CN110632494A - Chip temperature testing method, device, equipment and medium - Google Patents
Chip temperature testing method, device, equipment and medium Download PDFInfo
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- CN110632494A CN110632494A CN201810644719.7A CN201810644719A CN110632494A CN 110632494 A CN110632494 A CN 110632494A CN 201810644719 A CN201810644719 A CN 201810644719A CN 110632494 A CN110632494 A CN 110632494A
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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Abstract
The embodiment of the invention provides a chip temperature test, a device, equipment and a medium, which relate to the technical field of integrated circuits, and the method comprises the following steps: applying current to the chip pins according to the applied current value; detecting the voltage of the chip pin to obtain a test voltage value; and determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin. The embodiment of the invention can accurately determine the temperature test result of the chip pin without using a temperature sensor, thereby reducing the expense of the chip area and reducing the test complexity and the test cost.
Description
Technical Field
The present invention relates to the field of integrated circuit technologies, and in particular, to a method and an apparatus for testing a chip temperature, an electronic device, and a storage medium.
Background
With the rapid development of computer technology, electronic devices such as mobile phones and tablet computers are more and more popular, and great convenience is brought to life, study and work of people. In which, a chip as a part of these electronic devices usually needs to be tested before use, so as to avoid that the chip consumes too much power and affects the performance of the electronic devices.
In a particular implementation, chip temperature is an important factor that affects chip power consumption. Therefore, when testing a chip, three temperature tests, namely a high temperature test, a normal temperature test and a low temperature test are generally required to be performed on the chip. However, after the chip is subjected to high and low temperatures, how to accurately detect the real-time temperature of the chip is a problem faced in many chip testing processes at present.
At present, a temperature sensor is usually added in a chip, and then the temperature test of the chip is performed through the temperature sensor. This chip temperature test scheme requires a separate module of temperature sensors in the chip, thereby increasing the test cost and increasing the chip area overhead.
Disclosure of Invention
In view of the above problems, embodiments of the present invention are proposed to provide a method for testing a chip temperature that overcomes or at least partially solves the above problems, so as to reduce testing costs.
Correspondingly, the embodiment of the invention also provides a device for testing the chip temperature, electronic equipment and a storage medium, which are used for ensuring the realization and application of the method.
In order to solve the above problems, an embodiment of the present invention discloses a method for testing a chip temperature, including: applying current to the chip pins according to the applied current value; detecting the voltage of the chip pin to obtain a test voltage value; and determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
Optionally, adjusting the ambient temperature of the chip pin; and after the environment temperature is adjusted, detecting the voltage of the chip pin to obtain a test voltage value. Or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain a test voltage value.
Optionally, the determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference of the chip pin includes: acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value; and calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value.
Optionally, the calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value includes: calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted; calculating a ratio between the voltage difference and the forward voltage drop difference; and adding the ratio and a preset chip temperature value, and determining a test temperature value obtained after adding as a temperature test result.
Optionally, the applying the current to the chip pin according to the applied current value includes: and applying current to the chip pin according to the applied current value through a chip testing machine. The adjusting the environmental temperature of the chip pin includes: and adjusting the environmental temperature of the chip pins through a temperature box or a cup.
The embodiment of the invention also discloses a device for testing the temperature of the chip, which comprises:
the current applying module is used for applying current to the chip pins according to the applied current value;
the voltage detection module is used for detecting the voltage of the chip pin to obtain a test voltage value;
and the test result determining module is used for determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
Optionally, the voltage detection module includes:
the temperature adjusting submodule is used for adjusting the environmental temperature of the chip pin;
the voltage detection submodule is used for detecting the voltage of the chip pin after the environmental temperature is adjusted to obtain a test voltage value; or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain a test voltage value.
Optionally, the test result determining module includes:
the acquisition submodule is used for acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value;
and the determining submodule is used for calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value and determining a temperature test result corresponding to the test voltage value.
Optionally, the determining sub-module includes:
the voltage difference unit is used for calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted;
a ratio calculation unit for calculating a ratio between the voltage difference and the forward voltage drop difference;
and the result determining unit is used for adding the ratio and a preset chip temperature value and determining a test temperature value obtained after adding as a temperature test result.
