WO2022253257A1 - Procédé et appareil pour mesurer une résistance thermique interfaciale - Google Patents

Procédé et appareil pour mesurer une résistance thermique interfaciale Download PDF

Info

Publication number
WO2022253257A1
WO2022253257A1 PCT/CN2022/096529 CN2022096529W WO2022253257A1 WO 2022253257 A1 WO2022253257 A1 WO 2022253257A1 CN 2022096529 W CN2022096529 W CN 2022096529W WO 2022253257 A1 WO2022253257 A1 WO 2022253257A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermal resistance
data
thermal
measuring
contact
Prior art date
Application number
PCT/CN2022/096529
Other languages
English (en)
Chinese (zh)
Inventor
付志伟
梁振堂
郑冰洁
王健
徐及乐
杨晓锋
陈思
周斌
Original Assignee
中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所) (中国赛宝实验室))
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所) (中国赛宝实验室)) filed Critical 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所) (中国赛宝实验室))
Publication of WO2022253257A1 publication Critical patent/WO2022253257A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

Definitions

  • the present disclosure relates to the technical field of semiconductor device interface material detection, in particular to a method and device for measuring interface thermal resistance.
  • interface materials with low thermal resistance such as sintered layers of micro-nano metal particles, carbon nanotubes, and graphene have been widely promoted.
  • the thermal resistance of the interface material needs to be measured in the process of use, so as to select it in the design of the integrated circuit.
  • Thermal resistance includes two parts: intrinsic thermal resistance and interface thermal resistance. Accurate testing of interface thermal resistance is a technical problem to be solved in the industry.
  • the interface thermal resistance of the interface material is tested using the method shown in Figure 1, and material A and material B are placed between two metal blocks, wherein the hot end refers to the heated metal block, and the cold end refers to the It is a cooled metal block that compresses the interface material by external pressure.
  • multiple thermocouples are arranged inside the interface material to obtain the temperature gradient in the heat transfer direction.
  • thermocouples are used to measure the temperature, and the temperature difference ⁇ T between material A and material B is derived using Fourier's law , the temperature difference ⁇ T between the upper and lower interfaces cannot be accurately measured, and the measurement accuracy is not high.
  • the present disclosure provides a method and device for measuring interface thermal resistance.
  • a method for measuring interface thermal resistance including:
  • the intrinsic thermal resistance of the first material and the second material the contact thermal resistance of the measuring end and the first material, the contact thermal resistance of the measuring end and the second material, and the measuring end includes a hot end and a cold end ;
  • the second thermal resistance is set to exchange the positions of the first material and the second material, and the total measured heat between the hot end and the cold end is measured resistance;
  • the interface thermal resistance between the first material and the second material is determined according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance.
  • the thermal contact resistance between the measuring end and the first material includes: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively;
  • the thermal contact resistance between the measuring end and the second material includes: the sum of the thermal contact resistances between the hot end and the cold end of the measuring end and the second material respectively.
  • the obtaining the intrinsic thermal resistance of the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the intrinsic thermal resistance of the first material is determined.
  • the obtaining the intrinsic thermal resistance of the first material includes:
  • the thermal conductivity of the first material is determined.
  • the obtaining the thermal conductivity of the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the thermal conductivity of the first material is determined according to the correlation and the area.
  • the acquiring the contact thermal resistance between the measuring end and the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the obtaining the first thermal resistance includes:
  • the first thermal resistance is determined according to the temperature difference and the heat flow.
  • the acquiring multiple sets of thermal resistance data between the hot end and the cold end includes:
  • a device for measuring interface thermal resistance including: a first acquisition module, configured to acquire the intrinsic thermal resistance of the first material and the second material, the measurement terminal and the first material, The respective interface thermal resistances of the second materials, the measurement terminals include a hot terminal and a cold terminal;
  • the second obtaining module is used to obtain the first thermal resistance, and the first thermal resistance is set to be placed between the hot end and the cold end after the first material and the second material are in contact total measured thermal resistance;
  • the third acquisition module is used to acquire the second thermal resistance, and the second thermal resistance is set to be placed between the hot end and the cold end after exchanging the positions of the first material and the second material The total measured thermal resistance between;
  • a determining module configured to determine the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the interface thermal resistance, the first thermal resistance and the second thermal resistance.
  • a device for measuring interface thermal resistance including:
  • memory for storing processor-executable instructions
  • the processor is configured to execute the method for measuring interface thermal resistance described in any embodiment of the present disclosure.
  • a non-transitory computer-readable storage medium When the instructions in the storage medium are executed by the processor of the mobile terminal, the processor mobile terminal can execute the implementation according to the present disclosure. Examples of any of the methods described.
  • the technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:
  • the first material and the second material are contacted in a random manner, the first thermal resistance between the two materials is measured, and the first material and the second material are exchanged.
  • the second material measure the thermal resistance between the two materials again to obtain the second thermal resistance, according to the first thermal resistance and the second thermal resistance, and use the contact heat between the first material and the second material and the measurement end respectively
  • the sum of the resistance and the intrinsic thermal resistance of the two materials can be used to obtain the interface thermal resistance of the first material and the second material.
  • thermoelectric Both the couple and the heat flow meter can be installed in a unified position, such as the measuring end, and the position will not be changed due to different measurement materials.
  • Fig. 1 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment.
  • Fig. 2 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment.
  • Fig. 3 is a flow chart of a method for measuring interface thermal resistance according to an exemplary embodiment.
  • Fig. 4 is a schematic diagram showing a method for measuring interface thermal resistance according to an exemplary embodiment.
  • Fig. 5 is a schematic diagram showing a method for measuring intrinsic thermal resistance according to an exemplary embodiment.
  • Fig. 6 is a schematic diagram showing a correlation relationship between fitted thermal resistance data and thickness data according to an exemplary embodiment.
  • Fig. 7 is a schematic block diagram of a device for measuring intrinsic thermal resistance according to an exemplary embodiment.
  • Fig. 8 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.
  • Fig. 9 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.
  • FIG. 2 is a schematic diagram of a method for measuring interface thermal resistance in the related art according to an exemplary embodiment.
  • a plurality of thermocouples are respectively arranged in the metal block, wherein the hot end refers to the heated metal block, and the cold end refers to the cooled metal block.
  • material A and material B Placed between the hot and cold ends; in the three-piece method, place Material B, Material A, and Material B between the hot and cold ends. By applying constant pressure, the material is compacted.
  • d 1 and d 2 represent the thicknesses of material A and material B, respectively
  • k 1 and k 2 represent the thermal conductivity of material A and material B, respectively, obtained by consulting the literature.
  • the total thermal resistance of the entire structure is measured by the two-piece method, including A intrinsic thermal resistance + AB interface thermal resistance + B intrinsic thermal resistance + A contact thermal resistance + B contact thermal resistance.
  • the total thermal resistance of the entire structure is measured by the three-piece method, including the contact thermal resistance of B ⁇ 2 + the thermal resistance of the AB interface ⁇ 2 + the intrinsic thermal resistance of B ⁇ 2 + the intrinsic thermal resistance of A. Then, get the intrinsic thermal resistance of A and B respectively, and subtract them to get the interface thermal resistance.
  • the present disclosure provides a method and device for measuring interface thermal resistance.
  • Fig. 1 is a method flowchart of an embodiment of a method for measuring interface thermal resistance provided by the present disclosure.
  • the present disclosure provides method operation steps as shown in the following embodiments or drawings, more or less operation steps may be included in the method based on routine or no creative effort. In the steps where logically there is no necessary causal relationship, the execution order of these steps is not limited to the execution order provided by the embodiments of the present disclosure.
  • FIG. 1 an embodiment of a method for measuring interface thermal resistance provided by the present disclosure is shown in FIG. 1 , and the method that can be applied to a terminal or server includes:
  • Step S301 obtaining the intrinsic thermal resistance of the first material and the second material, the contact thermal resistance between the measuring end and the first material, and the contact thermal resistance between the measuring end and the second material, the measuring end includes hot and cold ends;
  • Step S303 obtaining a first thermal resistance
  • the first thermal resistance is the total measured heat between the hot end and the cold end measured after the first material and the second material are in contact resistance
  • Step S305 obtaining a second thermal resistance, the second thermal resistance being the total measurement between the hot end and the cold end obtained after exchanging the positions of the first material and the second material thermal resistance;
  • Step S307 determining the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance.
  • the first material and the second material may include interface materials with low thermal resistance such as micro-nano metal particles, nano-carbon materials, and graphene.
  • the types of the first material and the second material may be the same or different.
  • the measuring end is used to contact the material to be tested to obtain its parameters. Referring to FIG. 4 , the measuring end may include a hot end and a cold end. The hot end includes an end with a high temperature, and the cold end includes an end with a low temperature. By detecting the temperature at both ends, the heat loss on the material and the contact surface is measured.
  • the intrinsic thermal resistance (also referred to as bulk thermal resistance) includes the ratio between the temperature at both ends of the object and the power of the heat source when heat is transmitted on the material.
  • contact thermal resistance the thermal resistance generated at the contact interface between two materials.
  • the obtaining the intrinsic thermal resistance of the first material may include: obtaining the thermal conductivity k of the first material and the length of the second material, and obtaining the intrinsic thermal resistance of the first material through formula (1). sign thermal resistance.
  • A represents the contact area between the material and the measuring end
  • R represents the intrinsic thermal resistance
  • k thermal conductivity represents the length of the first material
  • the obtaining the intrinsic thermal resistance of the first material may also include measuring the sum of the intrinsic thermal resistance of multiple first materials and the contact thermal resistance between the first material and the measuring end, to obtain multiple sets of thermal resistance data, determining the intrinsic thermal resistance of the first material according to the correlation between the thermal resistance data and the first material.
  • the setting method of obtaining the intrinsic thermal resistance of the first material is not limited to the above example, for example, obtaining the intrinsic thermal resistance of the first material by consulting the literature can also be used as the preset triggering event, which belongs to the technical field Under the enlightenment of the technical essence of this application, personnel may make other changes, but as long as their functions and effects are the same or similar to those of this application, they should be covered within the protection scope of this application.
  • the method for obtaining the intrinsic thermal resistance of the second material is the same as the above method for obtaining the intrinsic thermal resistance of the first material, and will not be repeated here.
  • the thermal contact resistance between the measuring terminal and the first material may include the sum of the thermal contact resistances of the hot terminal and the cold terminal of the measuring terminal and the first material respectively, and the thermal contact resistance between the measuring terminal and the second The thermal contact resistance of the material may include: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the second material respectively.
  • the acquisition of the contact thermal resistances of the measurement terminal, the first material, and the second material can be obtained from pre-stored measurement data, or by measuring the intrinsic properties of multiple first materials. The sum of the thermal resistance and the contact thermal resistance between the first material and the measuring end is obtained to obtain multiple sets of thermal resistance data, and according to the correlation between the thermal resistance data and the first material, the contact thermal resistance between the measuring end and the first material is obtained resistance.
  • the specific measurement method can include, can use the thermocouple to measure the temperature difference ⁇ T between the hot end and the cold end, use the heat flow meter to measure the heat flow Q between the hot end and the cold end, according to the temperature difference and the heat flow Determine the value of the first thermal resistance.
  • the first thermal resistance includes the intrinsic thermal resistance R A of the first material, the contact thermal resistance R A-c1 between the first material and the hot end, and the interface thermal resistance R AB between the first material and the second material , the intrinsic thermal resistance R B of the second material, and the contact thermal resistance R B-c2 between the second material and the cold end, expressed as the following formula (2):
  • R tot-AB R A +R A-c1 +R AB +R B +R B-c2 (2)
  • the specific measurement method may include that a thermocouple may be used to measure the temperature difference ⁇ T between the hot end and the cold end, and a heat flow meter may be used to measure the heat flow Q between the hot end and the cold end, according to The temperature difference and heat flow determine the value of the first thermal resistance.
  • the second thermal resistance includes the intrinsic thermal resistance R B of the second material, the contact thermal resistance R B-c1 between the second material and the hot end, and the interface thermal resistance R AB between the first material and the second material , the intrinsic thermal resistance RA of the first material, and the contact thermal resistance RA -c2 between the first material and the cold end, expressed as the following formula (3):
  • R tot-BA R B +R B-c1 +R AB +R A +R A-c2 (3)
  • the interface thermal resistance between the first material and the second material is determined according to the intrinsic thermal resistance, the contact thermal resistance, the first thermal resistance and the second thermal resistance .
  • R AB represents the interface thermal resistance of the first material and the second material
  • R tot-AB represents the first thermal resistance
  • R tot-BA represents the second thermal resistance
  • RA and RB represent the first material and the second Intrinsic thermal resistance of the material
  • R A-c1 + R A-c2 represents the sum of the contact thermal resistance of the hot end and cold end of the measurement end and the first material respectively
  • R B-c1 + R B-c2 represents the thermal resistance of the measurement end The sum of the contact thermal resistances of the hot end and the cold end respectively to the second material.
  • the first material and the second material are contacted in a random manner, the first thermal resistance between the two materials is measured, and the positions of the first material and the second material are exchanged to obtain the second thermal resistance, according to the first The first thermal resistance and the second thermal resistance, and using the sum of the contact thermal resistances between the first material and the second material and the measurement end and the intrinsic thermal resistance of the two materials, the interface thermal resistance of the first material and the second material is obtained, and measured
  • the results are accurate and reliable, and there is no need to open holes in the material itself, which does not affect the performance of the material itself; both thermocouples and heat flow meters can be installed at the same location, such as the measurement end, and will not change the position due to different measurement materials .
  • Fig. 5 is a schematic diagram showing a method for measuring intrinsic thermal resistance according to an exemplary embodiment.
  • the obtaining the intrinsic thermal resistance of the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the intrinsic thermal resistance of the first material is determined.
  • Fig. 6 is a schematic diagram showing a correlation relationship between fitted thermal resistance data and thickness data according to an exemplary embodiment. Referring to Fig. 6, according to the thermal resistance data and the thickness data, the correlation relationship between the thermal resistance data and the thickness data is obtained by fitting, expressed as follows:
  • k represents the thermal conductivity of the first material
  • A represents the contact area between the first material and the measuring end.
  • the first item in formula (5) is the intrinsic thermal resistance of the first material, and the intrinsic thermal resistance of the first material can be obtained by substituting the data in Table 1.
  • the relationship between the thermal resistance data and the thickness data of the first material is obtained, and then the intrinsic thermal resistance of the first material is determined, and the intrinsic thermal resistance with high precision can be obtained .
  • the obtaining the intrinsic thermal resistance of the first material includes:
  • the thermal conductivity of the first material is determined.
  • the thermal conductivity of the first material can be determined through the formula (1), wherein the thermal conductivity can be obtained through the stored measurement data Obtained, or real-time measurement data acquisition.
  • the real-time measurement data can include the following methods:
  • the obtaining the thermal conductivity of the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the thermal conductivity of the first material is determined according to the correlation and the area.
  • multiple sets of thermal resistance data between the hot end and the cold end are acquired, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot ends respectively. and the total thermal resistance measured between the cold end; obtaining the thickness data of the first material, and fitting the relationship between the thermal resistance data and the thickness data according to the thermal resistance data and the thickness data , which is the same as the above embodiment, and will not be repeated here.
  • the determining the thermal conductivity of the first material according to the correlation relationship and the area may include formula (5).
  • the acquiring the contact thermal resistance between the measuring end and the first material includes:
  • the thermal resistance data is set to be measured by placing the first material with different thicknesses and the same area between the hot end and the cold end respectively total thermal resistance;
  • the thermal contact resistance between the measuring end and the first material includes the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively.
  • multiple sets of thermal resistance data between the hot end and the cold end are acquired, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot ends respectively. and the total thermal resistance measured between the cold end; obtaining the thickness data of the first material, and fitting the relationship between the thermal resistance data and the thickness data according to the thermal resistance data and the thickness data , the manner is the same as that of the foregoing embodiment, and will not be repeated here.
