CN112019985A

CN112019985A - Microphone structure and electronic equipment

Info

Publication number: CN112019985A
Application number: CN202011099928.1A
Authority: CN
Inventors: 解士翔
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2020-10-15
Filing date: 2020-10-15
Publication date: 2020-12-01
Anticipated expiration: 2040-10-15
Also published as: CN112019985B

Abstract

The invention discloses a microphone structure and electronic equipment, wherein the microphone structure comprises a packaging shell, a vibration component and a detector, the packaging shell is enclosed to form an accommodating cavity, and a sound inlet hole communicated with the accommodating cavity is formed in the packaging shell; the vibration assembly comprises a vibrating diaphragm and an elastic structure which are arranged in the containing cavity, and the elastic structure is connected with the vibrating diaphragm; the detector is electrically connected with the packaging shell and is used for detecting the displacement or tension of the elastic structure. The invention aims to improve the sensitivity of the microphone structure, thereby increasing the signal-to-noise ratio of the microphone structure and avoiding the influence on the frequency response performance of the microphone structure.

Description

Microphone structure and electronic equipment

Technical Field

The present invention relates to the field of microphone technologies, and in particular, to a microphone structure and an electronic device using the same.

Background

The MEMS (Micro-Electro-Mechanical System) technology is a high and new technology developed at a high speed in recent years, and it adopts an advanced semiconductor manufacturing process to implement the batch manufacturing of devices such as sensors and drivers, and compared with the corresponding conventional devices, the MEMS device has very obvious advantages in terms of volume, power consumption, weight and price. Major examples of applications of MEMS devices on the market include pressure sensors, accelerometers, and microphone structures.

The microphone structure is also called MEMS microphone, which is a microphone manufactured based on MEMS technology. The microphone structure can convert sound pressure change into capacitance change, and then the capacitance change is reduced by the ASIC chip to be converted into an electric signal, so that the sound-electricity conversion is realized.

In the related art, the air volume of the rear chamber of the microphone structure is small, the difficulty of pushing the silicon diaphragm to move is increased, the sensitivity of the MEMS sensor is reduced, the signal-to-noise ratio of the microphone structure is reduced, the air volume of the front chamber is large, the resonant frequency is reduced, and the frequency response performance of the microphone structure is affected.

Disclosure of Invention

The invention mainly aims to provide a microphone structure and electronic equipment, aiming at improving the sensitivity of the microphone structure, so that the signal-to-noise ratio of the microphone structure is increased, and the influence on the frequency response performance of the microphone structure is avoided.

In order to achieve the above object, the present invention provides a microphone structure, including:

the packaging shell is enclosed to form an accommodating cavity, and a sound inlet hole communicated with the accommodating cavity is formed in the packaging shell;

the vibration assembly comprises a vibrating diaphragm and an elastic structure which are arranged in the containing cavity, and the elastic structure is connected with the vibrating diaphragm; and

a detector electrically connected with the package housing, the detector for detecting a displacement or tension of the elastic structure.

In one embodiment, the package housing includes a case and a substrate, the case is provided with the sound inlet hole, and the substrate includes:

the circuit board and the shell enclose to form the accommodating cavity; and

the chip is arranged on one side, facing the sound inlet hole, of the circuit board and is electrically connected with the circuit board, a containing groove is formed in the chip, and the vibrating diaphragm covers the notch of the containing groove and surrounds the chip to form a vibrating cavity.

In an embodiment, the elastic structure is an elastic column, one end of the elastic column is connected to the diaphragm, the other end of the elastic column extends toward the inside of the vibration cavity, and the detector is configured to detect a displacement of the elastic column.

In one embodiment, the elastic column and the diaphragm are of an integrally formed structure;

and/or the elastic column and the vibrating diaphragm are arranged in a T shape;

and/or one end of the elastic column is connected to the center of the diaphragm.

