CN111875242B - Cutting method for cutting substrate and cutting machine table - Google Patents
Cutting method for cutting substrate and cutting machine table Download PDFInfo
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- CN111875242B CN111875242B CN202010751259.5A CN202010751259A CN111875242B CN 111875242 B CN111875242 B CN 111875242B CN 202010751259 A CN202010751259 A CN 202010751259A CN 111875242 B CN111875242 B CN 111875242B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The application discloses a cutting method and a cutting machine table for cutting a substrate, wherein the cutting method comprises the following steps: placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table; adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine platform; after cutting, driving a second cutting machine table according to preset parameters to enable the second cutting machine table and the first cutting machine table to form a leading-off height difference; driving a second cutting machine to lead away from the first cutting machine so as to lead away the finished substrate obtained by cutting from the large substrate; conveying the finished base plate obtained by cutting to a specified position, and resetting the second cutting machine to an initial state; the second cutting machine table and the first cutting machine table are driven to form a leading-out height difference, so that the two substrates are subjected to splitting action, and the problem of abnormal quality caused by direct leading-out due to insufficient cutting penetration is solved.
Description
Technical Field
The present disclosure relates to the field of substrate manufacturing technologies, and in particular, to a cutting method and a cutting machine for cutting a substrate.
Background
The substrate manufacturing process mainly comprises the manufacturing of an array substrate and a color film substrate; sealing the array substrate and the color film substrate, and filling a liquid crystal material between the two substrates; the display module is integrally assembled to form a substrate module; after the array substrate and the color film substrate are sealed, the array substrate and the color film substrate are placed on a cutting machine table, and the sealed product needs to be cut and split.
In the process of cutting the splinters, after the splinters are cut by the cutter wheel, the large substrate of the cutting table is generally not thorough in splinter after cutting due to insufficient cutting permeation of the cutter wheel, and the circuit board at the cutting edge can be torn during leading-off, so that the quality of the substrate is abnormal.
Disclosure of Invention
The application aims to provide a cutting method and a cutting machine table for cutting a substrate, and the problem of abnormal quality caused by insufficient cutting penetration and direct leading-off is solved.
The application discloses a cutting method for cutting a substrate, comprising the following steps:
placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine platform;
after cutting, driving a second cutting machine table according to preset parameters to enable the second cutting machine table and the first cutting machine table to form a leading-off height difference;
driving a second cutting machine to lead away from the first cutting machine so as to lead away the finished substrate obtained by cutting from the large substrate; and
and conveying the finished base plate obtained by cutting to a specified position, and resetting the second cutting machine to an initial state.
Optionally, after the cutting is completed, the second cutting machine is driven according to preset parameters, so that the step of forming the leading-away height difference between the second cutting machine and the first cutting machine comprises:
after cutting, lifting one end of the second cutting machine table close to the first cutting machine table according to the angle parameter, so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle.
Optionally, the step of adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on the second cutting machine includes:
adjusting the cutting device to the cutting position of the substrate to be cut;
adjusting the height of one end, close to the first cutting machine, of the second cutting machine according to the first angle parameter, so that a cutting inclination angle is formed between the second cutting machine and the first cutting machine; and
and cutting the large substrate to be cut to obtain a finished substrate falling on the second cutting machine.
Optionally, the step of adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on the second cutting machine includes:
after cutting, adjusting the height of one end, close to the first cutting machine, of the second cutting machine according to the second angle parameter, so that the second cutting machine and the first cutting machine form a splitting inclination angle for splitting; and
and completing the splitting to obtain a finished substrate which falls on the second cutting machine and is subjected to the splitting.
Optionally, the cutting machine table includes a driving device for driving the second cutting machine table to tilt; the driving device comprises a Z-axis screw rod and a power module for driving the Z-axis screw rod to move, and the Z-axis screw rod is arranged on the lower side of the second cutting machine platform;
after the cutting is finished, the second cutting machine table is driven according to the angle parameter, so that the step of leading the second cutting machine table and the first cutting machine table to form a leading-off inclination angle comprises the following steps:
after cutting, the power module drives the Z-axis screw rod to move according to the angle parameters;
and the Z-axis screw rod drives and lifts the second cutting machine platform to move to be close to one end of the first cutting machine platform, so that the second cutting machine platform and the first cutting machine platform form a leading-off inclination angle.
Optionally, the cutting machine platform comprises a gripping device;
the step of carrying the finished product substrate obtained by cutting to a specified position and resetting the second cutting machine table comprises the following steps:
conveying the cut finished base plate to a designated position through a grabbing device;
the cutting machine resets the second cutting machine to the initial state;
wherein the leading-away inclination angle is matched with the grabbing angle of the grabbing device.
