CN112020226A - Manufacturing method of PCB semi-slotted hole - Google Patents
Manufacturing method of PCB semi-slotted hole Download PDFInfo
- Publication number
- CN112020226A CN112020226A CN202010861034.5A CN202010861034A CN112020226A CN 112020226 A CN112020226 A CN 112020226A CN 202010861034 A CN202010861034 A CN 202010861034A CN 112020226 A CN112020226 A CN 112020226A
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- positioning
- optical
- pcb
- manufacturing
- pcs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention relates to a manufacturing method of a semi-slot hole of a PCB (printed circuit board), wherein the PCB comprises a SET (single event processing) large board, a plurality of PCS (personal communications systems) small boards are arranged in the SET large board, the manufacturing method comprises PCB positioning manufacturing and semi-slot hole routing manufacturing, the PCB positioning manufacturing comprises the steps of respectively positioning the SET large board and positioning each PCS small board, and the PCB positioning manufacturing is completed in a mode of respectively positioning the SET large board and the PCS small boards; and after the PCB is positioned, routing a half slot hole by using an optical routing machine to finish the manufacture of the half slot hole. The manufacturing method of the PCB semi-slotted hole has the advantages of solving the technical problem of inconsistent size of the semi-slotted hole, improving the yield of products and the like.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a PCB semi-slotted hole.
Background
Along with the continuous development of electronic product, the requirement to half hole of PCB board is higher and higher, among the prior art, to half slot hole preparation on the PCB board, the mode preparation of thick gong with the smart gong of general shaping adoption, half slot hole of this mode preparation has half hole size to be inconsistent, and such anomaly just appears easily like having the board of a plurality of pcs in a board, and the main reason is because factor influence such as big board harmomegathus.
Disclosure of Invention
Therefore, the applicant provides a manufacturing method of the PCB semi-slot hole, which solves the technical problem of inconsistent size of the semi-slot hole and improves the product yield.
In order to achieve the above purpose, the following technical solutions are provided.
A manufacturing method of a semi-slot hole of a PCB (printed circuit board), wherein the PCB comprises a SET (single event processing) large board, a plurality of PCS (personal communications systems) small boards are arranged in the SET large board, the manufacturing method comprises PCB positioning manufacturing and semi-slot hole routing manufacturing, the PCB positioning manufacturing comprises the steps of respectively positioning the SET large board and positioning each PCS small board, and the positioning manufacturing of the PCB is completed in a mode of respectively positioning the SET large board and the PCS small boards; and after the PCB is positioned, routing a half slot hole by using an optical routing machine to finish the manufacture of the half slot hole. According to the manufacturing method of the PCB semi-slot, the SET large board and each PCS small board of the PCB are respectively positioned, and then the optical routing machine is used for routing the semi-slot, so that the problem that the semi-slot is inconsistent in size due to factors such as expansion and shrinkage of the large board during manufacturing of the traditional semi-slot is effectively solved, namely the semi-slot is large on one side and small on the other side, the product yield is effectively improved, scrappage is reduced, the manufacturing cost is further reduced, and the problems of customer complaints and compensation caused by hidden troubles of product quality are solved.
Furthermore, the positioning of the SET large plate is realized by arranging a mechanical positioning hole at the plate edge of the SET large plate and positioning the SET large plate on the machine table in a mechanical positioning mode. And a mechanical positioning hole is arranged at the edge of the SET large plate and used for positioning the SET large plate on a milling machine table.
Furthermore, the PCB small plates are positioned by arranging optical positioning points at the plate edges of each PCS small plate and adopting an optical routing machine to route half-slots after grabbing the optical positioning points on each PCS small plate, so that the independent positioning of the PCB small plates is realized. SET up the optics setpoint at the flange of PCS platelet, the setting of optics setpoint, it is in the same place to combine with optics gong machine, make optics gong machine advance before the gong board and snatch the optics setpoint pair PCS platelet on the PCS platelet and fix a position the back, carry out the gong board again, it is accurate effectively to ensure PCS platelet location, especially ensure not receive the influence of the big board harmomegathus of SET in the preparation process PCS platelet, and then promote the gong hole precision of half slotted hole, make the size of half slotted hole unanimous, effectively solve the technical problem that half slotted hole size is inconsistent among the prior art.
Furthermore, the optical positioning points are four optical positioning points additionally arranged at four corners of the PCS small plate when the line engineering data is manufactured. The optical positioning points are designed when the line engineering data are manufactured, the design of the optical positioning points is completed under the condition that the design data are not increased, and the manufacturing efficiency is effectively improved.
Furthermore, the PCS small plate is provided with the position of an optical positioning point, windowing is carried out in the subsequent anti-welding process, and the size of the windowing is larger than that of the optical positioning point, so that the optical point is exposed after windowing. The position of optical locating point on the PCS platelet is windowing when preventing welding, and the size of windowing is greater than the size of optical locating point, effectively ensures that the optics gong machine can snatch four optical locating points in every platelet and fix a position the operation when shaping gong half slot, and then effectively solves the half slot size nonconformity problem that causes because of reasons such as big board harmomegathus is inhomogeneous.
Furthermore, the diameter of the optical point copper PAD of the optical locating point is 100mil, so that the optical locating point can be accurately grabbed by the optical routing machine to complete optical locating, the locating accuracy of the PCS small plate is further ensured, and the influence of uneven expansion and contraction of the PCS small plate is reduced.
Further, the diameter of the window is 200mil, and the distance from the single side of the window to the optical point copper PAD is 50 mil. The single side of the diameter of the window is 50mil larger than the optical point copper, so that the optical point copper is exposed, and the optical routing machine can accurately grab the optical point copper to complete optical positioning of the PCS small plate.
Furthermore, the half slot holes are completed through an optical gong machine, the SET large plate is placed on a machine table of the gong machine for mechanical positioning, then the optical gong machine is started to grab four optical positioning points in each PCS small plate for optical positioning, and then the operation of half slot holes is performed.
Compared with the prior art, the manufacturing method of the PCB semi-slot hole has the following beneficial effects:
according to the invention, the optical positioning points are arranged at the plate edges of the PCS small plate and are combined with the optical routing machine, so that the optical routing machine can capture the optical positioning points on the PCS small plate to position the PCS small plate before routing the plate, and then routing the plate, thereby effectively ensuring the positioning accuracy of the PCS small plate, particularly ensuring that the PCS small plate is not influenced by the expansion and contraction of a SET (single SET) large plate in the manufacturing process, further improving the routing accuracy of the half slotted holes, ensuring the sizes of the half slotted holes to be consistent, and effectively solving the technical problem of inconsistent sizes of the half slotted holes in the prior art.
Detailed Description
The method for forming the half slot of the PCB of the present invention will be described in detail with reference to the following embodiments.
The invention relates to a manufacturing method of a semi-slot of a PCB (printed circuit board), which comprises a SET (single event processing) large board, wherein a plurality of PCS (process control system) small boards are arranged in the SET large board, and the manufacturing method comprises PCB positioning manufacturing and routing manufacturing of the semi-slot.
In a non-limiting embodiment of the present invention, the PCB positioning and manufacturing includes positioning the SET large board and positioning each PCS small board, and the positioning and manufacturing of the PCB is completed by positioning the SET large board and the PCS small board respectively; the PCB positioning and manufacturing specifically comprises: 1. the positioning of the SET large board is realized by arranging mechanical positioning holes at the board edges of the SET large board, and positioning the SET large board on a machine table in a mechanical positioning mode, specifically, the mechanical positioning holes are arranged at the board edges of the SET large board and used for positioning the SET large board on the machine table of a milling machine, the mechanical positioning holes arranged at the two edges of the SET large board are different in quantity and used for preventing the SET large board from being blocked when being arranged in the milling machine table. 2. The PCB small plates are positioned by arranging optical positioning points at the plate edges of all the PCS small plates and routing half-slot holes after the optical positioning points on all the PCS small plates are grabbed by an optical routing machine, so that the independent positioning of the PCB small plates is realized. SET up the optics setpoint at the flange of PCS platelet, the setting of optics setpoint, it is in the same place to combine with optics gong machine, make optics gong machine advance before the gong board and snatch the optics setpoint pair PCS platelet on the PCS platelet and fix a position the back, carry out the gong board again, it is accurate effectively to ensure PCS platelet location, especially ensure not receive the influence of the big board harmomegathus of SET in the preparation process PCS platelet, and then promote the gong hole precision of half slotted hole, make the size of half slotted hole unanimous, effectively solve the technical problem that half slotted hole size is inconsistent among the prior art.
According to a non-limiting embodiment of the invention, the SET large board is positioned on a routing machine table through a mechanical positioning method, the PCS small board is optically positioned by an optical routing machine after an optical positioning point on the PCS small board is grabbed, namely after the PCB is positioned, a half-slot hole is routed on each PCS small board through the optical routing machine, and the routing manufacture of the half-slot hole is completed.
According to the manufacturing method of the half-slot hole of the PCB, the SET large board and each PCS small board of the PCB are respectively positioned, and then the half-slot hole is milled by the optical milling machine, so that the problem that the size of the half-slot hole is inconsistent due to factors such as expansion and shrinkage of the large board during the manufacturing of the traditional half-slot hole is effectively solved, namely the half-slot hole is large on one side and small on the other side, the product yield is effectively improved, the scrap is reduced, the manufacturing cost is further reduced, and the customer complaint and the compensation problems caused by the hidden danger of the product quality are solved.
In a non-limiting embodiment of the present invention, the optical positioning points are four optical positioning points additionally arranged at four corners of the PCS small board when the line engineering data is manufactured. The optical positioning points are designed when the line engineering data are manufactured, the design of the optical positioning points is completed under the condition that the design data are not increased, and the manufacturing efficiency is effectively improved.
In a non-limiting embodiment of the present invention, the PCS small plate is provided with a position of an optical positioning point, and the window is opened in a subsequent solder mask process, wherein the size of the window is larger than that of the optical positioning point, so that the optical point is exposed after the window is opened. The position of optical locating point on the PCS platelet is windowing when preventing welding, and the size of windowing is greater than the size of optical locating point, effectively ensures that the optics gong machine can snatch four optical locating points in every platelet and fix a position the operation when shaping gong half slot, and then effectively solves the half slot size nonconformity problem that causes because of reasons such as big board harmomegathus is inhomogeneous.
According to a non-limiting embodiment of the invention, the diameter of the optical point copper PAD of the optical positioning point is 100mil, so that the optical positioning point can be effectively and accurately grasped by an optical gong machine to complete optical positioning, the positioning accuracy of the PCS small plate is further ensured, and the influence of uneven expansion and contraction of the PCS small plate on the large plate is reduced.
In one non-limiting embodiment of the present invention, the window has a diameter of 200 mils, and the distance from the single side of the window to the optical point copper PAD is 50 mils. The single side of the diameter of the window is 50mil larger than the optical point copper, so that the optical point copper is exposed, and the optical routing machine can accurately grab the optical point copper to complete optical positioning of the PCS small plate.
According to a non-limiting embodiment of the invention, the half-slot hole is completed by an optical gong machine, the optical gong machine is placed on a machine table of the gong machine through an SET large plate for mechanical positioning, then the optical gong machine is started to grab four optical positioning points in each PCS small plate for optical positioning, and then the half-slot hole gong operation is performed.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (8)
1. A method for manufacturing a half slot of a PCB is characterized in that: the PCB comprises a SET large board, a plurality of PCS small boards are arranged in the SET large board, the manufacturing method comprises PCB positioning manufacturing and semi-slot hole routing manufacturing, the PCB positioning manufacturing comprises the steps of respectively positioning the SET large board and positioning each PCS small board, and the positioning manufacturing of the PCB is completed in a mode of respectively positioning the SET large board and the PCS small boards; and after the PCB is positioned, routing a half slot hole by using an optical routing machine to finish the manufacture of the half slot hole.
2. The method for manufacturing the half slot of the PCB as recited in claim 1, wherein the SET large board is positioned by arranging a mechanical positioning hole at the board edge of the SET large board and positioning the SET large board on a machine table in a mechanical positioning manner.
3. The method for manufacturing the semi-slot hole of the PCB as claimed in claim 1 wherein the PCB small plate is positioned by arranging an optical positioning point at the edge of each PCS small plate and performing semi-slot routing after grabbing the optical positioning point on each PCS small plate by an optical routing machine to realize independent positioning of the PCB small plate.
4. The method as claimed in claim 3, wherein the optical alignment points are four optical alignment points added at four corners of the PCS small board during the manufacturing of circuit engineering data.
5. The method for manufacturing the half-slot of the PCB as recited in claim 4, wherein the PCS small plate is provided with a position of the optical positioning point, and is windowed during a subsequent solder mask process, and the size of the windowed window is larger than that of the optical positioning point, so that the optical point is exposed after the window is windowed.
6. The method as claimed in claim 5, wherein the diameter of the optical spot copper PAD of the optical positioning point is 100 mil.
7. The method as claimed in claim 6, wherein the diameter of the window is 200mil, and the distance from the single side of the window to the optical point copper PAD is 50 mil.
8. The method for manufacturing a semi-slot of a PCB according to any of claims 1 to 7 wherein the semi-slot is completed by an optical gong machine, the semi-slot is mechanically positioned by a SET large board placed on a machine of the gong machine, and then the optical gong machine is started to grab four optical positioning points in each PCS small board for optical positioning, and then the semi-slot is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010861034.5A CN112020226B (en) | 2020-08-25 | 2020-08-25 | Manufacturing method of PCB semi-slotted hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010861034.5A CN112020226B (en) | 2020-08-25 | 2020-08-25 | Manufacturing method of PCB semi-slotted hole |
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| Publication Number | Publication Date |
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| CN112020226A true CN112020226A (en) | 2020-12-01 |
| CN112020226B CN112020226B (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010861034.5A Active CN112020226B (en) | 2020-08-25 | 2020-08-25 | Manufacturing method of PCB semi-slotted hole |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201700090U (en) * | 2010-06-25 | 2011-01-05 | 上海晨兴希姆通电子科技有限公司 | Tray for supporting PCB panel |
| CN201742643U (en) * | 2010-05-19 | 2011-02-09 | 苏州安可信通信技术有限公司 | Printed circuit board jointed board and matched work fixture |
| US20130121652A1 (en) * | 2011-11-10 | 2013-05-16 | Honda Tsushin Kogyo Co., Ltd. | Optical communication module and method of manufacturing the same |
| CN207305080U (en) * | 2017-10-09 | 2018-05-01 | 深圳市煜辰光学有限公司 | FPC jigsaw |
| CN210120704U (en) * | 2019-06-26 | 2020-02-28 | 昆山首源电子科技有限公司 | Circuit board punching structure capable of preventing copper sheet from warping |
-
2020
- 2020-08-25 CN CN202010861034.5A patent/CN112020226B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201742643U (en) * | 2010-05-19 | 2011-02-09 | 苏州安可信通信技术有限公司 | Printed circuit board jointed board and matched work fixture |
| CN201700090U (en) * | 2010-06-25 | 2011-01-05 | 上海晨兴希姆通电子科技有限公司 | Tray for supporting PCB panel |
| US20130121652A1 (en) * | 2011-11-10 | 2013-05-16 | Honda Tsushin Kogyo Co., Ltd. | Optical communication module and method of manufacturing the same |
| CN207305080U (en) * | 2017-10-09 | 2018-05-01 | 深圳市煜辰光学有限公司 | FPC jigsaw |
| CN210120704U (en) * | 2019-06-26 | 2020-02-28 | 昆山首源电子科技有限公司 | Circuit board punching structure capable of preventing copper sheet from warping |
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| Publication number | Publication date |
|---|---|
| CN112020226B (en) | 2021-09-10 |
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