Optionally, the current applying module is specifically configured to apply a current to the chip pin according to an applied current value by using a chip tester; the temperature adjusting submodule is specifically used for adjusting the environmental temperature of the chip pins through a temperature box or a cup.
An embodiment of the present invention also discloses an electronic device comprising a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, the one or more programs including instructions for: applying current to the chip pins according to the applied current value; detecting the voltage of the chip pin to obtain a test voltage value; and determining a chip temperature test result according to the test voltage value and the forward voltage drop difference value of the chip pin.
The embodiment of the invention also discloses a readable storage medium, and when instructions in the storage medium are executed by a processor of the electronic equipment, the electronic equipment can execute one or more chip temperature testing methods in the embodiment of the invention.
The embodiment of the invention has the following advantages:
according to the embodiment of the invention, the voltage of the chip pin is detected, so that the temperature test result of the chip pin can be accurately determined according to the detected test voltage value and the forward voltage drop difference value of the chip pin, a temperature sensor is not needed, the cost of the chip area is reduced, the temperature sensor in the chip is not needed to be calibrated, and the test complexity and the test cost are reduced.
Drawings
FIG. 1 is a flow chart of steps of an embodiment of a method for testing the temperature of a chip according to the present invention;
FIG. 2 is a flow chart of steps of an alternative embodiment of a method for testing chip temperature in accordance with the present invention;
FIG. 3 is a block diagram of an embodiment of an apparatus for testing a chip temperature according to the present invention;
fig. 4 is a block diagram illustrating an electronic device for testing chip temperature according to an example embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
When the chip is subjected to a three-temperature test, the index of the temperature of the chip needs to be closely concerned. At present, the method of measuring the temperature of the chip is usually to add the design of a temperature sensor at the time of chip design so as to measure the temperature of the chip through the temperature sensor. However, adding temperature sensors to the chip increases the overhead of chip area, and calibration of the temperature sensors also increases the complexity of the temperature test, as well as increases the cost of the test.
One of the core concepts of the embodiment of the invention is that the temperature of the chip is determined by testing the voltage value of the pin of the chip under the condition of not using a temperature sensor, the complexity of temperature test is reduced, and the test cost is saved.
Referring to fig. 1, a flowchart illustrating steps of an embodiment of a method for testing a chip temperature according to the present invention is shown, which may specifically include the following steps:
and step 102, applying current to the chip pin according to the applied current value.
In the embodiment of the invention, when the chip is subjected to temperature test, current can be applied to any one or more chip pins to be tested in the chip according to the preset applied current value, so that the applied current can flow through the chip pins to be tested, and the voltage value of the chip pins can be tested. For example, when a chip is tested on Automatic Test Equipment (ATE), current may be applied to one or more chip pins of the chip under test at a preset application current value by each Pin measurement unit (PPMU) in the ATE.
The chip pin may refer to a digital pin with a diode protection circuit in the chip. The applied current value may be set based on the performance of the chip pin, such as 20 microamperes (uA), which is not limited by the embodiment of the present invention.
And 104, detecting the voltage of the chip pin to obtain a test voltage value.
Specifically, after the current is applied to the chip pin to be tested, the voltage of the chip pin can be detected by performing voltage detection on the chip pin, and the detected voltage value can be determined as the test voltage value corresponding to the current chip temperature, so that the real-time temperature of the current chip pin can be determined according to the current test voltage value.
Optionally, when the test item is a three-temperature test, the obtained test voltage values of the chip pins may specifically include voltage values of the chip pins at different temperatures, and for example, the test voltage values may include: one or more high-temperature voltage values of the chip pin in a high-temperature state, one or more normal-temperature voltage values of the chip pin in a normal-temperature state, one or more low-temperature voltage values of the chip pin in a low-temperature state, and the like.
And 106, determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
In a specific implementation, the chip pin typically includes a diode, such as a conventional silicon diode. According to the influence of the temperature on the diode, the forward voltage drop difference of the chip pin can be determined. The forward voltage drop difference may be used to characterize a voltage at which the forward voltage drop of the diode decreases as the temperature increases, such as a voltage at which the forward voltage drop of a pin of the chip decreases by about 2 millivolts (mV) for every 1 degree c increase in the temperature of the pin of the chip. The forward voltage drop may be a voltage difference between two ends of the diode when the diode is in forward conduction, for example, the forward voltage drop of the silicon material diode is about 0.6 to 0.8 v, and the forward voltage drop of the germanium material diode is about 0.1 to 0.3 v, and the like.
After the current test voltage value corresponding to the chip pin is determined, the embodiment of the invention can calculate by adopting the forward voltage drop difference value of the chip pin and the test voltage value, thereby obtaining the temperature value of the chip pin corresponding to the test voltage value by calculation, and determining the calculated temperature value of the chip pin as the current temperature test result of the chip.
In summary, the embodiment of the invention applies current to the chip pin and detects the voltage of the chip pin, so that the temperature test result of the chip pin can be accurately determined according to the detected test voltage value and the forward voltage drop difference value of the chip pin, a temperature sensor is not needed, the cost of the chip area is reduced, the temperature sensor in the chip is not needed to be calibrated, and the test complexity and the test cost are reduced.
In specific implementation, under the condition that the chip does not have a temperature sensor module, the embodiment of the invention can test the voltage value of the pin of the chip through the existing test items on the basis of not adding any test items, and calculate based on the tested voltage value to obtain the actual temperature of the chip during high-temperature and low-temperature tests, thereby saving the test cost.
As an example of the present invention, in combination with an existing ATE test project, the chip temperature can be accurately tested by the method for testing the chip temperature provided by the embodiment of the present invention. Specifically, when the ATE performs a chip test, the connectivity test may be an indispensable test item of the chip. The principle of the connectivity test may be an inlet pressure measurement (ISVM) principle. Based on the ISVM principle, the corresponding voltage can be tested by applying a current. When the chip is tested at high and low temperatures, the current can be applied to the chip pins to be tested in the chip according to the applied current determined in the connectivity test, so that a corresponding test voltage value can be tested, and the current actual temperature of the chip pins can be calculated according to the test voltage value.
It should be noted that the chip pin may be a diode, and the relationship between the temperature of the chip pin and the voltage across the chip pin may be determined based on the relationship between the voltage u across the diode and the current i flowing through the diode. The relationship between the voltage u across the diode and the current i flowing through the diode may be:
i＝Is*(equ/kT-1)；
wherein Is may represent a reverse saturation current of the diode, and in case the diode Is fabricated with a silicon material, Is may be about 10 pA (pA); q may represent the charge of an electron, i.e., q may be 1.6 times 10 coulombs to the power of-9; k may be a Boltzmann constant, and the value of K may be equal to 1.38 multiplied by 10 joules per Kelvin (J/K) to the power of-23; t may represent a Thermodynamic Temperature (Thermodynamic Temperature). The thermodynamic temperature is also called the thermodynamic temperature scale, denoted by the symbol T, and expressed in Kelvin (K).
Deducing according to the relation between the voltage u at the two ends of the diode and the current i flowing through the diode, wherein the relation between the thermodynamic temperature T and the voltage u at the two ends of the diode is obtained as follows:
T＝(qu/k)*[1/ln(i/Is+1)]；
based on the relation between the thermodynamic temperature T and the voltage u at the two ends of the diode, the direct proportion relation between the voltage at the two ends of the chip pin and the actual temperature of the chip pin can be determined, so that the actual temperature of the chip pin can be determined by measuring the test voltage value corresponding to the chip pin, the method can be applied to the temperature test of a large-scale digital chip with a complex structure, the test method is simple and accurate, and the test cost is reduced.
Referring to fig. 2, a flowchart illustrating steps of an alternative embodiment of the method for testing chip temperature according to the present invention is shown, which may specifically include the following steps:
and step 202, applying current to the chip pins according to the applied current value through a chip testing machine.
Specifically, when a chip is tested by using a chip tester, a current can be applied to a chip pin to be tested by the PPMU of the chip tester according to a preset applied current value, so that a corresponding test voltage value can be detected based on the value of the current flowing through the chip pin.
And 204, detecting the voltage of the chip pin to obtain a test voltage value.
For example, when a chip is subjected to a temperature test, a current may be applied to a chip pin so that the magnitude of the current flowing through the chip pin is 20uA, then a current test voltage value corresponding to the chip pin may be measured to be XmV, and then a calculation may be performed using the test voltage value XmV to determine an actual temperature corresponding to the chip pin.
In the embodiment of the present invention, optionally, after the environmental temperature of the chip pin is adjusted, the voltage test may be performed on the chip pin again, so as to calculate the actual temperature of the chip pin after the environmental temperature adjustment according to the test voltage value obtained by the retest. The detecting the voltage of the chip pin to obtain the test voltage value may include: adjusting the environmental temperature of the chip pin; and after the environment temperature is adjusted, detecting the voltage of the chip pin to obtain a test voltage value.
In concrete realization, can control the ambient temperature of chip pin through equipment such as incubator, cup for the ambient temperature of chip pin keeps unchangeable, guarantees chip temperature's stability, improves the test accuracy. Thus, in an alternative embodiment of the invention, the ambient temperature of the chip pins may be adjusted by a temperature box or cup. After the environmental temperature is adjusted, the voltage of the chip pin can be detected through a voltmeter, a special test digital pin voltage module in ATE and the like, and a corresponding test voltage value is obtained, so that the real-time temperature of the chip pin after the environmental temperature is adjusted can be determined according to the test voltage value.
In an optional embodiment of the present invention, after the environmental temperature of the chip pin is adjusted, the voltage of the chip pin may be detected after waiting for a certain period of time, so as to ensure the accuracy of the voltage detection. Optionally, the detecting the voltage of the chip pin to obtain the test voltage value may specifically include: adjusting the environmental temperature of the chip pin; after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time length, and at least one test voltage value is obtained. Specifically, after the environmental temperature of the chip pins is adjusted, the voltage of the chip pins can be detected after waiting for a preset time period, so as to detect the test voltage values of one or more chip pins. For example, when the preset waiting time is 20 minutes, after the environmental temperature is adjusted for 20 minutes, the voltages of one or more chip pins may be detected, so as to obtain the test voltage values of one or more chip pins. After waiting for 20 minutes again, namely after the environmental temperature is adjusted for 40 minutes, the voltage of one or more chip pins can be detected for the second time, so that the test voltage values of one or more chip pins are obtained; after the environmental temperature is adjusted for 60 minutes, the voltage of one or more chip pins is detected for the third time, so that the test voltage value … … of one or more chip pins is obtained, and the detection can be performed on the voltage of the chip pins for multiple times based on the preset waiting time, so that the temperature test result of the chip is determined based on the test voltage values detected for multiple times, and the accuracy of the temperature test result is improved.
And step 206, acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value.
The theoretical test voltage value can represent a voltage value obtained by testing when the temperature of the chip pin is tested. For example, when a normal temperature test is performed on a chip, a current of 20uA may be applied to a chip pin currently being tested, and then voltage detection may be performed on the chip pin. If the current voltage value of the chip pin is about 450mV, 450mV can be determined as the test theoretical voltage value. It should be noted that the normal temperature may be a temperature set in advance according to a temperature test requirement, and may generally refer to the room temperature, such as 25 degrees celsius or 26 degrees celsius, which is not limited in this embodiment of the present invention.
And 208, calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value.
In the embodiment of the invention, the test voltage value obtained by detection can be calculated by adopting the test theoretical voltage value and the forward voltage drop difference value based on the relation between the test voltage value and the actual temperature of the chip pin, and the temperature value obtained by calculation can be determined as the temperature test result corresponding to the test voltage value obtained by current test. Optionally, the calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value may include: calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted; calculating a ratio between the voltage difference and the forward voltage drop difference; and adding the ratio and a preset chip temperature value, and determining a test temperature value obtained after adding as a temperature test result. The preset chip temperature value is a temperature corresponding to the test theoretical voltage value, and if the test theoretical voltage value of the chip pin is 450mv, and the temperature of the obtained test theoretical voltage value is 26 ℃, the preset chip temperature value is 26 ℃.