Optionally, the Z-axis lead screw contacts with the second cutting machine to form a contact point; the distance between the contact point and the end, close to the first cutting machine table, of the second cutting machine table is d1, and the distance between the contact point and the end, far away from the first cutting machine table, of the second cutting machine table is d 2; the d 1: d2 is 1: 3.
Optionally, a distance from one end of the second cutting machine platform far away from the first cutting machine platform to one end close to the first cutting machine platform is set as a;
after the cutting is finished, the step of driving the second cutting machine table according to the angle parameter so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle includes:
and driving to lift one end of the second cutting machine close to the first cutting machine according to the angle parameter, wherein the lifting height is one-thirty-one-ten-thousandth A to one-three-hundredth A, so that the second cutting machine and the first cutting machine form a leading-off inclination angle.
The application also discloses a cutting method for cutting a substrate, comprising the following steps:
placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
adjusting the cutting device to a cutting position of the substrate to be cut, which corresponds to the position between the first cutting machine table and the second cutting machine table;
the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the first angle parameter, so that the second cutting machine and the first cutting machine form a cutting inclination angle;
cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after cutting, the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the second angle parameter, so that the second cutting machine and the first cutting machine form a splitting inclination angle to split;
completing the splitting to obtain a finished substrate which is dropped on a second cutting machine and is split;
the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the third angle parameter, so that the second cutting machine and the first cutting machine form a leading-off inclination angle; and
and carrying the finished base plate obtained by cutting to a specified position through the grabbing device, and resetting the second cutting machine to the initial state by the cutting machine.
The application also discloses a cutting machine table, which comprises a first cutting machine table, a second cutting machine table, a driving device, a cutting device and a grabbing device, wherein the second cutting machine table and the first cutting machine table are arranged in alignment, the first cutting machine table and the second cutting machine table are used for placing a substrate to be cut, the second cutting machine table and the first cutting machine table are horizontally aligned in an initial state, the driving device comprises a Z-axis lead screw and a power module, the Z-axis lead screw is arranged below one end, close to the first cutting machine table, of the second cutting machine table, the power module drives the Z-axis lead screw to adjust the height of one end, close to the first cutting machine table, of the second cutting machine table, and the cutting device is used for cutting the large substrate to be cut so as to obtain a finished product substrate; and the grabbing device conveys the cut finished base plate to a specified position through the grabbing device.
After cutting is finished, directly and horizontally moving the second cutting machine platform to lead away the first cutting machine platform and conveying the first cutting machine platform to a specified position through the grabbing device; this application is after the cutting is accomplished, according to the preset parameter adjustment, drive lifting second cutting board, make first cutting board and second cutting board form and draw from the difference in height, it is unusual, draw from the big base plate that the difference in height made first cutting board bench, form the difference in height each other with the finished product base plate that breaks away from big base plate and falls on the second cutting board, the difference in height just can avoid the inter contact between the base plate, carry out the lobe of a leaf action this moment, make the lobe of a leaf of cutting position more thorough, improve the problem that the quality that cutting device infiltration is not enough and directly draws from the quality anomaly that brings, promote finished product base plate quality.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a diagram illustrating a substrate cutting process performed by a cutting machine.
Fig. 2 is a flowchart of a method of cutting a substrate according to an embodiment of the present application;
FIG. 3 is a flow chart of a method of cutting a substrate according to another embodiment of the present application;
FIG. 4 is a flowchart of a method for cutting a substrate according to yet another embodiment of the present application;
FIG. 5 is a flowchart of a method of a dicing method for dicing a substrate according to yet another embodiment of the present application;
FIG. 6 is a flow chart of a cutting step in the cutting method according to an embodiment of the present application;
FIG. 7 is a flow chart of a breaking step in the cutting method according to an embodiment of the present application;
FIG. 8 is a flow chart of the cutting and breaking steps in the cutting method of one embodiment of the present application;
fig. 9 is a flowchart of a method of a dicing method for dicing a substrate according to yet another embodiment of the present application;
FIG. 10 is a schematic block diagram of a cutting machine according to another embodiment of the present disclosure;
fig. 11 is a cross-sectional view of a cutting machine according to another embodiment of the present application.
100, cutting machine table; 110. a first cutting machine table; 120. a second cutting machine table; 130. a substrate; 140. a drive device; 141. a Z-axis lead screw; 142. a power module; 150. a cutting device; 160. and (4) a grabbing device.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Fig. 1 is a diagram illustrating a cutting process of a conventional and undisclosed cut substrate 130, wherein a fixing structure (not shown) for fixing a large substrate 130 to be cut is correspondingly disposed on a first cutting machine 110, and when the large substrate to be cut is transported to the cutting machine 100 and correspondingly placed on the first cutting machine 110 and a second cutting machine 120, a cutting device 150 is pressed down to cut the large substrate 130, so as to obtain a finished substrate 130 on the second cutting machine 120, where the finished substrate 130 includes two layers of glass substrates, and after the cutting is completed, an upper layer of the glass substrate of the finished substrate on the second cutting machine 120 generally protrudes relative to a lower layer of the glass substrate.
