CN112004640B - 具备研磨垫的表面性状测定装置的研磨装置及研磨系统 - Google Patents

具备研磨垫的表面性状测定装置的研磨装置及研磨系统 Download PDF

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Publication number
CN112004640B
CN112004640B CN201980026985.6A CN201980026985A CN112004640B CN 112004640 B CN112004640 B CN 112004640B CN 201980026985 A CN201980026985 A CN 201980026985A CN 112004640 B CN112004640 B CN 112004640B
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China
Prior art keywords
polishing
polishing pad
surface texture
dressing
texture measuring
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CN201980026985.6A
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English (en)
Chinese (zh)
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CN112004640A (zh
Inventor
神木启佑
丸山徹
本岛靖之
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Ebara Corp
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Ebara Corp
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Priority claimed from PCT/JP2019/017691 external-priority patent/WO2019208712A1/ja
Publication of CN112004640A publication Critical patent/CN112004640A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN201980026985.6A 2018-04-26 2019-04-25 具备研磨垫的表面性状测定装置的研磨装置及研磨系统 Active CN112004640B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018-085143 2018-04-26
JP2018085143 2018-04-26
JP2019-071994 2019-04-04
JP2019071994A JP7269074B2 (ja) 2018-04-26 2019-04-04 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム
PCT/JP2019/017691 WO2019208712A1 (ja) 2018-04-26 2019-04-25 研磨パッドの表面性状測定装置を備えた研磨装置および研磨システム

Publications (2)

Publication Number Publication Date
CN112004640A CN112004640A (zh) 2020-11-27
CN112004640B true CN112004640B (zh) 2023-01-31

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CN201980026985.6A Active CN112004640B (zh) 2018-04-26 2019-04-25 具备研磨垫的表面性状测定装置的研磨装置及研磨系统

Country Status (6)

Country Link
US (1) US11958161B2 (https=)
JP (1) JP7269074B2 (https=)
KR (1) KR102699351B1 (https=)
CN (1) CN112004640B (https=)
SG (1) SG11202010259SA (https=)
TW (1) TWI830730B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TWI856837B (zh) * 2019-03-21 2024-09-21 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
TWI765192B (zh) 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7390945B2 (ja) * 2020-03-19 2023-12-04 株式会社荏原製作所 研磨装置、情報処理システム及びプログラム
JP2022112194A (ja) * 2021-01-21 2022-08-02 株式会社荏原製作所 研磨パッドの表面性状測定装置、研磨パッドの表面性状測定方法、および研磨パッドの表面性状判定方法
JP7726611B2 (ja) * 2021-03-04 2025-08-20 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JP7345867B2 (ja) * 2021-04-08 2023-09-19 株式会社ナガセインテグレックス 砥面判定装置、学習器、判定プログラム、および砥面判定方法
KR20230151901A (ko) * 2022-04-26 2023-11-02 가부시키가이샤 에바라 세이사꾸쇼 표면 성상 측정 시스템, 표면 성상 측정 방법, 연마 장치 및 연마 방법
KR102851780B1 (ko) * 2022-09-20 2025-08-29 에프엔에스테크 주식회사 Cmp 패드 검사 자동화 장치
KR102612601B1 (ko) * 2022-10-17 2023-12-12 주식회사 서연테크 반도체 공정용 정밀 석정반의 제작 시스템
TWI877961B (zh) * 2023-12-20 2025-03-21 聯策科技股份有限公司 研磨墊檢測裝置、系統及方法

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JPH05312526A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd レーザー計測器
JPH10197219A (ja) * 1997-01-16 1998-07-31 Mitsubishi Heavy Ind Ltd 管形状測定装置
JPH10296615A (ja) * 1997-04-25 1998-11-10 Okamoto Kosaku Kikai Seisakusho:Kk 研磨布特性検出装置およびシステム
JPH10315131A (ja) * 1997-05-23 1998-12-02 Hitachi Ltd 半導体ウエハの研磨方法およびその装置
JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
CN201610885U (zh) * 2010-03-02 2010-10-20 叶春煌 一种定位销机构
JP2016209951A (ja) * 2015-05-08 2016-12-15 株式会社ディスコ 乾式研磨装置

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JP3106849B2 (ja) * 1994-05-19 2000-11-06 日産自動車株式会社 塗装面性状測定装置
JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
WO2001058644A1 (en) 2000-02-10 2001-08-16 Applied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
KR200337279Y1 (ko) 2003-08-26 2004-01-07 테이코쿠 덴소 가부시키가이샤 경질원반의 연마장치
JP2006263876A (ja) 2005-03-24 2006-10-05 Renesas Technology Corp 研磨装置、研磨方法および半導体装置の製造方法
JP2007019434A (ja) 2005-07-11 2007-01-25 Disco Abrasive Syst Ltd 研磨パッド形状修正装置および研磨装置
US20140273752A1 (en) 2013-03-13 2014-09-18 Applied Materials, Inc. Pad conditioning process control using laser conditioning
CN104325283B (zh) * 2014-10-27 2017-01-18 北京金风科创风电设备有限公司 螺栓紧固装置
JP6465345B2 (ja) * 2014-12-26 2019-02-06 株式会社荏原製作所 研磨パッドの表面性状測定方法および装置
US10369675B2 (en) 2015-01-07 2019-08-06 Ebara Corporation CMP apparatus having polishing pad surface property measuring device
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
KR101657993B1 (ko) 2015-07-14 2016-09-20 지앤피테크놀로지 주식회사 인쇄회로기판 등 판상가공물 연마용 화학기계적 연마장치
JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05312526A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd レーザー計測器
JPH10197219A (ja) * 1997-01-16 1998-07-31 Mitsubishi Heavy Ind Ltd 管形状測定装置
JPH10296615A (ja) * 1997-04-25 1998-11-10 Okamoto Kosaku Kikai Seisakusho:Kk 研磨布特性検出装置およびシステム
JPH10315131A (ja) * 1997-05-23 1998-12-02 Hitachi Ltd 半導体ウエハの研磨方法およびその装置
JP2001198794A (ja) * 2000-01-21 2001-07-24 Ebara Corp 研磨装置
CN201610885U (zh) * 2010-03-02 2010-10-20 叶春煌 一种定位销机构
JP2016209951A (ja) * 2015-05-08 2016-12-15 株式会社ディスコ 乾式研磨装置

Also Published As

Publication number Publication date
KR20210002580A (ko) 2021-01-08
JP7269074B2 (ja) 2023-05-08
SG11202010259SA (en) 2020-11-27
US20210370461A1 (en) 2021-12-02
JP2019193970A (ja) 2019-11-07
CN112004640A (zh) 2020-11-27
US11958161B2 (en) 2024-04-16
KR102699351B1 (ko) 2024-08-30
TW201946143A (zh) 2019-12-01
TWI830730B (zh) 2024-02-01

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