CN111916990A

CN111916990A - Coaxial packaging laser device

Info

Publication number: CN111916990A
Application number: CN202010831038.9A
Authority: CN
Inventors: 黄祥恩; 陈春明; 王波
Original assignee: Guilin Xinfei Optoelectronic Technology Co ltd
Current assignee: Guilin Xinfei Optoelectronic Technology Co ltd
Priority date: 2020-08-18
Filing date: 2020-08-18
Publication date: 2020-11-10

Abstract

The invention discloses a coaxial packaging laser device, wherein a tube seat plays a supporting role, a thermistor well detects the working temperature of a laser chip, is transmitted to the thermoelectric refrigerator through a circuit, controls the working temperature of the laser chip by adjusting the input current of the thermoelectric refrigerator, the pins are connected through the electric lead, the inner cavity is arranged in the heat conducting piece, one or more of water, liquid nitrogen and carbon dioxide are loaded in the inner cavity, after one side of the heat conducting piece is heated, the liquid in the inner cavity is heated and gasified to take away heat, the other side of the heat conducting piece is far away from the heat source to form a backflow to promote the heat conducting piece to circularly cool, and then coaxial encapsulation laser device solves traditional coaxial encapsulation laser device radiating effect not good, leads to the unstable technical problem of luminous power.

Description

Coaxial packaging laser device

Technical Field

The invention relates to the technical field of laser devices, in particular to a coaxial packaging laser device.

Background

Optical fiber communication enters a brand new development stage in the 21 st century, and has profound influence on various fields of national economy and national defense construction. The semiconductor laser is used as a coherent light source for optical fiber communication, and has the advantages of high conversion efficiency, small volume, light weight, high reliability, direct modulation, integration with other semiconductor devices, and the like, so that the semiconductor laser plays a very important role in optical communication.

The existing laser coaxial packaging device mainly adopts two structures, one is a high-molecular plastic packaging structure, and the other is a ceramic ferrule, an optical fiber and an open ceramic sleeve packaging structure, wherein in the first mode, the optical power of high-molecular plastic is unstable under the high-temperature condition and cannot be used as a long-distance transmission medium of a single-mode optical fiber, and the second packaging mode has the defects that the end face of a ceramic element is easy to physically damage and is easy to adhere impurities.

Therefore, the laser coaxial packaging device needs to improve the heat dissipation efficiency on the premise of ensuring the stability of the optical transmission power, and the packaging structure is reasonably designed by combining the characteristics of materials made of different materials.

Disclosure of Invention

The invention aims to provide a coaxial packaging laser device, and aims to solve the technical problem that the laser device with the coaxial packaging laser device in the prior art is unstable in optical power due to poor heat dissipation effect.

In order to achieve the above object, the present invention provides a coaxial package laser device, which comprises a tube seat, a thermoelectric refrigerator, a first heat sink transition block, a second heat sink transition block, a laser chip, a thermistor, a pin and a heat conducting piece;

the thermoelectric refrigerator is detachably connected with the tube seat and is positioned on one side of the tube seat, the first heat sink transition block is detachably connected with the thermoelectric refrigerator and is positioned on one side of the thermoelectric refrigerator far away from the tube seat, the second heat sink transition block is fixedly connected with the first heat sink transition block and is positioned on one side of the first heat sink transition block far away from the thermoelectric refrigerator, the laser chip is positioned on one side of the second heat sink transition block far away from the first heat sink transition block, the thermistor is positioned on one side of the second heat sink transition block far away from the laser chip, the pin is fixedly connected with the tube seat and is positioned on one side of the tube seat far away from the thermoelectric refrigerator, one end of the heat conducting piece is fixedly connected with the tube seat and is positioned on one side of the tube seat close to the thermoelectric refrigerator, and the other end of the heat conducting piece penetrates through the tube seat, and is positioned on one side of the tube seat close to the pin.

The coaxial packaging laser device further comprises a pipe cap, wherein the pipe cap is fixedly connected with the pipe seat and is positioned on one side, far away from the pin, of the pipe seat.

The pipe cap is provided with a through hole, and the through hole is positioned on one side, far away from the pipe seat, of the pipe cap.

The coaxial packaging laser device further comprises a lens, wherein the lens is fixedly connected with the pipe cap and is positioned on one side, close to the through hole, of the pipe cap.

The coaxial packaging laser device further comprises a heat insulation ring, wherein the heat insulation ring is detachably connected with the thermoelectric refrigerator and is positioned on the four peripheral surfaces of the thermoelectric refrigerator.

The coaxial packaging laser device further comprises a backlight detection chip, and the backlight detection chip is arranged on one side, close to the laser chip, of the first heat sink transition block.

The coaxial packaging laser device has the supporting function through the pipe seat, the thermoelectric refrigerator is TEC1-12706 and is electrically connected with the thermistor and the laser chip, the thermistor is SA1-TH, the first heat sink transition block and the second heat sink transition block are both made of aluminum nitride, the coaxial packaging laser device has the advantages of good thermal conductivity, small thermal expansion coefficient and the like, can effectively conduct heat to components of the device, the first heat sink transition block and the second heat sink transition block form a 90-degree included angle, the laser chip and the thermistor are respectively attached to two sides of the second heat sink transition block, the second heat sink transition block is matched with the first heat sink transition block to increase the installation cross-sectional area of each component to play a heat dissipation role, and the thermistor well detects the working temperature of the laser chip through the second heat sink transition block, the working temperature change of the laser chip can cause the change of the resistance value of the thermistor, the change is transmitted to a control circuit of the thermoelectric refrigerator through a circuit, the control circuit controls the working temperature of the laser chip by adjusting the input current of the thermoelectric refrigerator, the first heat sink transition block, the second heat sink transition block and the tube seat are pasted by epoxy silver, so that the heat dissipation of the laser chip is faster, a plurality of pins are arranged and are respectively and electrically connected with the laser chip, the thermoelectric refrigerator and the thermistor through the conducting wires, one end of the heat conducting piece is positioned at one side of the tube seat close to the thermoelectric refrigerator, the other end of the heat conducting piece is positioned at one side of the tube seat close to the pins and is internally provided with the inner cavity, and water, liquid nitrogen and the like are loaded in the inner cavity, One or more carbon dioxide, after one side of the heat conducting piece close to the thermoelectric refrigerator is heated, the liquid in the inner cavity is heated and gasified to take away heat, so that the cooling effect is achieved, the other side of the heat conducting piece is far away from a heat source to form a backflow, the heat conducting piece is enabled to be cooled circularly, and further the coaxial packaging laser device can improve the heat dissipation efficiency, and the technical problem that the traditional coaxial packaging laser device is poor in heat dissipation effect and unstable in light power is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of an overall structure of a coaxial package laser device according to the present invention.

Fig. 2 is a schematic internal view of a cap of a coaxial package laser device according to the present invention.

Fig. 3 is a front cross-sectional view of a coaxial package laser apparatus provided by the present invention.

The laser device comprises a 1-tube seat, a 2-thermoelectric refrigerator, a 3-first heat sink transition block, a 4-second heat sink transition block, a 5-laser chip, a 6-thermistor, a 7-pin, an 8-heat conducting piece, a 9-inner cavity, a 10-insulating sleeve, an 11-tube cap, a 12-through hole, a 13-lens, a 14-heat insulating ring, a 15-backlight detection chip, a 16-electric lead, a 17-laser, an 18-accommodating cavity and a 100-coaxial packaging laser device.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1 to 3, the present invention provides a coaxial packaged laser device 100, which includes a tube seat 1, a thermoelectric refrigerator 2, a first heat sink transition block 3, a second heat sink transition block 4, a laser chip 5, a thermistor 6, a pin 7 and a heat conducting member 8;

the thermoelectric refrigerator 2 is detachably connected with the tube seat 1 and is positioned at one side of the tube seat 1, the first heat sink transition block 3 is detachably connected with the thermoelectric refrigerator 2 and is positioned at one side of the thermoelectric refrigerator 2 far away from the tube seat 1, the second heat sink transition block 4 is fixedly connected with the first heat sink transition block 3 and is positioned at one side of the first heat sink transition block 3 far away from the thermoelectric refrigerator 2, the laser chip 5 is positioned at one side of the second heat sink transition block 4 far away from the first heat sink transition block 3, the thermistor 6 is positioned at one side of the second heat sink transition block 4 far away from the laser chip 5, the pin 7 is fixedly connected with the tube seat 1 and is positioned at one side of the tube seat 1 far away from the thermoelectric refrigerator 2, one end of the heat conducting piece 8 is fixedly connected with the tube seat 1, and the other end of the heat conducting piece 8 penetrates through the tube seat 1 and is positioned on one side of the tube seat 1 close to the pin 7.

In this embodiment, the tube seat 1 plays a supporting role, the thermoelectric refrigerator 2 is of TEC1-12706, and is electrically connected to the thermistor 6 and the laser chip 5, the thermistor 6 is of SA1-TH, the first heat sink transition block 3 and the second heat sink transition block 4 are both made of aluminum nitride, which has the advantages of good thermal conductivity, small thermal expansion coefficient, and the like, and can effectively conduct heat to the components of the device, the laser chip 5 and the thermistor 6 are respectively attached to two sides of the second heat sink transition block 4, the thermistor 6 well detects the working temperature of the laser chip 5 through the second heat sink transition block 4, the working temperature change of the laser chip 5 can cause the change of the resistance value of the thermistor 6, and the change is transmitted to the control circuit of the thermoelectric refrigerator 2 through the circuit, the control circuit controls the working temperature of the laser chip 5 by adjusting the input current of the thermoelectric refrigerator 2, the thermoelectric refrigerator is mounted with the first heat sink transition block 3, the second heat sink transition block 4 and the tube seat 1 by adopting epoxy silver, so that the heat dissipation of the laser chip 5 is faster, the number of the pins 7 is multiple, the pins are respectively and electrically connected with the laser chip 5, the thermoelectric refrigerator 2 and the thermistor 6 through the conducting wires 16, one end of the heat conducting piece 8 is positioned at one side of the tube seat 1 close to the thermoelectric refrigerator 2, the other end of the heat conducting piece 8 is positioned at one side of the tube seat 1 close to the pins 7, the inner cavity 9 is arranged in the tube seat, one or more of water, liquid nitrogen and liquid carbon dioxide are loaded in the inner cavity 9, and after one side of the heat conducting piece 8 close to the thermoelectric refrigerator 2 is heated, the liquid in the inner cavity 9 is heated and gasified to take away heat, so that a cooling effect is achieved, the other side of the heat conducting piece 8 is far away from a heat source to form a backflow, the heat conducting piece 8 can be made to be cooled circularly, the heat dissipation efficiency can be improved by the coaxial packaging laser device 100, and the technical problem that the traditional coaxial packaging laser device is unstable in light power due to poor heat dissipation effect is solved.

Further, referring to fig. 3, the heat conducting member 8 has an inner cavity 9, and the inner cavity 9 is located inside the heat conducting member 8.

In this embodiment, the heat conducting member 8 is made of a copper material, has good heat conducting performance, and is internally provided with the inner cavity 9, one or more of water, liquid nitrogen and liquid carbon dioxide are loaded in the inner cavity 9, after one side of the heat conducting member 8 close to the thermoelectric refrigerator 2 is heated, the liquid in the inner cavity 9 is heated and gasified to take away heat, so as to perform a cooling function, the other side of the heat conducting member 8 is far away from a heat source to form a backflow, so that the heat conducting member 8 can be cooled circularly, and further the coaxial packaged laser device 100 can improve the heat dissipation efficiency, thereby solving the technical problem that the traditional coaxial packaged laser device is poor in heat dissipation effect and unstable in optical power.

Further, referring to fig. 3, the coaxial package laser device 100 further includes an insulating sleeve 10, where the insulating sleeve 10 is sleeved on the outer wall of the heat conducting member 8 and is located on a side of the heat conducting member 8 close to the pin 7.

In this embodiment, the heat conducting member 8 is close to one side of the pin 7, and the insulating sleeve 10 is sleeved on the outer wall, so as to prevent the heat conducting member 8 from directly contacting the outside, avoid the heat conducting member 8 from conducting electricity, and influence the outside, and further promote better user experience.

Further, referring to fig. 2, an included angle of 90 ° is formed between the first heat sink transition block 3 and the second heat sink transition block 4.

In this embodiment, the both sides of second heat sink transition block 4 set up respectively laser chip 5 with thermistor 6, with first heat sink transition block 3 combines, increases the cross-sectional area of components and parts installation, and heat conduction is to both sides diffusion, and then plays the radiating effect, solves traditional coaxial encapsulation laser device radiating effect not good, leads to the unstable technical problem of luminous power, second heat sink transition block 4 with first heat sink transition block 3 is 90 right angles, impels laser chip 5 vertical set up in on the tube socket 1, the convenient cooperation lens 13 impels user experience to feel better.

Further, referring to fig. 1, the coaxial package laser device 100 further includes a cap 11, where the cap 11 is fixedly connected to the socket 1 and is located on a side of the socket 1 away from the pin 7.

In this embodiment, the cap 11 is disposed on the tube seat 1, and forms an accommodating cavity 18 with the tube seat 1, and each component is placed in the accommodating cavity 18, so as to protect the inside of the coaxial package laser device 100, and promote better user experience.

Further, referring to fig. 1, the tube cap 11 has a through hole 12, and the through hole 12 is located on a side of the tube cap 11 away from the tube seat 1.

In this embodiment, the pipe cap 11 is provided with the through hole 12, the through hole 12 facilitates installation of the lens 13, so that the next operation is facilitated, and the user experience is better.

Further, referring to fig. 1, the coaxial package laser device 100 further includes a lens 13, where the lens 13 is fixedly connected to the cap 11 and is located on a side of the cap 11 close to the through hole 12.

In this embodiment, the light exit of the laser 17 on the laser chip 5 and the central point of the lens 13 are located on the same straight line, so as to improve the light transmission effect, and further, the coaxial package laser device 100 can improve the heat dissipation efficiency thereof on the premise of ensuring the stability of the light transmission power, so as to make the user experience better.

Further, referring to fig. 3, the coaxial packaged laser device 100 further includes a heat insulation ring 14, where the heat insulation ring 14 is detachably connected to the thermoelectric refrigerator 2 and is located on the periphery of the thermoelectric refrigerator 2.

In the present embodiment, the heat insulation ring 14 is disposed around the thermoelectric refrigerator 2, so as to prevent the thermoelectric refrigerator 2 from directly contacting the tube seat 1 around the thermoelectric refrigerator, and reduce the influence of heat exchange between the cooling surface of the thermoelectric refrigerator 2 and the tube seat 1 on the operation of the thermoelectric refrigerator 2, thereby improving the user experience.

Further, referring to fig. 2, the coaxial package laser device 100 further includes a backlight detection chip 15, where the backlight detection chip 15 is disposed on a side of the first heat sink transition block 3 close to the laser chip 5.

In this embodiment, the backlight monitoring chip is mainly used for receiving the light emitted from the back side of the laser chip 5, converting the light signal into an electrical signal, obtaining the backlight current of the laser chip 5, and feeding back the electrical signal to the control circuit. If the performance of the laser 17 on the laser chip 5 is weakened and the output optical power is low, the backlight current is weakened, the control circuit increases the driving current to increase the output power of the laser chip 5, and conversely, if the output power of the laser 17 is increased due to environmental changes, the backlight current is increased and is fed back to the control circuit to reduce the driving current and the output power of light, so that the light output by the laser 17 is ensured to have stable optical power, and the performance of the laser 17 chip can be judged according to the size of the backlight current, thereby promoting better user experience.

Further, referring to fig. 2, the coaxial package laser device 100 further includes a conductive wire 16, one side of the conductive wire 16 is fixedly connected to the laser chip 5, and the other side of the conductive wire 16 is fixedly connected to the pin 7 and is located on one side of the pin 7 close to the stem 1.

In this embodiment, the conductive wire 16 is a thin gold wire or a copper wire, so that the plurality of pins 7 are respectively connected with the laser chip 5, the thermistor 6 and the thermoelectric refrigerator 2, and compared with the conventional method of directly welding the pins 7, the heat dissipation efficiency and the stability of optical transmission power of the whole packaging device are improved, and the user experience is better.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A coaxial packaging laser device is characterized by comprising a tube seat, a thermoelectric refrigerator, a first heat sink transition block, a second heat sink transition block, a laser chip, a thermistor, a pin and a heat conducting piece;

2. The coaxial package laser device of claim 1,

3. The coaxial package laser device of claim 2,

the pipe cap is provided with a through hole, and the through hole is positioned on one side of the pipe cap, which is far away from the pipe seat.

4. The coaxial package laser device of claim 3,

5. The coaxial package laser device of claim 1,

6. The coaxial package laser device of claim 1,