In an embodiment, the elastic structure is two/annular elastic pieces, one end of the elastic piece is connected with one end of the vibrating diaphragm, the other end of the elastic piece is connected with the side wall of the accommodating groove, the vibrating diaphragm covers the notch of the accommodating groove through the elastic piece, and the detector is used for detecting the tension of the elastic piece.

In an embodiment, a limiting table is formed on the chip adjacent to the notch of the accommodating groove, a supporting protrusion is convexly arranged on the limiting table, and the end part of the vibrating diaphragm adjacent to the elastic sheet abuts against the supporting protrusion.

In one embodiment, an adhesive layer and a welding point which are arranged at intervals are arranged on one side of the circuit board facing the sound inlet hole, and the chip is connected with the circuit board through the adhesive layer and is connected with the welding point through a metal lead.

In one embodiment, the housing is soldered to the circuit board by solder paste;

and/or a bonding pad is arranged on one side of the circuit board, which is back to the chip, and the bonding pad is used for electrically connecting terminal equipment;

and/or the chip comprises an ASIC chip.

In one embodiment, the elastic structure is made of silicon;

and/or the vibrating diaphragm is made of silicon material;

and/or the vibrating diaphragm is arranged opposite to the sound inlet hole.

The invention also provides electronic equipment which comprises an equipment main body and the microphone structure, wherein the microphone structure is arranged in the equipment main body.

According to the microphone structure, the vibration assembly and the detector are arranged in the containing cavity formed by the shell and the substrate, the elastic structure of the vibration assembly is connected with the vibrating diaphragm, and the detector is electrically connected with the substrate. Get into when sound through the sound inlet hole of shell and hold the intracavity, hold the vibrating diaphragm of intracavity and feel the acoustic pressure even and take place the vibration, drive the elastic construction during vibrating diaphragm vibration this moment and remove or shrink and take place displacement or tension change, utilize the displacement or the tension change that the detector detected the elastic construction, and with this change information transmission to base plate, thereby the realization is changed sound signal into mechanical operation signal, convert the signal of telecommunication again, with this sensitivity that improves the microphone structure, when the SNR of increase microphone structure, avoid causing the influence to the frequency response performance of microphone structure.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a microphone structure according to an embodiment of the invention;

fig. 2 is a schematic structural diagram of a microphone structure according to another embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Microphone structure	221	Accommodating tank
1	Outer casing	222	Limiting table
				11	Sound inlet hole	223	Supporting projection
2	Substrate	3	Containing cavity
				21	Circuit board	4	Vibration assembly
211	Glue layer	41	Vibrating diaphragm
				212	Welding point	421	Elastic column
213	Soldering tin paste	422	Elastic sheet
				214	Bonding pad	5	Metal lead wire
22	Chip and method for manufacturing the same

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The conventional microphone structure is also called MEMS microphone, which is a microphone manufactured based on MEMS technology. The MEMS microphone in the related art is composed of a MEMS sensor, an ASIC amplifier, an acoustic cavity, and a circuit board with an RF suppression circuit. The MEMS sensor chip is a micro capacitor formed by a silicon diaphragm and a silicon back plate, and can convert sound pressure change into capacitance change, and then the ASIC chip converts the capacitance change into an electric signal to realize sound-electricity conversion.

The silicon diaphragm divides the sound cavity of the microphone structure into two parts, the area between the sound inlet hole and the silicon diaphragm is a front chamber, and the rest part of the sound cavity is a rear chamber. In the microphone structure in the related art, the difficulty of pushing the silicon diaphragm to move is increased due to the small air volume of the rear chamber, so that the sensitivity of the MEMS sensor is reduced, the signal-to-noise ratio of the microphone structure is reduced, the air volume of the front chamber is large, the resonant frequency is reduced, and the frequency response performance of the microphone structure is influenced.

Based on the above-mentioned concepts and problems, the present invention proposes a microphone structure 100. It will be appreciated that the microphone structure 100 applies to electronic devices. The electronic device may be a sound-producing electronic product such as a sound box, a mobile phone, a tablet computer, an earphone, and the like, which is not limited herein.

