WO2022253257A1

WO2022253257A1 - Method and apparatus for measuring interfacial thermal resistance

Info

Publication number: WO2022253257A1
Application number: PCT/CN2022/096529
Authority: WO
Inventors: 付志伟; 梁振堂; 郑冰洁; 王健; 徐及乐; 杨晓锋; 陈思; 周斌
Original assignee: 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所) (中国赛宝实验室))
Priority date: 2021-06-02
Filing date: 2022-06-01
Publication date: 2022-12-08
Also published as: CN113514492B; CN113514492A

Abstract

A method and apparatus for measuring an interfacial thermal resistance. The method comprises: acquiring the intrinsic thermal resistance of a first material and a second material, a contact thermal resistance between a measurement end and the first material, and a contact thermal resistance between the measurement end and the second material, wherein the measurement end comprises a hot end and a cold end; acquiring a first thermal resistance and a second thermal resistance; and according to the intrinsic thermal resistances, the contact thermal resistances, the first thermal resistance and the second thermal resistance, determining an interfacial thermal resistance between the first material and the second material. The measurement result is accurate and reliable, and it is unnecessary to open holes in a material, thereby not affecting the performance of the material itself; and both a thermocouple and a heat-flow meter can be mounted at a unified position, such as a measurement end, such that the position is not changed due to the difference of measurement materials.

Description

A method and device for measuring interface thermal resistance

technical field

The present disclosure relates to the technical field of semiconductor device interface material detection, in particular to a method and device for measuring interface thermal resistance.

Background technique

As the power density of integrated circuits continues to increase, the problem of heat generation is becoming more and more serious, which has a serious impact on the performance and service life of electronic products. In order to further improve the heat dissipation capability of devices, interface materials with low thermal resistance such as sintered layers of micro-nano metal particles, carbon nanotubes, and graphene have been widely promoted. The thermal resistance of the interface material needs to be measured in the process of use, so as to select it in the design of the integrated circuit. Thermal resistance includes two parts: intrinsic thermal resistance and interface thermal resistance. Accurate testing of interface thermal resistance is a technical problem to be solved in the industry.

In the related art, the interface thermal resistance of the interface material is tested using the method shown in Figure 1, and material A and material B are placed between two metal blocks, wherein the hot end refers to the heated metal block, and the cold end refers to the It is a cooled metal block that compresses the interface material by external pressure. At the same time, multiple thermocouples are arranged inside the interface material to obtain the temperature gradient in the heat transfer direction. The temperature difference ΔT between material A and material B is deduced by Fourier’s law, the heat flow Q is measured by the heat flow meter at the contact interface of the two materials, and the interface of the test piece is calculated according to the definition of interface thermal resistance R _c =ΔT/Q thermal resistance. In the process of measurement in the related art, there are the following deficiencies: 1) in the related art, holes need to be opened on the interface material, which is a destructive measurement method; 2) in the related art, the size of the opening and the placement of the thermocouple The position has a significant impact on the dimension test results, and it is difficult to guarantee the accuracy and repeatability of the measurement results; 3) In related technologies, thermocouples are used to measure the temperature, and the temperature difference ΔT between material A and material B is derived using Fourier's law , the temperature difference ΔT between the upper and lower interfaces cannot be accurately measured, and the measurement accuracy is not high.

Therefore, there is an urgent need for an accurate and reliable method for measuring interfacial thermal resistance.

Contents of the invention

In order to overcome at least one problem existing in the related art, the present disclosure provides a method and device for measuring interface thermal resistance.

According to a first aspect of an embodiment of the present disclosure, a method for measuring interface thermal resistance is provided, including:

Obtain the intrinsic thermal resistance of the first material and the second material, the contact thermal resistance of the measuring end and the first material, the contact thermal resistance of the measuring end and the second material, and the measuring end includes a hot end and a cold end ;

obtaining a first thermal resistance, said first thermal resistance being set to contact said first material and said second material, said measurement resulting in a total measurement between said hot junction and said cold junction thermal resistance;

Obtaining a second thermal resistance, the second thermal resistance is set to exchange the positions of the first material and the second material, and the total measured heat between the hot end and the cold end is measured resistance;

The interface thermal resistance between the first material and the second material is determined according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance.

In a possible implementation manner, the thermal contact resistance between the measuring end and the first material includes: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively;

The thermal contact resistance between the measuring end and the second material includes: the sum of the thermal contact resistances between the hot end and the cold end of the measuring end and the second material respectively.