For example, under the condition that the applied current value is 20 milliamperes, if the difference value of the forward voltage drops of the chip pins is 2 millivolts, and the theoretical test voltage value of the chip pins is detected to be 450 millivolts at the normal temperature of 26 ℃, it can be determined that the relationship between the real-time temperature Y of the chip pins and the test voltage value X is as follows:
Y＝[(450-X)/2]+26；
when the chip is tested at high and low temperatures, current can be applied to the chip pins according to the applied current value of 20 milliamperes, then the test voltage value X corresponding to the current chip pins is tested, and then the test voltage value X can be calculated according to the relation between the real-time temperature Y of the chip pins and the test voltage value X, so that the real-time temperature Y of the current chip pins is calculated.
Specifically, when the chip is subjected to a high temperature test, after a current is applied to the chip pin to be tested according to the applied current value of 20 milliamperes, one or more test temperature values of the chip pin at a high temperature can be tested, and then calculation can be performed based on the test temperature values tested at a high temperature, so that the temperature value of the chip pin at a high temperature is calculated, and the calculated temperature value can be determined as a temperature test result of the chip pin at the high temperature test.
Similarly, when the chip is subjected to low-temperature test, after the current is applied to the chip pin to be tested according to the applied current value of 20 milliamperes, one or more test temperature values of the chip pin at low temperature can be tested, and then calculation can be performed based on the test temperature values tested at low temperature, so that the temperature value of the chip pin at low temperature is calculated, and then the calculated temperature value can be determined as the temperature test result of the chip pin at low temperature test.
Wherein, the high temperature and the low temperature are relative to the normal temperature, for example, the normal temperature can mean about 25 ℃; the high temperature may range from 85 degrees celsius to 125 degrees celsius, or may range from 95 degrees celsius to 125 degrees celsius, etc.; the low temperature may range from-30 degrees to-60 degrees, or may range from-40 degrees to-55 degrees, and the like, which is not limited in the embodiments of the present invention.
In the above embodiments of the present invention, the chip temperature is the temperature at which the chip is not in the working state; in addition, the method for acquiring the chip temperature in the embodiment of the invention can also be applied to the chip temperature measurement process when the chip is in a working state.
Specifically, after the chip is started to operate, the voltage of one or more chip pins can be detected according to the preset waiting time, so that the test voltage value of one or more chip pins can be obtained. For example, when the preset waiting time is 30 minutes, after the chip runs for 30 minutes, the voltage of one or more chip pins may be detected for the first time, so as to obtain the test voltage value of one or more chip pins; after waiting for 30 minutes, namely after the chip runs for 60 minutes, the voltage of the chip pins can be detected for the second time, and the test voltage values of one or more chip pins are obtained; and after the chip runs for 90 minutes, detecting the voltage of one or more chip pins for the third time to obtain a test voltage value … … of one or more chip pins, and so on, detecting the voltage of the chip pins for multiple times based on the preset waiting time, determining a temperature test result of the chip based on the test voltage values detected for multiple times, and improving the accuracy of the temperature test result.
In summary, in the embodiment of the invention, when testing at high and low temperatures, the real-time temperature of the chip pin can be accurately obtained by detecting the test voltage value corresponding to the chip pin, so that the influence of over-high or over-low temperature on the performance of the chip can be avoided, and the purpose of protecting the silicon diode of the chip at the same time can be achieved.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
Referring to fig. 3, a block diagram of a structure of an embodiment of the apparatus for testing a chip temperature according to the present invention is shown, and the apparatus may specifically include the following modules:
a current applying module 302, configured to apply a current to a chip pin according to an applied current value;
the voltage detection module 304 is configured to detect a voltage of the chip pin to obtain a test voltage value;
and a test result determining module 306, configured to determine a temperature test result for the chip according to the test voltage value and the forward voltage drop difference of the chip pin.
In an alternative embodiment of the present invention, the voltage detection module 304 may include the following sub-modules:
the temperature adjusting submodule is used for adjusting the environmental temperature of the chip pin;
the voltage detection submodule is used for detecting the voltage of the chip pin after the environmental temperature is adjusted to obtain a test voltage value; or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain at least one test voltage value.
In an optional embodiment of the present invention, the test result determining module 306 may include the following sub-modules:
the acquisition submodule is used for acquiring a forward voltage drop difference value and a test theoretical voltage value of the chip pin;
and the determining submodule is used for calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value and determining a temperature test result corresponding to the test voltage value.
In an optional embodiment of the present invention, the determining sub-module may comprise the following units:
the voltage difference unit is used for calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted;
a ratio calculation unit for calculating a ratio between the voltage difference and the forward voltage drop difference;
and the result determining unit is used for adding the ratio and a preset chip temperature value and determining a test temperature value obtained after adding as a temperature test result.
In this embodiment of the present invention, optionally, the current applying module 302 may be specifically configured to apply a current to the chip pin according to the applied current value through a chip tester. The temperature adjustment submodule can be specifically used for adjusting the environmental temperature of the chip pins through a temperature box or a cup.
For the device embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
Fig. 4 is a block diagram illustrating an electronic device 400 for testing chip temperature according to an example embodiment. For example, the electronic device 400 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.
Referring to fig. 4, electronic device 400 may include one or more of the following components: processing components 402, memory 404, power components 406, multimedia components 408, audio components 410, input/output (I/O) interfaces 412, sensor components 414, and communication components 416.
The processing component 402 generally controls overall operation of the electronic device 400, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 402 may include one or more processors 420 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 402 can include one or more modules that facilitate interaction between the processing component 402 and other components. For example, the processing component 402 can include a multimedia module to facilitate interaction between the multimedia component 408 and the processing component 402.
The memory 404 is configured to store various types of data to support operations at the device 400. Examples of such data include instructions for any application or method operating on the electronic device 400, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 404 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The power supply component 406 provides power to the various components of the electronic device 400. Power components 406 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for electronic device 400.
The multimedia component 408 comprises a screen providing an output interface between the electronic device 400 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 408 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the electronic device 400 is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 410 is configured to output and/or input audio signals. For example, the audio component 410 includes a Microphone (MIC) configured to receive external audio signals when the electronic device 400 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 404 or transmitted via the communication component 416. In some embodiments, audio component 410 also includes a speaker for outputting audio signals.
The I/O interface 412 provides an interface between the processing component 402 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor component 414 includes one or more sensors for providing various aspects of status assessment for the electronic device 400. For example, the sensor component 414 can detect an open/closed state of the device 400, the relative positioning of components, such as a display and keypad of the electronic device 400, the sensor component 414 can also detect a change in the position of the electronic device 400 or a component of the electronic device 400, the presence or absence of user contact with the electronic device 400, orientation or acceleration/deceleration of the electronic device 400, and a change in the temperature of the electronic device 400. The sensor assembly 414 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 414 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 414 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 416 is configured to facilitate wired or wireless communication between the electronic device 400 and other devices. The electronic device 400 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 416 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 416 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the electronic device 400 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium comprising instructions, such as the memory 404 comprising instructions, executable by the processor 420 of the electronic device 400 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
A non-transitory computer readable storage medium having instructions therein which, when executed by a processor of a terminal, enable the terminal to perform a method of testing chip temperature, the method comprising: applying current to the chip pins according to the applied current value; detecting the voltage of the chip pin to obtain a test voltage value; and determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
Optionally, adjusting the ambient temperature of the chip pin; and after the environment temperature is adjusted, detecting the voltage of the chip pin to obtain a test voltage value. Or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain at least one test voltage value.
Optionally, the determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference of the chip pin includes: acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value; and calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value.
Optionally, the calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value includes: calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted; calculating a ratio between the voltage difference and the forward voltage drop difference; and adding the ratio and a preset chip temperature value, and determining a test temperature value obtained after adding as a temperature test result.