It is understood that the microphone structure 100 is applied to an earphone, and the earphone may be a pair of converting units for receiving an electrical signal from a media player or a receiver and converting the electrical signal into audible sound waves by a speaker near the ear.

The headset may be used in a conversation scenario as an accessory to a terminal device, including but not limited to a handheld device, an in-vehicle device, a wearable device, a computing device, or other processing device connected to a wireless modem. The terminal devices may include a cellular phone (cellular phone), a smart phone (smartphone), a Personal Digital Assistant (PDA) computer, a tablet computer, a laptop computer (laptop computer), a vehicle-mounted computer, a smart watch (smart watch), a smart bracelet (smart watch), a pedometer (pedometer), and other terminal devices having a call function. The call scene includes, but is not limited to, an indoor call scene, an outdoor call scene, and a vehicular call scene. The call scenes may include quiet call scenes, noisy call scenes (e.g., scenes in streets, shopping malls, airports, stations, construction sites, in the rain, at tours, concerts, etc.), riding call scenes, outdoor windy call scenes, monaural call scenes, binaural call scenes, and other call-enabled scenes.

The headset may be generally classified into a wired headset (wired telephone or wired headset) and a wireless headset (wireless headset). The wired earphone is provided with two earphones and a connecting wire, wherein the left earphone and the right earphone are connected through the connecting wire. Wired earphones may be inconvenient to wear and need to be connected with terminal equipment through earphone jacks, and the electric quantity of the terminal equipment needs to be consumed in the working process. And the wireless headset may communicate with the terminal device using wireless communication technology (e.g., bluetooth technology, infrared radio frequency technology, 2.4G wireless technology, ultrasonic waves, etc.). Compared with a wired earphone, the wireless earphone is more convenient and fast to use due to the fact that the wireless earphone is free from the constraint of physical wires, and therefore the wireless earphone is rapidly developed. Wherein, the left earphone of wireless earphone can pass through bluetooth connection right earphone.

Referring to fig. 1 and fig. 2, in an embodiment of the invention, a package housing of a microphone structure includes a housing and a substrate. Specifically, the microphone structure 100 includes a housing 1, a substrate 2, a vibration component 4 and a detector, wherein the substrate 2 and the housing 1 enclose to form an accommodating cavity 3, the housing 1 is provided with a sound inlet hole 11 of the substrate 2, and the sound inlet hole 11 is communicated with the accommodating cavity 3; the vibration component 4 comprises a vibrating diaphragm 41 and an elastic structure which are arranged in the accommodating cavity 3, the elastic structure is connected with the vibrating diaphragm 41, the detector is electrically connected with the substrate 2, and the detector is used for detecting the displacement or tension of the elastic structure.

In this embodiment, the sound inlet 11 penetrates through the housing 1 or the substrate 2, i.e. the sound inlet 11 is a through hole. The external sound air flows through the sound inlet hole 11 into the inside of the microphone structure. In one embodiment, the substrate 2 has a concave configuration, the housing 1 is a cover plate, and the housing 1 covers the substrate 2 to form the accommodating cavity 3. In another embodiment, the housing 1 has a concave configuration, the substrate 2 is a flat plate, and the housing 1 is fastened to the substrate 2 to form the accommodating cavity 3.

It is understood that the sound inlet hole 11 communicates with the accommodating chamber 3, and the external sound air flows through the sound inlet hole 11 into the accommodating chamber 3, and the accommodating chamber 3 functions as an acoustic chamber. In the present embodiment, as shown in fig. 1 and fig. 2, the housing 1 is provided with the sound inlet 11, the housing 1 includes a top surface and four side walls connected to the top surface, and the sound inlet 11 is provided on the top surface or the side walls. Alternatively, the sound input hole 11 may be provided in plurality. Of course, in other embodiments, the sound inlet 11 may be disposed on the substrate 2, and is not limited herein.