In a possible implementation manner, the obtaining the intrinsic thermal resistance of the first material includes:

Acquiring multiple sets of thermal resistance data between the hot end and the cold end, the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;

Obtaining the thickness data of the first material, and according to the thermal resistance data and the thickness data, fitting the relationship between the thermal resistance data and the thickness data;

According to the association relationship and the thickness of the first material, the intrinsic thermal resistance of the first material is determined.

obtaining the thermal conductivity and thickness of the first material;

Based on the thermal conductivity and the thickness, the thermal conductivity of the first material is determined.

In a possible implementation manner, the obtaining the thermal conductivity of the first material includes:

The thermal conductivity of the first material is determined according to the correlation and the area.

In a possible implementation manner, the acquiring the contact thermal resistance between the measuring end and the first material includes:

According to the association relationship, determine the contact thermal resistance between the measuring end and the first material.

In a possible implementation manner, the obtaining the first thermal resistance includes:

Acquiring the temperature difference and heat flow between the hot end and the cold end;

The first thermal resistance is determined according to the temperature difference and the heat flow.

In a possible implementation manner, the acquiring multiple sets of thermal resistance data between the hot end and the cold end includes:

Obtain more than three sets of thermal resistance data between the hot end and the cold end.

According to the second aspect of an embodiment of the present disclosure, there is provided a device for measuring interface thermal resistance, including: a first acquisition module, configured to acquire the intrinsic thermal resistance of the first material and the second material, the measurement terminal and the first material, The respective interface thermal resistances of the second materials, the measurement terminals include a hot terminal and a cold terminal;

The second obtaining module is used to obtain the first thermal resistance, and the first thermal resistance is set to be placed between the hot end and the cold end after the first material and the second material are in contact total measured thermal resistance;

The third acquisition module is used to acquire the second thermal resistance, and the second thermal resistance is set to be placed between the hot end and the cold end after exchanging the positions of the first material and the second material The total measured thermal resistance between;

A determining module, configured to determine the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the interface thermal resistance, the first thermal resistance and the second thermal resistance.

According to a third aspect of an embodiment of the present disclosure, a device for measuring interface thermal resistance is provided, including:

processor;

memory for storing processor-executable instructions;

Wherein, the processor is configured to execute the method for measuring interface thermal resistance described in any embodiment of the present disclosure.

According to the fourth aspect of the embodiments of the present disclosure, there is provided a non-transitory computer-readable storage medium. When the instructions in the storage medium are executed by the processor of the mobile terminal, the processor mobile terminal can execute the implementation according to the present disclosure. Examples of any of the methods described.

The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects: In the embodiments of the present disclosure, the first material and the second material are contacted in a random manner, the first thermal resistance between the two materials is measured, and the first material and the second material are exchanged. After the position of the second material, measure the thermal resistance between the two materials again to obtain the second thermal resistance, according to the first thermal resistance and the second thermal resistance, and use the contact heat between the first material and the second material and the measurement end respectively The sum of the resistance and the intrinsic thermal resistance of the two materials can be used to obtain the interface thermal resistance of the first material and the second material. The measurement result is accurate and reliable, and there is no need to open holes in the material without affecting the performance of the material itself; thermoelectric Both the couple and the heat flow meter can be installed in a unified position, such as the measuring end, and the position will not be changed due to different measurement materials.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment.

Fig. 2 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment.

Fig. 3 is a flow chart of a method for measuring interface thermal resistance according to an exemplary embodiment.

Fig. 4 is a schematic diagram showing a method for measuring interface thermal resistance according to an exemplary embodiment.

Fig. 5 is a schematic diagram showing a method for measuring intrinsic thermal resistance according to an exemplary embodiment.

Fig. 6 is a schematic diagram showing a correlation relationship between fitted thermal resistance data and thickness data according to an exemplary embodiment.

Fig. 7 is a schematic block diagram of a device for measuring intrinsic thermal resistance according to an exemplary embodiment.

Fig. 8 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.

Fig. 9 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

In order to make it easier for those skilled in the art to understand the technical solutions provided by the embodiments of the present disclosure, the technical environment in which the technical solutions are implemented is firstly described below.

