WO2024002031A1 - Chip temperature test method and apparatus - Google Patents

Abstract

A chip temperature test method and apparatus applied to automatic test equipment ATE, the ATE comprising a parameter measurement unit PMU and a digital signal processing DSP chip (60). The chip temperature test method comprises: if the time a target chip spends in a test environment satisfies a stabilization time, the PMU acquiring the electrical parameters of a diode of an electrostatic discharge ESD protection circuit of the target chip, and sending the electrical parameters to the DSP chip (60), wherein the target chip is in a non-powered state; the DSP chip (60) receiving the electrical parameters and, according to the electrical parameters, querying corresponding relationships to find the current temperature of the target chip; the corresponding relationships describing how the electrical parameters of the same category of chip as the target chip change with temperature, and the stabilization time describing the time required for the temperature of the same category of chip as the target chip to reach the same temperature as the test environment.

Description

Chip temperature testing method and device

This application requires the priority of the Chinese patent submitted to the China Patent Office on June 28, 2022, with the application number 202210784504.1 and the invention name "An ATE high and low temperature test method", and the Chinese patent submitted on September 5, 2022 Office, application number is 202211080722.3, and the invention title is "Chip Temperature Testing Method and Device". The entire content of the above-mentioned Chinese patent is incorporated into this application by reference.

Technical field

The present application relates to the field of chip detection, and in particular, to a chip temperature testing method and device.

Background technique

As the chip industry continues to develop, people have higher and higher expectations for the reliability and performance of chips. In order to improve the performance of the chip, the chip needs to be accurately tested. In order to ensure the accuracy of chip testing, it is necessary to provide a precise testing environment for the chip when testing the chip, especially the testing temperature of the chip. The test temperature of the chip is the actual on-chip temperature of the chip when performance testing is performed on the chip.

In the prior art, the ambient temperature of the chip under test or the real on-chip temperature of the chip under test is often tested, and the ambient temperature of the chip under test or the real on-chip temperature of the chip under test is used as the test temperature of the chip under test. However, when the chip under test is When the real on-chip temperature is different from the ambient temperature, the real on-chip temperature of the chip under test is in an unstable state, and the test temperature of the chip under test cannot be accurately determined through the ambient temperature of the chip under test or the real on-chip temperature of the chip under test, resulting in an inability to Provide an accurate testing environment for the chip under test, affecting the test accuracy of the chip under test.

Contents of the invention

In view of the above, it is necessary to provide a chip temperature testing method and device to obtain the voltage and/or diode current of the diode of the electrostatic discharge (ESD) protection circuit of the chip under test that meets the stabilization time through automated testing equipment ATE , determine the temperature of the chip under test based on voltage or current, and test the real on-chip temperature of the target chip when the target chip and the test environment reach thermal equilibrium. At this time, the real on-chip temperature of the target chip is in a stable state, ensuring the accuracy of the temperature of the target chip. .

In the first aspect, embodiments of the present application provide a chip temperature testing method, which is applied to automated testing equipment ATE. The ATE includes a parameter measurement unit PMU and a digital signal processing DSP chip. The chip temperature testing method includes: if the target chip is in When the time in the test environment meets the stabilization time, the PMU obtains the electrical parameters of the diode of the ESD protection circuit of the target chip and sends the electrical parameters to the DSP chip, where the target chip is not powered on. state, the stabilization time is the time required for the temperature of the chip of the same type as the chip to be tested to reach the same temperature as the temperature of the test environment; the DSP chip receives the electrical parameters and derives the corresponding relationship from the electrical parameters based on the electrical parameters. Query the current temperature of the target chip in , and the corresponding relationship describes the relationship between the electrical parameters of chips of the same type as the target chip as the temperature changes.

Among them, the stabilization time is the time required for the temperature of the similar chip of the target chip obtained by the ATE to reach the same temperature as the ambient temperature of the test environment. The stabilization time can be stored in the ATE in advance. Among them, chips of the same type as the target chip can be chips that are similar to the target chip. Chips with the same specifications and made using the same process.

Using the above technical solution, testing the chip temperature does not require changing the design of the chip. The ESD protected diode of the target chip is directly used to test the temperature of the chip. When the target chip meets the stabilization time in the test environment, the target chip is obtained through automated testing equipment. The voltage across the diode or/and the current flowing through the diode in the ESD protection circuit is then determined based on the corresponding relationship between the voltage or/and current and the voltage or/and current of the diode of the target chip and the temperature. Since the target chip The chip meets the stabilization time in the test environment, so the target chip and the test environment have reached thermal equilibrium or have a high probability of reaching thermal equilibrium. At this time, the temperature of the test chip is likely to be in a stable state. The temperature of the target chip measured by ATE is the stability of the target chip. The real temperature can be used to determine whether the target chip reaches the ambient temperature of the test environment, thereby improving the accuracy of the temperature test of the target chip. By accurately determining the test temperature of the target chip, the test performance of the target chip can be improved. ATE only needs to test the target chip when the time of the target chip in the test environment is greater than or equal to the stable time, which reduces the number of tests and improves the efficiency of testing.

Furthermore, the relationship between the voltage and/or current of the diode of the target chip and the temperature of the target chip can be a linear relationship, that is, one current or voltage corresponds to one temperature, or it can also be a one-to-many relationship, for example, one temperature to corresponding A current range or voltage range, current range. In this way, if the voltage of the diode in the ESD protection circuit of the ATE test target chip is within the voltage range or the current is within the current range, it is determined that the target chip has reached the test temperature.

In a possible implementation of the above first aspect, the current and/or the voltage obtained by the PMU are analog quantities. Among them, compared to digital quantities, analog quantities can more accurately reflect the current value or voltage value of the diode. The PMU uses the analog quantity current or voltage as the processing object, which can improve the accuracy of the data.

In a possible implementation of the above first aspect, the chip temperature testing method further includes: determining the corresponding relationship, and determining the corresponding relationship includes: the PMU obtains calibration test data of multiple similar chips, And send the calibration test data to the DSP chip, where the calibration test data includes: the excitation voltage received by the diode of the ESD protection circuit of the target chip, multiple temperatures of the target chip, and each temperature The corresponding current flowing through the diode, or the excitation current received by the diode of the ESD protection circuit of the target chip, multiple temperatures of the target chip, and the voltage across the diode corresponding to each temperature; The DSP chip receives the calibration test data, determines the target data in the calibration test data based on the corresponding relationship between temperature and voltage or current under ideal conditions, and determines the temperature and voltage or current of the target chip based on the target data. Correspondence of current.