  • the thermal contact resistance between the measuring end and the first material is the intercept R c1 +R c2 of the linear function represented by formula (5).
  • the correlation between the thermal resistance data and the thickness data is obtained by fitting, and then the determined contact thermal resistance between the measuring end and the first material has accurate High degree of beneficial effect.
  • the obtaining the first thermal resistance includes:
  • the first thermal resistance is determined according to the temperature difference and the heat flow.
  • a temperature measuring device such as a thermometer
  • a thermometer may be respectively arranged at the hot end and the cold end of the measuring end, so as to measure the temperature difference between the hot end and the cold end.
  • the heat flow from the hot end to the cold end can be measured by a heat flow meter, and the heat flow meter can be arranged in the measurement end. It does not need to be set in the material body, so it can be used repeatedly once set.
  • the determination of the first thermal resistance according to the temperature difference and the heat flow can be determined by the following formula:
  • R tot-AB represents the first thermal resistance
  • ⁇ T represents the temperature difference between the hot end and the cold end
  • Q represents the heat flow from the hot end to the cold end.
  • the test of the first thermal resistance can be completed without destroying the material, and the measurement result is accurate.
  • the intrinsic thermal resistance of the second material and the contact thermal resistance between the measuring end and the second material are measured in the same manner as the first material, which will not be repeated here.
  • the acquiring multiple sets of thermal resistance data between the hot end and the cold end includes: acquiring more than three sets of thermal resistance data between the hot end and the cold end block data. Using three or more sets of thermal resistance data can be fitted so that the correlation between the fitted thermal resistance data and the thickness data is more accurate.
  • the interface thermal resistance of the metal material adhesive layer is tested with reference to the technical solution of the present invention to verify the effectiveness and feasibility of the technical solution of the present invention.
  • stainless steel materials with different thicknesses are selected for bonding, and the interface thermal resistance of the bonding layer is tested through the method of the technical solution of the present invention.
  • DynTIM thermal conductivity tester standard samples of stainless steel materials (thicknesses are 1000/1500/2000/2500/3000um, diameter 12.5mm) and thermal conductive silicone grease, etc.
  • the intrinsic thermal resistance test can be performed on a stainless steel sample with a thickness of 1000um.
  • a thin layer of thermal conductive silicone grease is evenly applied on the upper and lower surfaces of the sample to reduce the distance between the two ends of the sample and the equipment. contact thermal resistance;
  • K' is the slope of Figure 6
  • Ka is the thermal conductivity
  • Fig. 7 is a schematic block diagram of a device for measuring intrinsic thermal resistance according to an exemplary embodiment. Refer to Figure 7, including:
  • the first obtaining module 701 is used to obtain the intrinsic thermal resistance of the first material and the second material, and measure the interface thermal resistance of the end and the first material and the second material respectively, and the measuring end includes the hot end and the second material. cold end;
  • the second acquisition module 703 is configured to acquire a first thermal resistance, the first thermal resistance is set to be placed between the hot end and the cold end after the first material and the second material are in contact The total measured thermal resistance between;
  • the third obtaining module 705 is used to obtain the second thermal resistance, and the second thermal resistance is set to be placed at the hot end and the cold end after exchanging the positions of the first material and the second material The total measured thermal resistance between;
  • the determination module 707 is configured to determine the interface thermal resistance between the first material and the second material according to the intrinsic thermal resistance, the interface thermal resistance, the first thermal resistance and the second thermal resistance.
  • the thermal contact resistance between the measuring end and the first material includes: the sum of the thermal contact resistances of the hot end and the cold end of the measuring end and the first material respectively, and the measuring end
  • the contact thermal resistance with the second material includes: the sum of the contact thermal resistances of the hot end and the cold end of the measurement end with the second material respectively.
  • the first obtaining module includes:
  • the first acquisition sub-module is used to acquire multiple sets of thermal resistance data between the hot end and the cold end, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot end respectively and the total thermal resistance measured between the cold junction;
  • the second acquisition sub-module is used to acquire the thickness data of the first material, and obtain the relationship between the thermal resistance data and the thickness data by fitting according to the thermal resistance data and the thickness data;
  • the first determining submodule is used to determine the intrinsic thermal resistance of the first material according to the correlation and the thickness of the first material.
  • the first obtaining module includes:
  • the third acquisition sub-module is to acquire the thermal conductivity and thickness of the first material
  • the second determining submodule determines the thermal conductivity of the first material according to the thermal conductivity and the thickness.
  • the third acquiring submodule includes:
  • the first acquisition unit is used to acquire multiple sets of thermal resistance data between the hot end and the cold end, and the thermal resistance data is set to place first materials of different thicknesses and the same area on the hot end and the cold end respectively.
  • the second acquiring unit is configured to acquire the thickness data of the first material, and obtain the relationship between the thermal resistance data and the thickness data by fitting according to the thermal resistance data and the thickness data;
  • the determining unit is configured to determine the thermal conductivity of the first material according to the correlation and the area.
  • the first obtaining module includes:
  • the first acquisition sub-module is used to acquire multiple sets of thermal resistance data between the hot end and the cold end, and the thermal resistance data is set to place first materials with different thicknesses and the same area on the hot end respectively and the total thermal resistance measured between the cold junction;
  • the second acquisition sub-module is used to acquire the thickness data of the first material, and obtain the relationship between the thermal resistance data and the thickness data by fitting according to the thermal resistance data and the thickness data;