In the related art, when detecting the interface thermal resistance of the interface material, the interface material is punched, causing some damage. Fig. 2 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment. As shown in Figure 2, a plurality of thermocouples are respectively arranged in the metal block, wherein the hot end refers to the heated metal block, and the cold end refers to the cooled metal block. In the two-piece method, material A and material B Placed between the hot and cold ends; in the three-piece method, place Material B, Material A, and Material B between the hot and cold ends. By applying constant pressure, the material is compacted. Taking the two-piece method as an example, it is assumed that the interfacial thermal resistance between material A and the hot end is the same as the interfacial thermal resistance between material B and the cold end. The intrinsic thermal resistance R ₁ of material A and the intrinsic thermal resistance R ₂ of material B can be calculated and obtained by formulas respectively: R ₁ =d ₁ /k ₁ , R ₂ =d ₂ /k ₂ . where d ₁ and d ₂ represent the thicknesses of material A and material B, respectively, and k ₁ and k ₂ represent the thermal conductivity of material A and material B, respectively, obtained by consulting the literature. The total thermal resistance of the entire structure is measured by the two-piece method, including A intrinsic thermal resistance + AB interface thermal resistance + B intrinsic thermal resistance + A contact thermal resistance + B contact thermal resistance. The total thermal resistance of the entire structure is measured by the three-piece method, including the contact thermal resistance of B × 2 + the thermal resistance of the AB interface × 2 + the intrinsic thermal resistance of B × 2 + the intrinsic thermal resistance of A. Then, get the intrinsic thermal resistance of A and B respectively, and subtract them to get the interface thermal resistance. In related technologies, it is necessary to assume that the contact thermal resistance between material A and the hot end is the same as the contact thermal resistance between material B and the cold end, but they are actually different. Moreover, the calculations of intrinsic thermal resistance _R1 and intrinsic thermal resistance _R2 in the related art are all calculated by formulas, _k1 and _k2 in the formulas are not measured by experiments, but obtained by consulting literature, therefore, the measurement results are accurate degree is difficult to guarantee.

Based on practical technical requirements similar to those described above, the present disclosure provides a method and device for measuring interface thermal resistance.

The method for measuring interfacial thermal resistance described in the present disclosure will be described in detail below with reference to FIG. 1 . Fig. 1 is a method flowchart of an embodiment of a method for measuring interface thermal resistance provided by the present disclosure. Although the present disclosure provides method operation steps as shown in the following embodiments or drawings, more or less operation steps may be included in the method based on routine or no creative effort. In the steps where logically there is no necessary causal relationship, the execution order of these steps is not limited to the execution order provided by the embodiments of the present disclosure.

Specifically, an embodiment of a method for measuring interface thermal resistance provided by the present disclosure is shown in FIG. 1 , and the method that can be applied to a terminal or server includes:

Step S301, obtaining the intrinsic thermal resistance of the first material and the second material, the contact thermal resistance between the measuring end and the first material, and the contact thermal resistance between the measuring end and the second material, the measuring end includes hot and cold ends;

Step S303, obtaining a first thermal resistance, the first thermal resistance is the total measured heat between the hot end and the cold end measured after the first material and the second material are in contact resistance;

Step S305, obtaining a second thermal resistance, the second thermal resistance being the total measurement between the hot end and the cold end obtained after exchanging the positions of the first material and the second material thermal resistance;

Step S307, determining the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance.

In the embodiment of the present disclosure, the first material and the second material may include interface materials with low thermal resistance such as micro-nano metal particles, nano-carbon materials, and graphene. The types of the first material and the second material may be the same or different. In the embodiment of the present disclosure, the measuring end is used to contact the material to be tested to obtain its parameters. Referring to FIG. 4 , the measuring end may include a hot end and a cold end. The hot end includes an end with a high temperature, and the cold end includes an end with a low temperature. By detecting the temperature at both ends, the heat loss on the material and the contact surface is measured. In the embodiment of the present disclosure, the intrinsic thermal resistance (also referred to as bulk thermal resistance) includes the ratio between the temperature at both ends of the object and the power of the heat source when heat is transmitted on the material. When heat flows through the interface of two contacting solids, the interface itself presents an obvious thermal resistance to the heat flow, which is called contact thermal resistance. As contact thermal resistance, the thermal resistance generated at the contact interface between two materials is called interfacial thermal resistance.

In the embodiment of the present disclosure, the obtaining the intrinsic thermal resistance of the first material may include: obtaining the thermal conductivity k of the first material and the length of the second material, and obtaining the intrinsic thermal resistance of the first material through formula (1). sign thermal resistance.

Wherein, A represents the contact area between the material and the measuring end, R represents the intrinsic thermal resistance, k thermal conductivity, and d represents the length of the first material.

In an example, the obtaining the intrinsic thermal resistance of the first material may also include measuring the sum of the intrinsic thermal resistance of multiple first materials and the contact thermal resistance between the first material and the measuring end, to obtain multiple sets of thermal resistance data, determining the intrinsic thermal resistance of the first material according to the correlation between the thermal resistance data and the first material. It should be noted that the setting method of obtaining the intrinsic thermal resistance of the first material is not limited to the above example, for example, obtaining the intrinsic thermal resistance of the first material by consulting the literature can also be used as the preset triggering event, which belongs to the technical field Under the enlightenment of the technical essence of this application, personnel may make other changes, but as long as their functions and effects are the same or similar to those of this application, they should be covered within the protection scope of this application. In the embodiment of the present disclosure, the method for obtaining the intrinsic thermal resistance of the second material is the same as the above method for obtaining the intrinsic thermal resistance of the first material, and will not be repeated here.

