CN111992893A - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN111992893A CN111992893A CN202010277835.7A CN202010277835A CN111992893A CN 111992893 A CN111992893 A CN 111992893A CN 202010277835 A CN202010277835 A CN 202010277835A CN 111992893 A CN111992893 A CN 111992893A
- Authority
- CN
- China
- Prior art keywords
- optical system
- processing
- mask
- laser
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 67
- 238000005286 illumination Methods 0.000 claims abstract description 27
- 238000013016 damping Methods 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 238000004381 surface treatment Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 34
- 238000002679 ablation Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019098389A JP7278868B2 (ja) | 2019-05-27 | 2019-05-27 | レーザ加工装置 |
JP2019-098389 | 2019-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111992893A true CN111992893A (zh) | 2020-11-27 |
Family
ID=73461720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010277835.7A Pending CN111992893A (zh) | 2019-05-27 | 2020-04-10 | 激光加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7278868B2 (ja) |
KR (1) | KR102627053B1 (ja) |
CN (1) | CN111992893A (ja) |
TW (1) | TW202042948A (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1691293A (zh) * | 2004-04-23 | 2005-11-02 | 株式会社半导体能源研究所 | 激光照射设备和制造半导体器件的方法 |
KR20060012398A (ko) * | 2004-08-03 | 2006-02-08 | 주식회사 이오테크닉스 | 오차 보정이 가능한 폴리곤 미러를 이용한 레이저 가공장치 |
JP2008068275A (ja) * | 2006-09-13 | 2008-03-27 | Hiraide Seimitsu:Kk | ビーム加工装置およびビーム観察装置 |
JP2008147242A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Via Mechanics Ltd | プリント基板のレーザ加工方法 |
CN101878088A (zh) * | 2007-11-27 | 2010-11-03 | 三星钻石工业股份有限公司 | 激光加工装置 |
CN103358018A (zh) * | 2012-03-28 | 2013-10-23 | 东丽工程株式会社 | 激光光轴校准方法和利用该方法的激光加工装置 |
CN105026098A (zh) * | 2013-02-22 | 2015-11-04 | 古河电气工业株式会社 | 激光焊接装置以及激光焊接方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001079678A (ja) | 1999-09-13 | 2001-03-27 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
JP2001096390A (ja) | 1999-09-29 | 2001-04-10 | Sumitomo Heavy Ind Ltd | レーザ加工装置用コンタクトマスクのクリーニング方法及びマスククリーニング機構付きレーザ加工装置 |
-
2019
- 2019-05-27 JP JP2019098389A patent/JP7278868B2/ja active Active
-
2020
- 2020-02-14 TW TW109104661A patent/TW202042948A/zh unknown
- 2020-02-21 KR KR1020200021531A patent/KR102627053B1/ko active IP Right Grant
- 2020-04-10 CN CN202010277835.7A patent/CN111992893A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1691293A (zh) * | 2004-04-23 | 2005-11-02 | 株式会社半导体能源研究所 | 激光照射设备和制造半导体器件的方法 |
KR20060012398A (ko) * | 2004-08-03 | 2006-02-08 | 주식회사 이오테크닉스 | 오차 보정이 가능한 폴리곤 미러를 이용한 레이저 가공장치 |
JP2008068275A (ja) * | 2006-09-13 | 2008-03-27 | Hiraide Seimitsu:Kk | ビーム加工装置およびビーム観察装置 |
JP2008147242A (ja) * | 2006-12-06 | 2008-06-26 | Hitachi Via Mechanics Ltd | プリント基板のレーザ加工方法 |
CN101878088A (zh) * | 2007-11-27 | 2010-11-03 | 三星钻石工业股份有限公司 | 激光加工装置 |
CN103358018A (zh) * | 2012-03-28 | 2013-10-23 | 东丽工程株式会社 | 激光光轴校准方法和利用该方法的激光加工装置 |
CN105026098A (zh) * | 2013-02-22 | 2015-11-04 | 古河电气工业株式会社 | 激光焊接装置以及激光焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202042948A (zh) | 2020-12-01 |
KR20200136304A (ko) | 2020-12-07 |
KR102627053B1 (ko) | 2024-01-19 |
JP2020192550A (ja) | 2020-12-03 |
JP7278868B2 (ja) | 2023-05-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7499180B2 (en) | Alignment stage, exposure apparatus, and semiconductor device manufacturing method | |
KR20180105079A (ko) | 레이저 가공 장치 | |
KR102192600B1 (ko) | 마킹 장치 및 패턴 생성 장치 | |
JP5556774B2 (ja) | 露光装置 | |
JPH0945608A (ja) | 面位置検出方法 | |
TW200807164A (en) | Exposure apparatus and device manufacturing method | |
KR20080084583A (ko) | 레이저 가공 장치 | |
KR100907779B1 (ko) | 기판 이동 장치 | |
JP2024014997A (ja) | アブレーション加工用の加工装置および加工方法 | |
US20090316127A1 (en) | Substrate, and method and apparatus for producing the same | |
KR102033059B1 (ko) | 노광 장치 및 그 고정 방법 | |
CN112272966B (zh) | 转移装置、使用方法和调整方法 | |
KR102627053B1 (ko) | 레이저 가공 장치 | |
CN115229361A (zh) | 激光加工装置的调整方法和激光加工装置 | |
JP3754743B2 (ja) | 表面位置設定方法、ウエハ高さ設定方法、面位置設定方法、ウエハ面位置検出方法および露光装置 | |
CN116060797A (zh) | 照明光学系统和激光加工装置 | |
JP2023066564A (ja) | 照明光学系及びレーザ加工装置 | |
CN116060799A (zh) | 照明光学系统和激光加工装置 | |
JP4487688B2 (ja) | ステップ式近接露光装置 | |
TW202317297A (zh) | 加工裝置、加工方法及基板的製造方法 | |
CN118104402A (zh) | 加工装置、加工方法及基板的制造方法 | |
JP2006098774A (ja) | 近接露光装置 | |
JP2005017341A (ja) | 光照射装置 | |
JP2006210803A (ja) | ステップ式近接露光装置 | |
JP2006120777A (ja) | ウエハ撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |