respectively disposed in the front area 2105 and the back area 2106; that is, the novel high frequency inductor The first coil 23 of the first embodiment is an outer wound coil. Further, the main body 21 is composed of the non-magnetic material so that the body 21 of the first embodiment has an integral structure. Preferably, the non-magnetic material is selected from a bismuth-based material or a metal material. More preferably, the ruthenium-based material may be quartz, silicon wafer, tantalum carbide (SiC) or tantalum nitride (Si ₃ N ₄ ). As can be seen from the above description, the main body 21 is integrated, so that the overall structure strength of the main body 21 of the high-frequency inductor 2 is high, unlike the laminated inductor 1 shown in FIG. 1, in the circuit ceramic sheets 11 There is a problem of insufficient strength between adjacent interfaces of 12, 13, and 14. In addition, the first coil 23 is also an integrated structure, and does not generate non-ohmic contact between the circuit patterns 112, 122, 132, and 142 as shown in FIG. 1 due to a discontinuous interface, or increases impedance to generate Additional electrothermal effects.

The above detailed description of the first embodiment of the present invention is integrated. Briefly, the present invention is defined as an integral structure as described above. In addition, the so-called integral structure means that the main body 21 is formed by etching a bulk matter, so that the main body 21 has high structural strength and there is no problem of interlayer peeling inside. The block may be a plate-like block such as a quartz wafer.

It should be added here that the novel high-frequency inductor 2 is mainly mass-produced through a micro-electromechanical system (MEMS) process; therefore, the main body 21 of the high-frequency inductor 2 of the novel MEMS process is completed. An apparent size is between 0.2 mm x 0.1 mm x 0.1 mm to 0.6 mm x 0.3 mm x 0.3 mm. Preferably, the apparent size is between 0.2 mm x 0.1 mm x 0.1 mm to 0.4 mm x 0.2 mm x 0.2 mm. The related mass production method of the novel high-frequency inductor 2 will be described later.

Referring to FIG. 9, a second embodiment of the present high frequency inductor 2 is substantially the same as the first embodiment except that the main body 21 There are also two rows of grooves 213 defined in the front region 2105 and the back region 2106 of the contoured surface 210 of the body 21. Each row of grooves 213 are spaced apart from each other along the first direction X, and extend from the top surface area 2101 of the contour surface 210 of the main body 21 to the bottom surface area 2102, and the two rows of grooves 213 are respectively from the main body The front area 2105 of the contoured surface 210 of 21 is recessed toward the back side area 2106. The longitudinal sections 232 of the first coil 23 are received in the respective grooves 213; that is, the first coil 23 of the second embodiment of the novel high frequency inductor is also an outer wound coil.

Referring to Figure 10, a third embodiment of the present high frequency inductor 2 is substantially identical to the first embodiment except that the body 21 also has two rows of perforations 214. Each row of perforations 214 are spaced apart from each other along the first direction X. The perforations 214 are the top surface region 2101 and the bottom surface region 2102 that extend through the contoured surface 210 of the body 21, respectively. The longitudinal sections 232 of the first coil 23 are received in the respective through holes 214; that is, the first coil 23 of the third embodiment of the novel high frequency inductor is an inner wound coil.

Referring to FIG. 11 and FIG. 12, a fourth embodiment of the present high frequency inductor 2 is substantially the same as the first embodiment, except that the fourth embodiment further includes an insulating layer 24 and a first Two coils 25. The insulating layer 24 covers the contour surface 210 of the body 21 and the first coil 23. The second coil 25 is disposed on the insulating layer 24 to surround the top surface area 2101, the bottom surface area 2102, the front surface area 2105 and the back surface area 2106 of the contour surface 210 of the main body 21, so that the second coil 25 A coil 23 and the second coil 25 together form a structure of a concentric coil winding. In FIG. 12, two layers of coils 23 and 25 are taken as an example, but To this end, the insulating layer and the coil may be alternately plated to form a structure of the common core multilayer coil according to the practical application surface.

In detail, the first coil 23 of each embodiment of the novel high frequency inductor 2 and the second coil 25 of the fourth embodiment are formed by electroplating or electroless plating. Therefore, the novel high frequency inductor 2 further includes a first precursor layer 4 (not shown) disposed under the first coil 23 and a second precursor layer 7 disposed under the second coil 25 ( The figure is not shown), and the detailed manufacturing method will be explained later.

