CN111867255B - Manufacturing method of PCB with horizontally segmented metalized side wall for display screen - Google Patents

Manufacturing method of PCB with horizontally segmented metalized side wall for display screen Download PDF

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Publication number
CN111867255B
CN111867255B CN202010645649.4A CN202010645649A CN111867255B CN 111867255 B CN111867255 B CN 111867255B CN 202010645649 A CN202010645649 A CN 202010645649A CN 111867255 B CN111867255 B CN 111867255B
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layer
segmentation
manufacturing
side wall
design
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CN111867255A (en
Inventor
蒋华
张亚锋
朱雪晴
谢易松
张永谋
叶锦群
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Victory Giant Technology Huizhou Co Ltd
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Victory Giant Technology Huizhou Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention relates to a manufacturing method of a PCB (printed Circuit Board) with a metallized side wall for a display screen, which comprises the steps of manufacturing substrates, selecting 2 manufactured substrates after the substrates are manufactured, arranging a segmentation layer for manufacturing a horizontal segmentation groove between the 2 substrates, and pressing the segmentation layer together with an upper substrate and a lower substrate. The manufacturing method of the PCB with the horizontally segmented metalized side wall for the display screen has the advantages of high production efficiency, good quality and the like.

Description

Manufacturing method of PCB with horizontally segmented metalized side wall for display screen
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a PCB with horizontally segmented metalized side walls for a display screen.
Background
LEDs are widely used in stadiums, cities and public squares, traffic, corporate image promotions, commercials, and other applications. Because the stadium has long watching distance and high ambient brightness, only the LED display screen can meet the special requirement, thereby ensuring that the spectators obtain clear and vivid color images and bringing infinite visual enjoyment for the spectators. The precision requirement of PCB is higher and higher, converts former face lamp pearl board into board lateral wall lamp pearl board. The traditional panel lamp bead board is manufactured by adopting a traditional depth control gong, and the copper gong on the side wall of the panel lamp bead board is removed in a conventional gong mode, so that the vertical segmentation of the side wall is realized; the existing side wall lamp bead plate cannot be produced by a conventional production mode of routing or drilling, and the requirements on quality and manufacturing process are difficult, so that the production flow needs to be changed to meet the requirements of customers.
Disclosure of Invention
Therefore, the applicant provides a manufacturing method of the PCB with the metalized side wall horizontally segmented for the display screen, which has high production efficiency and good product quality.
In order to achieve the above purpose, the following technical solutions are provided.
A manufacturing method of a PCB with a metallized side wall horizontal segmentation for a display screen comprises the steps of manufacturing substrates, selecting 2 manufactured substrates after the substrates are manufactured, arranging a segmentation layer used for manufacturing a horizontal segmentation groove between the 2 substrates, and pressing the segmentation layer together with an upper substrate and a lower substrate. The arrangement of the segmentation layers between the upper substrate and the lower substrate is used for manufacturing a side wall groove so as to realize horizontal segmentation of the side wall, specifically, the manufacturing of the segmentation layers comprises drilling and forming slotting, the forming slotting is positioned at one side of the segmentation layers, and after the slotting of the segmentation layers, the segmentation layers are pressed together with the upper substrate and the lower substrate to form the horizontal segmentation groove together with the upper substrate and the lower substrate. The forming and slotting of the segmentation layer are convenient to manufacture, the efficiency is high, and the manufacturing efficiency of the PCB manufacturing method for the metallized side wall horizontal segmentation of the display screen is effectively ensured.
Further, the substrate is a double-sided board, and the double-sided board is obtained by cutting materials, drilling PTH holes and manufacturing circuits according to conventional procedures. The double-sided board is adopted as the substrate, and the double-sided board is manufactured by multiple pressing relative to the single-sided boards, so that the manufacturing process of the substrate is greatly simplified, and the manufacturing efficiency is improved.
Further, the segmented layer comprises a segmented core layer having a thickness of 0.8 mm. The segmented core layer comprises a first light plate layer, a first PP layer and a second PP layer, wherein the first PP layer and the second PP layer are respectively located on the upper side and the lower side of the first light plate layer, one side of the segmented core layer is provided with a notch, and the notch and the upper substrate and the lower substrate form a segmented groove together. The thickness of first unthreaded board layer is 0.7mm, the thickness of first PP layer and second PP layer is 0.05 mm. Namely, the groove width of the segmentation groove is 0.8mm, the segmentation groove is positioned on the side wall of the segmentation layer, and after the segmentation layer is pressed with the upper substrate and the lower substrate, the horizontal segmentation groove of the side wall is formed, so that the product is segmented from top to bottom on the side wall, and the requirement of the horizontal segmentation of the product is well met. The first optical plate layer is arranged to ensure the manufacture of the segmented groove on one hand, and effectively ensure the conduction of the circuits of the upper substrate and the lower substrate on the other hand, and the first optical plate layer and the upper substrate and the lower substrate are bonded together when the first PP layer and the second PP layer are arranged.
