CN111933552A - 一种半导体智能吹沙生产线 - Google Patents

一种半导体智能吹沙生产线 Download PDF

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CN111933552A
CN111933552A CN202010840560.3A CN202010840560A CN111933552A CN 111933552 A CN111933552 A CN 111933552A CN 202010840560 A CN202010840560 A CN 202010840560A CN 111933552 A CN111933552 A CN 111933552A
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sand blowing
robot
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何礼平
何鑫
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Wuxi Jingjie Robot Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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Abstract

本发明涉及半导体晶片技术领域，具体为一种半导体智能吹沙生产线，其能够提高吹沙效率，操作简单，其包括工作台和吹沙机，其特征在于，所述工作台旁设置料盒抓取机器人、中间取片机器人、吹沙取片机器人，所述工作台上设置有两个对应所述吹沙取片机器人的定位台、两个对应所述中间取片机器人的料盒放置区，所述吹沙机包括转盘，所述转盘上均匀设置有晶片放置板，所述晶片放置板倾斜布置且上端面设置有晶片支撑柱。

Description

一种半导体智能吹沙生产线
技术领域
本发明涉及半导体晶片技术领域，具体为一种半导体智能吹沙生产线。
背景技术
硅是一种灰色、易碎、四价的非金属化学元素，半导体晶片主要由硅构成，为一层较薄的灰色圆片，很容易破碎，加工出来后需要进行吹沙机进行吹沙操作，传统的操作是由人工完成，从料盒中取出放入吹沙机，吹沙完成后再取出放回料盒，操作困难，效率较低。
发明内容
为了解决现有半导体晶片吹沙操作效率低，操作困难，容易碎片的问题，本发明提供了一种半导体智能吹沙生产线，其能够提高吹沙效率，操作简单。
其技术方案是这样的：一种半导体智能吹沙生产线，其包括工作台和吹沙机，其特征在于，所述工作台旁设置料盒抓取机器人、中间取片机器人、吹沙取片机器人，所述工作台上设置有两个对应所述吹沙取片机器人的定位台、两个对应所述中间取片机器人的料盒放置区，所述吹沙机包括转盘，所述转盘上均匀设置有晶片放置板，所述晶片放置板倾斜布置且上端面设置有晶片支撑柱。
其进一步特征在于，所述料盒抓取机器人上安装有料盒机械手，所述料盒机械手包括对称布置的左夹板和右夹板，所述左夹板和所述右夹板分别安装于左夹爪和右夹爪一端，所述左夹爪与所述右夹爪另一端分别通过连杆连接固定座，所述连杆包括平行布置的前连杆和后连杆，所述前连杆两端分别与所述左夹爪/右夹爪、固定座铰接，所述后连杆一端与所述左夹爪或所述右夹爪铰接、另一端安装有齿轮，两个所述后连杆连接的所述齿轮相啮合，其中一个所述齿轮连接驱动电机；
所述左夹板与所述右夹板内侧面均为锯齿面，所述左夹板与所述右夹板外侧面分别通过连接架固定连接所述左夹爪和所述右夹爪；
所述中间取片机器人上安装有中间取片机械手，所述中间取片机械手包括两个取片叉，所述取片叉端部上表面开设有真空吸料孔，所述取片叉内开设有与所述真空吸料孔连通的空气通道；
所述吹沙取片机器人上安装有两个柔性爪，所述柔性爪外表面为硅胶层，所述柔性爪内设置有气腔，所述气腔通过软管连接气源；
所述定位台中间开设有柱形凹槽，所述柱形凹槽内设置有用于支撑半导体晶片的台阶面，所述定位台侧面开设有两个与所述取片叉配合的第一让位槽，所述定位台上还开设有与两个所述柔性爪配合的第二让位槽；