The inventors have found that if the second cutting machine 120 is directly moved horizontally to be taken away from the first cutting machine 110 and transported to a designated position by the grabbing device 160, the finished substrate 130 may be partially adhered to the main body of the large substrate due to insufficient penetration during cutting, and the problems of incomplete breaking, even breakdown, and abnormal quality of the finished substrate may occur. Specifically, if the first cutting machine 110 and the second cutting machine 120 perform cutting in a flat state, the large substrate is cut in the flat state, the knife pressure range is small, and the fault tolerance rate is low. In addition, the lower side surface of the upper glass substrate is generally provided with metal wiring structures, and the metal wiring structures are horizontally separated from each other, which may cause the metal wiring structures near one end of the first cutting machine 110 to be subjected to an acting force, thereby causing problems such as wire breakage and scratching.
The inventor improves the method, and the improvement scheme is as follows:
the present application is described in detail below with reference to the figures and alternative embodiments.
Fig. 2 is a flowchart of a method of a cutting method for cutting a substrate according to an embodiment of the present application, and discloses a cutting method for cutting a substrate, including the steps of:
s1: placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
s2: adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine platform;
s3: after cutting, driving a second cutting machine table according to preset parameters to enable the second cutting machine table and the first cutting machine table to form a leading-off height difference;
s4: driving a second cutting machine to lead away from the first cutting machine so as to lead away the finished substrate obtained by cutting from the large substrate;
s5: and conveying the finished base plate obtained by cutting to a specified position, and resetting the second cutting machine to an initial state.
After the cutting is finished, the second cutting machine 120 is directly moved horizontally to be led away from the first cutting machine 110 and conveyed to the designated position through the gripping device; after the cutting is completed, according to preset parameter adjustment, the second cutting machine table 120 is driven to lift, so that the first cutting machine table 110 and the second cutting machine table 120 form a leading-away height difference, particularly, the leading-away height difference enables a large substrate on the first cutting machine table 110 to form a height difference with a finished substrate 130 separated from the large substrate 130 and falling on the second cutting machine table 120, and the height difference is formed between the finished substrate 130 and the finished substrate 130, so that the splitting action is performed, the splitting at the cutting position is more thorough, the problems of abnormal quality and the like caused by insufficient penetration and direct leading-away of the cutting device 150 are solved, and the quality of the finished substrate 130 is improved.
Specifically, the preset parameter is a parameter for lifting the height of the second cutting machine, the preset parameter can be adjusted according to different properties and models of the cutting substrate, and the leading-away height difference is formed in other ways: the one end of second cutting board is lifted, certainly also can be with the whole lifting of second cutting board, specifically as follows:
fig. 3 is a flowchart of a method of a cutting method for cutting a substrate, and referring to fig. 3 in conjunction with fig. 2, in particular, the step S3 includes a process of:
and S31, after the cutting is finished, lifting one end of the second cutting machine close to the first cutting machine according to the angle parameter, so that the second cutting machine and the first cutting machine form a leading-off inclined angle.
The preset parameters include angle parameters, the setting of the angle parameters is equivalent to the setting of a leading-off inclination angle, specifically, one end of the second cutting machine table 120 close to the first cutting machine table 110 is lifted, so that the problem of insufficient cutting penetration is thoroughly improved due to the existence of the leading-off inclination angle by splitting the glass substrate between the finished product substrate 130 and the large substrate 130, and the metal wires on the surfaces of the two substrates can be separated in advance, so that when the second cutting machine table 120 is led off from the first cutting machine table 110, the problems of scraping damage and the like caused by the direct horizontal leading-off of the metal wires can be solved.
Of course, the lead-away height difference is formed by other methods, and the step of S3 includes:
after the cutting is finished, the two ends of the second cutting machine table are lifted integrally according to the preset angle parameter to form a leading-away height difference.
The second cutting machine 120 is integrally lifted, and the height difference is integrally led away, so that the finished substrate 130 is cracked more thoroughly, and the yield of the finished substrate 130 is improved.
Fig. 4 is a flowchart of a method of a cutting method for cutting a substrate, wherein the flowchart shown in fig. 4 is one of the methods of forming a lead-off tilt angle in the flowchart of fig. 3, and specifically, the cutting machine includes a driving device for driving the second cutting machine to tilt; the driving device comprises a Z-axis screw rod and a power module for driving the Z-axis screw rod to move, and the Z-axis screw rod is arranged on the lower side of the second cutting machine platform;
the step of S31 includes:
s311, after cutting, the power module drives the Z-axis screw rod to move according to the angle parameters;
s312: the Z-axis screw rod drives the second cutting machine platform to move, so that the second cutting machine platform and the first cutting machine platform form a leading-off inclination angle.