Further, the segmentation layer is still including being located upper protective layer and the lower protective layer about the segmentation sandwich layer, the upper protective layer upwards is equipped with second polished finish board layer and third PP layer from the segmentation sandwich layer in proper order, the lower protective layer is equipped with third polished finish board layer and fourth PP layer from the segmentation sandwich layer downwards in proper order. The thickness of the second optical plate layer and the third optical plate layer is 0.17 mm. The thickness of the third PP layer and the thickness of the fourth PP layer are both 0.05 mm. The upper protective layer and the lower protective layer are arranged, the light plates in the upper protective layer and the lower protective layer are connected with the segmentation core layer, the PP layer is connected with the upper substrate and the lower substrate, on one hand, metallization of the segmentation groove is effectively guaranteed, on the other hand, the segmentation core layer, the upper substrate and the lower substrate are effectively protected, and mutual interference influence cannot occur when the segmentation core layer, the upper substrate and the lower substrate are connected with each other.
Furthermore, the first PP layer, the second PP layer, the third PP layer and the fourth PP layer are all non-gummosis PP, and the non-gummosis PP is selected for grooving production, so that the gummosis amount is small, the control is easy, and the problem that the gummosis of the side wall position after lamination cannot be guaranteed due to large gummosis amount of common PP is effectively solved.
Further, the manufacturing method of the PCB with the metallized side walls horizontally segmented for the display screen further comprises a windowing design, wherein the windowing design comprises a substrate windowing design, a PP (polypropylene) layer windowing design and a light panel windowing design, the substrate windowing design is to window at the side wall position, the side wall metallization position is gonged out by using a gong machine, and the gong positions of L1/L2 and L3/L4 layers are consistent; the design of the light plate windowing comprises a first light plate windowing design, a second light plate windowing design and a third light plate windowing design, wherein the second light plate windowing design and the third light plate windowing design are consistent with the windowing design of the substrate, the first light plate windowing design is set according to the depth a of the horizontal grooving position of the product, and the design data of the first light plate windowing design is a larger than the forming edge of the horizontal grooving side wall of the product; the PP layer windowing design is that 1mil is increased on the basis of the base plate windowing design.
Compared with the prior art, the manufacturing method of the PCB with the horizontally segmented metalized side wall for the display screen has the following beneficial effects:
the manufacturing method of the PCB comprises the steps that firstly, efficiency is high, a section layer is arranged between an upper substrate and a lower substrate and used for manufacturing a side wall groove so as to realize horizontal section of the side wall, specifically, the manufacturing of the section layer comprises drilling and forming grooving, the forming grooving is arranged at one side of the section layer, the section layer side wall is pressed together with the upper substrate and the lower substrate after being grooved, and the horizontal section groove is formed together with the upper substrate and the lower substrate, the forming grooving of the section layer is convenient to manufacture and high in efficiency, and the manufacturing efficiency of the manufacturing method of the PCB with the metallized side wall horizontal section for the display screen is effectively ensured;
secondly, the quality is good, the manufacturing method of the PCB realizes the horizontal segmentation of the side wall by manufacturing the forming slot on the newly added segmentation layer, the manufacturing of the substrate is not influenced in the manufacturing process, the width and the depth of the forming slot are easy to manufacture and master, the product requirements can be met, and the product quality is effectively ensured.
Detailed Description
The method for fabricating the PCB with metallized sidewall horizontal segments for a display screen according to the present invention will be described in further detail with reference to the following embodiments.
A manufacturing method of a PCB with a metallized side wall horizontal segmentation for a display screen comprises the steps of manufacturing substrates, selecting 2 manufactured substrates after the substrates are manufactured, arranging a segmentation layer used for manufacturing a horizontal segmentation groove between the 2 substrates, and pressing the segmentation layer together with an upper substrate and a lower substrate. Specifically, the substrate manufacturing comprises material-cutting-drilling-molding-slotting-plate-electrical-double-drilling-etching external detection, the manufacturing is carried out twice by adopting the same manufacturing mode to obtain L1/L2 and L3/L4 layers, after the L1/L2 and L3/L4 layers are manufactured, the positions of sidewall metallization are milled by using a milling machine, namely, the side wall positions are windowed, and the L1/L2 and the L3/L4 layers are designed to be consistent in windowing. The segmented layer comprises a segmented core layer consisting of a first optical plate layer, a first PP layer and a second PP layer, an upper protective layer consisting of a second optical plate layer and a third PP layer, and a lower protective layer consisting of a third optical plate layer and a fourth PP layer. Taking a metal plate with the thickness of 0.7mm to manufacture the first optical plate layer, setting the depth a according to the horizontal slotting position of the product, wherein the windowing design data of the first optical plate layer with the thickness of 0.7mm is a larger than the forming edge of the horizontal slotting side wall of the product, and the depth a is 0.2mm, so that the windowing design data of the first optical plate layer is 0.2mm larger than the forming edge of the horizontal slotting side wall of the product. Taking a metal plate with the thickness of 0.17mm to manufacture