Using the above technical solution, before conducting the temperature test, multiple test data of similar chips of multiple target chips are obtained through multiple measurements, and the multiple test data are calibrated through the corresponding relationship between temperature and voltage or current under ideal conditions to reduce the cost. The scope of test data improves the accuracy of test data. By measuring multiple similar chips, it reduces the process deviation between different chips and improves the applicable scope of the corresponding relationship.

In a possible implementation of the above first aspect, the test environment includes ambient temperature, the chip temperature testing method further includes: determining the stabilization time, and the determining method of determining the stabilization time includes: The PMU obtains stable test data of similar chips in the test environment, and sends the stable test data to the DSP chip, where the test environment includes ambient temperature, and the stable test data includes the stable test data of the similar chips under ambient temperature. Corresponding electrical parameters at multiple test time points; the DSP chip receives the stable test data and determines the stable time based on the stable test data.

Using the above technical solution, by testing similar chips at multiple test time points, if the currents or voltages corresponding to multiple consecutive time points are equal, it is determined that the similar chips and the test environment have reached thermal equilibrium at this time, and the voltage or current can be determined based on the equal voltage or current. Multiple consecutive time points determine stabilization time. Furthermore, it can also be determined that the temperatures of similar chips corresponding to multiple consecutive time points are the same based on the currents or voltages corresponding to multiple consecutive time points being equal. The stabilization time of the target chip is determined by measuring similar chips at multiple time points to reduce process deviations between different chips and improve the applicable scope of the stabilization time.

In a possible implementation of the above first aspect, the PMU obtaining the voltage across the diode of the ESD protection circuit of the target chip and/or the current flowing through the diode includes: the PMU transmitting the voltage to the target chip. The PMU applies an excitation voltage to the diode of the ESD protection circuit of the target chip to obtain the current flowing through the diode, or the PMU applies an excitation current to the diode of the ESD protection circuit of the target chip to obtain the voltage across the diode.

Using the above technical solution, the excitation current or voltage can be applied to the diode of the ESD protection circuit of the target chip through the PMU, and the current or voltage of the diode after receiving the excitation can be obtained.

In a possible implementation of the first aspect above, the chip temperature testing method further includes: if the current temperature of the target chip is different from the ambient temperature of the test environment, the PMU determines the temperature according to multiple preset test time points. The target chip is tested to obtain the current or voltage of the diode of the ESD protection circuit of the target chip, and the current or voltage is sent to the DSP chip; the DSP chip relies on the current or voltage and The corresponding relationship determines the temperature of the target chip, and updates the stabilization time according to a preset test time point when the temperature of the target chip is the same as the ambient temperature.

Using the above technical solution, when the current temperature of the target chip meets the stabilization time and the ambient temperature is different, the target chip is tested again according to the preset test time point to obtain the temperature of the target chip, and the temperature of the target chip is the same as the ambient temperature of the test environment. The stabilization time is updated at the time point corresponding to the temperature of the target chip to ensure the accuracy of the stabilization time.

In a possible implementation of the above first aspect, the ATE further includes a test module, and the chip temperature testing method further includes: if the temperature of the target chip is equal to the ambient temperature of the test environment, then the The test module powers on the target chip and performs performance or reliability testing.

Using the above scheme, when the time of the target chip in the test environment is greater than or equal to the stable time and the current temperature of the target chip obtained by the test is the same as the temperature of the test environment, it is determined that the temperature of the chip to be tested and the test environment have reached thermal equilibrium, that is, the temperature to be tested is When the stable real temperature of the chip reaches the temperature required for other tests, the target chip can be powered on to test the performance, reliability, etc. of the target chip.

In a second aspect, an automated test equipment is provided. The automated test equipment includes a parameter measurement unit PMU and a digital signal processing DSP chip; if the time of the target chip in the test environment meets the stabilization time, the PMU is used to obtain the target The electrical parameters of the diode of the ESD protection circuit of the chip are sent to the DSP chip, where the target chip is in an unpowered state, and the stabilization time is the time between the temperature of the target chip and the The time required for the temperature of the test environment to reach the same level; the DSP chip is used to receive the electrical parameters and determine the temperature of the target chip based on the electrical parameters and the corresponding relationship, the corresponding relationship describes the target chip The relationship between the electrical parameters of similar chips as a function of temperature.

In a possible implementation of the above second aspect, the electrical parameters obtained by the PMU are analog quantities.

In a possible implementation of the second aspect above, the PMU is also used to obtain calibration test data of multiple similar chips, and send the calibration test data to the DSP chip, where the calibration test data Including the excitation voltage received by the diode of the ESD protection circuit of the same chip, the multiple temperatures of the target chip and the current flowing through the diode corresponding to each temperature, or the excitation received by the diode of the ESD protection circuit of the target chip. Current, multiple temperatures of the same type of chip and the voltage across the diode corresponding to each temperature; the DSP chip is also used to receive the calibration test data, based on the corresponding relationship between temperature and voltage or current under ideal conditions Determine the target data in the test data; and determine the corresponding relationship between the temperature and voltage or current of the similar chip based on the target data. Among them, similar chips are chips with the same specifications and manufacturing process as the target chip.

In a possible implementation of the above second aspect, the PMU is also used to obtain stable test data of similar chips in the test environment, and send the stable test data to the DSP chip, wherein the test environment Including the ambient temperature, the test data includes the current or voltage corresponding to the similar chip at multiple test time points under the ambient temperature; the DSP chip is also used to receive the stable test data and determine based on the stable test data the stabilization time.

In a possible implementation of the second aspect above, the PMU is further used to apply an excitation voltage to a diode of the ESD protection circuit of the target chip to obtain a current flowing through the diode, or the PMU is further used to Apply an excitation current to the diode of the ESD protection circuit of the target chip to obtain the voltage across the diode.

In a possible implementation of the second aspect above, if the temperature of the target chip is different from the ambient temperature of the test environment, the PMU is also used to test the target chip according to multiple preset test time points, so as to Obtain the electrical parameters of the diode of the ESD protection circuit of the target chip, and send the electrical parameters to the DSP chip; the DSP is also used by the module to determine the target chip based on the electrical parameters and the corresponding relationship. temperature, and update the stabilization time according to a preset test time point when the temperature of the target chip is the same as the temperature.

In a possible implementation of the above second aspect, the ATE further includes a test module. If the temperature of the target chip is equal to the ambient temperature of the test environment, the test module powers on the target chip. , perform performance or reliability testing.

In a third aspect, embodiments of the present application provide an automated test equipment, including: one or more processor parameter measurement units PMU; a digital signal processing DSP chip; a memory for storing one or more programs; when the one or A plurality of programs are executed by the PMU or the DSP chip, so that the PMU implements the operations performed by the PMU in the chip temperature testing method described in the first aspect, and the DSP chip implements any of the operations described in the first aspect. The operations performed by the DSP chip in the chip temperature testing method described in the item.

In a fourth aspect, embodiments of the present application provide a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the chip temperature testing method as described in any one of the first aspects is implemented.

It should be understood that the technical effects brought by any design in the second to fourth aspects can refer to the beneficial effects in the corresponding methods provided above, and will not be described again here.

Description of drawings

Figure 1 is a schematic module diagram of an ATE provided by an embodiment of the present application.

FIG. 2 is a schematic diagram of a relationship curve between the voltage across a diode and temperature under an ideal state according to an embodiment of the present application.

FIG. 3 is a schematic diagram illustrating the relationship between the voltage across a diode and the temperature in an actual scenario according to an embodiment of the present application.

FIG. 4 is a schematic flowchart of a method for determining a correspondence relationship provided by an embodiment of the present application.

FIG. 5 is a schematic flowchart of a method for determining the stabilization time provided by an embodiment of the present application.

FIG. 6 is a schematic flowchart of a chip temperature testing method provided by an embodiment of the present application.

FIG. 7 is a schematic diagram of an ATE test target chip according to an embodiment of the present application.

Figure 8 is a hardware schematic diagram of automated testing equipment according to an embodiment of the present application.

Detailed ways

Hereinafter, in the description of the embodiments of the present application, words such as “exemplary” or “for example” are used to identify examples, illustrations or illustrations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of this application shall not be interpreted as To be more preferred or advantageous than other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concept in a concrete manner.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. It will be understood that in this application, unless otherwise stated, "plurality" means two or more than two, and "and/or" includes any and all combinations of one or more of the associated listed items.

First, the technical terms involved in the embodiments of this application are introduced:

1. Thermal equilibrium

Thermal balance refers to the situation where the internal temperature of an object in contact with the outside world (such as a target chip) is uniform everywhere and equals the outside temperature. In thermal equilibrium, there is no heat exchange between various parts of the object and between the object and the outside world.

2. Analog quantity

Analog quantity refers to a quantity in which a variable (such as voltage, current) changes continuously within a certain range; that is, it can take any value (within the value domain) within a certain range (definition domain). For example, analog current value, analog voltage value.

Digital quantities are discrete quantities, not continuously changing quantities. They can only take on a few discrete values. For example, a binary digital variable can only take on two values. For example, digital current value, digital voltage value.

In order to obtain the performance of the chip, it is often necessary to perform performance testing on the chip, such as high and low temperature testing of the chip to obtain the performance of the chip in high and low temperature environments. During the high and low temperature testing process, it is necessary to ensure that the chip is at a specific testing temperature. However, existing methods of obtaining the temperature of the target chip cannot ensure that the chip under test reaches thermal equilibrium with its environment, resulting in the inability to accurately determine the true temperature of the chip under test.

Based on the above problems, this application provides a chip temperature testing method. Among them, the target chip has an electrostatic discharge (Electro-Static discharge, ESD) protection circuit, and the ESD protection circuit has a diode. When the target chip meets the stabilizing time (soaking time) in the test environment, the voltage across the diode or/and the current flowing through the diode in the ESD protection circuit of the target chip is obtained through automated test equipment (ATE), and then The temperature of the target chip is determined based on the corresponding relationship between the voltage or/and current and the voltage or/and current of the diode of the target chip and the temperature.

It can be understood that the stabilizing time (soaking time), also known as the soaking time, is the time required for the real temperature of the test sample (Device under test, DUT) to reach thermal equilibrium with its test environment. The stabilizing time can be a time period, such as 45 seconds to 60 seconds. The stabilization time can also be a time point, such as 50 seconds.

It can be understood that the temperature of the test environment is different, and the stability time of the test sample (such as the target chip) is different. For example, if the ambient temperature is 60°, the stability time of the test sample is 1 minute, that is, the test sample is placed in a 60° test environment. , the time for the test sample and the test environment to reach thermal equilibrium is 1 minute; if the ambient temperature is 80°, the stabilization time of the test sample is 1 minute and 20 seconds.

It can be understood that since the target chip meets the stabilization time in the test environment, the target chip and the test environment reach thermal equilibrium. At this time, the temperature of the test chip is in a stable state. The temperature of the target chip measured by ATE is the stable real temperature of the target chip. Based on this temperature, determine whether the target chip reaches the test temperature. By accurately determining the test temperature of the target chip, the test performance of the target chip can be improved. Wherein, the test temperature may be the ambient temperature of the test environment.

Please refer to Figure 1. Figure 1 is a schematic module diagram of an ATE provided by an embodiment of the present application. The ATE includes a parameter measurement unit (power management unit, PMU) and a digital signal processing (digital signal processing, DSP) chip.

Among them, when the target chip is in an unpowered state and the time in the preset test environment meets the stabilization time, the PMU is used to test the target chip. For example, the PMU can perform voltage and current measurement on the diode of the ESD protection circuit of the target chip, or it can also perform current and voltage measurement on the diode to obtain the electrical parameters of the diode, and then send the electrical parameters to the DSP chip. Among them, the electrical parameters can be voltage and/or current.

The DSP chip is used to receive the voltage or current sent by the PMU, and determine the true temperature of the target chip based on the received voltage or current and the corresponding relationship. The corresponding relationship is the relationship between the voltage or current of the diode of the ESD protection circuit of the target chip and the temperature corresponding to the voltage or current.

In this way, the test method of this application can realize the test of the target chip temperature through the PMU and DSP chips of the ATE shown in Figure 1. Compared with the existing ATE that tests the temperature of the target chip through thermocouples, the structure of the ATE is simplified. , saving costs.

It can be understood that the ATE in Figure 1 is only an example of the ATE and is not a limitation. The ATE may have more or fewer modules than those shown in Figure 1 . By way of example, in other embodiments, the ATE also includes a numerically controlled power board and a clock generation module. The numerically controlled power board is used to provide power for the ATE, and the clock generation module is used to provide clock signals for each module of the ATE. As another example, in some embodiments, the ATE also includes a Pin Electronics (PE) device, and the PMU and DSP chips are located in the Pin Electronics device.

The DSP chip can be an ASIC chip, FPGA, SoC, or CPU. Among them, if the DSP chip is an FPGA, when ATE tests the temperature of the chip under test, the CPU module sends an instruction sequence to the FPGA, and the FPGA receives the instruction sequence and drives the pin electronic device according to the agreed communication protocol, so that the pin electronic device The PMU module tests and collects data on the target chip. For example, the PMU applies an excitation current to the diode of the ESD protection circuit of the target chip to obtain the voltage across the diode. Then the PMU sends the collected data to the DSP chip of the FPGA. The DSP chip determines the temperature of the target chip based on the collected data.