  • the third determining submodule is configured to determine the thermal contact resistance between the measuring end and the first material according to the association relationship.
  • the second obtaining module includes:
  • the fourth acquisition sub-module is used to acquire the temperature difference and heat flow between the hot end and the cold end;
  • the fourth determination submodule is configured to determine the first thermal resistance according to the temperature difference and the heat flow.
  • the first obtaining submodule includes:
  • the first acquisition unit is configured to acquire more than three sets of thermal resistance data between the hot end and the cold end.
  • Fig. 8 is a schematic block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.
  • the apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.
  • device 800 may include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and communication component 816 .
  • the processing component 802 generally controls the overall operations of the device 800, such as those associated with display, telephone calls, data communications, camera operations, and recording operations.
  • the processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above method. Additionally, processing component 802 may include one or more modules that facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802 .
  • the memory 804 is configured to store various types of data to support operations at the device 800 . Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and the like.
  • the memory 804 can be implemented by any type of volatile or non-volatile storage device or their combination, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), Magnetic Memory, Flash Memory, Magnetic or Optical Disk.
  • SRAM static random access memory
  • EEPROM electrically erasable programmable read-only memory
  • EPROM erasable Programmable Read Only Memory
  • PROM Programmable Read Only Memory
  • ROM Read Only Memory
  • Magnetic Memory Flash Memory
  • Magnetic or Optical Disk Magnetic Disk
  • the power supply component 806 provides power to the various components of the device 800 .
  • Power components 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for device 800 .
  • the multimedia component 808 includes a screen that provides an output interface between the device 800 and the user.
  • the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user.
  • the touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may not only sense a boundary of a touch or swipe action, but also detect duration and pressure associated with the touch or swipe action.
  • the multimedia component 808 includes a front camera and/or a rear camera. When the device 800 is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capability.
  • the audio component 810 is configured to output and/or input audio signals.
  • the audio component 810 includes a microphone (MIC) configured to receive external audio signals when the device 800 is in operation modes, such as call mode, recording mode and voice recognition mode. Received audio signals may be further stored in memory 804 or sent via communication component 816 .
  • the audio component 810 also includes a speaker for outputting audio signals.
  • the I/O interface 812 provides an interface between the processing component 802 and a peripheral interface module, which may be a keyboard, a click wheel, a button, and the like. These buttons may include, but are not limited to: a home button, volume buttons, start button, and lock button.
  • Sensor assembly 814 includes one or more sensors for providing status assessments of various aspects of device 800 .
  • the sensor component 814 can detect the open/closed state of the device 800, the relative positioning of components, such as the display and keypad of the device 800, and the sensor component 814 can also detect a change in the position of the device 800 or a component of the device 800 , the presence or absence of user contact with the device 800 , the device 800 orientation or acceleration/deceleration and the temperature change of the device 800 .
  • Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects in the absence of any physical contact.
  • Sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications.
  • the sensor component 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor or a temperature sensor.
  • the communication component 816 is configured to facilitate wired or wireless communication between the apparatus 800 and other devices.
  • the device 800 can access wireless networks based on communication standards, such as WiFi, 2G or 3G, or a combination thereof.
  • the communication component 816 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel.
  • the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication.
  • NFC near field communication
  • the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra Wide Band (UWB) technology, Bluetooth (BT) technology and other technologies.
  • RFID Radio Frequency Identification
  • IrDA Infrared Data Association
  • UWB Ultra Wide Band
  • Bluetooth Bluetooth
  • apparatus 800 may be programmed by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable A gate array (FPGA), controller, microcontroller, microprocessor or other electronic component implementation for performing the methods described above.
  • ASICs application specific integrated circuits
  • DSPs digital signal processors
  • DSPDs digital signal processing devices
  • PLDs programmable logic devices
  • FPGA field programmable A gate array
  • controller microcontroller, microprocessor or other electronic component implementation for performing the methods described above.
  • non-transitory computer-readable storage medium including instructions, such as the memory 804 including instructions, which can be executed by the processor 820 of the device 800 to implement the above method.
  • the non-transitory computer readable storage medium may be ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like.
  • Fig. 9 is a block diagram of a device for measuring interface thermal resistance according to an exemplary embodiment.
  • the apparatus 900 may be provided as a server.
  • apparatus 900 includes processing component 922, which further includes one or more processors, and memory resources represented by memory 932 for storing instructions executable by processing component 922, such as application programs.
  • the application program stored in memory 932 may include one or more modules each corresponding to a set of instructions.
  • the processing component 922 is configured to execute instructions to perform the above method.
  • Device 900 may also include a power component 926 configured to perform power management of device 1900 , a wired or wireless network interface 950 configured to connect device 1900 to a network, and an input-output (I/O) interface 958 .
  • the device 900 can operate based on an operating system stored in the memory 932, such as Windows ServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM or the like.
  • non-transitory computer-readable storage medium including instructions, such as the memory 932 including instructions, which can be executed by the processing component 922 of the device 900 to implement the above method.
  • the non-transitory computer readable storage medium may be ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