In the embodiment of the present disclosure, the thermal contact resistance between the measuring terminal and the first material may include the sum of the thermal contact resistances of the hot terminal and the cold terminal of the measuring terminal and the first material respectively, and the thermal contact resistance between the measuring terminal and the second The thermal contact resistance of the material may include: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the second material respectively. In the embodiment of the present disclosure, the acquisition of the contact thermal resistances of the measurement terminal, the first material, and the second material can be obtained from pre-stored measurement data, or by measuring the intrinsic properties of multiple first materials. The sum of the thermal resistance and the contact thermal resistance between the first material and the measuring end is obtained to obtain multiple sets of thermal resistance data, and according to the correlation between the thermal resistance data and the first material, the contact thermal resistance between the measuring end and the first material is obtained resistance.

Referring to the front method shown in Figure 4, after the first material and the second material are in contact, they are placed between the hot end and the cold end, and the total measured thermal resistance from the hot end to the cold end is measured, that is, the first thermal resistance R _tot-AB , the specific measurement method can include, can use the thermocouple to measure the temperature difference ΔT between the hot end and the cold end, use the heat flow meter to measure the heat flow Q between the hot end and the cold end, according to the temperature difference and the heat flow Determine the value of the first thermal resistance. Referring to Fig. 4, the first thermal resistance includes the intrinsic thermal resistance R _A of the first material, the contact thermal resistance R _A-c1 between the first material and the hot end, and the interface thermal resistance R _AB between the first material and the second material , the intrinsic thermal resistance R _B of the second material, and the contact thermal resistance R _B-c2 between the second material and the cold end, expressed as the following formula (2):

R _tot-AB ＝R _A +R _A-c1 +R _AB +R _B +R _B-c2 (2)

Referring to the reverse method shown in Figure 4, after exchanging the positions of the first material and the second material, place it between the hot end and the cold end, and measure the total measured thermal resistance from the hot end to the cold end, That is, the second thermal resistance R _tot-BA , the specific measurement method may include that a thermocouple may be used to measure the temperature difference ΔT between the hot end and the cold end, and a heat flow meter may be used to measure the heat flow Q between the hot end and the cold end, according to The temperature difference and heat flow determine the value of the first thermal resistance. Referring to Fig. 4, the second thermal resistance includes the intrinsic thermal resistance R _B of the second material, the contact thermal resistance R _B-c1 between the second material and the hot end, and the interface thermal resistance R _AB between the first material and the second material , the intrinsic thermal resistance _RA of the first material, and the contact thermal resistance RA _-c2 between the first material and the cold end, expressed as the following formula (3):

R _tot-BA ＝R _B +R _B-c1 +R _AB +R _A +R _A-c2 (3)

In the embodiment of the present disclosure, the interface thermal resistance between the first material and the second material is determined according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance . Can include, combine formula (2) and formula (3), get:

Among them, R _AB represents the interface thermal resistance of the first material and the second material, R _tot-AB represents the first thermal resistance, R _tot-BA represents the second thermal resistance, _RA and _RB represent the first material and the second Intrinsic thermal resistance of the material, R _A-c1 + R _A-c2 represents the sum of the contact thermal resistance of the hot end and cold end of the measurement end and the first material respectively, and R _B-c1 + R _B-c2 represents the thermal resistance of the measurement end The sum of the contact thermal resistances of the hot end and the cold end respectively to the second material. The above parameters are all obtained in the above examples.

In the embodiment of the present disclosure, the first material and the second material are contacted in a random manner, the first thermal resistance between the two materials is measured, and the positions of the first material and the second material are exchanged to obtain the second thermal resistance, according to the first The first thermal resistance and the second thermal resistance, and using the sum of the contact thermal resistances between the first material and the second material and the measurement end and the intrinsic thermal resistance of the two materials, the interface thermal resistance of the first material and the second material is obtained, and measured The results are accurate and reliable, and there is no need to open holes in the material itself, which does not affect the performance of the material itself; both thermocouples and heat flow meters can be installed at the same location, such as the measurement end, and will not change the position due to different measurement materials .