In some embodiments, the PMU is a Digital to Analog Converter (DAC) circuit module, used to provide a DC test channel to collect test signals of the target chip, such as collecting diodes in the ESD protection circuit of the target chip. voltage or/and current.

It can be understood that diodes have the following characteristics: as the temperature increases, the junction resistance of the diode becomes smaller. The chip temperature testing method proposed in the embodiment of this application is implemented based on this characteristic of the diode. In this way, when the diode is at different temperatures and different excitation currents are applied to the diode, the voltages across the diode are different. Under ideal conditions, the excitation current received by the diode has a linear relationship with the voltage across the diode; similarly, when the diode is at different temperatures and different voltages are applied to the diode, the current flowing through the diode is different, and the excitation voltage received by the diode is different from the voltage across the diode. The diode current has a linear relationship. Please refer to Figure 2. Figure 2 is the relationship curve between the voltage across the diode and the temperature under ideal conditions. Figure 2 includes two relationship curves. In the two relationship curves, the excitation currents applied by the PMU to the diode are 100μA and 1500μA respectively. As shown in Figure 2, when the excitation current received by the diode is fixed, the voltage across each diode corresponds to a temperature value, that is, the voltage at both ends of the diode has a linear relationship with the temperature of the diode. Therefore, when the ATE DSP chip receives the voltage sent by the PMU , the temperature of the chip corresponding to the voltage can be determined based on the corresponding relationship between voltage and temperature in the relationship curve in Figure 5.

It can be understood that different chips have different manufacturing processes or different device types, resulting in different characteristics of diodes in different chips. Therefore, the relationship between voltage or current and temperature across diodes in different target chips will be different when receiving the same voltage or excitation current. Therefore, before conducting a temperature test on the target chip, similar chips of the target chip can be tested through ATE to determine the correspondence between the voltage or current of the diodes of the same chip and the temperature. Through this correspondence The relationship describes the relationship between the electrical parameters of chips of the same type as the target chip as the temperature changes.

In order to ensure the accuracy of the relationship between the voltage or current and temperature across the diode of the ESD protection circuit of the same chip as the target chip, ATE can conduct multiple tests on one or more similar chips to obtain multiple calibration test data, based on The relationship curve under the ideal state determines the target data in the calibration test data, and based on the target data, the corresponding relationship between the voltage and temperature at both ends of the diode of the ESD protection circuit of the similar chip of the target chip is determined. For an example, please refer to Figure 3. Figure 3 is the relationship curve between the voltage and temperature of the diode of the similar chip of the target chip in the actual scenario. Figure 3 includes two relationship curves. In the two relationship curves, the PMU applies to the diode The excitation currents are 100μA and 1500μA respectively. It can be seen from Figure 3 that when the excitation current received by the diode is fixed, each temperature of the similar chip of the target chip corresponds to a voltage range. For example, when the excitation current is 100μA and the voltage range across the diode is 0.41V~0.43V, the target The temperature of the chip is 60°. In this way, when the preset temperature is 60°, when the voltage across the diode of the target chip obtained by ATE measurement ranges from 0.41V to 0.43V, it can be determined that similar chips of the target chip reach Preset temperature is 60°.

Therefore, when ATE performs a temperature test on the target chip, the electrical parameters of the diode of the ESD protection circuit of the target chip can be obtained through the PMU, and the temperature of the target chip can be determined based on the corresponding relationship between the electrical parameters and similar chips of the target chip in Figure 3.

Please refer to Figure 4, which is a method for determining the correspondence relationship between a target chip and similar chips provided by an embodiment of the present application. The determination method includes the following steps:

S401. PMU obtains the calibration test data of multiple similar chips and sends the calibration test data to the DSP chip.

Among them, the calibration test data includes the excitation voltage received by the diode of the ESD protection circuit of the same chip of the target chip, multiple temperatures of the same chip and the current flowing through the diode corresponding to each temperature, or the diodes of the ESD protection circuit of the same chip. The received excitation current, multiple temperatures of similar chips and the voltage across the diode corresponding to each temperature.

Among them, chips of the same type as the target chip are considered to have the same stabilization time with a high probability. For example: when the target chip and the package of a certain batch of chips have similar specifications and parameters, then the target chip is considered to be a similar chip of this batch of chips; or when the target chip and the package of a certain batch of chips have the same specifications and parameters , then the target chip is considered to be the same type of chips in this batch of chips; or, when the package of the target chip and a certain batch of chips have the same specifications and parameters and the manufacturer is the same, then the target chip is considered to be the same kind of chips as this batch of chips; Or, when the package of the target chip and a certain batch of chips have the same specifications and parameters, are made by the same manufacturer, and are manufactured in the same time period, the target chip and this batch of chips are considered to be of the same type.

It can be multiple chips with the same specifications as the target chip, or it can be a single chip with the same specifications as the target chip. For example, the diodes of multiple ESD protection circuits of a single similar chip can be measured multiple times.

S402. The DSP chip receives the calibration test data sent by the PMU, and determines the target data in the calibration test data based on the corresponding relationship between voltage or current and temperature under ideal conditions.

Among them, as shown in Figure 2, the voltage or current under ideal conditions has a linear relationship with temperature.

Specifically, the DSP chip determines whether the calibration test data conforms to the corresponding relationship between voltage or current and temperature under the ideal state. If the calibration test data conforms to the corresponding relationship between voltage or current and temperature under the ideal state, then the calibration test data is determined as Target data; if the calibration measurement data does not conform to the corresponding relationship between voltage or current and temperature under ideal conditions, discard or ignore the measurement data.

In some embodiments, a deviation threshold is set in the DSP chip of ATE. If the DSP chip determines that the correspondence between the calibration test data and the voltage or current and temperature under the ideal state exceeds the deviation threshold, the calibration test data will be deleted; if If the data deviation between the calibration test data and the corresponding relationship between voltage or current and temperature under the ideal state is within the deviation threshold range, the calibration test data is used as the target data.

For example, under ideal conditions, the excitation current applied to the diode of the ESD protection circuit is 100 μA, and the relationship curve equation between the voltage across the diode and the temperature is: y=3x+1, the ordinate y is the voltage, the abscissa x is the temperature, ATE's PMU performs current pressure measurement on similar chips of the target chip. The applied excitation current is 100μA. The calibration test data obtained are A(1,4.1), B(2,6.5), C(3,12), D(4,12.5), where the deviation threshold is 0.15, the temperature in test data C is 12°, the temperature in the ideal state is 10°, the data deviation is 0.2 and greater than the deviation threshold, the calibration test data A, B and D The data deviation is less than the deviation threshold, and the test data A, B and D are used as target data.

In this way, the target data in the ATE test data is determined based on the corresponding relationship between voltage or current and temperature in the ideal state, so as to eliminate unconforming test data from the test data and improve the accuracy of the test data.

S403. The DSP chip determines the corresponding relationship between the voltage or current and temperature of similar chips based on the target data.

Among them, the relationship between the current or voltage of similar chips and temperature can be a linear relationship as shown in 2; it can also be a nonlinear relationship, as shown in Figure 3. Under a specific excitation current, the voltage range across each diode Corresponds to a temperature.

In this way, in order to improve the accuracy of the corresponding relationship between the current or voltage and temperature of similar chips of the target chip, the calibration test data of similar chips is calibrated based on the relationship between current or voltage and temperature under ideal conditions to achieve Precisely process the calibration test data to improve the accuracy of the target data, thereby improving the accuracy of the correspondence between the current or voltage and temperature of similar chips of the target chip.

Before testing the temperature of the target chip on ATE, you can test similar chips of the target chip to determine the stabilization time of similar chips of the target chip. ATE can conduct temperature tests on the target chip based on the stabilization time of similar chips. That is, when the target chip resides in the test environment for a time greater than or equal to the stable time, ATE performs a temperature test on the target chip to reduce the number of temperature tests and improve the efficiency of temperature tests.

It can be understood that when the ambient temperature of the test environment is the same, the stabilization time of chips of different specifications is different. Therefore, the chips are classified according to their device types and process characteristics, and then the stabilization time of each type of chip is determined. In order to test the target chip, the corresponding stabilization time of similar chips of the target chip can be directly used.

Furthermore, if the temperature to be reached in the test environment is different, the corresponding stabilization time of the chip will also be different. For example, if the temperature of the test environment is 30°, the corresponding stabilization time of the chip is 30 seconds; if the temperature of the test environment is 40°, the corresponding stabilization time of the chip is 40 seconds. Therefore, in order to obtain the stabilization time of the target chip corresponding to a specific temperature, one or more similar chips of the target chip can be placed in a test environment (such as an incubator) at a specific temperature, and then multiple test time points are set, and each test time point is At each test time point, the temperature of similar chips is tested through the ATE shown in Figure 1. During the test, if the temperatures of similar chips tested by ATE at multiple consecutive test time points are all equal, it is determined that similar chips are in thermal equilibrium with their test environment, and the target is determined based on multiple consecutive test time points where the temperatures of similar chips are equal. The stabilization time of similar chips of the chip.

Please refer to Figure 5 , which is a method for determining the stabilization time of a similar chip of a target chip provided by an embodiment of the present application. The method of determining the stabilization time includes the following steps:

S501 and PMU obtain the stable test data of similar chips in the test environment and send the stable test data to the DSP chip.

Among them, the test environment includes the ambient temperature, and the stable test data includes the current or voltage corresponding to multiple time points of similar chips under the ambient temperature.

Specifically, similar chips are placed in the test environment, and then the PMU applies excitation voltage or excitation current to the diodes of the ESD protection circuits of the similar chips at multiple preset test time points, and obtains the voltage or voltage across the diode after receiving the excitation. The current flowing through the diode. The voltage across the diode or the current flowing through the diode after being excited will be treated as the same type. Stable test data of the chip and send the stable test data to the DSP chip.

S502, DSP chip receives stable test data and determines the stabilization time based on the stable test data.

In some embodiments, there is a corresponding relationship stored in the ATE. The DSP chip can determine the temperatures of similar chips corresponding to multiple test time points based on multiple test time points and corresponding relationships in the stable test data, and then based on multiple test time points with the same temperature. Consecutive test time points determine stabilization time. Among them, the correspondence relationship describes the relationship between the voltage across the diode of the ESD protection circuit of the same chip as the target chip or the current flowing through the diode and the temperature of the similar chip.

Of course, in other embodiments, when the ambient temperature of the test environment is the same, if the currents or voltages at multiple test time points in the stable test data obtained by the PMU are the same, then the values of similar chips corresponding to the multiple test time points will be the same. The temperature is also the same, so the stabilization time can be determined from multiple consecutive test time points with the same current or voltage.

Furthermore, the relationship between the voltage and/or current of diodes of similar chips of the target chip and the temperature of similar chips can be a linear relationship, that is, one current or voltage corresponds to one temperature, or it can be a many-to-one relationship, such as many. A current or voltage corresponds to a temperature value, or a current range or voltage range corresponds to a temperature.

Furthermore, if according to the corresponding relationship, a current or voltage range corresponds to a temperature, for example, when the voltage across the diode is 0.7V ~ 0.8V and the temperature of the target chip is 30°, then when the ATE tests the target chip temperature, when the diode If the current is within the current range corresponding to the preset temperature or the voltage of the diode is within the voltage range, it can be determined that the target chip has reached the preset temperature.

It can be understood that in S502, the stabilization time is determined based on the stability test data, including, but not limited to, the following methods.

Method 1: Determine the time when the temperature of the similar chip of the target chip is the same as the ambient temperature of the test environment as the stabilization time, or determine the time when the current or voltage of the diode of the similar chip is equal to the current or voltage corresponding to the ambient temperature of the test environment as the stable time. stable schedule.

Method two, in some embodiments, the test time point at which the temperature of the test environment first appears to be the same among the temperatures of similar chips corresponding to multiple test time points is determined as the stabilization time, or the voltage or current corresponding to the multiple test points is determined as the stabilization time. The stabilization time is determined before the test time point when the voltage or current corresponding to the temperature of the test environment is equal for the first time. For example, assuming that the ambient temperature is 35°, and the time point when the temperature of a similar chip in the ATE test first changes to 35° is 1 minute and 30 seconds, the stabilization time is 1 minute and 30 seconds.

Method 3: In other embodiments, when the temperatures of similar chips tested by ATE at multiple consecutive test time points are all equal and at ambient temperature, the corresponding stabilization time can be determined based on multiple consecutive test time points where the temperatures of similar chips are the same. Or when the voltages or currents of diodes of similar chips tested by ATE at multiple consecutive test time points are all equal, the corresponding stabilization time can be determined based on multiple consecutive test time points where the voltage or current of similar chips are the same. For example, ATE tests the temperature of similar chips every 10 seconds. The temperatures of similar chips tested by ATE at 1 minute 20 seconds, 1 minute 30 seconds, 1 minute 40 seconds, and 1 minute 50 seconds are all the same and equal to the ambient temperature. ATE's DSP chip determines the stabilization time based on the above multiple continuous test time points: 1 minute 25 seconds to 1 minute 35 seconds.

Method 4: In other embodiments, in order to improve the accuracy of the stabilization time, when the ambient temperature of the test environment is determined, ATE can conduct multiple tests on the same type of chip through the method shown in Figure 5 to obtain multiple stable schedule. Correspondingly, ATE's DSP chip can determine the stabilization time of similar chips based on multiple stabilization times. For example, ATE conducts multiple rounds of testing on the same type of chip to obtain the stabilization time of each round of testing. ATE's DSP chip calculates the average of multiple stabilization times and uses the average as the stabilization time of the same type of chip. It can be understood that through multiple measurements, the process deviations of different chips can be covered and the accuracy of the chip's stabilization time can be improved.

Method 5: In other embodiments, ATE tests multiple similar chips with the same specifications to obtain multiple stabilization times, and ATE's DSP chip determines the stabilization time of similar chips based on the multiple stabilization times.

For example, similar chips include: chip 1, chip 2, and chip 3 with the same specifications. Test three similar chips through ATE, and obtain the stability time T1 corresponding to chip 1, the stability time T2 corresponding to chip 2, and the stability time T2 corresponding to chip 3. Stability time T3, ATE's DSP chip determines that the stabilization time of similar chips of the target chip is (T1+T2+T3)/3.

After determining the stabilization time and corresponding relationship of similar chips of the target chip, ATE can perform a temperature test on the target chip. Please refer to Figure 6, which is a schematic flow chart of a chip temperature testing method provided by an embodiment of the present application. This chip temperature test method can be applied to ATE. The following uses the chip temperature test method applied to the ATE in Figure 1 as an example for detailed explanation. As shown in Figure 6, the chip temperature testing method includes the following steps.

S601. If the time of the target chip in the test environment meets the stable time, the PMU obtains the electrical parameters of the diode of the ESD protection circuit of the target chip and sends the electrical parameters to the DSP chip.

Among them, before testing the performance of the chip under test, the target chip is not powered on. The stabilization time is the time required for the temperature of similar chips of the target chip to reach the same temperature as the ambient temperature of the test environment. The electrical parameters include voltage and current.

In some embodiments, when performing performance testing on the target chip, the target chip is placed in a test environment with a preset temperature (for example, 35°C). When the temperature of the target chip reaches the preset temperature, the target chip can be powered on. , and perform performance testing on the target chip. In order to ensure that the real on-chip temperature of the target chip is at the preset temperature. When the residence time of the target chip in the test environment is greater than or equal to the stable time, determine that the time of the target chip in the test environment meets the stable time, the target chip and the test environment reach thermal equilibrium, and the temperature of the target chip is in a stable state, and then ATE measures the target chip temperature to improve the accuracy of the temperature measurement of the target chip, and use the temperature of the target chip measured by ATE to determine whether the target chip has reached the ambient temperature of the test environment. If the temperature measured by ATE is the same as the ambient temperature, it is determined that the target chip has reached If the temperature of the target chip does not reach the ambient temperature, measures can be taken, such as increasing the preset time of the target chip in the preset test environment and resetting the target chip. Conduct a temperature test to ensure that the target chip reaches the ambient temperature of the test environment.

Please refer to FIG. 7 , which is a schematic diagram of an ATE test target chip provided by an embodiment of the present application. As shown in Figure 7, take the target chip having an ESD protection circuit as an example. The ESD protection circuit includes diodes D1 and D2. ATE's PMU can perform voltage measurement on diodes D1 and D2. Specifically, the PMU applies current to the diodes D1 and D2 through the signal pin 1 and the signal pin 2 of the target chip to obtain the voltages across the diodes D1 and D2.

Further, in order to improve the accuracy of the voltages across diodes D1 and D2, the PMU can apply different currents to diodes D1 and D2 and obtain the voltages across diodes D1 and D2 corresponding to each current.

It can be understood that in other embodiments, the PMU of ATE can perform voltage and current measurement on diodes D1 and D2. Specifically, the PMU applies voltage to the diodes D1 and D2 through the signal pins of the target chip to obtain the current flowing through the diodes D1 and D2.

In some embodiments, the current or voltage obtained by the PMU is an analog quantity. Compared with the digital quantity, the analog quantity can more accurately reflect the current value or voltage value at both ends of the diode. The PMU uses the analog quantity current or voltage as the processing object. Can improve the accuracy of data. If the voltage across the diode and/or the current flowing through the diode obtained by the PMU are digital quantities, the PMU performs digital-to-analog conversion on the voltage drop across the diode and/or the digital quantity of the current flowing through the diode to obtain the voltage across the diode. and/or an analog quantity of the current flowing through the diode.

S602. The DSP chip receives the electrical parameters and determines the current temperature of the target chip based on the electrical parameters and the corresponding relationship.

Among them, the correspondence relationship describes the changing relationship between the electrical parameters and temperature of similar chips of the target chip.

Specifically, the ATE stores the corresponding relationship between similar chips of the target chip. When the PMU sends the voltage or current of the diode of the ESD protection circuit of the target chip to the DSP chip, the DSP chip queries the current current value of the target chip from the corresponding relationship based on the electrical parameters. temperature.

It can be understood that when the PMU applies different voltages or excitation currents to the diodes of the ESD protection circuit of the target chip, the corresponding relationship between the voltage or current and the temperature of the target chip is also different. Therefore, the PMU is also used to send the voltage or excitation current applied to the diode of the ESD protection circuit of the target chip to the DSP chip. After receiving the voltage or excitation current, the DSP chip determines the corresponding relationship between similar chips based on the voltage or excitation current, and then based on The corresponding relationship with the electrical parameters determines the current temperature of the target chip.

The above ATE method of determining the temperature of the target chip is measured under the premise that the target chip meets the stabilization time. At this time, the target chip and its test environment reach thermal equilibrium, so the current temperature of the target chip is in a stable state. That is, the current temperature of the target chip in the ATE test is its stable temperature. Temperature testing of the target chip through the stabilization time can improve the accuracy and efficiency of the temperature test of the target chip, and is especially suitable for temperature test scenarios of large batches of chips. In addition, by setting the stabilization time, the number of invalid tests can be reduced to improve the efficiency of temperature testing.

Further, the above test method obtains the current or voltage of the diode of the ESD protection circuit of the target chip through ATE, and determines the temperature of the target chip based on the corresponding relationship between the current or voltage and similar chips. This temperature is the real on-chip temperature of the target chip, which is equivalent to Compared with testing the temperature near the target chip through a thermocouple, the above temperature testing method improves the accuracy of the target chip temperature test, simplifies the structure of the ATE, and saves the cost of the ATE.

It can be understood that the chip temperature testing method of the present application can be used to determine whether the target chip has reached a preset temperature before performing a performance test on the target chip. The preset temperature can be the ambient temperature of the test environment. When the preset temperature is determined, the ambient temperature of the test environment can be adjusted to be the same as the preset temperature, and the target chip is placed in the test environment so that the temperature of the target chip reaches the preset temperature.

The preset temperature may be the temperature that the target chip reaches for performance testing. For example, if this performance test requires the temperature of the target chip to be at 45°, the default temperature is 45°.

In some embodiments, the above chip temperature testing method also includes:

If the temperature of the target chip is different from the ambient temperature of the test environment, the PMU tests the target chip based on multiple test time points to obtain the current or voltage of the diode of the ESD protection circuit of the target chip corresponding to the multiple test time points, and Send the current or voltage to the DSP chip;

The DSP chip receives current or voltage, determines the temperature of the target chip based on the current or voltage and the corresponding relationship, and updates the stabilization time based on the test time point when the temperature of the target chip is the same as the ambient temperature of the test environment.

Specifically, the DSP chip determines the current temperature of the target chip based on the corresponding relationship between similar chips and the received current and voltage. When the current temperature obtained by the test is different from the ambient temperature of the test environment, the PMU determines the current temperature of the target chip based on the preset multiple test times. Click to test the target chip again, and send the current or voltage obtained by the retest to the DSP chip. The DSP chip determines the current temperature of the target chip corresponding to the test time point based on the current or voltage and the corresponding relationship, then determines the test time point corresponding to the current temperature of the target chip that is the same as the ambient temperature of the test environment, and finally updates the stability based on the test time point time.

For example, assuming that the preset temperature is 35° and the corresponding stabilization time is 30 seconds, when the target chip is placed in the test environment for a time greater than or equal to the stabilization time, the temperature of the ATE test target chip is 34° and less than 35°. Then ATE obtains the test time point of 5 seconds and tests the temperature of the target chip after 5 seconds. If the temperature is 35° and equal to the preset temperature, the DSP chip update stabilization time is (30+5)/2=32.5 seconds .

It can be understood that in the embodiment of the present application, the PMU applies an excitation current to the diode and obtains the The voltage across the diode, or the PMU applies an excitation voltage to the diode and obtains the current flowing through the diode after applying the excitation voltage. In other embodiments, other devices may apply current or excitation voltage to the diodes of the ESD protection circuit of the target chip or other modules of the ATE may apply current or excitation voltage to the diodes of the ESD protection circuit of the target chip.

In some embodiments, the ATE also includes a test module (not shown). The test module is used to perform a power-on test on the target chip. For example, if the current temperature of the target chip reaches a preset temperature (for example, the ambient temperature of the test environment), the test The module starts to power on the target chip to perform performance or reliability testing.

The above chip temperature testing methods also include:

If the current temperature of the target chip is equal to the ambient temperature of the test environment, the test module performs a power-on test on the target chip. For example, perform high and low temperature tests on targets.

Please refer to FIG. 8 , which is a structural diagram of the automated testing equipment 110 provided by the embodiment of the present application. As shown in Figure 8, the automated test equipment 110 includes: MCU 10, transmitter 20, receiver 30, memory 40, port 50 and DSP chip.

Specifically, the memory 40, the transmitter 20, the receiver 30, the MCU 10 and the DSP chip 60 may be connected through a bus. Of course, in actual application, the memory 40, the transmitter 20, the receiver 30, the DSP chip 60, and the MCU 10 may not have a bus structure, but may have other structures, such as a star structure, which is not specifically limited in this application.

Optionally, the memory 40 may include read-only memory (Read Only Memory, ROM), random access memory (Random Access Memory, RAM), and disk memory. The memory 40 is used to store data required when the MCU is running. The number of memories 40 is one or more and is used to store one or more programs.

Optionally, the number of ports 50 is one or more, used to connect to the upper or lower automated test equipment 110 . If the automated test device 110 is an automated test device 110 connected to a host or a server, port 50 is also used to connect to the host or server.

Optionally, the transmitter 20 and the receiver 30 may be physically independent of each other or integrated together. Transmitter 20 can transmit data through port 50. Receiver 30 may receive data through port 50.

When one or more programs in the memory are executed by the PMU or DSP chip, the PMU implements the operations performed by the PMU in the chip temperature testing method of any of the above embodiments, and the DSP chip implements the chip temperature testing method of any of the above embodiments. The operations performed by the DSP chip described in .

Further, the ATE also includes a test module 70, which is used to perform a power-on test on the target chip when the temperature of the target chip is the same as the ambient temperature of the test environment.

Those skilled in the art will understand that embodiments of the present application may be provided as methods, systems, or computer program products. Accordingly, the present application may take the form of a hardware embodiment, a software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein. These computer program codes may be stored in computer-readable memory that directs a computer or other programmable data processing device to operate in a particular manner.

This embodiment also provides a computer storage medium. Computer instructions are stored in the computer storage medium. When the computer instructions are run on the automated testing equipment, the automated testing equipment executes the above related method steps to achieve the chip temperature in the above embodiment. Test Methods.

This embodiment also provides a computer program product. When the computer program product is run on the automated testing equipment, the automated testing equipment performs the above related steps to implement the chip temperature testing method in the above embodiment.

In addition, embodiments of the present application also provide a device. This device may be a chip, a component or a module. The device The device may include a connected processor and memory; wherein the memory is used to store computer execution instructions. When the device is running, the processor may execute the computer execution instructions stored in the memory to cause the chip to perform the chip temperature test in each of the above method embodiments. method.

Through the above description of the embodiments, those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above functional modules is used as an example. In actual applications, the above functions can be allocated as needed. It is completed by different functional modules, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above.

In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the modules or the division of modules are only a logical function division. In actual implementation, there may be other division methods, for example, multiple modules or components may be combined. Either it can be integrated into another device, or some features can be ignored, or not implemented. On the other hand, the coupling or direct coupling or communication connection between each other shown or discussed may be through some interfaces, indirect coupling or communication connection of devices or modules, which may be in electrical, mechanical or other forms.

A module described as a separate component may or may not be physically separate. A component shown as a module may be one physical module or multiple physical modules, that is, it may be located in one place, or it may be distributed to multiple different places. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional module in each embodiment of the present application can be integrated into one processing module, or each module can exist physically alone, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or software function modules.

If the integrated module is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present application are essentially or contribute to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, and the software product is stored in a storage medium , including several instructions to cause a device (which can be a microcontroller, a chip, etc.) or a processor to execute all or part of the steps of the methods described in various embodiments of this application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program code. .