Referring to FIG. 13 to FIG. 22, a first mass production method of the novel high frequency inductor 2 is a MEMS process for fabricating the high frequency inductor 2 of the first embodiment shown in FIG. A step (a), a step (b), a step (c), a step (d), a step (e), a step (f), a step (h) and a step (g).

Referring to FIG. 13 and FIG. 14, the step (a) is to form a first photoresist layer 3 having a predetermined pattern 31 on an upper surface 201 and a lower surface 202 of a substrate 20. Each of the predetermined patterns 31 has an array covering the upper surface 201 and the lower surface 202 of the substrate 20, each array having a plurality of external shapes 310, and each of the external shapes 310 sequentially has a base portion connected to each other along the first direction X. 311, two bridges 312 and a body portion 313. The body portion 313 of the external shape 310 is spaced apart from each other along the first direction X or a second direction Y that is a predetermined angle with the first direction X, and the base portion 311 of the external shape 310 is along The first direction X or the second direction Y are connected to each other.

In the first mass production method, the substrate 20 is made of the non-magnetic The predetermined angle is exemplified by 90 degrees, but is not limited thereto; the external shape 310 of each first photoresist layer 3 is as shown in FIG. 13 along the first direction X. Arranging at intervals, and the appearance shapes 310 of the predetermined patterns 31 of the first photoresist layers 3 are vertically aligned with each other; the body portions 313 of the external shape 310 are spaced apart from each other along the second direction Y, and the like The base portions 311 of the outer shape 310 are connected to each other along the second direction Y; a width of the bridge portions 312 of the outer shape shapes 310 is decreased along the first direction X, and the bridge portions 312 of the outer shape shapes 310 are The second direction Y is spaced apart from each other; the bridge portions 312 of the respective outer shape 310 of the first photoresist layer 3 formed on the upper surface 201 and the lower surface 202 of the substrate 20 are formed with a gap adjacent to the body portion 313 thereof. 3121, and each of the notches 3121 is recessed from the peripheral edge of the bridge portion 312 in the second direction Y such that the bridge portions 312 and the body portions 313 are disconnected from each other.

Referring to FIG. 15 and FIG. 16, the step (b) is to etch the substrate 20 so that the substrate 20 exposed outside the array of the predetermined patterns 31 of the first photoresist layers 3 is removed and formed. The plurality of susceptors 200, the plurality of connection portions 22 connected to the susceptors 200, and the plurality of main bodies 21 as shown in FIG. Each of the susceptor 200 and each of the connecting portions 22 has a contoured surface 203, 220. The contoured surface 203 of each of the pedestals 200 includes a first side edge 204 and a second side edge 205 which are oppositely disposed, and the contoured surface 220 of each connecting portion 22 includes a first end 221 and a second end 222 which are oppositely disposed. . The first end 221 and the second end 222 of each connecting portion 22 are respectively connected to the second side edge 205 of each base 200 and the first side edge 211 of each main body 21 to make the contour surface 220 of each connecting portion 22 Corresponding to the contour surface 210 of each body 21 And a contoured surface 203 of each base 200. In addition, the second end 222 of each connecting portion 22 of the step (b) is formed with two recesses 2221, one of the two recesses 2221 of each connecting portion 22 (see the recess 2221 shown in FIG. 16). Is extending from a top surface area of one of the contour faces 220 toward a bottom surface area thereof, and the other of the two grooves 2221 of each connecting portion 22 (see the lower groove 2221 shown in FIG. 16) is from The bottom surface region of the contoured surface 220 extends toward the top surface region thereof, and the two grooves 2221 of the respective connecting portions 22 are recessed from the contour surface 220 thereof in the second direction Y.

It should be noted that the first mass production method is described by taking the notch 3121 of the outer shape 310 of the two first photoresist layers 3 as an example, but is not limited thereto. When the first mass production method is that the bridging portion 312 of the outer shape 310 of one of the two first photoresist layers 3 has the notch 3121, the second end of each connecting portion 22 of the step (b) can be made. 222 is formed with only one single groove 2221, and the groove 2221 of each connecting portion 22 of the step (b) is one of the top surface area and the bottom surface area of the contour surface 220 thereof, toward the contour surface 220 thereof. The other of the top and bottom regions extends.

