CN108614005A - A kind of test method and system of the thermal physical property parameter based on multilayer materials - Google Patents
A kind of test method and system of the thermal physical property parameter based on multilayer materials Download PDFInfo
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- CN108614005A CN108614005A CN201810330613.XA CN201810330613A CN108614005A CN 108614005 A CN108614005 A CN 108614005A CN 201810330613 A CN201810330613 A CN 201810330613A CN 108614005 A CN108614005 A CN 108614005A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
Abstract
The invention discloses a kind of test methods of the thermal physical property parameter based on multilayer materials comprising following steps：System is tested object heating to multilayer materials, and measures tested object temperatur-timel curve T (t)；System-computed obtains the thermal resistance and interface resistance that the multilayer materials are tested object vertical direction layers of material；System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；System measures plane thermal physical property parameter using Angstrom methods, and is converted to related thermal physical property parameter.A kind of test system of the thermal physical property parameter based on multilayer materials comprising：Temperatur-timel curve acquisition module, thermal resistance conversion module, system carry out analogue simulation, thermal physical property parameter computing module.By the above-mentioned means, the present invention can measure multilayer materials vertical direction thermal resistance and horizontal direction thermal diffusion coefficient, and simulate the hot crosstalk direction of hot-fluid between multilayer material, material Thermal test field can be widely applied to.
Description
Technical field
The present invention relates to material Thermal test fields, and in particular to a kind of test method of multilayer materials thermal physical property parameter
And system.
Background technology
As multilayer materials are growing, more and more applications are obtained, while with microelectric technique
Development, electronic component is to thin, light, small, multifunction direction change, and component packing density is higher and higher, power device
Heat dissipation has become an outstanding problem.If the heat of accumulation cannot shed in time, component operating temperature will be caused to increase, directly
Connect the life and reliability for influencing various high-precision equipments.Heat-conducting polymer material processing and forming is simple, at low cost, quality
Gently, chemical stability is high, is adjusted by being formulated, the heat dissipation composite material met the requirements can be made.Multilayer materials at
One ring of key of electronic equipment dissipating heat will be solved the problems, such as future, and how accurately be surveyed after researcher synthesizes composite material
It is most important to try out its corresponding thermal physical property parameter.Accurately know thermal physical property parameter and interface resistance of material etc., ability
Know whether material property meets the requirements, and then could preferably develop new multilayer materials.
There are hot cross-interference issue between multilayer materials, be because：Multilayer materials and homogenous material performance are less
Identical, hot crosstalk mutual between different materials, interface is asymmetric in heat transfer process, between layers heat transfer system
The material that number differs greatly, hot crosstalk is more serious, is produced a very large impact to result；It is this deviate it is big when can be more than 10%.
Thermometric error more than 10% may derive the error more than 20% in substituting into formula and calculating.Currently, most of heat
The theory of testing is all built upon on the basis of One-dimensional heat transfer hypothesis, and the hot cross-interference issue of multilayer materials can not be ignored, therefore
It needs new theory or is used after being modified pervious Thermal test theory hypothesis condition and boundary condition.
Therefore presently, the theory of the still unified authority of neither one tests the hot physical property of multilayer materials with method
Parameter.It will produce hot crosstalk during the test for multilayer materials, bring very big test error, it is difficult to measure each
The problem of layer material thermal physical property parameter, it is necessary to which a kind of new test method is provided.
Invention content
In order to solve the above-mentioned technical problem, the object of the present invention is to provide a kind of heat testing methods, can measure Vertical Square
Thermal diffusion coefficient, thermal conductivity etc. in the thermal resistance, thermal conductivity and horizontal direction of layers of material upwards.
The technical solution adopted in the present invention is：
The present invention provides a kind of test method of the thermal physical property parameter based on multilayer materials comprising following steps：
System is tested object heating to multilayer materials, and measures tested object temperatur-timel curve T (t)；
System-computed obtains the thermal resistance and interface resistance that the multilayer materials are tested object vertical direction layers of material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
System measures plane thermal physical property parameter using Angstrom methods, and is converted to related thermal physical property parameter.