In this embodiment, the vibrating diaphragm 41, the elastic structure and the detector are all disposed in the accommodating cavity 3, the vibrating diaphragm 41 is disposed corresponding to the sound inlet hole 11, so that the external sound airflow enters the accommodating cavity 3 through the sound inlet hole 11, the vibrating diaphragm 41 is deformed by the sound pressure generated by the sound airflow to generate vibration, the elastic structure is connected to the vibrating diaphragm 41, so that when the vibrating diaphragm 41 vibrates, the elastic structure is driven to generate displacement change or contraction change, so as to detect the displacement or tension of the elastic structure through the detector, transmit the detection signal to the substrate 2, and further convert the detection signal into an electrical signal, thereby completing the "sound-electricity" conversion. Alternatively, the detector may be a displacement detection device, a tension detection device, or other structures or sensors capable of detecting displacement or tension, and is not limited herein.

The microphone structure 100 of the present invention is connected to the diaphragm 41 by an elastic structure by disposing the vibration element 4 and the detector in the accommodation chamber 3 formed by the housing 1 and the substrate 2, and the detector is electrically connected to the substrate 2. When sound enters the accommodating cavity 3 through the sound inlet hole 11, the vibrating diaphragm 41 in the accommodating cavity 3 continuously senses sound pressure and vibrates, at the moment, the vibrating diaphragm 41 drives the elastic structure to move or contract to generate displacement or tension change when vibrating, the displacement or tension change of the elastic structure is detected by using the detector, and the change information is transmitted to the substrate 2, so that a sound signal is converted into a mechanical operation signal and then is converted into an electric signal, the sensitivity of the microphone structure 100 is improved, the signal-to-noise ratio of the microphone structure 100 is increased, and the influence on the frequency response performance of the microphone structure 100 is avoided.

In one embodiment, as shown in fig. 1 and fig. 2, the substrate 2 includes a circuit board 21 and a chip 22, wherein the circuit board 21 and the housing 1 enclose to form the accommodating cavity 3; the chip 22 is disposed on one side of the circuit board 21 facing the sound inlet hole 11 and electrically connected to the circuit board 21, the chip 22 is formed with an accommodating groove 221, and the diaphragm 41 covers a notch of the accommodating groove 221 and encloses with the chip 22 to form a vibration cavity.

In the present embodiment, the chip 22 includes an ASIC chip.

In the present embodiment, the chip 22 is provided on the inner surface of the substrate 2. The chip 22 is formed with an accommodating groove 221, and the diaphragm 41 covers a notch of the accommodating groove 221 and encloses with the chip 22 to form a vibration cavity. The elastic structure is located on the side of the diaphragm 41 facing away from the sound inlet hole 11 or on the periphery of the diaphragm 41.

It is understood that the receiving groove 221 can be recessed on the chip 22; the receiving groove 221 may also be disposed on the chip 22 in a protruding manner, that is, the chip 22 is disposed with a connecting arm, and the connecting arm and the chip 22 surround to form the receiving groove 221, which is not limited herein. Alternatively, the accommodating groove 221 may be a groove or a through groove, which is not limited herein.

In an embodiment, as shown in fig. 1, the elastic structure is an elastic pillar 421, one end of the elastic pillar 421 is connected to the diaphragm 41, the other end of the elastic pillar 421 extends toward the vibration cavity, and the detector is configured to detect a displacement of the elastic pillar 421.

In this embodiment, a connecting arm or a supporting arm is disposed on a side of the chip 22 opposite to the circuit board 21, the connecting arm or the supporting arm and the chip 22 enclose the accommodating groove 221 forming a groove structure, and the diaphragm 41 is connected to the connecting arm or the supporting arm to cover the notch of the accommodating groove 221 and enclose the chip 22 to form a vibration cavity.

It can be understood that the elastic column 421 is located in the vibration cavity, so that when the vibration diaphragm 41 is vibrated by the sound pressure of the sound airflow, the elastic column 421 is conveniently driven to generate displacement change in the vibration cavity, and meanwhile, the elastic column 421 is prevented from being interfered by the sound airflow, and the displacement change of the elastic column 421 in the vibration cavity is influenced, so as to prevent the data detected by the detector from being inaccurate.

In one embodiment, as shown in fig. 1, the elastic column 421 and the diaphragm 41 are integrally formed. It can be understood that, by such an arrangement, the connection stability of the elastic column 421 and the vibrating diaphragm 41 can be improved, and meanwhile, when the elastic column 421 and the vibrating diaphragm 41 are connected through other connecting structures, inaccurate displacement change of the elastic column 421 along with the vibration of the vibrating diaphragm 41 is avoided.

In one embodiment, as shown in fig. 1, the elastic column 421 and the diaphragm 41 are disposed in a T shape. It can be understood that, so set up, thereby utilize vibrating diaphragm 41 closing cap at the holding tank 221 notch department of chip 22, make the one end that vibrating diaphragm 41 was kept away from to elasticity post 421 be the free end, so can amplify the vibration process of vibrating diaphragm 41 under the acoustic pressure, thereby make things convenient for the detector to detect, with the sensitivity that improves microphone structure 100, when the signal-to-noise ratio of increase microphone structure 100, avoid causing the influence to the frequency response performance of microphone structure 100.

In one embodiment, as shown in fig. 1, one end of the elastic column 421 is connected to the center of the diaphragm 41. It can be understood that, so set up to be favorable to the elasticity post 421 to connect and take place the biggest position department of deformation when the vibrating diaphragm 41 receives the acoustic pressure, so usable elasticity post 421 implements the vibration change that reflects vibrating diaphragm 41, thereby makes things convenient for the detector to detect, with the sensitivity that improves microphone structure 100, when increasing microphone structure 100's SNR, avoids causing the influence to microphone structure 100's frequency response performance.

In another embodiment, as shown in fig. 2, the elastic structure is two/ring-shaped elastic pieces 422, one end of the elastic piece 422 is connected to one end of the diaphragm 41, the other end of the elastic piece 422 is connected to the side wall of the accommodating groove 221, the diaphragm 41 covers the notch of the accommodating groove 221 through the elastic piece 422, and the detector is configured to detect the tension of the elastic piece 422.

In this embodiment, the chip 22 is recessed with a receiving groove 221, and the receiving groove 221 is a through-groove structure and penetrates through the chip 22. It can be understood that the diaphragm 41 is covered in the notch of the accommodating groove 221 by the elastic piece 422, that is, the two ends of the diaphragm 41 are connected to the chip 22 by the elastic piece 422. When the diaphragm 41 receives the sound pressure of the sound airflow from the sound inlet hole 11, the diaphragm 41 vibrates to pull the elastic sheet 422 to change in a stretching manner, so that the tension change of the elastic sheet 422 can be detected by the detector, and the tension change is transmitted to the chip 22 of the substrate 2, processed and converted by the chip 22, transmitted to the circuit board 21, and output to the terminal device.

In this embodiment, the diaphragm 41 and the elastic sheet 422 are integrally formed. It can be understood that, by such an arrangement, the connection stability of the elastic sheet 422 and the vibrating diaphragm 41 can be improved, and meanwhile, it is avoided that when the elastic sheet 422 and the vibrating diaphragm 41 are connected through other connecting structures, the elastic sheet 422 is affected to cause inaccurate expansion change along with the vibration of the vibrating diaphragm 41.

As shown in fig. 2, the elastic sheet 422 and the diaphragm 41 are located on the same plane, so that when the diaphragm 41 vibrates, the elastic sheet 422 feeds back the stretching change in real time according to the vibration of the diaphragm 41, so as to facilitate the detection of the detector, improve the sensitivity of the microphone structure 100, increase the signal-to-noise ratio of the microphone structure 100, and avoid affecting the frequency response performance of the microphone structure 100.

