CN1119833C - 封装的集成电路器件 - Google Patents

封装的集成电路器件 Download PDF

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CN1119833C
CN1119833C CN98114873A CN98114873A CN1119833C CN 1119833 C CN1119833 C CN 1119833C CN 98114873 A CN98114873 A CN 98114873A CN 98114873 A CN98114873 A CN 98114873A CN 1119833 C CN1119833 C CN 1119833C
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integrated circuits
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CN1205550A (zh
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朴相昱
白亨吉
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SK Hynix Inc
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Hyundai Electronics Industries Co Ltd
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Abstract

一种封装的集成电路器件，可将封装翘曲降低到最小程度，并抑制空隙的形成。其包括：一集成电路芯片，在芯片彼此相对的两侧有以各个槽的形式出现的焊盘，而且焊盘槽垂直地贯穿芯片；多个内引线结构，每个内引线结构包括一板形的内引线和一挡块，各内引线垂直地插在对应的焊盘中，挡块形成为垂直于内引线并在内引线之上，并且挡块水平地放在芯片的上表面之上，以防止内引线和芯片脱离；以及一个用于封装芯片和内引线结构的塑模。

Description

封装的集成电路器件
技术领域
本发明涉及一种封装的集成电路器件，更具体地说，涉及在塑模中封装的具有多条导电引线的半导体集成电路器件。
背景技术
在半导体集成电路芯片或基片的表面上具有多条引线的半导体集成电路的封装有时称作“引线在芯片之上”(LOC，lead-on-chip或lead-over-chip)型封装。LOC型封装的具体结构示于图1中。
参照图1，LOC型封装包括一个集成电路芯片1和通过粘合剂6将其贴在集成电路芯片1的表面上的引线框架2。引线框架有内引线21和外引线，内引线将信号传送给芯片1，外引线与外部装置，诸如印刷电路板电连接。内引线21通过诸如金丝(导线)的金属线5与芯片1的焊盘电连接。芯片1和内引线21封装在塑模3中。
LOC型封装的优点在于减小了集成电路的厚度，并基本防止出现裂纹的现象。
然而，LOC型封装的结构是不对称的，特别是在垂直方向上。这是由于在成模过程中塑模3非平滑地流淌造成的。当塑模3的流淌不平滑时，就会产生封装翘曲，并在塑模3中形成空隙，而封装翘曲则会导致封装失败。而且，图1所示的LOC型封装在传送信号时速度很慢，这是因为在芯片1和内引线21之间的电连接是由金属导线5完成的。另外，图1所示的LOC型封装，由于它的引线高度(LH)很短，因此外引线的焊点至衬底的阻力就很小，这也是LOC型封装的一个缺点。还有一点就是，图1所示的LOC型封装不易将芯片1产生的热量散发掉。
发明内容
由于LOC型封装有上述的不足，因此本发明的一个目的就是提供一种有对称结构的封装集成电路器件，以把封装翘曲减少到最低程度，并阻止塑模中空隙的形成。
本发明的另一个目的是提供一种封装的集成电路器件，以能加快信号传递到集成电路芯片的速度。
本发明的再一个目的是提供一种封装的集成电路器件，以使器件有足够的引线高度来增大焊点由外引线至衬底的阻力。
本发明的又一个目的是提供一种封装的集成电路器件，以能容易地将集成电路芯片产生的热量散发掉。
根据本发明，提供一种封装的集成电路器件，包括：一个集成电路芯片，在芯片彼此相对的两侧有以各个槽的形式出现的焊盘，而且每个焊盘槽都垂直地贯穿芯片；多个内引线结构，每一个内引线结构包括一个板形的内引线和一个挡块，各个内引线垂直地插在对应的焊盘中，该挡块形成为垂直于内引线并在内引线之上，并且该挡块水平地放在芯片的上表面之上，以防止内引线和芯片脱离；以及一个用于封装芯片和内引线结构的塑模；外引线，它一方面和内引线电连接，另一方面和外部装置电连接。
根据本发明，一种封装的集成电路器件包括一个集成电路芯片，而此芯片在它彼此相对的两侧有以各个槽的形式出现的焊盘。集成电路芯片中的每个焊盘槽都是垂直地贯穿芯片而形成的。焊盘槽的表面覆盖着一层具有导电性和可焊性的材料，如焊料。每一个包括内引线和挡块的多个内引线结构插入焊盘槽中并与这些焊盘电连接，并且在内引线结构中和各焊盘接触的那部分的表面也都涂有一层具有导电性和可焊性的材料，如焊料。
每个内引线呈板形(plate shape)并垂直地插在对应的各个焊盘槽中，每个挡块呈板形。而且挡块都在各自的内引线部位形成，以使它水平地位于集成电路芯片的表面上，从而防止内引线和焊盘脱离。在一个实施例中，每个外引线的上部搭在对应的内引线上端，以实现彼此的电连接，这样就使得相应的外引线的上部和下部之间的高度差最大。此时，挡块在各个内引线的中部形成。在另一个实施例中，每个内引线和对应的焊盘槽有相同的垂直长度。挡块在内引线的顶端形成，成弯曲状的外引线和对应的内引线的侧端接触，以实现彼此的电连接。
根据本发明的一种封装的集成电路器件包括一个集成电路芯片，其具有相应的槽的形式的焊盘，板形的内引线直接插在槽中。因此，根据本发明封装的集成电路器件具有对称的结构，在模塑过程中能平滑塑模的流淌，从而将封装翘曲降低到最小程度，并减少塑模中的空隙。同时，由于器件没有使用金属导线，这一点就消除了由于金属导线而产生的信号传输延迟。另外，根据本发明封装的集成电路器件使用了板形内引线，并且内引线分别垂直地插在芯片的各个焊盘中，这样就使得引线高度达到了最大，也就使得外引线的焊点到衬底的阻力最大化。再者，根据本发明封装的集成电路器件使用了导热性能非常好的内引线，而且每个内引线都由上、下表面向外扩展，并一直延伸到塑模的表面附近，这样器件就可以容易地散发芯片产生的热量。
附图说明
通过以下结合附图对本发明的优选实施例的详细描述，上述以及其它的目的、特征和优点将更清楚。附图中：
图1是表现了采用现有工艺的LOC型封装的典型结构的截面图；
图2是表现了根据本发明的第一实施例封装的集成电路器件的截面图；
图3是图2所示的封装的集成电路器件沿线III-III′的截面图；
图4A是表现了图2所示的封装的集成电路器件以槽的形式出现的焊盘的透视图；
图4B是表现了图2所示的封装的集成电路器件中的一个内引线和一个外引线的透视图；
图5是表现了根据本发明的第二实施例封装的集成电路器件的截面图；
图6是表现了根据本发明的第二实施例封装的集成电路器件中焊盘和引线之间的连接的透视图；
图7是表现了根据本发明第三实施例封装的集成电路器件的截面图；
图8是表现了图7所示的封装的集成电路器件的焊盘和引线之间的连接的透视图；
图9是表现了根据本发明的第四实施例封装的集成电路器件的截面图；
图10是表现了图9所示的封装的集成电路器件中的一个焊盘及插在其中的一个内引线框架的透视图；
具体实施方式
参见图2及沿着图2中线III-III′截取的图3，图中表现了根据本发明的第一实施例的一种封装的集成电路器件。此器件包括一个集成电路芯片10。在芯片10彼此相对的两侧以垂直贯穿芯片10的各个槽的形式形成了焊盘12。内引线结构由一个板形的内引线14和一个板形的挡块16组成，并且它插在各个焊盘12的槽中，与焊盘形成电连接。每个内引线14都垂直地插在各个焊盘槽中。而每个挡块16形成为与对应的内引线14垂直，这样，每个挡块16就水平地位于集成电路芯片10的表面，以防止对应的内引线14与焊盘12脱离。外引线18的形状为 状，每个外引线18的上水平部18a堆叠在内引线14的上表面，以使引线高度(LH)最大。塑模3将集成电路芯片10和内引线14包围着。另外，内引线14还从芯片10的上、下表面向外伸出并靠近塑模3的表面延伸，以便可以通过有良好导热性的内引线14容易地将芯片10产生的热量散发掉。
图4A显示了根据本发明的第一实施例在器件中芯片两边形成的槽的形式的焊盘；焊盘12是按照常规蚀刻工艺形成的，包括一个垂直贯穿芯片10的矩形槽11。槽11具有狭窄的宽度，而且它的表面涂有一层既有导电性又有可焊性的材料，如焊料(solder)。
图4B显示了根据本发明的第一实施例插在器件对应焊盘槽中的内引线的结构。内引线结构包括一个内引线14和一个挡块16。内引线14由方形板片构成，并且它的厚度要薄到能插进芯片彼此相对的两侧焊盘槽中，它的尺寸又要足够大，以使它可以由芯片的上、下表面向外伸出。在槽11的表面和挡块16将要与槽11接触的部位都涂有一层既有导电性又有可焊性的材料，如焊料。挡块16具有方形的板片，它形成为垂直于内引线14，并在内引线14上。而且，在内引线14垂直地插入焊盘槽中时，挡块16就水平地位于芯片的上表面，起防止内引线和焊盘槽12脱离的功能。外引线18的上水平部分18a叠置在内引线14的上表面，以实现彼此的电连接。
根据本发明的第一实施例封装的集成电路器件具有内引线14，每个内引线都插在对应的各个焊盘槽中，以使器件有对称的结构。因此，在用塑模3封装集成电路芯片10和内引线14时，塑模的流淌是平滑的。
图5是表现了根据本发明的第二实施例封装的集成电路器件的截面图。和第一实施例类似，作为图5所示器件中内引线结构一部分的内引线114也插在芯片10彼此相对的两侧焊盘槽中，由各个挡块116支承。
然而，如图6所示的根据本发明的第二实施例封装的集成电路器件中焊盘和引线之间连接的透视图，每个内引线114的垂直长度和对应的各个焊盘槽11的长度一样。因此，在被插入焊盘槽中时，内引线114不能从槽11向外伸出，从而不会阻碍在封装芯片和内引线的成模过程中塑模3的流动。为了防止内引线从焊盘中脱离，各个挡块116形成于对应的各个内引线114的顶端。这里，即使挡块116沿着它的宽度方向中间部分被定位在图6所示的内引线114的上端，内引线也可能会以上部弯曲90°来充当挡块的作用。同时，插在焊盘槽中的内引线114暴露侧端和 状的外引线118的垂直部118a紧贴在一起，以便每个外引线和相应的内引线114保持充分的接触，并有最大的引线高度LH。
图7是表现了根据本发明的第三个实施例封装的集成电路器件的截面图。参见图7，它显示了在制造时不同于本发明的第一、第二实施例中器件的芯片尺寸(chip size package)封装方案。图7所示的芯片尺寸封装器件包括集成电路芯片，而芯片在它彼此相对的两侧有以槽的形式出现的焊盘，内引线构件就插在焊盘槽中，以实现彼此的电连接。每个内引线结构由一个垂直插在焊盘中的内引线124和一个挡块126组成。挡块126在对应的各个内引线的上表面形成并暴露在器件外，起到电连接的作用。
图8是表现了图7所示的集成电路器件中焊盘和引线之间连接的透视图。
参见图8，每个挡块126形成为和内引线的上表面垂直接触，而每个内引线124都呈方板形，并且和槽11的尺寸相同。每个挡块126都有导电性，并有一个沿着内引线上表面的长度方向向外一直延伸超出了内引线124的部分126a。结果，在内引线124插入焊盘槽11时，每个挡块126的延伸部分126a由芯片10的这一侧扩展并向下弯曲与芯片的这一侧平行。当这样的芯片尺寸封装器件被安装在如印制电路板这样的外部装置上时，挡块126就起实现芯片10与外部装置之间电连接的作用。
图9是表现了根据本发明的第四实施例封装的集成电路器件的截面图。和上述的第三实施例相似，本发明的第四实施例也是用于芯片尺寸封装。因此，在图7至图10中，相同的标号指示有相同功能的部件，然而，和第三实施例不同的是，第四实施例中器件的每个挡块没有上述第三实施例中的引伸部分。因此在制造器件的过程中就不需要形成挡块136。这是通过使挡块136没有延伸出芯片10的部分而实现的。
图10是一个透视图，表现了图9所示的集成电路器件中的焊盘和插在焊盘中的内引线结构。参见图10，它显示了一个内引线结构，其中包括插在焊盘12的槽11中的内引线124和位于焊盘12上表面的挡块136。挡块136沿着内引线124上表面的长度方向延伸形成了它的宽度部分，而它的长度和内引线124的上表面的长度相等。因此，当内引线124插入焊盘槽11时，挡块136不从芯片10的这一侧向外扩展。当按照第四实施例制造的芯片尺寸封装器件安装在如印制电路板这样的外部装置上时，每个挡块136起着将芯片10和外部装置实现电连接的作用。
在根据本发明的第三、第四种实施例封装的集成电路器件中，由内引线和有导电性的挡块组成的内引线结构担当将芯片和外部器件实现电连接的作用。然而，除了起电连接的作用外，在芯片尺寸封装中内引线结构也可被用作散发芯片产生的热量的热量散发器。为了将内引线构件用作热量散发器，至少要在集成电路芯片的一侧形成至少一个不被用于焊盘的槽。插在槽中的内引线结构由用导热材料构成的内引线和挡块组成，并且挡块是在内引线的上表面形成的。而且，在封装集成电路芯片的塑模形成以后，挡块的外表面暴露在器件外。
正如上面所描述的，根据本发明封装的集成电路器件包括直接插入芯片两侧焊盘槽中的内引线，以使器件有对称的结构。这样，由于塑模非平滑地流淌而造成的封塑翘曲就被降低到了最小程度，并且形成的空隙也减少了。而且，在根据本发明封装的集成电路器件中是用内引线插入焊盘槽中实现电连接的而没有使用金属导线。因此，由于金属导线而产生的信号传输延迟被去除了。另外，在按照本发明封装的集成电路器件中，引线高度比采用现在工艺封装的引线高度要高，因此就使得将外引线连到衬底的焊点处的电阻值达到了最大。最后，按照本发明封装的集成电路器件包括具有良好导热性的内引线，并且每个内引线都从芯片的上、下表面向外扩展，并延伸到塑模的上、下表面附近，从而使得它可以容易地散发掉芯片产生的热量。
尽管已结合具体的实施例描述了本发明，但是以上的描述并不用于限定本发明，本领域的普通技术人员参照以上描述可以作出各种变型。因此，后附的权利要求覆盖对上述具体实施例的任何改进。

Claims (9)

1.一种封装的集成电路器件，包括：
一个集成电路芯片，在芯片彼此相对的两侧有以各个槽的形式出现的焊盘，而且每个焊盘槽都垂直地贯穿芯片；
多个内引线结构，每一个内引线结构包括一个板形的内引线和一个挡块，各个内引线垂直地插在对应的焊盘中，该挡块形成为垂直于内引线并在内引线之上，并且该挡块水平地放在芯片的上表面之上，以防止内引线和芯片脱离；以及
一个用于封装芯片和内引线结构的塑模；
外引线，它一方面和内引线电连接，另一方面和外部装置电连接。
2.根据权利要求1所述的封装的集成电路器件，其中，各个内引线的长度比各个焊盘槽的长度长，每个挡块形成于各个内引线的中间高度部分，而各个外引线连接于相应的内引线的顶端。
3.根据权利要求2所述的封装的集成电路器件，其中，各个外引线具有
Figure C9811487300021
的形状，其上水平部分连接于相应的内引线的顶端。
4.根据权利要求1所述的封装的集成电路器件，其中，各个内引线具有与各个槽相等的长度，各个挡块形成于相应的内引线的顶端，而各个外引线连接于相应的内引线的暴露侧端。
5.根据权利要求4所述的封装的集成电路器件，其中，各个外引线具有 的形状，其竖直部分连接于相应的内引线的暴露侧端。
6.根据权利要求1所述的封装的集成电路器件，其中，各个内引线具有与各个槽相同的尺寸；每个挡块由具有导电性的材料制成，并且其形成于相应的内引线的顶端，而且其外表面暴露在器件外，从而充当实现器件与外部电连接的作用。
7.根据权利要求1所述的封装的集成电路器件，其中，每个挡块具有一个沿着对应的内引线的长度方向从相应的内引线的顶端伸出的部分，并且伸出部分向下弯曲90°，并与塑模的外表面接触。
8.根据权利要求7所述的封装的集成电路器件，其中，每个挡块的长度和对应的内引线顶端的长度相同。
9.根据权利要求1所述的封装的集成电路器件，还包括：
一个热量散发器，它包括一个导热板和一个挡块，该导热板垂直插在芯片的槽中，该挡块形成为与该导热板垂直并位于该导热板上，该挡块水平地位于芯片的上表面，以防止导热板和芯片脱离。
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