所述料盒抓取机器人设置有一个，所述中间取片机器人、吹沙取片机器人、吹沙机设置有两个且分别布置于所述工作台两侧。
采用本发明后，料盒抓取机器人将装满半导体晶片的料盒送至料盒放置区，中间取片机器人将晶片取出放置于定位台，吹沙取片机器人将晶片取出放入吹沙机的晶片放置板上进行吹沙操作，两个定位台和两个料盒放置区可以实现一边进行没有经过吹沙操作的晶片上料、一边进行完成吹沙操作的晶片下料，有效的提高了吹沙效率，操作简单；进一步的，采用柔性爪来抓取晶片实现吹沙机处的上下料，确保产品不会出现碎片现象，提高产品质量。
附图说明
图1为本发明结构示意图；
图2为料盒机械手结构示意图；
图3为吹沙机结构示意图；
图4为中间取片机器人与料盒示意图；
图5为定位台结构主视图；
图6为定位台结构俯视图；
图7柔性爪结构示意图。
具体实施方式
见图1至图7所示，一种半导体智能吹沙生产线，其包括工作台1和两个吹沙机2，工作台1旁设置一个料盒抓取机器人3、两个中间取片机器人4、两个吹沙取片机器人5，工作台1上设置有两个对应一个吹沙取片机器人5的定位台6、两个对应一个中间取片机器人4的料盒放置区，料盒放置区用于竖向放置料盒7，即一共包括四个定位台6和四个料盒放置区，吹沙机2包括转盘8，转盘8上均匀设置有晶片放置板9，晶片放置板9倾斜布置且上端面设置有四个晶片支撑柱10，起到支撑半导体晶片的作用。
料盒抓取机器人3上安装有料盒机械手，料盒机械手包括对称布置的左夹板11和右夹板12，左夹板11和右夹板12分别安装于左夹爪13和右夹爪14一端，左夹爪13与右夹爪14另一端分别通过连杆连接固定座15，连杆包括平行布置的前连杆16和后连杆17，前连杆16两端分别与左夹爪13/右夹爪14、固定座15铰接，后连杆17一端与左夹爪13或右夹爪14铰接、另一端安装有齿轮18，两个后连杆17连接的齿轮18相啮合，其中一个齿轮18连接驱动电机，驱动电机让其中一个齿轮18转动，另一个齿轮18跟着转动，两个后连杆17同步摆动，两个前连杆16也同步摆动，最终实现左夹板11和右夹板12同步夹紧或者松开。
左夹板11与右夹板12内侧面均为锯齿面，可以更好的夹紧料盒7，左夹板11与右夹板12外侧面分别通过连接架19固定连接左夹爪13和右夹爪14。
中间取片机器人4上安装有中间取片机械手，中间取片机械手包括两个取片叉20，与叉车上的货叉类似，取片叉20端部上表面开设有真空吸料孔，取片叉内开设有与真空吸料孔连通的空气通道，取料时，取片叉20移至晶片下方然后升起接触晶片底面，真空吸料孔吸附住晶片后即可进行搬运操作。
定位台6中间开设有于柱形凹槽21，柱形凹槽21内设置有用于支撑半导体晶片的台阶面22，定位台6侧面开设有两个与取片叉20配合的第一让位槽23，可以让取片叉进入完成取片和放片操作。
吹沙取片机器人5上安装有两个柔性爪24，柔性爪24外表面为硅胶层，不会对晶片造成损伤，柔性爪24内设置有气腔，气腔通过软管26连接气源，当气腔内通入气体后，气腔内压力增大，柔性爪24在挤压力的作用下向内弯曲即可实现抓取，模仿人手的操作，当气体从气腔排出后，压力减小，不再产生挤压力，柔性爪复位松开晶片，定位台6上还开设有与两个柔性爪24配合的第二让位槽25，可以让柔性爪24伸入抓取到晶片。
工作原理如下：料盒抓取机器人3将两个料盒7抓取到工作台一侧的两个料盒放置区并竖向放置，让料盒7开口在侧面，其中一个料盒7装没有吹沙的晶片，另一个为空料盒，中间取片机器人4上的取片叉20从装有晶片的料盒7中取出一个晶片放置在其中一个定位台6上，吹沙取片机器人5驱动柔性爪24将晶片从定位台6上取出放在吹沙机2的晶片放置板9上，转盘转动进入吹沙，中间取片机器人4将下一片晶片放在一个定位台6上，吹沙取片机器人5再次工作将其放入吹沙机2内，重复上述操作，直到第一个晶片完成吹沙，在中间取片机器人4将晶片放在一个定位台6上时，吹沙取片机器人5将完成吹沙的晶片放在另一个定位台6上，吹沙取片机器人5再将没有吹沙的晶片放入吹沙机2同时中间取片机器人4将完成吹沙的晶片放到空的料盒中，再从装有晶片的料盒取出下一个晶片，实现了为吹沙的晶片上料和已吹沙的晶片下料同步进行，大大提高了效率。一个料盒抓取机器人3负责工作台两侧的料盒取放操作，用于将完成吹沙的料盒下料和为吹沙的料盒上料。