In one embodiment, as shown in fig. 2, a limiting platform 222 is formed on the chip 22 adjacent to the notch of the receiving groove 221, a supporting protrusion 223 is protruded on the limiting platform 222, and the end of the diaphragm 41 adjacent to the elastic sheet 422 abuts against the supporting protrusion 223.

It can be understood that, through being formed with spacing platform 222 at the notch department that chip 22 is close to holding tank 221, when so usable spacing platform 222 realizes spacing installation to flexure strip 422 and vibrating diaphragm 41, still can utilize the support arch 223 on the spacing platform 222 to play the supporting role, so usable support arch 223 avoids vibrating diaphragm 41 to vibrate when too big, causes the damage to flexure strip 422, also usable support arch 223 plays the spacing effect of buffering.

In one embodiment, as shown in fig. 1 and 2, a glue layer 211 and a soldering point 212 are disposed at an interval on a side of the circuit board 21 facing the sound inlet 11, and the chip 22 is connected to the circuit board 21 through the glue layer 211 and connected to the soldering point 212 through a metal lead 5.

In order to improve the connection stability between the chip 22 and the circuit board 21, a glue layer 211 is disposed between the circuit board 21 and the chip 22. As can be appreciated, the glue layer 211 is formed by the solidification of glue. The adhesive layer 211 is used for fixing the chip 22; on the other hand, the insulating circuit board 21 and the chip 22 are played. In the present embodiment, in order to realize the electrical connection between the circuit board 21 and the chip 22, so that the signals of the circuit board 21 and the chip 22 are transmitted, the circuit board 21 is further provided with a soldering point 212, and the electrical connection between the circuit board 21 and the chip 22 is realized by using the metal lead 5.

Of course, in other embodiments, the pins of the chip 22 may be disposed on the chip 22, and the contacts may be disposed on the circuit board 21, so that the pins of the chip 22 are soldered on the contacts of the circuit board 21 to fix the pins and simultaneously to achieve electrical connection, which is not limited herein.

In one embodiment, the housing 1 is soldered to the circuit board 21 by solder paste 213, as shown in fig. 1 and 2. It is understood that the housing 1 is a metal housing, so that the chip 22 is wrapped in the accommodating cavity 3 by the housing 1, and thus the short board is arranged to effectively supplement the electromagnetic shielding capability of the circuit board 21 in the related art, thereby improving the electromagnetic shielding capability of the microphone structure 100. In this embodiment, the fixed connection between the housing 1 and the circuit board 21 can be achieved by the solder paste 213 without affecting the performance of the circuit board 21.

In an embodiment, as shown in fig. 1 and fig. 2, a side of the circuit board 21 facing away from the chip 22 is further provided with a pad 214, and the pad 214 is used for electrical connection of a terminal device. It will be appreciated that by providing the bonding pads 214 on the side of the circuit board 21 facing away from the chip 22, it is possible to facilitate electrical connection of the terminal device to the microphone structure 100 via the bonding pads 214, thereby facilitating signal transmission.

It will be appreciated that the pads 214 may be placed on either side of the front or back side of the circuit board 21. In practical application, the design mode is set according to requirements, and compared with the traditional mode of only arranging the design mode at the bottom of the circuit board 21, the design mode increases the assembly flexibility of the product; the structural design can meet the assembly requirement of plugging and unplugging, so that the assembly flexibility of the product is improved.

In one embodiment, the elastic structure may be made of silicon. It can be understood that, by selecting the material of the elastic column 421 or the elastic sheet 422 of the elastic structure to be a silicon material, the sensitivity of the elastic structure to displacement or tension change when vibrating with the diaphragm 41 is ensured.