Optionally, the applying the current to the chip pin according to the applied current value includes: and applying current to the chip pin according to the applied current value through a chip testing machine. The adjusting the environmental temperature of the chip pin includes: and adjusting the environmental temperature of the chip pins through a temperature box or a cup.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal to function in a predictive manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing terminal to cause a series of operational steps to be performed on the computer or other programmable terminal to produce a computer implemented process such that the instructions which execute on the computer or other programmable terminal provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is provided for a chip temperature testing method and apparatus, an electronic device, and a storage medium, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above examples are only used to help understand the method and core ideas of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (12)
1. A method for testing the temperature of a chip is characterized by comprising the following steps:
applying current to the chip pins according to the applied current value;
detecting the voltage of the chip pin to obtain a test voltage value;
and determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
2. The method of claim 1, wherein the detecting the voltage of the chip pin to obtain a test voltage value comprises:
adjusting the environmental temperature of the chip pin; and the number of the first and second groups,
after the environment temperature is adjusted, detecting the voltage of the chip pin to obtain a test voltage value; or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain a test voltage value.
3. The method of claim 1, wherein determining a temperature test result for the chip based on the test voltage value and a forward voltage drop difference of the chip pins comprises:
acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value;
and calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value, and determining a temperature test result corresponding to the test voltage value.
4. The method according to claim 3, wherein the calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value to determine the temperature test result corresponding to the test voltage value comprises:
calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted;
calculating a ratio between the voltage difference and the forward voltage drop difference;
and adding the ratio and a preset chip temperature value, and determining a test temperature value obtained after adding as a temperature test result.
5. The method according to any one of claims 2 to 4,
the applying current to the chip pin according to the applied current value comprises the following steps: applying current to the chip pins according to the applied current value through a chip tester;
the adjusting the environmental temperature of the chip pin includes: and adjusting the environmental temperature of the chip pins through a temperature box or a cup.
6. A device for testing the temperature of a chip is characterized by comprising:
the current applying module is used for applying current to the chip pins according to the applied current value;
the voltage detection module is used for detecting the voltage of the chip pin to obtain a test voltage value;
and the test result determining module is used for determining a temperature test result of the chip according to the test voltage value and the forward voltage drop difference value of the chip pin.
7. The apparatus of claim 6, wherein the voltage detection module comprises:
the temperature adjusting submodule is used for adjusting the environmental temperature of the chip pin;
the voltage detection submodule is used for detecting the voltage of the chip pin after the environmental temperature is adjusted to obtain a test voltage value; or after the environmental temperature is adjusted, the voltage of the chip pin is detected after waiting for a preset time to obtain a test voltage value.
8. The apparatus of claim 7, wherein the test result determination module comprises:
the acquisition submodule is used for acquiring a forward voltage drop difference value of the chip pin and a preset test theoretical voltage value;
and the determining submodule is used for calculating the test voltage value according to the test theoretical voltage value and the forward voltage drop difference value and determining a temperature test result corresponding to the test voltage value.
9. The apparatus of claim 8, wherein the determination submodule comprises:
the voltage difference unit is used for calculating according to the test voltage value and the test theoretical voltage value to obtain a voltage difference after the environmental temperature is adjusted;
a ratio calculation unit for calculating a ratio between the voltage difference and the forward voltage drop difference;
and the result determining unit is used for adding the ratio and a preset chip temperature value and determining a test temperature value obtained after adding as a temperature test result.
10. The apparatus according to any one of claims 7 to 9,
the current applying module is specifically used for applying current to the chip pins according to the applied current value through a chip testing machine;
the temperature adjusting submodule is specifically used for adjusting the environmental temperature of the chip pins through a temperature box or a cup.
11. An electronic device comprising a memory, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by one or more processors the one or more programs including instructions for:
applying current to the chip pins according to the applied current value;
detecting the voltage of the chip pin to obtain a test voltage value;
and determining a chip temperature test result according to the test voltage value and the forward voltage drop difference value of the chip pin.
12. A readable storage medium, characterized in that instructions in the storage medium, when executed by a processor of an electronic device, enable the electronic device to perform a method of testing the temperature of a chip as claimed in one or more of the method claims 1-5.
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Address after: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Applicant after: Loongson Zhongke Technology Co.,Ltd. Address before: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Applicant before: LOONGSON TECHNOLOGY Corp.,Ltd. |
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Application publication date: 20191231 |