As the improvement of the technical solution, the step system to multilayer materials be tested object heating, and measure by
Tester temperatur-timel curve T (t) comprising：Tested object is placed in insulating box, is heated under condition of different temperatures, and
Measured object temperature change is measured using sensor.
As the improvement of the technical solution, differential process is carried out to the temperatur-timel curve of measured tested object, according to
It is tested physical performance, the corner position of differential curve determines the layering face of each material layer.
As the improvement of the technical solution, the method further includes：System detectio to experiment sensor test result with
When simulation results are corresponding, then stop iteration tests, and record relevant parameter.
Further, the method further includes that system compensates test error caused by hot crosstalk.
Further, the method further includes：Gained temperatur-timel curve is converted into time thermal resistance curve, can be indicated
For：
Wherein, T0For the initial temperature of measured object；ΔPhFor thermal power.
Further, derivative da/dz of the time thermal resistance curve under logarithmic time is acquired, deconvolution finds out time constant spectrum
For：
Wherein, W (z)=exp [z-exp (z)].
Further, electrothermal module is used to use equal-wattage with sinusoidal or cosine manner to measured object heating one end, separately
Two points that spacing is q are chosen in one end, if respectively placing dry temperature sensor, and record temperature information, substitute into formula and obtain
Thermal diffusion coefficient；
Wherein, q is measurement point spacing, and dt is phase difference, and M is that one of selected point puts amplitude, and N is another point width
Value.
On the other hand, the present invention also provides a kind of test system of the thermal physical property parameter based on multilayer materials, packets
It includes：
Temperatur-timel curve acquisition module is tested object heating to multilayer materials for executing step system, and surveys
Object temperatur-timel curve T (t) must be tested；
The tested object vertical direction of the multilayer materials is calculated for executing step system in thermal resistance conversion module
The thermal resistance and interface resistance of layers of material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
Thermal physical property parameter computing module is surveyed for executing step system using Angstrom methods
Plane thermal physical property parameter is measured, and is converted to related thermal physical property parameter.
The beneficial effects of the invention are as follows：This programme provides a kind of test method of multilayer materials thermal physical property parameter and is
Multilayer materials, are regarded as the system of an entirety, the hot physical property of tested object are calculated by temperature time curve by system
The test of parameter, this method measure material temperature rise curve under the premise of not destroying material, and thermal resistance is parsed by mathematical method
With the information such as thermal conductivity, nondestructive measurement is realized.It uses Transient Method to measure, and time of measuring is short, strong antijamming capability, once can be with
Multiple parameters are measured, it is efficient, the Thermal test of various nonmetal solid materials is can be widely applied to, there is efficient, quick, use
The features such as range is wide.
Description of the drawings
The specific implementation mode of the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is the step flow chart of first embodiment of the invention；
Fig. 2 is the temperature curve schematic diagram that the Angstrom method sensor measurements of second embodiment of the invention obtain；
Fig. 3 is the Angstrom method experimental method schematic diagrames of third embodiment of the invention.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
As shown in Figs. 1-3, the present invention provides a kind of test method of the thermal physical property parameter based on multilayer materials, packet
Include following steps：
System is tested object heating to multilayer materials, and measures tested object temperatur-timel curve T (t)；
System-computed obtains the thermal resistance and interface resistance that the multilayer materials are tested object vertical direction layers of material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
System measures plane thermal physical property parameter using Angstrom methods, and is converted to related thermal physical property parameter.
As the improvement of the technical solution, the step system to multilayer materials be tested object heating, and measure by
Tester temperatur-timel curve T (t) comprising：Tested object is placed in insulating box, is heated under condition of different temperatures, and
Measured object temperature change is measured using sensor.
As the improvement of the technical solution, differential process is carried out to the temperatur-timel curve of measured tested object, according to
It is tested physical performance, the corner position of differential curve determines the layering face of each material layer.
As the improvement of the technical solution, the method further includes：System detectio to experiment sensor test result with
When simulation results are corresponding, then stop iteration tests, and record relevant parameter.
Further, the method further includes that system compensates test error caused by hot crosstalk.
Further, the method further includes：Gained temperatur-timel curve is converted into time thermal resistance curve, can be indicated
For：
Wherein, T0For the initial temperature of measured object；ΔPhFor thermal power.
Further, derivative da/dz of the time thermal resistance curve under logarithmic time is acquired, deconvolution finds out time constant spectrum
For：
Wherein, W (z)=exp [z-exp (z)].
Further, electrothermal module is used to use equal-wattage with sinusoidal or cosine manner to measured object heating one end, separately
Two points that spacing is q are chosen in one end, if respectively placing dry temperature sensor, and record temperature information, substitute into formula and obtain
Thermal diffusion coefficient；
Wherein, q is measurement point spacing, and dt is phase difference, and M is that one of selected point puts amplitude, and N is another point width
Value.
A kind of test method of multilayer materials thermal physical property parameter is regarded measurand as a total system, is passed through
Curve (output) is changed over time to measuring measured object temperature after tested object heating (input), object temperature is tested by analysis
Time graph parses related thermal physical property parameter, including following steps：
(a) temperature time curve for being tested sample is obtained, integral structure function curve is extracted, calculates vertical direction
Interface resistance between upper layers of material thermal resistance and layers of material；
(b) experimental data base is established through a large number of experiments, and analogue simulation goes out multilayer materials internal heat flows side accordingly
To the hot crosstalk between different layers；
(c) current heat testing method is modified according to the result of emulation, multilayer is measured using Angstrom methods
Composite material plane thermal diffusivity is converted into the parameters such as thermal resistance, thermal conductivity according to physical relation.
It is specifically included：Tested object is placed in insulating box, is heated under condition of different temperatures and is tested object, and used
Sensor obtains measured object temperature rising curve.
According to the distributed data of temperature at any time on the heat flow path, be converted on heat source to heat flow path at each point
Accumulation thermal capacitance with the delta data of accumulation thermal resistance, i.e. the thermal resistance structure function of measurand, including integral structure function and micro-
Separation structure function.
Differential process is carried out to the temperature time curve of measured tested object, according to tested physical performance, differential curve
Inflection point determine material layer.
During extracting differential and integral structure function, specific filter and its scope of application are selected.
According to measured vertical direction parameter, carries out the hot crosstalk of multilayer material using computer software and simulate, mould is set
Parameter during quasi-.
In conjunction with the hot cross-talk models for the multilayer material that hydrodynamics, thermal conduction study etc. simulate, Binding experiment adjusts emulation ginseng
Number.
According to the method that hot cross-talk models compensate and correct the error that hot-fluid crosstalk is brought, Angstrom methods measure more
The plane thermal diffusion coefficient of layer material.
Further, first, the temperature time curve for being tested sample is obtained, integral structure function curve is extracted, calculates
Go out the interface resistance between layers of material thermal resistance and layers of material in vertical direction；Detected material is placed on thermostat
In, temperature is recorded by heating device and changes over time data, while recording the situation of change of heating device voltage, measures measurement
The transformational relation of voltage and temperature.Can be in the hope of the temperature value under each time by the expression formula of transformational relation, and then establish
A series of temperatur-timel curve, expression formula are as follows:
T (t)=m*V (t)+k；
Wherein, m, k are linear scale factor (being obtained according to experimental result adjustment)；V (t) is voltage；T is the time.
Initial temperature T is found out according to above formula0, the reference point of proper range is chosen first on temperatur-timel curve；Then
Least squares method calculating is done to the reference point of selection, seeks estimating the Trendline L by these points；Measurement initial stage finally there is into generation
The time of obvious errors substitutes into the value of straight line L, can acquire temperature results and initial temperature T after making corrections0。
Correction calculating is carried out to the error of above-mentioned temperature-time curve, the initial temperature of measured object is acquired, is considered as line
Sexual intercourse, i.e.,：
Wherein, Ph/A represents thermal power densities, is considered as steady state value；Kth is
Wherein c is thermal capacitance, and ρ is density, and λ is thermal conductivity.
Thermal resistance-time transformational relation is established according to temperature-time curve, conversion relational expression is：
Wherein T0For initial temperature, Δ P is thermal power change rate.
Regard thermal response as first-order system respond herein, tested object temperature-responsive indicated with the sum of exponential function,
I.e.：
Wherein τi=Rthi·Cthi。
Assuming that Δ P=1W, temperature-responsive is unit-step response, i.e.,：
Discrete thermal time constant value is composed with continuous thermal time constant and is replaced, can be obtained：
Wherein R (τ) is time constant.
It differentiates to thermal resistance-time graph, its thermal time constant can be acquired by deconvolution, i.e.,：
Each Δ z corresponds to a parallel RC circuits, then corresponding to thermal resistance, thermal capacitance can be expressed as：
Rth=R (z)/Δ z；
Cth=ez/Rth；
For the description thermal resistance thermal capacitance information of more intuitive and convenient, being integrated to it can obtain：
Wherein λ is thermal conductivity, and A (x) is cross-sectional area.
Wherein cvIt is unit thermal capacitance, A (x) is cross-sectional area.
By differentiating to thermal resistance-time graph, time constant is sought, integral structure function is converted to, is tied by integrating
Structure function parses corresponding thermal resistance, thermal capacitance information；Further according to physical relation conversion can obtain thermal resistance in vertical direction, thermal capacitance and
The parameter informations such as thermal conductivity.
Then, experimental data base is established through a large number of experiments, and analogue simulation goes out multilayer materials internal heat flows accordingly
Hot crosstalk between direction and different layers；By based on FInite Element, by solve partial differential equation (single physical field) or
Person's partial differential equations (multiple physical field) realize the emulation of actual physical phenomenon, simulate multilayer material change of temperature field feelings
Condition.
Third walks, and according to the normal direction thermal resistance information parsed, simulation material change of temperature field, is being heated in a computer
10 thermocouple collecting temperature change informations of Shi Caiyong, are compared with computer simulation result, adjustment analogue simulation ginseng
Number is allowed to match with experimental result, and simulation parameter iterates if mismatching, until simulation result is passed with practical
Sensor measured result stops iteration in error range, records relevant parameter.
4th step is adopted after being compensated and corrected in conjunction with the Thermal test error that simulation result brings the hot crosstalk of multilayer material
Multilayer materials plane thermal diffusivity is measured with Angstrom methods, sine is given using electrothermal module in tested object one end
Wave heating signal chooses at 2 points on tested object, horizontal direction thermal diffusion coefficient is obtained according to following formula.
Wherein, q is measurement point spacing, and dt is phase difference, and M is that one of selected point puts amplitude, and N is another point width
Value.
On the other hand, the present invention also provides a kind of test system of the thermal physical property parameter based on multilayer materials, packets
It includes：
Temperatur-timel curve acquisition module heats multilayer materials tester for executing step system, and measures
Tested object temperatur-timel curve T (t)；
Thermal resistance conversion module, for executing step system, that the multilayer materials tester vertical direction is calculated is each
The thermal resistance and interface resistance of layer material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
Thermal physical property parameter computing module measures the hot physical property ginseng of plane for executing step system using Angstrom methods
Number, and be converted to related thermal physical property parameter.