Fig. 5 is a schematic diagram showing a method for measuring intrinsic thermal resistance according to an exemplary embodiment. Referring to FIG. 5, in a possible implementation manner, the obtaining the intrinsic thermal resistance of the first material includes:

In the embodiment of the present disclosure, as shown in FIG. 5 , the total thermal resistance measured by placing first materials of different thicknesses and the same area between the hot end and the cold end respectively, the measured experimental data are as follows in Table 1:

Table 1 Experimental data of thermal resistance test of stainless steel body

编号Numbering	样品实际厚度(m)Sample actual thickness (m)	热阻(K/W)Thermal resistance (K/W)
11	9.98×10 ^-4 9.98×10 ^-4	1.21861.2186
22	1.517×10 ^-3 1.517×10 ^-3	1.38361.3836
33	2.009×10 ^-3 2.009×10 ^-3	1.52661.5266
44	2.504×10 ^-3 2.504×10 ^-3	1.60681.6068
55	3.007×10 ^-3 3.007×10 ^-3	1.75521.7552

Fig. 6 is a schematic diagram showing a correlation relationship between fitted thermal resistance data and thickness data according to an exemplary embodiment. Referring to Fig. 6, according to the thermal resistance data and the thickness data, the correlation relationship between the thermal resistance data and the thickness data is obtained by fitting, expressed as follows:

Wherein, k represents the thermal conductivity of the first material, and A represents the contact area between the first material and the measuring end. The first item in formula (5) is the intrinsic thermal resistance of the first material, and the intrinsic thermal resistance of the first material can be obtained by substituting the data in Table 1.

In the embodiment of the present disclosure, by fitting the thermal resistance data and the thickness data, the relationship between the thermal resistance data and the thickness data of the first material is obtained, and then the intrinsic thermal resistance of the first material is determined, and the intrinsic thermal resistance with high precision can be obtained .

obtaining the thermal conductivity and thickness of the first material;

In the embodiments of the present disclosure, according to the thermal conductivity and the thickness, the thermal conductivity of the first material can be determined through the formula (1), wherein the thermal conductivity can be obtained through the stored measurement data Obtained, or real-time measurement data acquisition. The real-time measurement data can include the following methods:

In the embodiment of the present disclosure, multiple sets of thermal resistance data between the hot end and the cold end are acquired, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot ends respectively. and the total thermal resistance measured between the cold end; obtaining the thickness data of the first material, and fitting the relationship between the thermal resistance data and the thickness data according to the thermal resistance data and the thickness data , which is the same as the above embodiment, and will not be repeated here. The determining the thermal conductivity of the first material according to the correlation relationship and the area may include formula (5).

In the embodiment of the present disclosure, the thermal contact resistance between the measuring end and the first material includes the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively. In the embodiment of the present disclosure, multiple sets of thermal resistance data between the hot end and the cold end are acquired, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot ends respectively. and the total thermal resistance measured between the cold end; obtaining the thickness data of the first material, and fitting the relationship between the thermal resistance data and the thickness data according to the thermal resistance data and the thickness data , the manner is the same as that of the foregoing embodiment, and will not be repeated here. In the embodiment of the present disclosure, the thermal contact resistance between the measuring end and the first material is the intercept R _c1 +R _c2 of the linear function represented by formula (5).

In the embodiment of the present disclosure, according to the thermal resistance data and the thickness data, the correlation between the thermal resistance data and the thickness data is obtained by fitting, and then the determined contact thermal resistance between the measuring end and the first material has accurate High degree of beneficial effect.

In the embodiment of the present disclosure, a temperature measuring device, such as a thermometer, may be respectively arranged at the hot end and the cold end of the measuring end, so as to measure the temperature difference between the hot end and the cold end. In one example, the heat flow from the hot end to the cold end can be measured by a heat flow meter, and the heat flow meter can be arranged in the measurement end. It does not need to be set in the material body, so it can be used repeatedly once set. In the embodiment of the present disclosure, the determination of the first thermal resistance according to the temperature difference and the heat flow can be determined by the following formula:

Among them, R _tot-AB represents the first thermal resistance, ΔT represents the temperature difference between the hot end and the cold end, and Q represents the heat flow from the hot end to the cold end.

In the embodiment of the present disclosure, the test of the first thermal resistance can be completed without destroying the material, and the measurement result is accurate.

It should be noted that the intrinsic thermal resistance of the second material and the contact thermal resistance between the measuring end and the second material are measured in the same manner as the first material, which will not be repeated here.

In a possible implementation manner, the acquiring multiple sets of thermal resistance data between the hot end and the cold end includes: acquiring more than three sets of thermal resistance data between the hot end and the cold end block data. Using three or more sets of thermal resistance data can be fitted so that the correlation between the fitted thermal resistance data and the thickness data is more accurate.

The process of a method for measuring interface thermal resistance in the present disclosure is explained below according to an example.

1. Purpose of the experiment

The interface thermal resistance of the metal material adhesive layer is tested with reference to the technical solution of the present invention to verify the effectiveness and feasibility of the technical solution of the present invention. In this case test, stainless steel materials with different thicknesses are selected for bonding, and the interface thermal resistance of the bonding layer is tested through the method of the technical solution of the present invention.

2. Experimental equipment

DynTIM thermal conductivity tester, standard samples of stainless steel materials (thicknesses are 1000/1500/2000/2500/3000um, diameter 12.5mm) and thermal conductive silicone grease, etc.

3. Experimental steps

3.1 Testing of intrinsic thermal resistance of stainless steel materials

1) According to the intrinsic thermal resistance measurement method disclosed in any embodiment of the present disclosure, the intrinsic thermal resistance test can be performed on a stainless steel sample with a thickness of 1000um. A thin layer of thermal conductive silicone grease is evenly applied on the upper and lower surfaces of the sample to reduce the distance between the two ends of the sample and the equipment. contact thermal resistance;

2) Measure and record the actual thickness d of the sample;

3) Record the measured bulk intrinsic thermal resistance and the actual thickness d of the sample;

4) Repeat steps 1) and 2) to test the remaining samples.

3.2 Calculation of contact thermal resistance between stainless steel material and measuring end

1) Based on the bulk thermal resistance and actual thickness data obtained in 3.1, according to the formula, fit the curve of the linear variation of bulk thermal resistance with thickness of stainless steel materials with different thicknesses;

2) Calculate the sum of the thermal conductivity and the upper and lower contact thermal resistance of the equipment end, where the reciprocal of the slope of the fitting line and the contact area of the sample is the material thermal conductivity k _A , and the intercept is the sum of the upper and lower contact thermal resistances of the equipment and material A R _A-c1 +R _A-c2 .

3.3 Calculation of interface thermal resistance

1) Bond a sample with a thickness of 1000um (denoted as A1) and a sample with a thickness of 1500um (denoted as A2) into a whole sample A1-A2;

2) Measure and record the actual thickness d _{A1-A2 of the bonding body A1-A2} ;

3) According to the formula (2), carry out the front method measurement, apply a thin layer of thermal conductive silicone grease evenly on the upper and lower surfaces of the samples A1-A2, reduce the contact thermal resistance between the two ends of the sample and the equipment, and record the measured intrinsic thermal resistance R _tot-A1-A2 ;

4) According to the formula (3), carry out the reverse method measurement, adjust the A1-A2 bonding body up and down, and reapply a thin layer of thermal conductive silicone grease evenly on the upper and lower surfaces to reduce the contact thermal resistance between the two ends of the sample and the equipment, remember The measured intrinsic thermal resistance R _tot-A2-A1 .

5) According to formula (4), determine the interface thermal group R _A1-A2 .

4. Recording of experimental data

1) Refer to Table 1 for the thermal resistance data measured by the intrinsic thermal resistance of stainless steel materials;

2) The first thermal resistance and the second thermal resistance measured by the front and back method are shown in Table 2.

Table 2 Experimental data of front and back method

the	粘结体实际厚度d _A1-A2(m) Bonded body actual thickness d _A1-A2 (m)	热阻(K/W)Thermal resistance (K/W)
正面法Positive law	2.612×10 ^-3 2.612×10 ^-3	4.204.20
反面法negative law	2.612×10 ^-3 2.612×10 ^-3	4.074.07

5. Data processing

1) Fitting of bulk thermal resistance of stainless steel materials with different thicknesses, refer to Figure 6.

2) Calculation of thermal conductivity:

In the formula, K' is the slope of Figure 6, and Ka is the thermal conductivity.

3) Calculation of contact area:

4) Calculation of contact thermal resistance between equipment and sample:

R _A-c1 +R _A-c2 = 0.977982K/W (9)

5) Calculation of interface thermal resistance

Calculate the interface thermal resistance based on the above parameters as follows:

Fig. 7 is a schematic block diagram of a device for measuring intrinsic thermal resistance according to an exemplary embodiment. Refer to Figure 7, including:

The first obtaining module 701 is used to obtain the intrinsic thermal resistance of the first material and the second material, and measure the interface thermal resistance of the end and the first material and the second material respectively, and the measuring end includes the hot end and the second material. cold end;

The second acquisition module 703 is configured to acquire a first thermal resistance, the first thermal resistance is set to be placed between the hot end and the cold end after the first material and the second material are in contact The total measured thermal resistance between;

The third obtaining module 705 is used to obtain the second thermal resistance, and the second thermal resistance is set to be placed at the hot end and the cold end after exchanging the positions of the first material and the second material The total measured thermal resistance between;

The determination module 707 is configured to determine the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the interface thermal resistance, the first thermal resistance and the second thermal resistance.

In a possible implementation manner, the thermal contact resistance between the measuring end and the first material includes: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively, and the measuring end The contact thermal resistance with the second material includes: the sum of the contact thermal resistances of the hot end and the cold end of the measurement end with the second material respectively.

In a possible implementation manner, the first obtaining module includes:

The first acquisition sub-module is used to acquire multiple sets of thermal resistance data between the hot end and the cold end, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot end respectively and the total thermal resistance measured between the cold junction;

The second acquisition sub-module is used to acquire the thickness data of the first material, and obtain the relationship between the thermal resistance data and the thickness data by fitting according to the thermal resistance data and the thickness data;

The first determining submodule is used to determine the intrinsic thermal resistance of the first material according to the correlation and the thickness of the first material.

In a possible implementation manner, the first obtaining module includes:

The third acquisition sub-module is to acquire the thermal conductivity and thickness of the first material;

The second determining submodule determines the thermal conductivity of the first material according to the thermal conductivity and the thickness.

In a possible implementation manner, the third acquiring submodule includes:

The first acquisition unit is used to acquire multiple sets of thermal resistance data between the hot end and the cold end, and the thermal resistance data is set to place first materials of different thicknesses and the same area on the hot end and the cold end respectively. The total thermal resistance measured between the cold junctions;

The second acquiring unit is configured to acquire the thickness data of the first material, and obtain the relationship between the thermal resistance data and the thickness data by fitting according to the thermal resistance data and the thickness data;

The determining unit is configured to determine the thermal conductivity of the first material according to the correlation and the area.

In a possible implementation manner, the first obtaining module includes:

The third determining submodule is configured to determine the thermal contact resistance between the measuring end and the first material according to the association relationship.

In a possible implementation manner, the second obtaining module includes:

The fourth acquisition sub-module is used to acquire the temperature difference and heat flow between the hot end and the cold end;

The fourth determination submodule is configured to determine the first thermal resistance according to the temperature difference and the heat flow.

In a possible implementation manner, the first obtaining submodule includes:

The first acquisition unit is configured to acquire more than three sets of thermal resistance data between the hot end and the cold end.

Regarding the apparatus in the foregoing embodiments, the specific manner in which each module executes operations has been described in detail in the embodiments related to the method, and will not be described in detail here.

Fig. 8 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment. For example, the apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

8, device 800 may include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and communication component 816 .

The processing component 802 generally controls the overall operations of the device 800, such as those associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above method. Additionally, processing component 802 may include one or more modules that facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802 .

The memory 804 is configured to store various types of data to support operations at the device 800 . Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and the like. The memory 804 can be implemented by any type of volatile or non-volatile storage device or their combination, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), Magnetic Memory, Flash Memory, Magnetic or Optical Disk.

The power supply component 806 provides power to the various components of the device 800 . Power components 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for device 800 .

The multimedia component 808 includes a screen that provides an output interface between the device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may not only sense a boundary of a touch or swipe action, but also detect duration and pressure associated with the touch or swipe action. In some embodiments, the multimedia component 808 includes a front camera and/or a rear camera. When the device 800 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a microphone (MIC) configured to receive external audio signals when the device 800 is in operation modes, such as call mode, recording mode and voice recognition mode. Received audio signals may be further stored in memory 804 or sent via communication component 816 . In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and a peripheral interface module, which may be a keyboard, a click wheel, a button, and the like. These buttons may include, but are not limited to: a home button, volume buttons, start button, and lock button.

Sensor assembly 814 includes one or more sensors for providing status assessments of various aspects of device 800 . For example, the sensor component 814 can detect the open/closed state of the device 800, the relative positioning of components, such as the display and keypad of the device 800, and the sensor component 814 can also detect a change in the position of the device 800 or a component of the device 800 , the presence or absence of user contact with the device 800 , the device 800 orientation or acceleration/deceleration and the temperature change of the device 800 . Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects in the absence of any physical contact. Sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor component 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor or a temperature sensor.

The communication component 816 is configured to facilitate wired or wireless communication between the apparatus 800 and other devices. The device 800 can access wireless networks based on communication standards, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra Wide Band (UWB) technology, Bluetooth (BT) technology and other technologies.

In an exemplary embodiment, apparatus 800 may be programmed by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable A gate array (FPGA), controller, microcontroller, microprocessor or other electronic component implementation for performing the methods described above.

In an exemplary embodiment, there is also provided a non-transitory computer-readable storage medium including instructions, such as the memory 804 including instructions, which can be executed by the processor 820 of the device 800 to implement the above method. For example, the non-transitory computer readable storage medium may be ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like.