In an embodiment, the material of the diaphragm 41 may be silicon. It can be understood that the material of the diaphragm 41 is silicon, so as to ensure the sensitivity of the diaphragm 41 to vibration when receiving sound pressure. In the embodiment, the elastic structure and the diaphragm 41 are integrally formed, so that the structural strength of the elastic structure and the diaphragm 41 can be improved, and the influence on the sensitivity of the microphone structure 100 caused by the connection between the elastic structure and the diaphragm 41 through other structures can be avoided.

In this embodiment, the area of the sound inlet hole 11 is smaller than the area of the diaphragm 41. It can be understood that the area of the sound inlet hole 11 is smaller than the area of the diaphragm 41, so as to ensure that the diaphragm 41 can completely receive the sound pressure of the sound airflow from the sound inlet hole 11, and avoid the sound airflow from performing multiple reflections in the accommodating cavity 3, which affects the performance of the microphone structure 100.

It is understood that the performance of the diaphragm 41 and the microphone structure 100 is not affected by the entrance of dust and other foreign matters into the accommodating chamber 3 from the sound inlet hole 11. In an embodiment, a dust screen is disposed at the sound inlet hole 11. In this embodiment, the dust screen may be a gauze or a dust-proof grid structure. The dust screen has a plurality of pores, which may facilitate sound to pass through the pores.

In one embodiment, the sound inlet holes 11 are provided in plurality, and a damping structure may be further disposed at the sound inlet holes 11, where the damping structure is a damping sheet and/or a micro-hole. It can be understood that, in order to realize the acoustic path difference, the air permeability of the damping structure is 80mm/s to 310mm/s, and the good directivity of the microphone structure 100 is realized by changing the acoustic path difference of the sound reaching the diaphragm 41 through the different sound inlet holes 11.

The invention further provides an electronic device, which comprises a device body and a microphone structure 100, wherein the microphone structure 100 is arranged in the device body. The specific structure of the microphone structure 100 refers to the foregoing embodiments, and since the electronic device adopts all the technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A microphone structure, characterized in that the microphone structure comprises:

the packaging shell is enclosed to form an accommodating cavity, and a sound inlet hole communicated with the accommodating cavity is formed in the packaging shell; and

2. The microphone structure of claim 1 wherein the package includes a housing and a substrate, the housing being provided with the sound inlet hole, the substrate including:

the circuit board and the shell enclose to form the accommodating cavity; and

3. The microphone structure of claim 2 wherein the resilient structure is a resilient post, one end of the resilient post is connected to the diaphragm, the other end of the resilient post extends into the vibration cavity, and the detector is configured to detect displacement of the resilient post.

4. The microphone structure of claim 3, wherein the elastic column and the diaphragm are of an integrally formed structure;

5. The microphone structure of claim 2, wherein the elastic structure is a two/ring-shaped elastic piece, one end of the elastic piece is connected with one end of the diaphragm, the other end of the elastic piece is connected with the side wall of the accommodating groove, the diaphragm is covered on the notch of the accommodating groove through the elastic piece, and the detector is used for detecting the tension of the elastic piece.

6. The microphone structure as claimed in claim 5, wherein the chip is formed with a stopper boss adjacent to the notch of the receiving groove, the stopper boss is provided with a support protrusion, and the end of the diaphragm adjacent to the elastic piece abuts against the support protrusion.

7. The microphone structure according to any one of claims 2 to 6, wherein a side of the circuit board facing the sound inlet hole is provided with a glue layer and a soldering point at intervals, and the chip is connected to the circuit board through the glue layer and connected to the soldering point through a metal lead.

8. The microphone structure as claimed in any one of claims 2 to 6, wherein the housing is soldered to the circuit board by solder paste;

and/or the chip comprises an ASIC chip.

9. The microphone structure according to any one of claims 1 to 6, wherein the elastic structure is made of a silicon material;

and/or the vibrating diaphragm is made of silicon material;

and/or the vibrating diaphragm is arranged opposite to the sound inlet hole.

10. An electronic device comprising a device body and a microphone structure as claimed in any one of claims 1 to 9, the microphone structure being provided within the device body.