It should be noted here that when the non-magnetic material constituting the substrate 20 is selected from the material mainly composed of ruthenium, in order to further enhance the protective effect during etching, the novel mass production method further includes one step at the step ( a) Previous step (a'). The step (a') is to form a metal protective layer (not shown) on at least the upper surface 201 or the lower surface 202 of the substrate 20, and the photoresist layer 3 of the step (a) is formed on the metal protective layer. on. In the first mass production method, the step (a') is on the upper surface 201 and the lower surface 202 of the substrate 20. The metal protective layer (not shown) is formed on the upper surface, and each photoresist layer 3 of the step (a) is formed on each metal protective layer (not shown).

Referring again to FIG. 16 and referring to FIG. 17, the step (c) is to remove the first photoresist layers 3. In detail, after removing the first photoresist layers 3, the first mass production method forms an array of susceptors 200, an array of connecting portions 22, and an array of main bodies 21 as shown in FIG. The susceptors 200 are connected to each other along the second direction Y, and the bodies 21 are spaced apart from each other along the second direction Y.

Referring to FIG. 18, the step (d) is to form a first precursor layer 4 on the contour surface 210 of each body 21 (FIG. 18 only shows a main body 21 and a first precursor layer 4 as an example). Description).

Referring to FIG. 19, the step (e) is to form a second photoresist layer 5 on the first precursor layer 4, and the second photoresist layer 5 has a plurality of corresponding first precursor layers 4 exposed. A line pattern area 51 of a partial area 41. Similarly, FIG. 19 also shows a partial region 41 of the first precursor layer 4 and a line pattern region 51 of the second photoresist layer 5 as an example.

Referring to FIG. 19 and referring to FIG. 20, the step (f) is: plating a first metal layer 6 on each of the first precursor layers 4 to form on the partial region 41 of each of the first precursor layers 4. A first coil 23 as shown in FIG. Similarly, FIG. 19 and FIG. 20 also show only a first precursor layer 4 and a first metal layer 6 as an example. It should be further noted that, if the non-magnetic material is the metal material; for example, copper (Cu), before the step of forming the first precursor layer 4 of the step (d), it is necessary to plate the main body 21 in advance. An electrical insulator is applied to prevent the first step formed by the step (f) The coil 23 has a problem of short-circuiting due to direct contact with the metal material.

Preferably, each of the first precursor layers 4 of the step (d) is an active material layer containing a catalytic metal source such as platinum (Pt), palladium (Pd), gold (Au), silver (Ag) or copper. (active layer), or a conductive seed layer containing chromium (Cr), nickel (Ni), titanium (Ti), tungsten (W) or molybdenum (Mo). It should be noted that when each of the first precursor layers 4 of the step (d) is a conductive seed layer, each of the first metal layers 6 of the step (f) is formed by electroplating. The partial region 41 of the precursor layer 4; when each of the first precursor layers 4 of the step (d) is the active material layer, each of the first metal layers 6 of the step (f) is formed by electroless plating The partial region 41 of each of the first precursor layers 4 is on. In the first mass production method, each of the first precursor layers 4 of the step (d) is the conductive seed layer, and the step (f) is electroplating to the portion of each of the first precursor layers 4. Each of the first coils 23 is formed on the region 41.

It should be further explained that in order to enable the novel high-frequency inductor 2 to pass through a surface-mount technology (SMT) followed by a circuit board (not shown), after the step (f), A step (j1), a step (j2), and a step (j3) may be included. In the step (j1), a precursor layer (not shown) is formed on each of the first coils 23 and the main bodies 21. The step (j2) is to form a photoresist layer (not shown) on the precursor layers of the step (j1), and the photoresist layer of the step (j2) has a plurality of opposite electrode pattern regions (not shown). Show). The opposite end electrode pattern regions are respectively located on the left side surface area 2103 and the right side surface area 2104 of each main body 21 to partially expose the left side surface area 2103 and the right side surface area 2014 of each main body 21. In the step (j3), a metal layer is plated on each of the precursor layers to form respective opposite electrodes (not shown) on the respective precursor layers.

Referring to FIG. 21 and referring to FIG. 19 and FIG. 20, the step (h) is to remove the second photoresist layer 5 and each of the first precursor layers 4 by the second photoresist layer 5. A remaining area is covered so that each of the first coils 23 is left on each body 21. It is worth mentioning that, in order to protect the first coil 23 from being short-circuited or broken by external factors, an insulating protective layer (not shown) may be formed on each body 21 after completing step (h). Each of the first coils 23 is on.