Fig. 9 is a block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment. For example, the apparatus 900 may be provided as a server. 9, apparatus 900 includes processing component 922, which further includes one or more processors, and memory resources represented by memory 932 for storing instructions executable by processing component 922, such as application programs. The application program stored in memory 932 may include one or more modules each corresponding to a set of instructions. In addition, the processing component 922 is configured to execute instructions to perform the above method.

Device 900 may also include a power component 926 configured to perform power management of device 1900 , a wired or wireless network interface 950 configured to connect device 1900 to a network, and an input-output (I/O) interface 958 . The device 900 can operate based on an operating system stored in the memory 932, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™ or the like.

In an exemplary embodiment, there is also provided a non-transitory computer-readable storage medium including instructions, such as the memory 932 including instructions, which can be executed by the processing component 922 of the device 900 to implement the above method. For example, the non-transitory computer readable storage medium may be ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like.

Other embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

A method for measuring interfacial thermal resistance, comprising:

Obtain the intrinsic thermal resistance of the first material and the second material, the contact thermal resistance of the measuring end and the first material, the contact thermal resistance of the measuring end and the second material, the measuring end includes the hot end and the cold end;

Obtaining a first thermal resistance, where the first thermal resistance is the total measured thermal resistance between the hot end and the cold end measured after the first material and the second material are in contact;

Obtaining a second thermal resistance, where the second thermal resistance is the total measured thermal resistance between the hot end and the cold end measured after exchanging the positions of the first material and the second material;

The interface thermal resistance between the first material and the second material is determined according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance.
The method according to claim 1, wherein the thermal contact resistance between the measuring end and the first material comprises: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively;

The thermal contact resistance between the measuring end and the second material includes: the sum of the thermal contact resistances between the hot end and the cold end of the measuring end and the second material respectively.
The method according to claim 1, wherein said obtaining the intrinsic thermal resistance of the first material comprises:

Acquiring multiple sets of thermal resistance data between the hot end and the cold end, the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;

Obtaining the thickness data of the first material, and according to the thermal resistance data and the thickness data, fitting the relationship between the thermal resistance data and the thickness data;

According to the association relationship and the thickness of the first material, the intrinsic thermal resistance of the first material is determined.
The method according to claim 1, wherein said obtaining the intrinsic thermal resistance of the first material comprises:

obtaining the thermal conductivity and thickness of the first material;

Based on the thermal conductivity and the thickness, the thermal conductivity of the first material is determined.
The method according to claim 4, wherein said obtaining the thermal conductivity of the first material comprises:

Acquiring multiple sets of thermal resistance data between the hot end and the cold end, the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;

Obtaining the thickness data of the first material, and according to the thermal resistance data and the thickness data, fitting the relationship between the thermal resistance data and the thickness data;

The thermal conductivity of the first material is determined according to the correlation and the area.
The method according to claim 2, wherein said acquiring the thermal contact resistance between the measuring end and said first material comprises:

Acquiring multiple sets of thermal resistance data between the hot end and the cold end, the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;

Obtaining the thickness data of the first material, and according to the thermal resistance data and the thickness data, fitting the relationship between the thermal resistance data and the thickness data;

According to the association relationship, determine the contact thermal resistance between the measuring end and the first material.
The method according to claim 1, wherein said obtaining the first thermal resistance comprises:

Acquiring the temperature difference and heat flow between the hot end and the cold end;

The first thermal resistance is determined according to the temperature difference and the heat flow.
The method according to claim 3, 5 or 6, wherein the acquiring multiple sets of thermal resistance data between the hot end and the cold end comprises:

Obtain more than three sets of thermal resistance data between the hot end and the cold end.
A device for measuring interface thermal resistance, characterized in that it comprises:

The first acquisition module is used to acquire the intrinsic thermal resistance of the first material and the second material, the contact thermal resistance between the measuring end and the first material, the contact thermal resistance between the measuring end and the second material, and the measuring end Including hot end and cold end;

The second acquisition module is used to acquire the first thermal resistance, and the first thermal resistance is set as the measured difference between the hot end and the cold end after the first material and the second material are in contact. The total measured thermal resistance between;

A third acquisition module, configured to acquire a second thermal resistance, the second thermal resistance is set to measure the hot end and the cold end after exchanging the positions of the first material and the second material The total measured thermal resistance between;

A determining module, configured to determine the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the interface thermal resistance, the first thermal resistance and the second thermal resistance.
A device for measuring interface thermal resistance, characterized in that it comprises:

processor;

memory for storing processor-executable instructions;

Wherein, the processor is configured to execute the method according to any one of claims 1-8.
A non-transitory computer-readable storage medium, when the instructions in the storage medium are executed by the processor of the mobile terminal, the processor mobile terminal can execute the method according to any one of claims 1-8.