a second optical plate layer and a third optical plate layer, wherein the windowing design of the second optical plate layer and the third optical plate layer with the thickness of 0.17mm is consistent with that of the substrate; and then taking a non-flowing glue PP with the thickness of 0.05mm to manufacture a first PP layer, a second PP layer, a third PP layer and a fourth PP layer. Wherein the first, second and third optical sheet layers are made in the same manner, and are all material cutting etched optical sheet drilling forming grooving; the manufacturing modes of the first PP layer, the second PP layer, the third PP layer and the fourth PP layer are all material cutting drilling molding grooving, the windowing design of each PP layer is increased by 1mil on the basis of the windowing design of the base plate, and therefore side surface irregularity caused by glue overflow of the no-flow PP is prevented. When the layers are manufactured, in order to prevent the layers from being seriously staggered due to the difference between different drilling machines, the layers are firstly stacked together, and after the drilling is carried out on the same drilling machine, the post-processes are respectively completed. After the above-mentioned each layer preparation, after the L1/2 layer base plate, the third PP layer, the second light sheet layer, the first PP layer, the first light sheet layer, the second PP layer, the third light sheet layer, the fourth PP layer and L3/L4 layer base plate top-down stack-up sequentially, utilize the laminator to laminate together, after the pressfitting, carry on the package of the log-on-log weld-off-log formation test OSP in order again, finish PCB preparation.
The arrangement of the segmentation layers between the upper substrate and the lower substrate is used for manufacturing a side wall groove so as to realize horizontal segmentation of the side wall, specifically, the manufacturing of the segmentation layers comprises drilling and forming slotting, the forming slotting is positioned at one side of the segmentation layers, and after the slotting of the segmentation layers, the segmentation layers are pressed together with the upper substrate and the lower substrate to form the horizontal segmentation groove together with the upper substrate and the lower substrate. The forming and slotting of the segmentation layer are convenient to manufacture, the efficiency is high, and the manufacturing efficiency of the PCB manufacturing method for the metallized side wall horizontal segmentation of the display screen is effectively ensured.
Further, the substrate is a double-sided board, and the double-sided board is obtained by cutting materials, drilling PTH holes and manufacturing circuits according to conventional procedures. The double-sided board is adopted as the substrate, and the double-sided board is manufactured by multiple pressing relative to the single-sided boards, so that the manufacturing process of the substrate is greatly simplified, and the manufacturing efficiency is improved.
Further, the segmented layer comprises a segmented core layer having a thickness of 0.8 mm. The segmented core layer comprises a first light plate layer, a first PP layer and a second PP layer, wherein the first PP layer and the second PP layer are respectively located on the upper side and the lower side of the first light plate layer, one side of the segmented core layer is provided with a notch, and the notch and the upper substrate and the lower substrate form a segmented groove together. The thickness of first unthreaded board layer is 0.7mm, the thickness of first PP layer and second PP layer is 0.05 mm. Namely, the groove width of the segmentation groove is 0.8mm, the segmentation groove is positioned on the side wall of the segmentation layer, and after the segmentation layer is pressed with the upper substrate and the lower substrate, the horizontal segmentation groove of the side wall is formed, so that the product is segmented from top to bottom on the side wall, and the requirement of the horizontal segmentation of the product is well met. The first optical plate layer is arranged to ensure the manufacture of the segmented groove on one hand, and effectively ensure the conduction of the circuits of the upper substrate and the lower substrate on the other hand, and the first optical plate layer and the upper substrate and the lower substrate are bonded together when the first PP layer and the second PP layer are arranged.
Further, the segmentation layer is still including being located upper protective layer and the lower protective layer about the segmentation sandwich layer, the upper protective layer upwards is equipped with second polished finish board layer and third PP layer from the segmentation sandwich layer in proper order, the lower protective layer is equipped with third polished finish board layer and fourth PP layer from the segmentation sandwich layer downwards in proper order. The thickness of the second optical plate layer and the third optical plate layer is 0.17 mm. The thickness of the third PP layer and the thickness of the fourth PP layer are both 0.05 mm. The upper protective layer and the lower protective layer are arranged, the light plates in the upper protective layer and the lower protective layer are connected with the segmentation core layer, the PP layer is connected with the upper substrate and the lower substrate, on one hand, metallization of the segmentation groove is effectively guaranteed, on the other hand, the segmentation core layer, the upper substrate and the lower substrate are effectively protected, and mutual interference influence cannot occur when the segmentation core layer, the upper substrate and the lower substrate are connected with each other.
Furthermore, the first PP layer, the second PP layer, the third PP layer and the fourth PP layer are all non-gummosis PP, and the non-gummosis PP is selected for grooving production, so that the gummosis amount is small, the control is easy, and the problem that the gummosis of the side wall position after lamination cannot be guaranteed due to large gummosis amount of common PP is effectively solved.
The width and depth of the horizontal groove of the metallized side wall manufactured by the manufacturing method of the PCB with the horizontally segmented metallized side wall of the display screen can meet the product requirements.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.

Claims (9)

1. A manufacturing method of a PCB with horizontally segmented metalized side walls for a display screen is characterized by comprising the following steps: including the base plate preparation, after the base plate preparation is accomplished, select for use 2 base plates that have been accomplished for use, set up the segmentation layer that is used for making horizontal segmentation recess between 2 base plates, the segmentation layer is in the same place with upper and lower base plate pressfitting, the segmentation layer is including the segmentation sandwich layer, the segmentation sandwich layer includes first plastic sheet layer and the first PP layer and the second PP layer that are located first plastic sheet layer upper and lower both sides respectively, one side of segmentation sandwich layer is equipped with the breach, the breach forms the segmentation recess with upper and lower base plate together.
2. The method of claim 1, wherein the substrate is a double-sided board, and the double-sided board is obtained by cutting, drilling PTH holes and fabricating circuit according to conventional procedures.
3. The method of claim 2, wherein the thickness of the segment core is 0.8 mm.
4. The method for manufacturing the PCB with the horizontally segmented metalized side wall for the display screen according to claim 3, wherein the thickness of the first light plate layer is 0.7mm, and the thickness of the first PP layer and the thickness of the second PP layer are both 0.05 mm.
5. The method for manufacturing the PCB with the horizontally segmented metalized side wall for the display screen according to claim 2, wherein the segmented layer further comprises an upper protective layer and a lower protective layer which are positioned above and below the segmented core layer, the upper protective layer is sequentially provided with a second light sheet layer and a third PP layer from the segmented core layer to the upper side, and the lower protective layer is sequentially provided with a third light sheet layer and a fourth PP layer from the segmented core layer to the lower side.
6. The method of claim 5, wherein the second and third optical sheet layers are each 0.17mm thick.
7. The method for manufacturing the PCB with the horizontally segmented metalized side wall for the display screen according to claim 5, wherein the thickness of the third PP layer and the thickness of the fourth PP layer are both 0.05 mm.
8. The method for manufacturing the PCB with the horizontally segmented metalized side wall for the display screen according to any one of claims 1 to 7, wherein the first PP layer, the second PP layer, the third PP layer and the fourth PP layer are all non-flowing glue PP.
9. The method for manufacturing a horizontally segmented PCB with metallized sidewalls for display screens of claim 8, further comprising a windowing design, wherein the windowing design comprises a substrate windowing design, a PP layer windowing design and a light panel windowing design, the substrate windowing design is to window at a sidewall position, the sidewall metallization position is routed out using a routing machine, and the routing positions of L1/L2 and L3/L4 layers are consistent; the design of the light plate windowing comprises a first light plate windowing design, a second light plate windowing design and a third light plate windowing design, wherein the second light plate windowing design and the third light plate windowing design are consistent with the windowing design of the substrate, the first light plate windowing design is set according to the depth a of the horizontal grooving position of the product, and the design data of the first light plate windowing design is a larger than the forming edge of the horizontal grooving side wall of the product; the PP layer windowing design is that 1mil is increased on the basis of the base plate windowing design.
CN202010645649.4A 2020-07-07 2020-07-07 Manufacturing method of PCB with horizontally segmented metalized side wall for display screen Active CN111867255B (en)

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DE19802089C2 (en) * 1998-01-21 2000-04-06 Bosch Gmbh Robert Contact plug connection and contact plug
JP2003317830A (en) * 2002-04-25 2003-11-07 Nec Corp Printed board connection structure
TWI336608B (en) * 2006-01-31 2011-01-21 Sony Corp Printed circuit board assembly and method of manufacturing the same
EP2911486A1 (en) * 2014-02-19 2015-08-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft PCB-based connector device

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