Referring to FIG. 22, the step (g) is to apply an external force from the top to the bottom or from the bottom to the top of the connecting portion 22, so that the second end 222 of each connecting portion 22 is from the first side of each main body 21. The edge 211 is broken, so that the main bodies 21 are detached from the respective connecting portions 22 to produce the high-frequency inductor 2 as shown in FIG. In the first mass production method of the present invention, the step (h) is completed before the step (g) as an example, but the step (h) may also be performed after the step (g), and This is limited to this. According to the detailed description of the mass production method, the notch 3121 located at the bridging portion 312 of the outer shape 310 of each of the first photoresist layers 3 is used to form the substrate 20 after performing the etching in the step (b). The groove 2221 of each connecting portion 22 as shown in FIG. 17 is shown in the groove 2221 in FIG. 17, and the purpose is to enable the mass production method to be beneficial to the external force when performing the step (g). Breaking to achieve the effect of mass production. It should be noted that each of the grooves 2221 may be formed on each of the connecting portions 22 by scribe or etching after forming the connecting portions 22 in the step (b).

The second mass production method of the novel high frequency inductor 2 is a high frequency inductor 2 of the second embodiment shown in FIG. 9 by a MEMS process, and the mass production method is substantially the same as the first a mass production method, different The main body portion 31 of each appearance shape 310 of each of the first photoresist layers 3 has two rows of notches 3131 disposed on one of the peripheral edges of the main body portion 313, and the main body portions 313 are disposed. The two rows of notches 3131 are recessed from the periphery of the body portion 313. Therefore, in the second mass production method of the present invention, after the etching step of the step (b) is performed, the two rows of notches 3131 of the main body portions 31 of the first photoresist layers 3 can form the corresponding bodies 21 The two rows of trenches 213 are as shown in FIG. 9, so that each of the first precursor layers 4 formed in the step (d) can also cover the two rows of trenches 213, and after the step (f) is implemented Each of the formed first coils 23 is in the outer wound coil.

The third mass production method of the novel high-frequency inductor 2 is a MEMS process to produce the high-frequency inductor 2 of the third embodiment shown in FIG. 10, and the mass production method is substantially the same as the first A mass production method is different in that, as shown in FIG. 24, the main body portion 311 of each appearance shape 310 of each first photoresist layer 3 has two rows of holes 3132 defined in the main body portion 313, and the main body portions. The two rows of holes 3132 of 313 are spaced apart from each other along the first direction X. Therefore, the third mass production method of the present invention, after the etching step of the step (b) is performed, the two rows of holes 3132 of the main body portions 31 of the first photoresist layers 3 can form the respective bodies 21 correspondingly. The two rows of perforations 214 are as shown in FIG. 10, so that each of the first precursor layers 4 formed in the step (d) can also cover two rows of inner annulus defining the two rows of perforations 214, and Each of the first coils 23 formed after the completion of the step (f) is in the inner wound coil.

Referring to FIG. 25 to FIG. 28, a fourth mass production method of the novel high frequency inductor 2 is a MEMS process for producing the high frequency inductor 2 of the fourth embodiment shown in FIGS. 11 and 12. The mass production method is roughly the same as The first mass production method is different in that, after the step (h), a step (i1), a step (i2), a step (i3), and a step (i4) are sequentially included.

Referring to FIG. 25, the step (i1) is to form an insulating layer 24 on the contour surface 210 of each main body 21 and each of the first coils 23. Referring to FIG. 26, the step (i2) is to form a second precursor layer 7 on each of the insulating layers 24. Referring to FIG. 27, the step (i3) is to form a third photoresist layer 8 on the second precursor layer 7, and the third photoresist layer 8 has a plurality of corresponding bare exposed second precursor layers 7. A line pattern area 81 of a partial area 71. Referring to FIG. 27 and referring to FIG. 28, the step (i4) is: plating a second metal layer 9 on each of the second precursor layers 7 to form on the partial region 71 of each of the second precursor layers 7. A second coil 25 is obtained to obtain a structure of a double layer coil as shown in Figs. Finally, a remaining area of the third photoresist layer 8 and each of the second precursor layers 7 covered by the line pattern regions 81 of the third photoresist layer 8 is removed, thereby remaining on each of the insulating layers 24. Next, each of the second coils 25 can obtain the high frequency inductor 2 as shown in FIGS. 11 and 12. It should be noted that FIGS. 25-28 only show the contour surface 210 of a single body 21, a single second precursor layer 7, and a single line pattern area 81 of the second photoresist layer 8, and a single one. The second metal layer 9 is exemplified. In the fourth mass production method of the present invention, the implementation of the step (i2) and the step (i4) is a comparison with the first mass production method, and details are not described herein again.

According to the detailed description of the mass production methods of the above-mentioned high-frequency inductor 2, the present invention only needs to pass through the six steps of the steps (a) to (f) to form an outer winding or an inner winding type. First coil 23. No need to As in the previous case 2, it is necessary to go through four passes of the through hole program, four ways to fill the conductive paste program, and four coats of conductive paste to form the circuit patterns 112, 122, 132, and 142, and a step ( E) The sintering process and other 13 procedures can be used to form the inner wound coil. In terms of the process surface, the new mass production method program is simplified; in terms of cost, the new mass production method can reduce the time cost required for the process due to the simplification of the program.

Furthermore, the high frequency inductor 2 of each of the present embodiments is formed by the step (b) of the mass production method directly from the substrate 20 through the MEMS process to form the body 21 of each of the high frequency inductors 2. Specifically, each of the main bodies 21 has an integral structure, so that the overall structure strength of the main body 21 of each of the high-frequency inductors 2 is high, unlike the laminated inductor 1 shown in FIG. 1, in the circuit ceramic sheets 11, There is a problem of insufficient strength between adjacent interfaces of 12, 13, and 14. In addition, the first coil 23 and the second coil 25 of the high frequency inductor 2 of the embodiments of the present invention are also integrated, and do not overlap between the circuit patterns 112, 122, 132, and 142 as shown in FIG. Non-ohmic contacts due to discontinuous interfaces, or increased impedance to create additional electrothermal effects.

In summary, the high-frequency inductor 2 of the present invention directly etches the substrate 20 through a MEMS process to pre-form each body 21 having a high structural strength and an integral structure, and is formed on the contour surface 210 of each body 21. Each of the first precursor layers 4 further electroplates or electrolessly electroplats the first coils 23 of the outer or inner windings on the first precursor layers 4 on the contoured surfaces 210 in a three-dimensional state. As far as the performance of the inductor is concerned, the structural strength is high and the problem of overheating is not easy to occur. In terms of the process surface and the cost side, the time cost is reduced due to the simplification of the production process, so the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still It is within the scope of this new patent.

2‧‧‧High Frequency Inductors

21‧‧‧ Subject

210‧‧‧ contour surface

2101‧‧‧Top area

2102‧‧‧Bottom area

2103‧‧‧Left area

2104‧‧‧ right side area

2105‧‧‧ front area

2106‧‧‧Back area

211‧‧‧ first side edge

212‧‧‧Second side edge

23‧‧‧First coil

231‧‧‧Top section

232‧‧‧Longitudinal section

233‧‧‧ bottom section

X‧‧‧ first direction

Claims (5)

A high frequency inductor comprising: a body having a contoured surface, the contoured surface of the body comprising a first side edge and a second side edge disposed oppositely, the body being composed of a non-magnetic material and And a first coil disposed on the body and including a plurality of top segments, a plurality of vertical segments, and a plurality of bottom segments, the top segments, the vertical segments, and the bottom segments being along the body The first side edges are spaced apart from each other in a first direction of the second side edge, and the top and the bottom segments are respectively disposed on a top surface area and a bottom surface area of the contour surface of the main body, and each The top section is electrically connected to each of the bottom sections in the first direction through the opposite end edges of the two adjacent longitudinal sections. The high frequency inductor according to claim 1, wherein the main body further has two rows of grooves disposed on a front surface and a back surface of the contour surface of the main body, and each of the rows of grooves is along the first direction Arranging from each other, and extending from the top surface area of the contour surface of the main body to the bottom surface area, and the two rows of grooves are respectively recessed from the front surface of the contour surface of the main body and the back surface area, the first The longitudinal sections of the coil are received in the respective grooves. The high frequency inductor of claim 1, wherein the body further has two rows of perforations, the rows of perforations being spaced apart from each other along the first direction, the perforations being respectively penetrating the top surface of the contour surface of the body a region and the bottom surface region, and each longitudinal segment of the first coil is received in each of the perforations. The high frequency inductor according to claim 1, further comprising an insulating layer and a second coil, the insulating layer covering the contour surface of the body and the first coil The second coil is disposed on the insulating layer to surround the top surface area, the bottom surface area, a front area and a back surface area of the contour surface of the main body. The high frequency inductor of any one of claims 1 to 4, wherein the non-magnetic material is selected from the group consisting of a bismuth-based material or a metal material.