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by the protection scope of the present application. . Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (16)

1. A chip temperature testing method, characterized in that it is applied to automated testing equipment ATE. The ATE includes a parameter measurement unit PMU and a digital signal processing DSP chip. The chip temperature testing method includes:

   When the target chip is in an unpowered state and the time in the test environment meets the stabilization time, the PMU obtains the electrical parameters of the diode of the electrostatic discharge ESD protection circuit of the target chip and transmits the electrical parameters to the DSP chip. Send, wherein the electrical parameter is an electrical parameter, and the stabilization time is the time required for the temperature of a chip of the same type as the target chip to reach the same temperature as the ambient temperature of the test environment;

   The DSP chip receives the electrical parameters, and queries the current temperature of the target chip from a preset correspondence based on the electrical parameters. The correspondence describes the electrical parameters of chips of the same type as the target chip as the temperature changes. changing relationship.
2. The chip temperature testing method according to claim 1, wherein the electrical parameters obtained by the PMU are analog quantities.
3. The chip temperature testing method according to claim 1 or 2, characterized in that the chip temperature testing method further includes:

   Determining the corresponding relationship includes:

   The PMU obtains the calibration test data of multiple similar chips and sends the calibration test data to the DSP chip, where the calibration test data includes: the excitation voltage received by the diodes of the ESD protection circuits of the similar chips. , multiple temperatures of the similar chip and the current of the diode corresponding to each temperature; or, the excitation current received by the diode of the ESD protection circuit of the similar chip, multiple temperatures of the similar chip and each The voltage of the diode corresponding to the temperature;

   The DSP chip receives the calibration test data, determines the target data in the calibration test data based on the corresponding relationship between temperature and electrical parameters in an ideal state, and determines the corresponding relationship based on the target data.
4. The chip temperature testing method according to any one of claims 1 to 3, wherein the testing environment provides an ambient temperature, and the chip temperature testing method further includes:

   Determining the stabilization time includes:

   The PMU obtains stable test data of similar chips in the test environment, and sends the stable test data to the DSP chip, where the stable test data includes the temperature of the similar chips under the ambient temperature. Electrical parameters corresponding to each test time point;

   The DSP chip receives the stability test data and determines the stabilization time based on the stability test data.
5. The chip temperature testing method according to any one of claims 1 to 4, wherein the PMU obtains the electrical parameters of the diode of the ESD protection circuit of the target chip, including:

   The PMU applies an excitation voltage to the diode of the ESD protection circuit of the target chip to obtain the current of the diode; or,

   The PMU applies an excitation current to the diode of the ESD protection circuit of the target chip to obtain the voltage of the diode.
6. The chip temperature testing method according to any one of claims 1 to 5, characterized in that the chip temperature testing method further includes:

   If the current temperature of the target chip is different from the ambient temperature of the test environment, the PMU tests the target chip according to multiple preset test time points to obtain the diodes of the ESD protection circuit of the target chip. The electrical parameters corresponding to the plurality of preset test time points, and sending the plurality of electrical parameters to the DSP chip;

   The DSP chip queries the temperature of the target chip from the corresponding relationship based on the electrical parameters, and updates the stabilization time based on a preset test time point when the temperature of the target chip is the same as the ambient temperature.
7. The chip temperature testing method according to any one of claims 1 to 6, wherein the ATE further includes a testing module, and the chip temperature testing method further includes:

   If the current temperature of the target chip is equal to the ambient temperature of the test environment, the test module powers on the target chip to perform a performance or reliability test.
8. An automated test equipment, characterized in that the automated test equipment includes a parameter measurement unit PMU and a digital signal processing DSP chip; wherein, if the target chip is in an unpowered state and the time in the test environment meets the stabilization time, the The PMU is used to obtain the electrical parameters of the diode of the ESD protection circuit of the target chip, and send the electrical parameters to the DSP chip. The electrical parameters are electrical parameters, and the stabilization time describes the relationship with the target chip. The time required for the temperature of similar chips to reach the same temperature as the ambient temperature of the test environment;

   The DSP chip is used to receive the electrical parameters, and query the current temperature of the target chip from a preset corresponding relationship based on the electrical parameters. The corresponding relationship describes the electrical parameters of chips of the same type as the target chip. temperature change relationship.
9. The automated testing equipment of claim 8, wherein the electrical parameters obtained by the PMU are analog quantities.
10. The automated test equipment according to claim 8 or 9, characterized in that the PMU is also used to obtain calibration test data of a plurality of similar chips and send the calibration test data to the DSP chip, wherein the The calibration test data includes the excitation voltage received by the diode of the ESD protection circuit of the similar chip, multiple temperatures of the similar chip and the current of the diode corresponding to each temperature; or, the ESD protection circuit of the similar chip The excitation current received by the diode, multiple temperatures of the similar chip and the voltage across the diode corresponding to each temperature;

    The DSP chip is also used to receive the calibration test data, determine the target data in the test data based on the corresponding relationship between the temperature and the electrical parameters under the ideal state; and determine the corresponding relationship based on the target data.
11. The automated test equipment according to any one of claims 8 to 10, characterized in that the PMU is also used to obtain stable test data of similar chips in the test environment, and send the stable test data to the DSP chip , wherein the test environment provides an ambient temperature, and the test data includes electrical parameters corresponding to the similar chips at multiple test time points under the ambient temperature;

    The DSP chip is also used to receive the stability test data and determine the stabilization time based on the stability test data.
12. The automated test equipment according to any one of claims 8 to 11, wherein the PMU is further used to apply an excitation voltage to the diode of the ESD protection circuit of the target chip to obtain the current of the diode; or,

    The PMU is further used to apply an excitation current to the diode of the ESD protection circuit of the target chip to obtain the voltage of the diode.
13. The automated testing equipment according to any one of claims 8 to 12, characterized in that,

    If the current temperature of the target chip is different from the ambient temperature of the test environment, the PMU is also used to test the target chip according to multiple preset test time points to obtain the ESD protection of the target chip. Electrical parameters corresponding to multiple preset test time points of the diodes of the circuit, and sending the electrical parameters to the DSP chip;

    The DSP is also used by the module to determine the temperature of the target chip based on the electrical parameters and the corresponding relationship, and update the stabilization time based on the preset test time point when the temperature of the target chip is the same as the ambient temperature. .
14. The automated test equipment according to any one of claims 8 to 13, characterized in that the automated test equipment further includes a test module, if the current temperature of the target chip is equal to the ambient temperature of the test environment, then the Debriefing The test module powers on the target chip and performs performance or reliability testing.
15. An automated test equipment ATE, characterized in that the ATE includes:

    Parameter measurement unit PMU;

    Digital signal processing DSP chip;

    Memory, used to store one or more programs;

    When the one or more programs are executed by the PMU or the DSP chip, the PMU implements the operations performed by the PMU in the chip temperature testing method according to any one of claims 1 to 7, The DSP chip implements the operations performed by the DSP chip in the chip temperature testing method according to any one of claims 1 to 7.
16. A computer-readable storage medium with a computer program stored thereon, characterized in that when the program is executed by a processor, the chip temperature testing method as described in any one of claims 1 to 7 is implemented.