The Z-axis screw rod is in contact with the second cutting machine table to form a contact point;
the distance between the contact point and the end of the second cutting machine 120 close to the first cutting machine 110 is d1, and the distance between the contact point and the end of the second cutting machine 120 far away from the first cutting machine 110 is d 2; the d 1: d2 is 1: 3. The Z-axis lead screw 141 is driven by the power module 142 to move upward or downward from the lower portion of the second cutting machine 120, so that according to a preset angle parameter, one end of the second cutting machine 120 close to the first cutting machine 110 can be driven to be lifted, so that a required leading-off angle difference is formed between the second cutting machine 120 and the first cutting machine 110, and subsequent leading-off operation is facilitated; and since d 1: d2 is 1:3, which can lift the second cutting machine 120 near the first cutting machine 110, and leave enough space for the tool post and the residue removing mechanism and residue material.
In addition, because these factors of different product characteristics (glass size, thickness, material, glass terminal width, even different cutter types for cutting) all influence the degree of splitting, therefore, power module 142 drive can set up different leading-off inclination angles according to the big base plate of waiting to cut of different sizes, simultaneously, to a big base plate 130, if the leading-off inclination angle effect of once adjusting is not too good, can adjust the leading-off inclination angle repeatedly, to the leading-off angle that accords with various conditions.
FIG. 5 is a method flow diagram of a cutting method for cutting a substrate; specifically, as shown in fig. 5, the cutting machine includes a gripping device;
the step of carrying the finished base plate obtained by cutting to a specified position and resetting the second cutting machine table comprises the following steps:
s51: conveying the finished base plate obtained by cutting to a designated position through the grabbing device, and resetting the second cutting machine to an initial state by the cutting machine;
wherein the leading-away inclination angle is matched with the grabbing angle of the grabbing device. The grabbing device 160 may include a robot arm, etc., and the driving device drives the second cutting machine 120 to form a preset leading-off inclination angle; after the leading-off, the robot arm takes the wafer and is influenced by the horizontal degree of the glass substrate, so the wafer outlet angle meets the horizontal requirement of taking the wafer by the arm, the leading-off inclination angle is set to be matched with the grabbing angle of the grabbing device, the problem of insufficient wafer cracking can be solved, meanwhile, the direct adjustment of the grabbing angle is avoided, the extra cost of the grabbing device is greatly saved, the problem that the grabbing angle needs to be adjusted for many times when the large substrates 130 with different sizes are grabbed or the finished substrates 130 are directly grabbed is solved, the grabbing angle of the grabbing device 160 does not need to be adjusted when the grabbing device 160 grabs the large substrates with different sizes, and the production efficiency is improved; then, the cutting machine 100 resets the second cutting machine to the initial state to facilitate the subsequent cutting operation.
Fig. 6 is a flowchart of a cutting step in a cutting method according to an embodiment of the present application, and referring to fig. 6 in combination with fig. 2 and 3, in order to better improve the problem of insufficient cutting penetration, the present application further discloses that the step of S2 may include:
s21, adjusting the cutting device to the cutting position of the substrate to be cut;
s22, driving a second cutting machine according to the first angle parameter to form a cutting inclination angle between the second cutting machine and the first cutting machine;
and S23, cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine.
The angle parameters comprise a first angle parameter, specifically, the height of one end, close to the first cutting machine, of the second cutting machine is adjusted, for example, the length of the second cutting machine is 300000um, the first angle parameter is an angle for increasing the cutting inclination angle formed by one end, close to the first cutting machine, of the second cutting machine before cutting, and the specific lifting height range is 1um to 500 um; the cutting machine is characterized in that a preset cutting inclination angle is set before cutting, so that the part of the large substrate 130 to be cut, which is positioned above the second cutting machine table 120, can slightly break away from the surface of the machine table due to the cutting inclination angle, and a certain downward self-gravity exists in the part of the large substrate to be cut, which is positioned above the second cutting machine table 120, so that the cutting wheel and the cutting wheel are labor-saving during cutting, the cutting penetration is thorough, the adhesion and other problems are reduced, a good splitting basis is provided for subsequent leading-off operation, partial risks are avoided in advance, and the production efficiency is improved.
Fig. 7 is a flowchart of a cutting step in the cutting method according to an embodiment of the present application, and referring to fig. 7 in combination with fig. 2 and 3, in order to make the splinter more complete, the following scheme may be further adopted, and the step of S2 may further include:
s211, adjusting the cutting device to the cutting position of the substrate to be cut;
s221, cutting the large substrate to be cut;
s231, after cutting, driving the second cutting machine platform and the first cutting machine platform to form a splitting inclination angle according to the second angle parameter so as to split;
and S241, completing the splitting to obtain a finished product substrate falling on a second cutting machine.
The angle parameters further include a second angle parameter, and the second angle parameter is an angle for lifting the second cutting machine table to form a splinter inclination angle near one end of the first cutting machine table in the splinter stage, specifically, taking the length of the second cutting machine table as 300000um as an example, the lifting height range is 300um to 500 um; that is, the splinter inclination angle makes the large substrate on the first cutting machine platform and the finished substrate 130 on the second cutting machine platform 120 have the dead weight and other factors brought by the splinter inclination angle at the cutting position, so as to bring extra splinter effect, and improve the problem of insufficient cutting penetration in the cutting stage.
Fig. 8 is a flowchart of the cutting and splitting steps in the cutting method according to an embodiment of the present application, and fig. 8 shows a further modification of fig. 6 and 7, and specifically, the step of S2 includes:
s201, adjusting the cutting device to the cutting position of the substrate to be cut;
s202, driving a second cutting machine according to the first angle parameter to enable the second cutting machine and the first cutting machine to form a cutting inclination angle so as to split the wafer;
s203, cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine;
s204, after cutting, driving a second cutting machine table and a first cutting machine table to form a lobe inclined angle according to a second angle parameter;
s205, completing the splitting to obtain a finished substrate which is dropped on the second cutting machine and is split.
Before cutting, the second cutting machine 120 and the first cutting machine 110 are driven to form a cutting inclination angle to improve the problem of insufficient cutting penetration, and after the cutting is completed, the second cutting machine 120 and the first cutting machine 110 are driven to form a splitting inclination angle, so that an additional splitting effect occurs between the two substrates 130, and the problem of insufficient splitting is improved.
Specifically, the distance from one end of the second cutting machine platform far away from the first cutting machine platform to one end close to the first cutting machine platform is set as A;
after the cutting is finished, the step of driving the second cutting machine table according to the angle parameter so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle includes:
driving to lift one end of the second cutting machine 120 close to the first cutting machine 110 according to the angle parameter, wherein the lifting height is one-thirty-one-ten-thousandth A to three-hundredth A, so that the second cutting machine 120 and the first cutting machine 110 form a leading-off inclination angle; taking a 300000um as an example, the lift height is 30um to 1000um to form a lift-off angle, and the specific lift height can be adaptively adjusted according to the size and material of the large substrate 130 to be cut.
Fig. 9 is a flowchart of a method of a cutting method for cutting a substrate according to yet another embodiment, and as shown in fig. 9, a cutting method for cutting a substrate is disclosed as another embodiment of the present application; the method comprises the following steps:
s1, placing the large substrate to be cut on a first cutting machine table and a second cutting machine table of the cutting machine table;
s2, adjusting the cutting device to the cutting position of the substrate to be cut between the first cutting machine and the second cutting machine;
s3, the power module drives the Z-axis screw rod to lift one end of the second cutting machine table close to the first cutting machine table according to the first angle parameter, so that the second cutting machine table and the first cutting machine table form a cutting inclination angle;
s4, cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine; after cutting, the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the second angle parameter, so that the second cutting machine and the first cutting machine form a splitting inclination angle to split;
s5, completing the splitting to obtain a finished substrate which falls on a second cutting machine and is split;
s6, the power module drives the Z-axis screw rod to lift one end of the second cutting machine table close to the first cutting machine table according to the third angle parameter, so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle; and
and S7, conveying the cut finished base plate to a specified position through the grabbing device, and resetting the second cutting machine to the initial state by the cutting machine.
Wherein the cutting inclination angle is smaller than the lobe inclination angle and the lead-away inclination angle;
the Z-axis wire 141 contacts the second cutting platform 120 to form a contact point; the contact point is at a distance d1 from the end of the second cutting platform 120 near the first cutting platform 110, and the contact point is at a distance d2 from the end of the second cutting platform 120 away from the first cutting platform 110; then the d 1: d2 ═ 1: 3.
the angle parameters further include a third angle parameter, for example, when the length of the second cutting machine 120 is 300000um, the first angle parameter is an angle for raising the cutting angle formed by the second cutting machine 120 close to one end of the first cutting machine before cutting, and the specific raising height range is 1um to 500 um; the second angle parameter is an angle for lifting one end of the second cutting machine 120 close to the first cutting machine 110 to form a splinter inclination angle in the splinter stage, and specifically, the lifting height range is 300um to 500 um; similarly, when the third angle parameter drives the second cutting machine 120 to be far away from the first cutting machine 110, the end of the second cutting machine 120 close to the first cutting machine 110 is lifted to form an angle leading away from the inclination angle, specifically, the lifting height range is 500um-1000 um. Of course, when the second cutting machine 120 is different and the material and the thickness of the substrate are different, the specific lifting height may be adjusted according to the actual situation. Within the scope of this invention, the term "about" is intended to include all such modifications. Before cutting, the second cutting machine 120 and the first cutting machine 110 are driven to form a cutting inclination angle to improve the problem of insufficient cutting penetration, and after cutting, the second cutting machine 120 and the first cutting machine 110 are driven to form a crack inclination angle, so that an additional crack effect occurs between the two substrates to improve the problem of insufficient cracks, and then, the second cutting machine 120 and the first cutting machine 110 are driven to form a leading-off inclination angle, so that additional splintering occurs between the two substrates again to make splintering more complete, meanwhile, the leading-out inclination angle is adjusted to be matched with the grabbing angle of the grabbing device, the specific cutting inclination angle is smaller than the splinter inclination angle and the leading-out inclination angle, meanwhile, the substrate is easier to cut, and the substrate falling on the second cutting machine 120 after cutting cannot be scratched instantaneously due to the inclination of a large angle, so that the quality is improved.
Fig. 10 is a schematic block diagram of a cutting machine according to another embodiment of the present application, and fig. 11 is a cross-sectional view of the cutting machine according to another embodiment of the present application, which discloses a cutting machine for a cutting method of a cutting machine plate according to another embodiment of the present application, where the cutting machine 100 includes: the cutting machine comprises a first cutting machine table 110, a second cutting machine table 120, a driving device 140, a cutting device 150 and a grabbing device 160, wherein the second cutting machine table 120 is aligned with the first cutting machine table 110, the first cutting machine table 110 and the second cutting machine table 120 are used for placing a substrate 130 to be cut, in an initial state, the second cutting machine table 120 is horizontally aligned with the first cutting machine table 110, the driving device 140 comprises a Z-axis lead screw 141 and a power module 142, the Z-axis lead screw 141 is arranged below one end, close to the first cutting machine table 120, of the second cutting machine table 120, the power module 142 drives the Z-axis lead screw 141 to adjust the height of one end, close to the first cutting machine table 110, of the second cutting machine table 120, and the cutting device 150 is used for cutting the large substrate 130 to be cut to obtain a finished substrate 130; and a gripper 160 for conveying the cut product substrate 130 to a predetermined position by the gripper 160. Wherein, the power module 142 includes a servo motor and the like; in addition, two Z-axis screws 141 may be symmetrically disposed on two sides of one end of the second cutting machine 120 close to the first cutting machine 110, and the two Z-axis screws 141 are lifted synchronously to ensure balanced and uniform lifting. The one end that the second cutting machine platform 120 kept away from first cutting machine platform 110 can set up the dog, the setting of dog for even when Z axle lead screw 141 is too high because the one end lift that error, trouble or bad operation etc. are close to first cutting machine platform 110 with second cutting machine platform 120, also be unlikely to fall the emergence of the condition such as damage.
It should be noted that, on the premise of not affecting the implementation of the specific embodiment, the limitations of the steps involved in the present solution are not considered to limit the order of the steps, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously; different embodiments may be combined and applied as long as they are not mutually conflicting, and the embodiments should be regarded as belonging to the protection scope of the present application as long as they can implement the present solution.
The technical solution of the present application can be widely applied to various display panels, such as TN (twisted nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (organic light-Emitting Diode) display panel, and the above solution can be applied.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (9)
1. A cutting method for cutting a substrate, comprising the steps of:
placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine platform;
after cutting, lifting one end of the second cutting machine table close to the first cutting machine table according to the angle parameter, so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle;
driving a second cutting machine to lead away from the first cutting machine so as to lead away the finished substrate obtained by cutting from the large substrate; and
conveying the finished base plate obtained by cutting to a specified position, and resetting the second cutting machine to an initial state;
the two cutting devices are respectively arranged above and below the large substrate to be cut, and the cutting device positioned above is close to the first cutting machine table; the lower cutting device is close to the second cutting machine table; the split section of the large substrate to be cut is a step surface.
2. The method according to claim 1, wherein the step of adjusting the cutting device to the cutting position of the substrate to be cut comprises the steps of:
adjusting the cutting device to the cutting position of the substrate to be cut;
adjusting the height of one end, close to the first cutting machine, of the second cutting machine according to the first angle parameter, so that a cutting inclination angle is formed between the second cutting machine and the first cutting machine; and
and cutting the large substrate to be cut to obtain a finished substrate falling on the second cutting machine.
3. The method according to any one of claims 1 to 2, wherein the step of adjusting the cutting device to the cutting position of the substrate to be cut, and cutting the large substrate to be cut to obtain a finished substrate on the second cutting machine further comprises:
after cutting, adjusting the height of one end, close to the first cutting machine, of the second cutting machine according to the second angle parameter, so that the second cutting machine and the first cutting machine form a splitting inclination angle for splitting; and
and completing the splitting to obtain a finished substrate which falls on the second cutting machine and is subjected to the splitting.
4. The method as claimed in claim 1, wherein the cutting machine comprises a driving device for driving the second cutting machine to tilt; the driving device comprises a Z-axis screw rod and a power module for driving the Z-axis screw rod to move, and the Z-axis screw rod is arranged on the lower side of the second cutting machine platform;
after the cutting is finished, the second cutting machine table is driven according to the angle parameter, so that the step of leading the second cutting machine table and the first cutting machine table to form a leading-off inclination angle comprises the following steps:
after cutting, the power module drives the Z-axis screw rod to move according to the angle parameters;
and the Z-axis screw rod drives and lifts one end of the second cutting machine table close to the first cutting machine table, so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle.
5. The method of claim 4, wherein the cutting table comprises a gripping device;
the step of carrying the finished substrate obtained by cutting to a specified position and resetting the second cutting machine to the initial state comprises the following steps:
conveying the cut finished base plate to a designated position through a grabbing device;
the cutting machine resets the second cutting machine to the initial state;
wherein the leading-away inclination angle is matched with the grabbing angle of the grabbing device.
6. The cutting method for cutting a substrate according to claim 4, wherein the Z-axis lead screw contacts with the second cutting machine to form a contact point;
the distance between the contact point and one end, close to the first cutting machine table, of the second cutting machine table is d1, and the distance between the contact point and one end, far away from the first cutting machine table, of the second cutting machine table is d 2;
the d 1: d2=1: 3.
7. The method as claimed in claim 2, wherein a distance between an end of the second cutting machine far from the first cutting machine and an end of the second cutting machine close to the first cutting machine is a;
after the cutting is finished, the step of driving the second cutting machine table according to the angle parameter so that the second cutting machine table and the first cutting machine table form a leading-off inclination angle includes:
and driving to lift one end of the second cutting machine close to the first cutting machine according to the angle parameter, wherein the lifting height is one-thirty-one-ten-thousandth A to one-three-hundredth A, so that the second cutting machine and the first cutting machine form a leading-off inclination angle.
8. A cutting method for cutting a substrate, comprising the steps of:
placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
adjusting the cutting device to a cutting position of the substrate to be cut, which corresponds to the position between the first cutting machine table and the second cutting machine table;
the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the first angle parameter, so that the second cutting machine and the first cutting machine form a cutting inclination angle;
cutting the large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after cutting, the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the second angle parameter, so that the second cutting machine and the first cutting machine form a splitting inclination angle to split;
completing the splitting to obtain a finished substrate which is dropped on a second cutting machine and is split;
the power module drives the Z-axis screw rod to lift one end, close to the first cutting machine, of the second cutting machine according to the third angle parameter, so that the second cutting machine and the first cutting machine form a leading-off inclination angle; and
conveying the finished base plate obtained by cutting to a specified position through a grabbing device, and resetting the second cutting machine to an initial state by the cutting machine;
the two cutting devices are respectively arranged above and below the large substrate to be cut, and the cutting device positioned above is close to the first cutting machine table; the lower cutting device is close to the second cutting machine table; the split section of the large substrate to be cut is a step surface.
9. A cutting machine table for using the cutting method for cutting a substrate according to any one of claims 1 to 8, comprising:
a first cutting machine table for cutting the workpiece,
the second cutting machine platform is aligned with the first cutting machine platform, and the first cutting machine platform and the second cutting machine platform are used for placing a substrate to be cut; in an initial state, the second cutting machine table is horizontally aligned with the first cutting machine table;
the driving device comprises a Z-axis screw rod and a power module, the Z-axis screw rod is arranged below one end, close to the first cutting machine table, of the second cutting machine table, and the power module drives the Z-axis screw rod to adjust the height of one end, close to the first cutting machine table, of the second cutting machine table;
the cutting device is used for cutting the large substrate to be cut so as to obtain a finished substrate; and
and the grabbing device is used for conveying the cut finished base plate to a specified position.
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| CN202010751259.5A CN111875242B (en) | 2020-07-30 | 2020-07-30 | Cutting method for cutting substrate and cutting machine table |
| US17/210,525 US11731895B2 (en) | 2020-07-30 | 2021-03-24 | Cutting method and cutting machine table for cutting substrate |
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| CN202010751259.5A CN111875242B (en) | 2020-07-30 | 2020-07-30 | Cutting method for cutting substrate and cutting machine table |
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| CN111875242B true CN111875242B (en) | 2021-10-08 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050052070A (en) * | 2003-11-29 | 2005-06-02 | 삼성에스디아이 주식회사 | Method and apparatus for cutting scribed glass plate |
| CN101415648A (en) * | 2006-03-24 | 2009-04-22 | 凯恩株式会社 | Glass cutting apparatus with bending member and method for cutting glass using thereof |
| CN201473449U (en) * | 2009-09-03 | 2010-05-19 | 北京京东方光电科技有限公司 | Liquid crystal glass substrate cutting device |
| CN103288342A (en) * | 2013-06-04 | 2013-09-11 | 深圳市华星光电技术有限公司 | Glass substrate cutting system |
| CN203930277U (en) * | 2014-06-30 | 2014-11-05 | 成都京东方光电科技有限公司 | Display panel sliver apparatus |
| CN204265634U (en) * | 2014-11-14 | 2015-04-15 | 中环高科（天津）股份有限公司 | A kind of table top of glass tiltable sliver |
| CN105988236A (en) * | 2015-03-16 | 2016-10-05 | 塔工程有限公司 | Breaking system for attached substrate |
| CN106467356A (en) * | 2015-08-19 | 2017-03-01 | 上海和辉光电有限公司 | A kind of cutting machine of display floater and cutting method |
| JP2018069536A (en) * | 2016-10-27 | 2018-05-10 | 三星ダイヤモンド工業株式会社 | Scribe device and scribe method |
| CN210199441U (en) * | 2019-07-26 | 2020-03-27 | 咸阳彩虹光电科技有限公司 | Lobe of a leaf device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT403688B (en) * | 1992-11-02 | 1998-04-27 | Lisec Peter | METHOD AND DEVICE FOR CUTTING COMPOSITE GLASS |
| US5927582A (en) * | 1997-08-05 | 1999-07-27 | Duecker; Peter | Separator for stacked corrugated board |
| JP3471664B2 (en) * | 1999-07-08 | 2003-12-02 | Ｎｅｃ液晶テクノロジー株式会社 | Cutting device for bonded substrates for liquid crystal cells |
| KR100623970B1 (en) * | 1999-11-22 | 2006-09-13 | 삼성전자주식회사 | Laser cutting equipment and method for cutting the same |
| WO2002057192A1 (en) * | 2001-01-17 | 2002-07-25 | Mitsuboshi Diamond Industrial Co., Ltd. | Separator and separating system |
| TWI226877B (en) * | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
| JP2010001160A (en) * | 2006-10-16 | 2010-01-07 | Panasonic Corp | Glass cutting method and its apparatus |
| JP3194224U (en) * | 2014-07-17 | 2014-11-13 | 株式会社シライテック | Panel splitting device |
| JP3202191U (en) * | 2015-11-06 | 2016-01-21 | 株式会社シライテック | LCD panel folding device |
| CN207671919U (en) * | 2017-11-14 | 2018-07-31 | 湖北宇创通电子科技有限公司 | Cutting splitting platform for LED screen processing |
| CN109081571A (en) * | 2018-07-26 | 2018-12-25 | 深圳市华星光电半导体显示技术有限公司 | A kind of cutter device of substrate |
-
2020
- 2020-07-30 CN CN202010751259.5A patent/CN111875242B/en active Active
-
2021
- 2021-03-24 US US17/210,525 patent/US11731895B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050052070A (en) * | 2003-11-29 | 2005-06-02 | 삼성에스디아이 주식회사 | Method and apparatus for cutting scribed glass plate |
| CN101415648A (en) * | 2006-03-24 | 2009-04-22 | 凯恩株式会社 | Glass cutting apparatus with bending member and method for cutting glass using thereof |
| CN201473449U (en) * | 2009-09-03 | 2010-05-19 | 北京京东方光电科技有限公司 | Liquid crystal glass substrate cutting device |
| CN103288342A (en) * | 2013-06-04 | 2013-09-11 | 深圳市华星光电技术有限公司 | Glass substrate cutting system |
| CN203930277U (en) * | 2014-06-30 | 2014-11-05 | 成都京东方光电科技有限公司 | Display panel sliver apparatus |
| CN204265634U (en) * | 2014-11-14 | 2015-04-15 | 中环高科（天津）股份有限公司 | A kind of table top of glass tiltable sliver |
| CN105988236A (en) * | 2015-03-16 | 2016-10-05 | 塔工程有限公司 | Breaking system for attached substrate |
| CN106467356A (en) * | 2015-08-19 | 2017-03-01 | 上海和辉光电有限公司 | A kind of cutting machine of display floater and cutting method |
| JP2018069536A (en) * | 2016-10-27 | 2018-05-10 | 三星ダイヤモンド工業株式会社 | Scribe device and scribe method |
| CN210199441U (en) * | 2019-07-26 | 2020-03-27 | 咸阳彩虹光电科技有限公司 | Lobe of a leaf device |
Also Published As
| Publication number | Publication date |
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| US11731895B2 (en) | 2023-08-22 |
| US20220033293A1 (en) | 2022-02-03 |
| CN111875242A (en) | 2020-11-03 |
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