CN108989919A - A kind of sensor - Google Patents
A kind of sensor Download PDFInfo
- Publication number
- CN108989919A CN108989919A CN201810772091.9A CN201810772091A CN108989919A CN 108989919 A CN108989919 A CN 108989919A CN 201810772091 A CN201810772091 A CN 201810772091A CN 108989919 A CN108989919 A CN 108989919A
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- China
- Prior art keywords
- vibrating diaphragm
- elastic body
- sensor
- light
- light transmission
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The invention discloses a kind of sensors, comprising: the shell with hollow cavity and upper end opening is provided with the light emitting source for emitting beam towards shell nozzle end, and the photoelectric detector for receiving reflection light in the bottom end of the housing cavity；The light transmission elastic body for being filled in housing cavity and covering light emitting source, photoelectric detector；The vibrating diaphragm for being carried on shell nozzle end and fitting together with light transmission elastic body, the vibrating diaphragm are configured as under the variation of external environment that deformation occurs with light transmission elastic body；Reflecting part is provided on the vibrating diaphragm, the reflecting part is configured as reflexing to the light that light emitting source issues on photoelectric detector.The problem of sensor of the invention, there is no acoustic resistances, the back chamber of large volume is not needed, therefore the overall dimensions of sensor can be substantially reduced, enhance the reliability of sensor.
Description
Technical field
The present invention relates to fields of measurement, more preparatively say, the present invention relates to a kind of sensors, such as microphone, pressure to pass
Sensor, displacement sensor.
Background technique
Sensor of existing mainstream, such as microphone, pressure sensor, displacement sensor etc. are to pass through capacity plate antenna
The principle of device is detected.Such as in the structure that wheat agrees wind, plate condenser includes the back of substrate and formation on substrate
Pole plate, vibrating diaphragm have gap, so that back pole plate, vibrating diaphragm constitute flat capacitor senses knot between back pole plate and vibrating diaphragm
Structure.
In order to make full use of the mechanical sensitivity of vibrating diaphragm, after microphone needs to design huge with environmental pressure
Chamber, to ensure rigidity much vibrating diaphragms of moving air.The volume of back chamber is typically much deeper than 1mm3, such as it is typically designed to 1-
15mm3.And microphone chip needs to open its cavity when encapsulation.Which limits MEMS microphone minimum dimensions
The design (> 3mm of encapsulation3)。
This is because being unfavorable for the circulation of air if back cavity volume is too small, the rigidity of this air can then drop significantly
The mechanical sensitivity of low vibrating diaphragm.In addition, intensive through-hole would generally be designed on back pole plate in order to press, since air viscosity is made
At gap or perforation in air flow resistance become MEMS microphone noise leading factor, to limit microphone
High s/n ratio performance.
Summary of the invention
It is an object of the present invention to provide a kind of new technical solutions of sensor.
According to the first aspect of the invention, a kind of sensor is provided, comprising:
Shell with hollow cavity and upper end opening is provided in the bottom end of the housing cavity for opening towards shell
The light emitting source that mouth end emits beam, and the photoelectric detector for receiving reflection light；
The light transmission elastic body for being filled in housing cavity and covering light emitting source, photoelectric detector；
The vibrating diaphragm for being carried on shell nozzle end and fitting together with light transmission elastic body, the vibrating diaphragm are configured as in the external world
Deformation occurs with light transmission elastic body under the variation of environment；Reflecting part is provided on the vibrating diaphragm, the reflecting part is configured as
The light that light emitting source issues is reflexed on photoelectric detector.
Optionally, the mechanical sensitivity of the light transmission elastic body is less than or equal to the mechanical sensitivity of vibrating diaphragm.
Optionally, the shell includes the bottom of the cavity surrounded by sidewall portion and closed side wall subordinate's end opening；Institute
State light emitting source, photoelectric detector is arranged on bottom.
Optionally, the bottom is circuit board, be additionally provided on the outside of the circuit board for external pad or
Pin.
Optionally, the contact surface of the light transmission elastic body and vibrating diaphragm is plane.
Optionally, the contact surface of the light transmission elastic body and vibrating diaphragm is convex or recessed curved surface.
Optionally, the light emitting source is laser diode；The photoelectric detector is quadrant photodetector.
Optionally, the reflecting part is the metal film layer being formed on vibrating diaphragm.
Optionally, the bottom of the housing cavity is provided with multiple groups photoelectric detector, light emitting source, the photoelectric detector
Quantity corresponding thereto.