L'invention concerne un procédé et un appareil pour mesurer une résistance thermique interfaciale. Le procédé comprend les étapes suivantes : acquisition de la résistance thermique intrinsèque d'un premier matériau et d'un deuxième matériau, d'une résistance thermique de contact entre une extrémité de mesure et le premier matériau, et d'une résistance thermique de contact entre l'extrémité de mesure et le deuxième matériau, l'extrémité de mesure comprenant une extrémité chaude et une extrémité froide ; acquisition d'une première résistance thermique et d'une deuxième résistance thermique ; et en fonction des résistances thermiques intrinsèques, des résistances thermiques de contact, de la première résistance thermique et de la deuxième résistance thermique, détermination d'une résistance thermique interfaciale entre le premier matériau et le deuxième matériau. Le résultat de mesure est précis et fiable, et il n'est pas nécessaire de pratiquer des trous dans un matériau, évitant ainsi d'affecter les performances du matériau lui-même. De plus, il est possible de monter à la fois un thermocouple et un appareil de mesure de flux thermique à une position unifiée, telle qu'une extrémité de mesure, de sorte que la position n'est pas modifiée en raison de la différence de matériaux de mesure.
PCT/CN2022/096529 2021-06-02 2022-06-01 Procédé et appareil pour mesurer une résistance thermique interfaciale WO2022253257A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110616270.5A CN113514492B (zh) 2021-06-02 2021-06-02 一种测量界面热阻的方法和装置
CN202110616270.5 2021-06-02