Claims (7)

1.一种半导体智能吹沙生产线，其包括工作台和吹沙机，其特征在于，所述工作台旁设置料盒抓取机器人、中间取片机器人、吹沙取片机器人，所述工作台上设置有两个对应所述吹沙取片机器人的定位台、两个对应所述中间取片机器人的料盒放置区，所述吹沙机包括转盘，所述转盘上均匀设置有晶片放置板，所述晶片放置板倾斜布置且上端面设置有晶片支撑柱。
2.根据权利要求1所述的一种半导体智能吹沙生产线，其特征在于，所述料盒抓取机器人上安装有料盒机械手，所述料盒机械手包括对称布置的左夹板和右夹板，所述左夹板和所述右夹板分别安装于左夹爪和右夹爪一端，所述左夹爪与所述右夹爪另一端分别通过连杆连接固定座，所述连杆包括平行布置的前连杆和后连杆，所述前连杆两端分别与所述左夹爪/右夹爪、固定座铰接，所述后连杆一端与所述左夹爪或所述右夹爪铰接、另一端安装有齿轮，两个所述后连杆连接的所述齿轮相啮合，其中一个所述齿轮连接驱动电机。
3.根据权利要求2所述的一种半导体智能吹沙生产线，其特征在于，所述左夹板与所述右夹板内侧面均为锯齿面，所述左夹板与所述右夹板外侧面分别通过连接架固定连接所述左夹爪和所述右夹爪。
4.根据权利要求1所述的一种半导体智能吹沙生产线，其特征在于，所述中间取片机器人上安装有中间取片机械手，所述中间取片机械手包括两个取片叉，所述取片叉端部上表面开设有真空吸料孔，所述取片叉内开设有与所述真空吸料孔连通的空气通道。
5.根据权利要求4所述的一种半导体智能吹沙生产线，其特征在于，所述吹沙取片机器人上安装有两个柔性爪，所述柔性爪外表面为硅胶层，所述柔性爪内设置有气腔，所述气腔通过软管连接气源。
6.根据权利要求5所述的一种半导体智能吹沙生产线，其特征在于，所述定位台中间开设有柱形凹槽，所述柱形凹槽内设置有用于支撑半导体晶片的台阶面，所述定位台侧面开设有两个与所述取片叉配合的第一让位槽，所述定位台上还开设有与两个所述柔性爪配合的第二让位槽。
7.根据权利要求1所述的一种半导体智能吹沙生产线，其特征在于，所述料盒抓取机器人设置有一个，所述中间取片机器人、吹沙取片机器人、吹沙机设置有两个且分别布置于所述工作台两侧。
CN202010840560.3A 2020-08-20 2020-08-20 一种半导体智能吹沙生产线 Pending CN111933552A (zh)

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