Optionally, the sensor is microphone, pressure sensor, displacement sensor.
According to one embodiment of present invention, sensor of the invention, the light transmission elastic body of vibrating diaphragm and sealing in the lumen
It is combined together, extraneous effect power drive vibrating diaphragm, light transmission elastic body are common, and deformation occurs, and passes through the change signal of optical signal
Detection.The problem of sensor of the invention, there is no acoustic resistances, the back chamber of large volume is not needed, therefore can substantially reduce
The overall dimensions of sensor enhance the reliability of sensor.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the structural schematic diagram of inventive sensor.
Fig. 2 is the structural schematic diagram of another embodiment of inventive sensor.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Sensor provided by the invention can be microphone, pressure sensor, displacement sensor or art technology
Other sensors known to personnel.For ease of description, now by taking microphone as an example, technical solution of the present invention is carried out detailed
Description.
Sensor includes the shell with hollow cavity, and the upper end of shell has the open end of connection housing cavity.Shell
It can be integrally formed, such as can choose monocrystalline silicon or other materials well-known to those skilled in the art.Work as selection
When monocrystalline silicon material, a hollow cavity with upper end opening can be formed in the central region of shell by means such as etchings.
In another embodiment, shell includes under the cavity surrounded by sidewall portion 2 and closed side wall portion 2
The bottom 1 of end opening.Sidewall portion 2 can select silicon material, and bottom 1 can be with selecting circuit plate.Circuit board can pass through the side of bonding
Formula is fixed on the lower end of sidewall portion 2, so that the lower ending opening of sidewall portion 2 be closed.
The light emitting source 6 for emitting beam towards shell nozzle end is provided on bottom 1, and for receiving reflected light
The photoelectric detector 5 of line；Light transmission elastic body 4 is filled in the inner cavity of shell, and the light transmission elastic body 4 is by light emitting source 6, photoelectricity
Detector 5 covers, and protects light emitting source 6, photoelectric detector 5 to a certain extent.
It is additionally provided with vibrating diaphragm 3 in the upper end of sidewall portion 2, vibrating diaphragm 3 is carried on the upper surface of sidewall portion 2, and elastic with light transmission
Body 4 fits together.The reflection that the light for issuing light emitting source 6 reflexes on photoelectric detector 5 is provided on vibrating diaphragm 3
Portion 7.
The light that light emitting source 6 issues passes through the reflecting part 7 on the arrival vibrating diaphragm 3 of light transmission elastic body 4, by the anti-of reflecting part 7
After penetrating, the light being reflected back passes through light transmission elastic body 4 and reaches photoelectric detector 5, and is detected by photoelectric detector 5.Work as the external world
Voice signal act on vibrating diaphragm 3 after, vibrating diaphragm 3 can deformation occurs together with light transmission elastic body 4, to change on vibrating diaphragm 3 anti-
The angle in portion 7 is penetrated, thus changes the optical path between light emitting source 6- reflecting part 7- photoelectric detector 5, the variation of the optical path is eventually
It is detected by photoelectric detector 5, the electric signal for thus changing 5 output light path of photoelectric detector characterizes the shape of vibrating diaphragm 3 with this
Become, realizes the conversion of sound to electric signal.
Light emitting source 6, photoelectric detector 5 can be fixed on such as circuit board by mode well-known to those skilled in the art
On bottom 1.The pad or pin 9 being connected to light emitting source 6, photoelectric detector 5 are additionally provided in the outside of bottom 1, by this
Pad or pin 9 can realize the connection of sensor and external circuit.Light emitting source 6 of the invention can use the hair of such as LED
Optical diode, it is preferred to use the small laser diode of hot spot, such as vertical cavity surface emitting laser (Vertical Cavity
Surface Emitting Laser), to improve the sensitivity of detection.The wavelength that laser diode emits beam for example can be with
0.85um, 1.064um, 20um etc..Photoelectric detector 5 can for example select quadrant photodetector, these belong to ability
The common knowledge of field technique personnel, no longer illustrates herein.
Light transmission elastic body 4 can select the materials such as polymer, such as dimethyl silicone polymer.It can lead in housing cavity
The polymer for crossing drop glue or other way filling liquid well-known to those skilled in the art forms light transmission after its solidification
Elastomer 4.Light transmission elastic body 4 solidify after, be used to can be with the upper surface that vibrating diaphragm 3 is bonded it is flat, with reference to Fig. 1；It can also be with
It is in recessed curved surface, with reference to Fig. 2；It is also possible in convex curved surface.When the upper surface of light transmission elastic body 4 selects curved surface,
It can be easier the angle of reflecting part 7 on modulation vibrating diaphragm 3, photoelectric detector 5 is received modulated by reflecting part 7
Optical signal.
Vibrating diaphragm 3 of the invention is fexible film, be can choose such as polySi, Si, SiO2、SixNy, metal, polymer or
Any combination.It can be incorporated in sidewall portion 2 and in light transmission elastic body 4 by way of deposition；Bonding can also be passed through
Mode be incorporated in sidewall portion 2, and fit together by way of bonding with light transmission elastic body 4.
In a preferred embodiment of the invention, the mechanical sensitivity of vibrating diaphragm 3 is greater than the machinery spirit of light transmission elastic body 4
After sensitivity, vibrating diaphragm 3 and light transmission elastic body 4 are combined together, the light transmission elastic body 4 of sealing can dominate the machinery of entire sensor
Sensitivity.Specifically, the Young's modulus of light transmission elastic body 4 can choose 100kPa-500kPa.
Reflecting part 7 can be the metal film layer being formed on vibrating diaphragm 3, can pass through deposition and patterned process etc.
Mode is formed on vibrating diaphragm 3.Reflecting part 7 can choose Al, Au or Ag etc..By the modes such as being deposited, being etched on vibrating diaphragm 3
Reflecting part 7 is formed, this technique belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
Under the premise of guaranteeing that light can reach emission part 7, reflecting part 7 be can be set in the top of vibrating diaphragm 3, can also be with
The lower section of vibrating diaphragm 3 is set, or the hollowed out area of vibrating diaphragm 3 is set.The position of reflecting part 7 needs to examine with light emitting source 6, photoelectricity
It is corresponding to survey device 5, even if when deformation occurs for vibrating diaphragm 3, it is also desirable to guarantee the light that reflecting part 7 can issue light emitting source 6
Line reflection is to photoelectric detector 5.
Sensor of the invention, the light transmission elastic body of vibrating diaphragm and sealing in the lumen are combined together, extraneous active force
Driving vibrating diaphragm, light transmission elastic body, deformation occurs jointly, and the detection of the change signal by optical signal.Sensor of the invention,
The problem of there is no acoustic resistances, does not need the back chamber of large volume, therefore can substantially reduce the overall dimensions of sensor, enhances
The reliability of sensor.
Multiple groups have can be set in photoelectric detector of the invention, light emitting source, and the quantity of reflecting part is corresponding thereto.Such as it shakes
Film is circular vibrating diaphragm, and photoelectric detector, light emitting source can be set four groups, be uniformly distributed in a circumferential direction, reflecting part is set
There are four setting, four groups of photoelectric detectors, light emitting sources are respectively corresponded.
Wherein, every group of photoelectric detector, in light emitting source, light emitting source can be multiple, the corresponding photoelectricity of multiple light emitting sources
Detector no longer illustrates herein.
Sensor of the invention not only can be applied in microphone, be also applied to pressure sensor, displacement sensing
In device.Such as when being applied in pressure sensor, vibrating diaphragm can drive vibration to extraneous presser sensor, the variation of ambient pressure
Deformation occurs for film, light transmission elastic body.When being applied in displacement sensor, a drive rod can be set and vibrating diaphragm 3 is connected to one
It rises, by drive rod promotion vibrating diaphragm 3, deformation occurs for light transmission elastic body, will not enumerate herein.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (10)
1. a kind of sensor characterized by comprising
Shell with hollow cavity and upper end opening is provided in the bottom end of the housing cavity for towards shell nozzle end
The light emitting source to emit beam, and the photoelectric detector for receiving reflection light；
The light transmission elastic body for being filled in housing cavity and covering light emitting source, photoelectric detector；
The vibrating diaphragm for being carried on shell nozzle end and fitting together with light transmission elastic body, the vibrating diaphragm are configured as in external environment
Variation under deformation occurs with light transmission elastic body；Reflecting part is provided on the vibrating diaphragm, the reflecting part is configured as to send out
The light that light source issues reflexes on photoelectric detector.
2. sensor according to claim 1, it is characterised in that: the mechanical sensitivity of the light transmission elastic body be less than or
Equal to the mechanical sensitivity of vibrating diaphragm.
3. sensor according to claim 1, it is characterised in that: the shell includes the cavity surrounded by sidewall portion, with
And the bottom of closed side wall subordinate's end opening；The light emitting source, photoelectric detector are arranged on bottom.
4. sensor according to claim 3, it is characterised in that: the bottom is circuit board, in the outer of the circuit board
Side is additionally provided with for external pad or pin.
5. sensor according to claim 1, it is characterised in that: the contact surface of the light transmission elastic body and vibrating diaphragm is flat
Face.
6. sensor according to claim 1, it is characterised in that: the contact surface of the light transmission elastic body and vibrating diaphragm is convex
Or recessed curved surface.
7. sensor according to claim 1, it is characterised in that: the light emitting source is laser diode；The photoelectricity inspection
Survey device is quadrant photodetector.
8. sensor according to claim 1, it is characterised in that: the reflecting part is the metallic film being formed on vibrating diaphragm
Layer.
9. sensor according to claim 1, it is characterised in that: the bottom of the housing cavity is provided with multiple groups photoelectricity
Detector, light emitting source, the quantity of the photoelectric detector is corresponding thereto.
10. sensor according to any one of claims 1 to 9, it is characterised in that: the sensor is microphone, pressure
Sensor, displacement sensor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772091.9A CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
| PCT/CN2019/088915 WO2020010950A1 (en) | 2018-07-13 | 2019-05-29 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810772091.9A CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108989919A true CN108989919A (en) | 2018-12-11 |
| CN108989919B CN108989919B (en) | 2020-09-22 |
Family
ID=64537557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810772091.9A Active CN108989919B (en) | 2018-07-13 | 2018-07-13 | Sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108989919B (en) |
| WO (1) | WO2020010950A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112019985A (en) * | 2020-10-15 | 2020-12-01 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160999C (en) * | 1997-05-08 | 2004-08-04 | 艾利森公司 | Sound transducer and method having light detector for detecting displacement of transducer diaphragm |
| CN201118979Y (en) * | 2007-07-09 | 2008-09-17 | 祝文光 | Semiconductor laser microphone |
| CN101646121A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Microphone module |
| CN103154683A (en) * | 2011-03-22 | 2013-06-12 | 松下电器产业株式会社 | Optical microphone |
| CN103492832A (en) * | 2011-04-08 | 2014-01-01 | 株式会社村田制作所 | Displacement sensor, displacement detecting apparatus, and operation device |
| CN103901556A (en) * | 2012-12-27 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric conversion module |
| CN104113813A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | MEMS fiber microphone |
| CN105452832A (en) * | 2013-06-06 | 2016-03-30 | 丹麦技术大学 | All-optical pressure sensor |
| CN106153227A (en) * | 2016-08-31 | 2016-11-23 | 贾岳杭 | The stress and strain detection device measured based on intensity of illumination |
-
2018
- 2018-07-13 CN CN201810772091.9A patent/CN108989919B/en active Active
-
2019
- 2019-05-29 WO PCT/CN2019/088915 patent/WO2020010950A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1160999C (en) * | 1997-05-08 | 2004-08-04 | 艾利森公司 | Sound transducer and method having light detector for detecting displacement of transducer diaphragm |
| CN201118979Y (en) * | 2007-07-09 | 2008-09-17 | 祝文光 | Semiconductor laser microphone |
| CN101646121A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Microphone module |
| CN103154683A (en) * | 2011-03-22 | 2013-06-12 | 松下电器产业株式会社 | Optical microphone |
| CN103492832A (en) * | 2011-04-08 | 2014-01-01 | 株式会社村田制作所 | Displacement sensor, displacement detecting apparatus, and operation device |
| CN103901556A (en) * | 2012-12-27 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Photoelectric conversion module |
| CN105452832A (en) * | 2013-06-06 | 2016-03-30 | 丹麦技术大学 | All-optical pressure sensor |
| CN104113813A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | MEMS fiber microphone |
| CN106153227A (en) * | 2016-08-31 | 2016-11-23 | 贾岳杭 | The stress and strain detection device measured based on intensity of illumination |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112019985A (en) * | 2020-10-15 | 2020-12-01 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
| CN112019985B (en) * | 2020-10-15 | 2021-01-22 | 潍坊歌尔微电子有限公司 | Microphone structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020010950A1 (en) | 2020-01-16 |
| CN108989919B (en) | 2020-09-22 |
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Effective date of registration: 20200804 Address after: 261061 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
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