Publications (1)

Publication Number Publication Date
WO2022253257A1 true WO2022253257A1 (fr) 2022-12-08

Family

ID=78065407

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/096529 WO2022253257A1 (fr) 2021-06-02 2022-06-01 Procédé et appareil pour mesurer une résistance thermique interfaciale

Country Status (2)

Country Link
CN (1) CN113514492B (fr)
WO (1) WO2022253257A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117148124A (zh) * 2023-11-01 2023-12-01 杭州高坤电子科技有限公司 一种集成电路热阻测试方法、系统及存储介质

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113514492B (zh) * 2021-06-02 2023-09-01 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 一种测量界面热阻的方法和装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142662A (en) * 1998-06-16 2000-11-07 New Jersey Institute Of Technology Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance
CN102768225A (zh) * 2012-08-07 2012-11-07 南京理工大学 一种高精度热界面材料测试方法
CN102768224A (zh) * 2012-08-07 2012-11-07 南京理工大学 正反双向热流法测固-固接触热阻的测试方法
CN102778476A (zh) * 2012-08-07 2012-11-14 南京理工大学 正反双向热流法测定导热系数的方法
CN109540961A (zh) * 2018-11-06 2019-03-29 清华大学深圳研究生院 测量热学参数的方法、装置及热觉传感器
CN111965212A (zh) * 2020-07-31 2020-11-20 南方科技大学 热物性计算方法、热物性测试系统、电子设备及存储介质
CN113514492A (zh) * 2021-06-02 2021-10-19 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 一种测量界面热阻的方法和装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2170924C2 (ru) * 1999-07-07 2001-07-20 Воронежская государственная лесотехническая академия Способ определения контактных термических сопротивлений
US8087821B2 (en) * 2007-06-06 2012-01-03 Waters Technologies Corporation Infrared heated differential scanning calorimeter
CN101929970B (zh) * 2010-07-13 2012-05-16 北京航空航天大学 接触热阻测试方法
CN101907590B (zh) * 2010-07-13 2012-01-11 北京航空航天大学 一种接触热阻测试设备
CN102253082B (zh) * 2011-06-29 2012-11-07 上海大学 一种动态测量薄膜热物理参数的装置和方法
CN103245694B (zh) * 2013-05-13 2015-07-22 北京工业大学 一种测量半导体器件和接触材料间接触热阻的方法
JP6923885B2 (ja) * 2016-12-13 2021-08-25 トヨタ自動車株式会社 熱特性評価測定装置及びそれを用いた熱特性の評価測定方法
CN107688039B (zh) * 2017-07-14 2020-01-10 昆明理工大学 薄板材料导热系数与界面热阻的测试系统及其测试方法
CN207611006U (zh) * 2017-12-27 2018-07-13 齐鲁工业大学 一种接触热阻测试装置
CN108007964A (zh) * 2017-12-27 2018-05-08 齐鲁工业大学 一种接触热阻测试装置及测试方法
CN108445040B (zh) * 2018-03-05 2021-06-15 大连海事大学 一种带有热膨胀修正的接触热阻测试方法
CN208297403U (zh) * 2018-05-29 2018-12-28 哈尔滨工业大学深圳研究生院 一种GaN外延晶片界面热阻的测量装置
CN109283216A (zh) * 2018-10-12 2019-01-29 广州特种承压设备检测研究院 一种石墨烯材料界面热阻的测量方法和装置
CN110044955B (zh) * 2019-02-15 2024-04-02 上海海事大学 用于稳态法测量膏状材料导热性能的样品支架及测量方法
CN209525290U (zh) * 2019-02-15 2019-10-22 上海海事大学 用于稳态法测量膏状材料导热性能的样品支架
CN109839406B (zh) * 2019-03-27 2022-08-09 桂林电子科技大学 一种界面接触热阻的高精度测试方法
CN109813753B (zh) * 2019-03-28 2022-08-05 桂林电子科技大学 双向热流法测定界面接触热阻的高精度方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142662A (en) * 1998-06-16 2000-11-07 New Jersey Institute Of Technology Apparatus and method for simultaneously determining thermal conductivity and thermal contact resistance
CN102768225A (zh) * 2012-08-07 2012-11-07 南京理工大学 一种高精度热界面材料测试方法
CN102768224A (zh) * 2012-08-07 2012-11-07 南京理工大学 正反双向热流法测固-固接触热阻的测试方法
CN102778476A (zh) * 2012-08-07 2012-11-14 南京理工大学 正反双向热流法测定导热系数的方法
CN109540961A (zh) * 2018-11-06 2019-03-29 清华大学深圳研究生院 测量热学参数的方法、装置及热觉传感器
CN111965212A (zh) * 2020-07-31 2020-11-20 南方科技大学 热物性计算方法、热物性测试系统、电子设备及存储介质
CN113514492A (zh) * 2021-06-02 2021-10-19 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 一种测量界面热阻的方法和装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FENG BIAO: "Molecular Dynamics and Experimental Study of the Thermophysical Properties of Polyol Phase Change Materials for Medium-temperature Latent Heat Storage", CHINESE DOCTORAL DISSERTATIONS FULL TEXT DATABASE, no. 1, 20 September 2021 (2021-09-20), pages 1 - 196, XP093010554 *
FENG BIAO; TU JING; ZHANG YU-HONG; FAN LI-WU; YU ZI-TAO: "An improved steady-state method for measuring the thermal contact resistance and bulk thermal conductivity of thin-walled materials having a sub-millimeter thickness", APPLIED THERMAL ENGINEERING, vol. 171, 11 January 2020 (2020-01-11), GB , XP086084405, ISSN: 1359-4311, DOI: 10.1016/j.applthermaleng.2020.114931 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117148124A (zh) * 2023-11-01 2023-12-01 杭州高坤电子科技有限公司 一种集成电路热阻测试方法、系统及存储介质
CN117148124B (zh) * 2023-11-01 2024-02-20 杭州高坤电子科技有限公司 一种集成电路热阻测试方法、系统及存储介质