This programme regards measurand as a total system, by measuring measured object after tested object heating (input)
Temperature changes over time curve (output), and being tested object temperature time curve by analysis calculates vertical direction layers of material
Interface resistance between thermal resistance and layers of material；Hot crosstalk between different materials is gone out by calculating simulation again, Binding experiment data are true
Plane thermal physical property parameter is measured using Angstrom methods after the test error compensation determined analog parameter, and hot crosstalk is brought,
It is converted into related thermal physical property parameter further according to physical relation.It hangs down by the above-mentioned means, the present invention can measure multilayer materials
Histogram simulates the hot crosstalk direction of hot-fluid between multilayer material to thermal resistance and horizontal direction thermal diffusion coefficient.
It is to be illustrated to the preferable implementation of the present invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations or be replaced under the premise of without prejudice to spirit of that invention
It changes, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (9)
1. a kind of test method of the thermal physical property parameter based on multilayer materials, which is characterized in that it includes the following steps：
System is tested object heating to multilayer materials, and measures tested object temperatur-timel curve T (t)；
System-computed obtains the thermal resistance and interface resistance that the multilayer materials are tested object vertical direction layers of material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
System measures plane thermal physical property parameter using Angstrom methods, and is converted to related thermal physical property parameter.
2. the test method of the thermal physical property parameter according to claim 1 based on multilayer materials, which is characterized in that institute
It states step system and object heating is tested to multilayer materials, and measure tested object temperatur-timel curve T (t) comprising：It will
Tested object is placed in insulating box, is heated under condition of different temperatures, and measures measured object temperature change using sensor.
3. the test method of the thermal physical property parameter according to claim 1 or 2 based on multilayer materials, feature exist
In to the temperatur-timel curve progress differential process of measured tested object, according to the inflection point of tested physical performance, differential curve
The layering face of each material layer of location determination.
4. the test method of the thermal physical property parameter according to claim 3 based on multilayer materials, which is characterized in that institute
The method of stating further includes：When the test result of system detectio to experiment sensor is corresponding with simulation results, then stop iteration
Test, and record relevant parameter.
5. the test method of the thermal physical property parameter according to claim 4 based on multilayer materials, which is characterized in that institute
The method of stating further includes that system compensates test error caused by hot crosstalk.
6. the test method of the thermal physical property parameter according to claim 5 based on multilayer materials, which is characterized in that institute
The method of stating further includes：Gained temperatur-timel curve is converted into time thermal resistance curve, is represented by：
Wherein, T0For the initial temperature of measured object；ΔPhFor thermal power.
7. the test method of the thermal physical property parameter according to claim 6 based on multilayer materials, which is characterized in that ask
Derivative da/dz of the time thermal resistance curve under logarithmic time is obtained, deconvolution finds out time constant spectrum and is：
Wherein, W (z)=exp [z-exp (z)].
8. the test method of the thermal physical property parameter according to claim 7 based on multilayer materials, which is characterized in that adopt
Use equal-wattage with sinusoidal or cosine manner to measured object heating one end with electrothermal module, the other end chooses two that spacing is q
It is a, if respectively placing dry temperature sensor, and temperature information is recorded, substitutes into formula and obtain thermal diffusion coefficient；
Wherein, q is measurement point spacing, and dt is phase difference, and M is that one of selected point puts amplitude, and N is another point amplitude.
9. a kind of test system of the thermal physical property parameter based on multilayer materials, which is characterized in that it includes：
Temperatur-timel curve acquisition module, for execute step system to multilayer materials be tested object heating, and measure by
Tester temperatur-timel curve T (t)；
Each layer of the tested object vertical direction of the multilayer materials is calculated for executing step system in thermal resistance conversion module
The thermal resistance and interface resistance of material；
System carries out analogue simulation, and the heat biography obtained between layers of material is disturbed；
Thermal physical property parameter computing module measures plane thermal physical property parameter for executing step system using Angstrom methods, and
Be converted to related thermal physical property parameter.
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