CN111965212A - Thermophysical property calculation method, thermophysical property test system, electronic device, and storage medium - Google Patents
Thermophysical property calculation method, thermophysical property test system, electronic device, and storage medium Download PDFInfo
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Abstract
The invention discloses a thermophysical property calculation method, a thermophysical property test system, electronic equipment and a storage medium, and relates to the technical field of thermophysical property test. The thermophysical property calculation method includes: acquiring temperature change information of the reference object and temperature change information of the measured sample; and calculating the thermophysical property parameter of the tested sample according to the temperature change information of the reference object and the temperature change information of the tested sample. The invention calculates the thermophysical property parameter of the measured sample by acquiring the temperature change information of the reference object and the temperature change information of the measured sample. Compared with the prior art that the thermophysical property is tested by using the current and the thermophysical property parameter is calculated by using the temperature, the temperature is the most direct expression form of the thermophysical property, so that the test error of the thermophysical property parameter can be reduced, and the accuracy of the test result is improved.
Description
Technical Field
The present invention relates to the field of thermophysical property testing technologies, and in particular, to a thermophysical property calculation method, a thermophysical property testing system, an electronic device, and a storage medium.
Background
Thermophysical property refers to the thermophysical property of a material, and is a parameter indicating a thermal phenomenon of the material. At present, most of techniques for testing thermophysical properties utilize current testing, and the error of a test result is large.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a thermophysical property calculation method which can reduce the test error of thermophysical property parameters and improve the accuracy of test results.
The invention also provides a thermophysical property testing system.
The invention further provides the electronic equipment.
The invention also provides a computer readable storage medium.
The thermophysical property calculation method is applied to a thermophysical property test system, the thermophysical property test system comprises a thermoelectric module, a reference object and a tested sample, the thermoelectric module is used for heating the reference object, and the reference object is in contact connection with the tested sample, and the method comprises the following steps:
acquiring temperature change information of the reference object and temperature change information of the measured sample;
and calculating the thermophysical property parameter of the tested sample according to the temperature change information of the reference object and the temperature change information of the tested sample.
The thermophysical property calculation method provided by the embodiment of the invention has at least the following beneficial effects: and calculating the thermophysical property parameter of the measured sample by acquiring the temperature change information of the reference object and the temperature change information of the measured sample. Compared with the prior art that the thermophysical property is tested by using the current and the thermophysical property parameter is calculated by using the temperature, the temperature is the most direct expression form of the thermophysical property, so that the test error of the thermophysical property parameter can be reduced, and the accuracy of the test result is improved.
According to some embodiments of the invention, the thermophysical parameters comprise one or more of: thermal conductivity, heat capacity, and thermal diffusivity.
According to some embodiments of the invention, the calculating the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample comprises:
calculating the heat flow flowing into the tested sample according to the temperature change information of the reference object;
and calculating the thermal conductivity of the tested sample according to the heat flow flowing into the tested sample and the temperature change information of the tested sample.
According to some embodiments of the invention, the calculating the heat flow into the measured sample according to the temperature change information of the reference object comprises:
calculating the heat flow into the sample under test using the following equation:
wherein ,jsHeat flow into the sample to be measured j0The amplitude of the heat flow flowing into the sample to be measured, omega is the frequency of the heat source, the heat source is connected with the thermoelectric module, and lambda isTIs the thermal conductivity of the reference, T is the temperature of a point on the reference, X is the position of the point, ATIs the cross-sectional area of the reference, AsIs the cross-sectional area, x, of the sample to be measuredjIs the lap point, x, of the reference and the measured samplej -Is the left-hand point of approach, x, of the said lap jointj +Is a right-hand point of approach to the point of overlap;
calculating the thermal conductivity of the tested sample according to the heat flow flowing into the tested sample and the temperature change information of the tested sample, and the method comprises the following steps:
setting different heat source frequencies, calculating temperature change amplitude values under the different heat source frequencies, and calculating a slope through data fitting, wherein the slope is the heat conductivity of the tested sample and the heat flow amplitude value j flowing into the tested sample0Using said slopeAnd the magnitude j of the heat flow into the sample to be measured0And calculating the thermal conductivity of the tested sample.
According to some embodiments of the invention, the calculating the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample further comprises:
and calculating the thermal diffusion coefficient of the measured sample according to the temperature change information of the measured sample.
According to some embodiments of the invention, the calculating the thermal diffusivity of the measured sample according to the temperature change information of the measured sample comprises:
calculating the thermal diffusivity of the tested sample by using the following formula:
wherein α is a thermal diffusion coefficient of the sample to be measured, L is a distance between two different positions on the sample to be measured, and a1 and a2 are amplitudes of temperature change information of the two different positions, respectively.
According to some embodiments of the invention, the calculating the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample further comprises:
and calculating the heat capacity of the tested sample according to the heat conductivity of the tested sample and the thermal diffusion coefficient of the tested sample.
According to some embodiments of the present invention, the calculating the heat capacity of the measured sample according to the thermal conductivity of the measured sample and the thermal diffusivity of the measured sample comprises:
calculating the heat capacity of the measured sample by using the following formula:
wherein ,CvIs the quiltAnd measuring the heat capacity of the sample, wherein lambda is the thermal conductivity of the sample to be measured, and alpha is the thermal diffusivity of the sample to be measured.
A thermophysical property testing system according to an embodiment of the second aspect of the invention comprises:
a sample to be tested;
the reference object is in contact connection with the tested sample;
a thermoelectric module for heating the reference;
the acquisition module is used for acquiring the temperature change information of the reference object and the temperature change information of the tested sample;
and the calculation module is used for acquiring the temperature change information of the reference object and the temperature change information of the detected sample acquired by the acquisition module, and calculating the thermophysical property parameter of the detected sample according to the temperature change information of the reference object and the temperature change information of the detected sample.
According to some embodiments of the invention, the thermophysical property testing system further comprises:
and the heat sink is respectively in contact connection with the thermoelectric module and the sample to be measured.
According to some embodiments of the invention, the thermophysical property testing system further comprises:
a vacuum chamber;
the thermoelectric module, the reference object, the tested sample and the heat sink are all arranged in the vacuum cavity.
An electronic device according to an embodiment of the third aspect of the present invention includes:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of thermophysical property calculation as described in the first aspect.
A computer-readable storage medium according to an embodiment of the fourth aspect of the present invention is characterized in that the computer-readable storage medium stores computer-executable instructions for causing a computer to execute the thermophysical property calculation method according to the first aspect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a thermophysical property testing system according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a thermophysical property testing system according to another embodiment of the invention;
FIG. 3 is a flowchart of a method for calculating thermophysical properties according to an embodiment of the invention;
FIG. 4 is a flow chart of a method for calculating thermophysical properties according to another embodiment of the invention;
FIG. 5 is a graph showing the temperature of a sample being tested as a function of time according to an embodiment of the present invention;
FIG. 6 is a flow chart of a method for calculating thermophysical properties according to another embodiment of the invention;
FIG. 7 is a flow chart of a method for calculating thermophysical properties according to another embodiment of the invention;
FIG. 8 is a graph illustrating the distribution of the thermal diffusivity of a fiber sample according to another embodiment of the present invention;
FIG. 9 is a data fit of constantan according to another embodiment of the present invention;
FIG. 10 is a graph illustrating the distribution of thermal diffusivity of various materials in accordance with another embodiment of the present invention.
Reference numerals:
the thermoelectric module comprises a first thermoelectric module 100, a second thermoelectric module 200, a reference object 300, a sample 400 to be measured, an acquisition module 500, a calculation module 600, a first heat sink 700, a second heat sink 800, a third heat sink 900 and a vacuum cavity 1000.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
At present, the technology for testing the thermophysical properties of the micro-nano wire mainly comprises methods such as a suspension micro-device method, a T-shaped method, a derivation method, a flash Raman method and a 3omega method, and the methods all have a certain application range, wherein the suspension micro-device method can only be used for testing the thermal conductivity of the micro-nano wire and cannot obtain parameters such as thermal diffusivity, thermal capacity and the like; the flash Raman method can obtain the thermal diffusion coefficient and the thermal conductivity, but needs an expensive high-precision Raman spectrometer; the T-type method and the derivative method thereof can simultaneously test a plurality of thermophysical parameters, but the test process is more complex and consumes longer time, so that the method is not suitable for industrial application; the problem with the 3omega method is that it requires the conductivity of the sample.
Based on the above, the present invention provides a thermophysical property calculation method, a thermophysical property test system, an electronic device, and a storage medium, which can not only reduce the test error of thermophysical property parameters and improve the accuracy of test results, but also calculate thermal diffusivity and thermal capacity.
In a first aspect, an embodiment of the present invention provides a thermophysical property testing system, including:
a sample to be tested;
the reference object is in contact connection with the tested sample;
the thermoelectric module is used for heating the reference object;
the acquisition module is used for acquiring the temperature change information of the reference object and the temperature change information of the measured sample;
and the calculation module is used for acquiring the temperature change information of the reference object and the temperature change information of the measured sample acquired by the acquisition module, and calculating the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample.
In some embodiments, as shown in fig. 1, the thermophysical property testing system includes a first thermoelectric module 100, a second thermoelectric module 200, a reference 300, a sample under test 400, an acquisition module 500, and a calculation module 600. Both ends of the reference object 300 are respectively fixed to the first thermoelectric module 100 and the second thermoelectric module 200, and an external heat source (not shown) heats the reference object 300 through the first thermoelectric module 100 and the second thermoelectric module 200. The sample 400 is contacted with the reference 300, and the point P is the lap joint point of the reference 300 and the sample 400. The reference object 300 may conduct heat, transferring thermal energy to the sample 400. The collecting module 500 collects the temperature variation information of the reference object and the temperature variation information of the measured sample, and sends the temperature variation information to the calculating module 600. The calculation module 600 calculates the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample. Compared with the prior art that the thermophysical property is tested by using the current and the thermophysical property parameter is calculated by using the temperature, the temperature is the most direct expression form of the thermophysical property, so that the test error of the thermophysical property parameter can be reduced, and the accuracy of the test result is improved.
In some embodiments, the first thermoelectric module 100 and the second thermoelectric module 200 may be resistors. When current flows, the resistor generates heat, so that the current is converted into heat.
In some embodiments, reference 300 comprises a thermally conductive metal. Such as a platinum wire, a copper wire, etc.
In some embodiments, the acquisition module 500 may be an infrared camera. The infrared camera collects the change of the temperature on the tested sample along with the time in real time. In some embodiments, the acquisition module 500 may also be a thermocouple.
In some embodiments, the computing module 600 may be a computer or other electronic device with data processing and data computing capabilities.
In some embodiments, the thermophysical property testing system further comprises:
and the heat sink is respectively in contact connection with the thermoelectric module and the sample to be measured.
In some embodiments, as shown in fig. 2, the heat sinks include a first heat sink 700, a second heat sink 800, and a third heat sink 900. The first heat sink 700 is in contact connection with the first thermoelectric module 100, the second heat sink 800 is in contact connection with the second thermoelectric module 200, and the third heat sink 900 is in contact connection with the sample 400.
In some embodiments, the thermal energy emitted by the thermoelectric module and the sample to be tested is absorbed and stored by the heat sink, so that the air can be prevented from being heated and affecting the test effect. The thermoelectric module and the tested sample are in contact connection with the heat sink, the temperature of air is kept constant, the testing precision of thermophysical properties can be improved, and the testing result is more accurate.
In some embodiments, as shown in fig. 2, the thermophysical property testing system further comprises:
a vacuum chamber 1000;
the first thermoelectric module 100, the second thermoelectric module 200, the reference 300, the sample 400 to be measured, the first heat sink 700, the second heat sink 800, and the third heat sink 900 are all disposed within the vacuum chamber 1000.
In some embodiments, the vacuum chamber 1000 can provide a stable testing environment, reducing the impact of air convection on the test.
In a second aspect, an embodiment of the present invention provides a thermal property calculation method, which is applied to the thermal property test system described in the first aspect. As shown in fig. 3, the thermophysical property calculation method includes:
step S100: acquiring temperature change information of a reference object and temperature change information of a measured sample;
step S200: and calculating the thermophysical property parameter of the tested sample according to the temperature change information of the reference object and the temperature change information of the tested sample.
In some embodiments, the temperature data of the reference object 300 and the measured sample 400 are collected (collected by an infrared camera) at the same time, and sent to a computer, and the computer processes the temperature data, plots the temperature change information of the reference object 300 and the measured sample 400, processes the data in the temperature change information by using an algorithm, and solves the thermophysical property parameter of the measured sample 400. Compared with the prior art that the thermophysical property is tested by using the current and the thermophysical property parameter is calculated by using the temperature, the temperature is the most direct expression form of the thermophysical property, so that the test error of the thermophysical property parameter can be reduced, and the accuracy of the test result is improved.
In some embodiments, the thermophysical parameters include thermal conductivity, heat capacity, and thermal diffusivity.
In some embodiments, solving for thermal conductivity requires first calculating the heat flow into the sample being measured. Therefore, as shown in fig. 4, step S200 includes:
step S210: calculating heat flow flowing into the measured sample according to the temperature change information of the reference object;
step S220: and calculating the thermal conductivity of the measured sample according to the heat flow flowing into the measured sample and the temperature change information of the measured sample.
In some embodiments, the heat flow into the sample being measured is calculated using the following equations:
in the formula (1), jsFor the heat flow into the sample to be measured, lambdaTIs the thermal conductivity of the reference (known), T is the temperature of a point on the reference (measurable), X is the position of the point, ATIs the cross-sectional area of the reference (known), AsIs the cross-sectional area (known) of the sample to be measured, xjIs the lap point (i.e. point P in FIG. 1) of the reference object and the sample to be measured, xj -Is the left-hand point of overlap, xj +Is the right-hand point of overlap. When the external environment provides heat sources with different frequencies, the heat flow flowing into the sample to be measured can be expressed by formula (2):
wherein j0In the amplitude of the heat flow into the sample to be measured, ω is the frequency of the heat source, i represents a complex number (e)iωtCos ω t + isin ω t), t is time.
The heat flow amplitude j flowing into the tested sample can be solved by using the formula (1) and the formula (2)0。
In some embodiments, as shown in fig. 5, the temperature of the sample is measured as a function of time. The curve X1 (solid line) and the curve X2 (dashed line) represent the temperature change information of two different positions of the sample to be measured (the position X1 and the position X2 are recorded, and the position X1 is used as a reference point to solve the thermophysical property parameter at the position X2). It can be seen that the temperature variation information is a sinusoidal waveform.
The thermal conductivity is solved using the following equation (3):
in the formula (3), M (X) is the temperature amplitude value of the X position, and lambda is the thermal conductivity,
is the frequency of the sine waveform, dt is the phase difference between the two sine waveforms (see fig. 5), L is the distance between position X1 and position X2, and a1 and a2 are the amplitudes of the two sine waveforms, respectively (see fig. 5).
Suppose a definition:
then there are:
setting different heat source frequencies, such as 0.01Hz, 0.02Hz and 0.03Hz, three groups of values P and Q are correspondingly obtained, and three omega values under three frequencies are obtained by respectively substituting the three groups of values P and Q into formula (4). Meanwhile, under 0.01Hz, 0.02Hz and 0.03Hz, the temperature amplitude value M (X) at the X position has three values, the value of omega and the value of M (X) are fitted to obtain the slope, and the slope value is the slope value
Magnitude j of heat flow0The thermal conductivity λ can be obtained by the above equations (1) and (2).
In some embodiments, as shown in fig. 6, step S200 further includes:
step S230: and calculating the thermal diffusion coefficient of the tested sample according to the temperature change information of the tested sample.
The calculation formula of the thermal diffusivity is as follows:
in the formula (6), α is a thermal diffusivity.
In some embodiments, as shown in fig. 7, step S200 further includes:
step S240: and calculating the heat capacity of the tested sample according to the heat conductivity of the tested sample and the thermal diffusion coefficient of the tested sample.
The heat capacity is calculated as follows:
in the formula (7), CvIs the heat capacity.
In summary, with the combination of the formulas (1) to (7), the present invention can calculate the thermal property parameter of the measured sample by using the known quantity (thermal conductivity of the reference substance) to obtain the unknown quantity: thermal conductivity lambda, heat capacity CvAnd a thermal diffusivity, alpha.
The thermal property parameter obtained as described above is only a thermal property parameter at a certain position on the sample to be measured, and therefore, the thermal property parameter at any position on the sample to be measured can be measured by using the technical solution of the present invention, and the thermal property of the sample to be measured locally or entirely can be studied by taking advantage of this advantage. Three specific application examples are illustrated below.
Application example 1
The temperature change at a plurality of positions on the sample to be measured is measured, and the thermal diffusivity at each position is determined using equation (6). Taking the measured sample as a fiber sample as an example, the distribution of the thermal diffusivity at each position in the fiber direction can be obtained, and the distribution curve chart is shown in fig. 8. In the prior art, due to the limitation of a tested point, the heat diffusion coefficients of a plurality of positions are difficult to test. However, the technical solution of the present invention can solve the problem, and the thermal diffusivity at a plurality of positions can be tested, and the variation trend of the thermal diffusivity can be analyzed through the curve of fig. 8.
Application example two
Providing heat sources with different frequencies for the constantan sample to be measured, collecting corresponding temperature information, and fitting the data by using a formula (5), wherein the fitting result is shown in figure 9. Through slope and heatFlow amplitude j0The thermal conductivity was found to be 22.8W/(mK).
Application example three
The temperature change at a plurality of positions on copper (Cu), constantan (Ni-Cu), polyvinyl alcohol, and carbon nanotube mixed material (PVA-CNT) was measured, and the thermal diffusion coefficient at each position was determined using equation (6). The results of the measurement are shown in fig. 10. FIG. 10(a) shows the measurement results of Cu, and FIG. 10(b) shows the measurement results of Ni-Cu and PVA-CNT.
Wherein the solid line α represents the average value of the thermal expansion coefficient over the entire material, and the dotted line
The local thermal diffusivity on the material is shown. Since Cu is a homogeneous material and the thermal properties of each portion of Cu are the same, as shown in fig. 10(a), the average value of the thermal expansion coefficient over the entire material and the local thermal expansion coefficient do not differ much. However, since Ni-Cu and PVA-CNT are heterogeneous materials and the thermal properties of Ni-Cu and PVA-CNT are significantly different from each other, the average value of the thermal expansion coefficients over the entire material and the local thermal expansion coefficient are greatly different from each other as shown in FIG. 10 (b).
In a third aspect, an embodiment of the present invention provides an electronic device, including:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of calculating a thermophysical property according to the second aspect.
In a fourth aspect, embodiments of the present invention provide a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the method for calculating thermophysical properties according to the second aspect.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (13)
1. The thermophysical property calculation method is applied to a thermophysical property test system, the thermophysical property test system comprises a thermoelectric module, a reference object and a tested sample, the thermoelectric module is used for heating the reference object, and the reference object is in contact connection with the tested sample, and the method comprises the following steps:
acquiring temperature change information of the reference object and temperature change information of the measured sample;
and calculating the thermophysical property parameter of the tested sample according to the temperature change information of the reference object and the temperature change information of the tested sample.
2. The thermophysical property calculation method of claim 1, wherein the thermophysical property parameter includes one or more of: thermal conductivity, heat capacity, and thermal diffusivity.
3. The method of claim 2, wherein the calculating the thermophysical property parameter of the measured sample according to the temperature change information of the reference object and the temperature change information of the measured sample comprises:
calculating the heat flow flowing into the tested sample according to the temperature change information of the reference object;
and calculating the thermal conductivity of the tested sample according to the heat flow flowing into the tested sample and the temperature change information of the tested sample.
4. The method of claim 3, wherein the calculating the heat flow into the sample to be measured based on the temperature change information of the reference object comprises:
calculating the heat flow into the sample under test using the following equation:
wherein ,jsHeat flow into the sample to be measured j0I represents a complex number, t is time, ω is heat source frequency, the heat source is connected to the thermoelectric module, λ is the magnitude of the heat flow into the sample under testTIs the thermal conductivity of the reference, T is the temperature of a point on the reference, X is the position of the point, ATIs the cross-sectional area of the reference, AsIs the cross-sectional area, x, of the sample to be measuredjIs the lap point, x, of the reference and the measured samplej -Is the left-hand point of approach, x, of the said lap jointj +Is a right-hand point of approach to the point of overlap;
calculating the thermal conductivity of the tested sample according to the heat flow flowing into the tested sample and the temperature change information of the tested sample, and the method comprises the following steps:
setting different heat source frequencies, calculating temperature change amplitude values under the different heat source frequencies, and calculating a slope through data fitting, wherein the slope is the heat conductivity of the tested sample and the heat flow amplitude value j flowing into the tested sample0Using the slope and the magnitude of heat flow into the sample being measuredValue j0And calculating the thermal conductivity of the tested sample.
5. The method according to claim 3, wherein the calculating the thermophysical property parameter of the measured sample from the temperature change information of the reference object and the temperature change information of the measured sample further includes:
and calculating the thermal diffusion coefficient of the measured sample according to the temperature change information of the measured sample.
6. The thermophysical property calculation method according to claim 5, wherein calculating the thermal diffusivity of the measured sample from the temperature change information of the measured sample includes:
calculating the thermal diffusivity of the tested sample by using the following formula:
wherein α is a thermal diffusion coefficient of the sample to be measured, L is a distance between two different positions on the sample to be measured, and a1 and a2 are amplitudes of temperature change information of the two different positions, respectively.
7. The method of claim 5, wherein the calculating the thermal property parameter of the sample based on the temperature change information of the reference object and the temperature change information of the sample further comprises:
and calculating the heat capacity of the tested sample according to the heat conductivity of the tested sample and the thermal diffusion coefficient of the tested sample.
8. The method of claim 7, wherein the calculating the heat capacity of the sample based on the thermal conductivity of the sample and the thermal diffusivity of the sample comprises:
calculating the heat capacity of the measured sample by using the following formula:
wherein ,CvLambda is the heat capacity of the tested sample, lambda is the thermal conductivity of the tested sample, and alpha is the thermal diffusivity of the tested sample.
9. A thermophysical property testing system is characterized by comprising:
a sample to be tested;
the reference object is in contact connection with the tested sample;
a thermoelectric module for heating the reference;
the acquisition module is used for acquiring the temperature change information of the reference object and the temperature change information of the tested sample;
and the calculation module is used for acquiring the temperature change information of the reference object and the temperature change information of the detected sample acquired by the acquisition module, and calculating the thermophysical property parameter of the detected sample according to the temperature change information of the reference object and the temperature change information of the detected sample.
10. The thermophysical property testing system of claim 9, further comprising:
and the heat sink is respectively in contact connection with the thermoelectric module and the sample to be measured.
11. The thermophysical property testing system of claim 10, further comprising:
a vacuum chamber;
the thermoelectric module, the reference object, the tested sample and the heat sink are all arranged in the vacuum cavity.
12. An electronic device, comprising:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of calculating a thermophysical property of any of claims 1 to 8.
13. A computer-readable storage medium storing computer-executable instructions for causing a computer to perform the method of calculating thermophysical properties of any one of claims 1 to 8.
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