CN213903386U - Thermal physical property testing device - Google Patents
Thermal physical property testing device Download PDFInfo
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- CN213903386U CN213903386U CN202021569749.5U CN202021569749U CN213903386U CN 213903386 U CN213903386 U CN 213903386U CN 202021569749 U CN202021569749 U CN 202021569749U CN 213903386 U CN213903386 U CN 213903386U
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- 238000012360 testing method Methods 0.000 title claims abstract description 49
- 230000000704 physical effect Effects 0.000 title description 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000002070 nanowire Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 7
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- 238000006243 chemical reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
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Abstract
The utility model discloses a thermophysical property testing arrangement relates to test technical field. The device includes: the thermoelectric module is in contact with a sample to be detected and is used for heating the sample to be detected; a heat sink on which the thermoelectric module is disposed. The utility model discloses can improve the measuring accuracy of thermophysical property, make the test result more accurate.
Description
Technical Field
The utility model belongs to the technical field of the test technique and specifically relates to a thermophysical property testing arrangement is related to.
Background
Thermophysical property refers to the thermophysical property of a material, and is a parameter indicating a thermal phenomenon of the material. In the fields of electronic chip heat dissipation, aerospace, energy conversion and the like, thermophysical properties have become one of the hot spots of research. In the related technology, the material is directly subjected to thermophysical property test, so that the material is easily influenced by environmental factors, the test precision is not high, and the test result is not accurate enough.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a thermophysical property testing arrangement can improve thermophysical property's measuring accuracy, makes the test result more accurate.
According to the utility model discloses thermophysical property testing arrangement, include:
the thermoelectric module is in contact with a sample to be detected and is used for heating the sample to be detected;
a heat sink in contact connection with the thermoelectric module.
According to the utility model discloses thermophysical property testing arrangement has following beneficial effect at least:
besides heating the sample to be tested, the thermoelectric module absorbs and stores other dissipated heat energy by the heat sink, so that the air can be prevented from being heated to influence the testing effect. The thermoelectric module is arranged on the heat sink, the temperature of air is kept constant, the testing precision of thermophysical properties can be improved, and the testing result is more accurate.
According to some embodiments of the present invention, the thermophysical property testing device further comprises:
and the thermoelectric module, the heat sink and the sample to be detected are all arranged in the vacuum cavity.
According to some embodiments of the present invention, the thermophysical property testing device further comprises:
and the acquisition module is used for acquiring the temperature data of the sample to be detected.
According to some embodiments of the invention, the acquisition module comprises an infrared camera.
According to some embodiments of the present invention, the thermophysical property testing device further comprises:
and the calculation module is connected with the acquisition module and used for receiving the temperature data sent by the acquisition module.
According to some embodiments of the present invention, the thermophysical property testing device further comprises:
the signal source is connected with the thermoelectric module and used for providing current for the thermoelectric module, and the thermoelectric module is used for heating the sample to be tested by utilizing the current.
According to some embodiments of the present invention, the heat sink includes a first heat sink and a second heat sink, the one end of the sample to be tested is disposed on the first heat sink, the other end of the sample to be tested is disposed on the thermoelectric module, the thermoelectric module is disposed on the second heat sink.
According to some embodiments of the invention, the thermoelectric module comprises a resistor.
According to some embodiments of the utility model, the sample that awaits measuring includes micro-nano wire rod.
According to some embodiments of the invention, the heat sink comprises a copper block.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a thermophysical property testing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thermophysical property testing apparatus according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a thermophysical property testing apparatus according to another embodiment of the present invention.
Reference numerals:
the thermoelectric module 100, the sample 200 to be measured, the heat sink 300, the first heat sink 310, the second heat sink 320, the vacuum chamber 400, the acquisition module 500, the calculation module 600, and the signal source 700.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
The micro-nano wire is widely applied to the fields of electronic chip heat dissipation, aerospace, energy conversion and the like, and the thermophysical property of the micro-nano wire becomes one of the hot spots of research. However, with the reduction of the size of the material, the thermophysical property measurement technology under the macro scale cannot be applied to the micro-nano scale. Firstly, a temperature sensor with a conventional scale cannot meet the requirement of the spatial resolution of the micro-nano material; secondly, the heat loss ratio of the micro-nano sample is large due to the large surface area of the micro-nano sample, so that a high-precision heat sensor needs to be developed; finally, the energy under the micro-nano scale is not continuous any more, and the temperature is possibly not suitable as the representation of the molecular average kinetic energy any more, thereby providing a challenge to the traditional thermal theory.
In the related art, the testing precision of the thermophysical property is not high, and the testing result is not accurate enough.
Based on the above, the utility model provides a thermophysical property testing arrangement can measure the thermophysical property of micro-nano wire rod optional position, and the temperature distribution through measuring the micro-nano wire rod changes with time to solve the thermophysical property ability of the sample that awaits measuring.
As shown in fig. 1, the embodiment of the present invention provides a thermophysical property testing apparatus, including:
the thermoelectric module 100 is in contact with the sample 200 to be measured, and is used for heating the sample 200 to be measured;
and a heat sink 300, wherein the heat sink 300 is in contact connection with the thermoelectric module 100.
In some embodiments, besides heating the sample 200 to be tested, the thermal energy emitted by the thermoelectric module 100 is absorbed and stored by the heat sink 300, so that the air can be prevented from being heated and affecting the testing effect. The thermoelectric module 100 is placed on the heat sink 300, the temperature of air is kept constant, and the testing precision of the thermophysical property can be improved, so that the testing result is more accurate.
In some embodiments, heat sink 300 may employ a copper block.
In some embodiments, as shown in fig. 2, the thermophysical property testing apparatus further comprises:
the vacuum chamber 400, the thermoelectric module 100, the heat sink 300, and the sample 200 to be measured are all disposed within the vacuum chamber 400.
In some embodiments, the vacuum chamber 400 can provide a stable testing environment, reducing the effects of air convection on testing.
In some embodiments, as shown in fig. 2, the thermophysical property testing apparatus further comprises:
the collection module 500, the collection module 500 is used for collecting the temperature data of the sample 200 to be measured.
In some embodiments, acquisition module 500 includes an infrared camera. The infrared camera collects the change of the temperature field distribution on the sample 200 to be measured along with time in real time. In some embodiments, the acquisition module 500 may also include a thermocouple.
In some embodiments, as shown in fig. 2, the thermophysical property testing apparatus further comprises:
and the calculating module 600, the calculating module 600 is connected with the collecting module 500, and is used for receiving the temperature data sent by the collecting module 500.
In some embodiments, taking the collecting module 500 as an infrared camera as an example, the infrared camera collects temperature data of the sample 200 (on the surface) to be tested and sends the temperature data to the calculating module 600, and after the calculating module 600 processes the temperature data, the calculating module 600 calculates a thermophysical property parameter (for example, thermophysical property rate) of the sample 200 to be tested, thereby completing the thermophysical property test on the sample 200 to be tested.
In some embodiments, the computing module 600 may be a computer or other electronic device with data processing and data computing capabilities.
In some embodiments, as shown in fig. 2, the thermophysical property testing apparatus further comprises:
the signal source 700 is connected to the thermoelectric module 100, and is configured to provide current to the thermoelectric module 100, and the thermoelectric module 100 is configured to heat the sample 200 to be tested by using the current.
In some embodiments, signal source 700 may stably provide three current signals of different frequencies and amplitudes. The signal source 700 is connected to the thermoelectric module 100 through a power line. This connection allows the current generated by the signal source 700 to be conducted to the thermoelectric module 100. The thermoelectric module 100 is heated by the current, so that the corresponding current signal is converted into a thermal wave signal, for example, a sinusoidal current signal is converted into a sinusoidal thermal wave signal. The heat generated by the thermoelectric module 100 may heat the sample 200 to be measured.
In some embodiments, the heat sink 300 includes a first heat sink on which one end of the sample 200 to be tested is disposed, and a second heat sink (not shown in the figure) on which the other end of the sample 200 to be tested is disposed on the thermoelectric module 100, and the thermoelectric module 100 is disposed.
In some embodiments, one end of the sample 200 to be tested is in direct contact with a heat sink, which can absorb the thermal energy dissipated by the thermoelectric module, with much less error than if measured directly in air. Therefore, a stable boundary value can be provided, and whether the calculation module 600 calculates the thermophysical property of the sample 200 to be measured is accurate or not can be conveniently judged.
In some embodiments, thermoelectric module 100 may be a resistor. When current flows, the resistor generates heat, so that the current is converted into heat.
In some embodiments, the sample 200 to be tested includes micro-nano wires. Because the temperature sensor with the conventional scale cannot meet the requirement of the spatial resolution of the micro-nano material, an infrared camera is adopted to acquire temperature data. The infrared camera obtains infrared thermal images, wherein different colors on the thermal images represent different temperatures of the sample 200 to be measured, and the temperature of any point on the images can be acquired.
The technical solution of the present invention is described below with reference to a specific application example.
As shown in fig. 3, the thermophysical property testing apparatus includes a thermoelectric module 100, a sample 200 to be tested, a first heat sink 310, a second heat sink 320, a vacuum chamber 400, an acquisition module 500, a calculation module 600, and a signal source 700. One end of the sample 200 to be tested is disposed on the first heat sink 310, the other end of the sample 200 to be tested is disposed on the thermoelectric module 100, and the thermoelectric module 100 is disposed on the second heat sink 320. The thermoelectric module 100, the sample 200 to be tested, the first heat sink 310, and the second heat sink 320 are all disposed within the vacuum chamber 400.
The signal source 700 is connected to the thermoelectric module 100 and provides current to the thermoelectric module 100, and the thermoelectric module 100 heats the sample 200 to be measured by using the current. The collection module 500 collects the temperature data of the sample 200 to be measured in real time and sends the temperature data to the calculation module 600. After the calculation module 600 processes the temperature data, the thermal property parameter of the sample 200 to be tested is calculated, and the thermal property test of the sample 200 to be tested is completed.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A thermophysical property testing device is characterized by comprising:
the thermoelectric module is in contact with a sample to be detected and is used for heating the sample to be detected;
a heat sink in contact connection with the thermoelectric module;
the heat sink comprises a first heat sink and a second heat sink, one end of the sample to be tested is arranged on the first heat sink, the other end of the sample to be tested is arranged on the thermoelectric module, and the thermoelectric module is arranged on the second heat sink.
2. The thermophysical property testing device according to claim 1, further comprising:
and the thermoelectric module, the heat sink and the sample to be detected are all arranged in the vacuum cavity.
3. The thermophysical property testing device according to claim 1, further comprising:
and the acquisition module is used for acquiring the temperature data of the sample to be detected.
4. The thermophysical property testing device of claim 3, wherein the acquisition module comprises an infrared camera.
5. The thermophysical property testing device according to claim 3, further comprising:
and the calculation module is connected with the acquisition module and used for receiving the temperature data sent by the acquisition module.
6. The thermophysical property testing device according to claim 1, further comprising:
the signal source is connected with the thermoelectric module and used for providing current for the thermoelectric module, and the thermoelectric module is used for heating the sample to be tested by utilizing the current.
7. The thermophysical property testing device of any one of claims 1-6, wherein the thermoelectric module includes a resistor.
8. The thermophysical property test device of any one of claims 1 to 6, wherein the sample to be tested comprises a micro-nano wire.
9. The thermophysical property testing device of any one of claims 1 to 6, wherein the heat sink comprises a copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021569749.5U CN213903386U (en) | 2020-07-31 | 2020-07-31 | Thermal physical property testing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021569749.5U CN213903386U (en) | 2020-07-31 | 2020-07-31 | Thermal physical property testing device |
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| Publication Number | Publication Date |
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| CN213903386U true CN213903386U (en) | 2021-08-06 |
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| CN202021569749.5U Active CN213903386U (en) | 2020-07-31 | 2020-07-31 | Thermal physical property testing device |
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| CN (1) | CN213903386U (en) |
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Effective date of registration: 20230113 Address after: 518104 Buildings 12, 13, 16, 17, Block A, Gonghe First Industrial Zone, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Jieyao Precision Hardware (Shenzhen) Co.,Ltd. Address before: No. 1088, Xili Xueyuan Avenue, Nanshan District, Shenzhen, Guangdong Province Patentee before: Southern University of Science and Technology |