Also Published As

Publication number Publication date
CN113514492B (zh) 2023-09-01
CN113514492A (zh) 2021-10-19

Similar Documents

Publication Publication Date Title
WO2022253257A1 (fr) Procédé et appareil pour mesurer une résistance thermique interfaciale
CN105633498B (zh) 电池温度检测方法及装置
US8870453B2 (en) System, method and computer program product for monitoring temperature
JP6392991B2 (ja) 画像による空間パラメータ特定方法、装置、プログラム、記録媒体および端末機器
WO2017031898A1 (fr) Procédé et appareil d'affichage d'informations
CN102045423A (zh) 移动终端、使用移动终端进行温度检测的方法
WO2017031905A1 (fr) Procédé et dispositif d'analyse de relations sociales
CN105627920A (zh) 尺寸显示方法和装置
US11218014B2 (en) Circuitry and method for detecting temperature of wireless charging coil, and storage medium
EP4203604A1 (fr) Procédé et appareil de demande de capacité de télémétrie, procédé et appareil d'envoi de capacité de télémétrie, et procédé et appareil de réception de capacité de télémétrie
WO2017088259A1 (fr) Procédé et dispositif de protection d'écran
CN105651381A (zh) 光线传感器校准方法和装置
CN112082656A (zh) 温度确定方法及装置、电子设备、存储介质
CN105258773A (zh) 一种重量变化提示的方法和装置
WO2023124143A1 (fr) Procédé et appareil de mesure de température corporelle, dispositif électronique et support de stockage
CN110632494A (zh) 芯片温度的测试方法、装置、设备及介质
CN108020374B (zh) 气压值确定方法及装置
WO2019119427A1 (fr) Procédé et dispositif de rapport d'informations d'essai d'unité de lecteur, procédé et dispositif de détection de fonctionnement de réseau
CN106557403B (zh) Tpe测试方法、装置及设备
WO2018126366A1 (fr) Procédé et appareil de mesure de température
CN104655294A (zh) 体温测量方法、装置及体温计
CN112986879B (zh) 电量计校正方法和装置、电子设备、存储介质
CN114818472A (zh) 超临界压力流体换热性能预测方法、装置和设备
CN111685738A (zh) 体温采集方法、装置、存储介质及电子设备
CN109211115B (zh) 一种测量方法及装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22815300

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE