CN103065561A - LED display screen display unit and automatic production method thereof - Google Patents
LED display screen display unit and automatic production method thereof Download PDFInfo
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- CN103065561A CN103065561A CN2013100111885A CN201310011188A CN103065561A CN 103065561 A CN103065561 A CN 103065561A CN 2013100111885 A CN2013100111885 A CN 2013100111885A CN 201310011188 A CN201310011188 A CN 201310011188A CN 103065561 A CN103065561 A CN 103065561A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000011159 matrix material Substances 0.000 claims abstract description 38
- 239000011148 porous material Substances 0.000 claims description 38
- 238000002955 isolation Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010923 batch production Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 238000009740 moulding (composite fabrication) Methods 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses an LED display screen display unit and an automatic production method thereof. The LED display screen display unit comprises a display unit main board, a drive IC (integrated circuit), and an LED lamp. The display unit main board comprises a first circuit board and a second circuit board. Pad sets consisting of a plurality of pads are disposed on the first side of the first circuit board and the first side of the second circuit board. The pad sets on the first circuit board and the pad sets on the second circuit board are in one-to-one correspondence and are mutually spaced. One pad set on the first circuit board and the corresponding pad set on the second circuit board form a pad matrix. The drive IC is disposed on the first circuit board and electrically connected with the pads of the pad matrix. Pins of the LED lamp are welded on the pads of the pad matrix. The LED display screen with the display unit has high transparency while having high pixel density, and the design meets the requirement for automatic batch production.
Description
Technical field
The present invention relates to the display screen field, relate in particular to a kind of LED display display unit and automatic production method thereof.
Background technology
LED display has obtained using very widely, and in some special application scenarios, LED display requires to have penetrating structure, and its advantage is: (1) is block vision not, can see the scenery of LED screen front and back; (2) keep certain daylighting effect, can satisfy when particularly being used on glass curtain wall or the show window indoor daylighting needs; (3) reduce to greatest extent using the impact of on-the-spot whole decoration design; (4) have certain artistic effect, when stage performance uses, can reach and only see that image loses the fancy effect of screen especially.Because above characteristics, the LED display of open type is subjected to the welcome of some particular application especially, such as on the airport, hotel, glass curtain wall building, conference and exhibition center, stage, shopper window etc., its result of use is that conventional tank formula structure LED display can not match in excellence or beauty.The design of open type LED display should be considered penetrating rate, considered pixel density again, and under same structural design condition, picture element density is larger, and penetrating rate is just less, and translucent effect is just poorer.Below be the relation of the screen pixels density of several typical pel spacings and correspondence:
| Pel spacing P(pixel pitch) | Picture element density R (resolution) |
| 40mm | 625pixel/㎡ |
| 25mm | 1,600pixel/㎡ |
| 20mm | 2,500pixel/㎡ |
| 16mm | 3,906pixel/㎡ |
| 10mm | 10,000pixel/㎡ |
| 8mm | 15,625pixel/㎡ |
| 7mm | 20,408pixel/㎡ |
| 6mm | 27,777pixel/㎡ |
| 5mm | 40,000pixel/㎡ |
* picture element density computing formula: R=(1000mm*1000mm)/(P*P)
By upper table and formula as seen, along with reducing of pel spacing, picture element density is geometric series and rises, significantly, below the 10mm pel spacing, every minimizings of pel spacing 1mm, the numerical value of picture element density rising is considerable.
The pad of the LED display display unit of existing open type is not arranged on the side, in the production run of existing product the LED lamp can not the robotization paster to the circuit board of this structure, need manual welding.And prior art can't guarantee higher penetrating rate in the high pixel density situation.
Summary of the invention
The object of the invention is to design a kind of LED display that can guarantee and under the high pixel density condition, still have the display unit of high penetrating rate, and design the automatic production method of described display unit.
For reaching this purpose, the present invention by the following technical solutions:
A kind of LED display display unit, comprise the display unit mainboard, drive IC, the LED lamp, described display unit mainboard comprises the first circuit board of setting, second circuit board, the first side of first circuit board and the first side of second circuit board are respectively arranged with the pad group that is comprised of a plurality of pads, the pad group of first circuit board and the one by one corresponding and mutually isolation of the pad group of second circuit board, a pad group of first circuit board forms a pad matrix with a corresponding pad group of second circuit board, drive IC is arranged at first circuit board, the pad of drive IC and pad matrix is electrically connected, and the pin of LED lamp is welded in the pad of pad matrix.
Wherein, also comprise insulation course, described insulation course is arranged between first circuit board and the second circuit board.
Wherein, the described display unit mainboard position that first circuit board and second circuit board have a common boundary on the first side is provided with V-shaped groove.
Wherein, the height of the pad of the pad group of described first circuit board is the 60-90% of first circuit board thickness; The height of the pad of the pad group of described second circuit board is the 60-90% of second circuit plate thickness.
Wherein, the second side of second circuit board is provided with metallized semi-pore, and the pad of the metallized semi-pore of second circuit board and the pad group of the first side of second circuit board is corresponding and be electrically connected one by one; The second side of first circuit board is provided with metallized semi-pore, the metallized semi-pore of first circuit board and the one by one corresponding and electric connection of the metallized semi-pore of second circuit board, and the metallized semi-pore of first circuit board and drive IC are electrically connected; Drive IC is embedded to be installed in the display unit mainboard; Pad group on described first circuit board and the second circuit board is at least respectively 2, the pad number of each pad group is 2 or 3, pad group on the first circuit board is equidistantly arranged, pad group on the second circuit board is equidistantly arranged, first circuit board comprises the two-tier circuit layer at least, and second circuit board comprises one deck circuit layer at least; Described LED light fixture has 4 or 6 pins, and is corresponding with the pin number of LED lamp, and described pad matrix has 4 or 6 pads, and described pad is planar pad.
A kind of automatic production method of above-mentioned LED display cell board comprises:
Wherein, in the first side of the first side of first circuit board and second circuit board the pad group that is comprised of a plurality of pads being set respectively specifically comprises:
On the jigsaw for the production of first circuit board, equidistantly bore more than one group of mounting hole along separatrix, the first side, on the jigsaw for the production of second circuit board, equidistantly bore more than one group of mounting hole along separatrix, the first side;
The metallization mounting hole;
Continue to use in separatrix, the first side excision forming of the jigsaw of producing first circuit board, one group of mounting hole has formed the pad group after the cutting; Continue to use in separatrix, the first side excision forming of the jigsaw of producing second circuit board, one group of mounting hole after the cutting has formed the pad group.
Described first circuit board, second circuit board are connected to form the display unit mainboard and comprise:
Connect first circuit board and second circuit board, the first side of first circuit board and the first side of second circuit board form combined side;
The pad that the pin of described LED lamp is welded in the pad matrix specifically comprises:
Make combined side that the first side of the first side of first circuit board and second circuit board forms up;
Make steel mesh, the steel mesh position is corresponding one by one with described pad;
Brush tin cream by the steel mesh position at pad;
Be brushed with robotization paster LED lamp on the pad of tin cream;
There is the pad of LED lamp to cross Reflow Soldering high temperature tin stove the robotization paster.
Wherein, also comprise in the step 1:
On the jigsaw for the production of first circuit board, equidistantly bore more than one group of circular hole along separatrix, the second side, on the jigsaw for the production of second circuit board, equidistantly bore more than one group of circular hole along separatrix, the second side;
Circular hole is metallized;
Along separatrix, the second side excision forming, form metallized semi-pore by circular hole behind the excision forming;
The pad of the metallized semi-pore of second circuit board and the pad group of the first side of second circuit board is corresponding and be electrically connected the metallized semi-pore of first circuit board and drive IC electric connection one by one.
Also comprise in the step 2:
The metallized semi-pore of first circuit board and the one by one corresponding electric connection of the metallized semi-pore of second circuit board.
Wherein, the pad group of the pad group of described first circuit board and second circuit board one by one corresponding and mutually the scheme that adopts of isolation be: between first circuit board and second circuit board, insulation course is set;
Or in the first side of first circuit board near the position chamfering of second circuit board, near the position chamfering of first circuit board, the position that first circuit board and second circuit board had a common boundary on the first side when first circuit board and second circuit board were connected to form the display unit mainboard forms V-shaped groove in the first side of second circuit board;
Or when boring mounting hole, the degree of depth of mounting hole is the 60-90% of circuit board thickness, in the side direction of all will not bore when first circuit board and second circuit board are connected to form the display unit mainboard.
Wherein, described drive IC is embedded is installed in the display unit mainboard; Pad group on described first circuit board and the second circuit board is at least respectively 2, the pad number of each pad group is 2 or 3, pad group on the first circuit board is equidistantly arranged, pad group on the second circuit board is equidistantly arranged, first circuit board comprises the two-tier circuit layer at least, and second circuit board comprises one deck circuit layer at least; Described LED light fixture has 4 or 6 pins, and is corresponding with the pin number of LED lamp, and described pad matrix has 4 or 6 pads, and described pad is planar pad.
Beneficial effect of the present invention is: the independent production by two circuit boards is combined into the display unit mainboard, the side that is combined in the display unit mainboard of the pad group by two circuit board sides has formed the pad matrix, can be on the pad matrix of side robotization paster LED lamp.This LED display display unit can guarantee that the LED display of producing has higher penetrating rate in the high pixel density situation, and this design can be satisfied the automated production in enormous quantities of this led display unit.
Description of drawings
Fig. 1 is a kind of LED display display unit of the present invention local structural graph;
Fig. 2 is a kind of LED display display unit of the present invention pad matrix enlarged drawing;
Fig. 3 is a kind of pad group isolation of a kind of LED display display unit of the present invention synoptic diagram;
Fig. 4 is a kind of pad group isolation of a kind of LED display display unit of the present invention synoptic diagram;
Fig. 5 is I place partial enlarged drawing among Fig. 4;
Fig. 6 is a kind of pad group isolation of a kind of LED display display unit of the present invention synoptic diagram;
Fig. 7 is a kind of LED display display unit of the present invention metallized semi-pore synoptic diagram;
Fig. 8 is that a kind of LED display display unit of the present invention is installed six pin LED lamp local structural graphs;
Fig. 9 is a kind of LED display display unit of the present invention whole structure figure;
Figure 10 is a kind of LED display display unit of the present invention automatic production method step block diagram;
Figure 11 A is the concrete steps block diagram that pad is set in the preferred embodiment of a kind of LED display display unit of the present invention automatic production method;
Figure 11 B is the concrete steps block diagram of mounted LED lamp in the preferred embodiment of a kind of LED display display unit of the present invention automatic production method;
Figure 12 A is the operation chart that pad and metallized semi-pore are set in a kind of LED display display unit of the present invention automatic production method;
Figure 12 B is the ordered state synoptic diagram of display unit mainboard when welding the LED lamp in a kind of LED display display unit of the present invention automatic production method;
Figure 12 C is LED paster fitting operation synoptic diagram in a kind of LED display display unit of the present invention automatic production method.
Wherein:
1, display unit mainboard; 11, first circuit board; 12, second circuit board; 13, insulation course; 2, drive IC; 3, metallized semi-pore; 31, separatrix, the second side; 32, circular hole; 4, pad; 41, pad group; 411, pad matrix; 42, mounting hole; 43, separatrix, the first side; 5, LED lamp; 51, pin.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and by embodiment.
A kind of LED display display unit the first embodiment of the present invention is as depicted in figs. 1 and 2:
A kind of LED display display unit, comprise display unit mainboard 1, drive IC 2, LED lamp 5, described display unit mainboard 1 comprises the first circuit board 11 of setting, second circuit board 12, the first side of first circuit board 11 and the first side of second circuit board 12 are respectively arranged with the pad group 41 that is comprised of a plurality of pads 4, the pad group 41 of first circuit board 11 and the one by one corresponding and mutually isolation of the pad group 41 of second circuit board 12, a pad group 41 of first circuit board 11 forms a pad matrix 411 with a corresponding pad group 41 of second circuit board 12, drive IC 2 is arranged at first circuit board 11, drive IC 2 is electrically connected with the pad 4 of pad matrix 411, and the pin 51 of LED lamp 5 is welded in the pad 4 of pad matrix 411.
Being divided into two-layer display unit mainboard 1 can form pad matrix 411 in the side of display unit mainboard 1 efficiently and accurately, thereby is conducive to robotization paster mounted LED lamp 5, improves the production efficiency of product, reduces cost of labor.
Another embodiment of a kind of LED display display unit of the present invention as shown in Figure 3.
The design of insulation course 13 is so that the pad group 41 of the pad group 41 of first circuit board 11 and second circuit board 12 can realize isolation at an easy rate.
Another embodiment of a kind of LED display display unit of the present invention as shown in Figure 4 and Figure 5.
The design of V-shaped groove can realize the isolation of the pad group 41 of the pad group 41 of first circuit board 11 and second circuit board 12 in the situation that does not increase display unit mainboard 1 thickness, play better penetrating effect.
Another embodiment of a kind of LED display display unit of the present invention as shown in Figure 6.
The height of the pad 4 of the pad group 41 of first circuit board 11 is the 60-90% of first circuit board 11 thickness; The height of the pad 4 of the pad group 41 of described second circuit board 12 is the 60-90% of second circuit board 12 thickness.
The position of the pad group 41 that this kind design directly utilizes first circuit board 11 and second circuit board 12 to generate to be used for isolation first circuit board 11 and the pad group 41 of second circuit board 12, and do not increase the thickness of display unit mainboard 1.
The preferred embodiment of a kind of LED display display unit of the present invention such as Fig. 7 are to shown in Figure 9.
The second side of second circuit board 12 is provided with metallized semi-pore 3, and the pad 4 of the metallized semi-pore 3 of second circuit board 12 and the pad group 41 of the first side of second circuit board 12 is corresponding and be electrically connected one by one; The second side of first circuit board 11 is provided with metallized semi-pore 3, the metallized semi-pore 3 of first circuit board 11 and the one by one corresponding and electric connection of the metallized semi-pore 3 of second circuit board 12, and the metallized semi-pore 3 of first circuit board 11 is electrically connected with drive IC 2; Drive IC 2 embedded being installed in the display unit mainboard 1; Pad group 41 on described first circuit board 11 and the second circuit board 12 is at least respectively 2, pad 4 numbers of each pad group 41 are 2 or 3, pad group 41 on the first circuit board 11 is equidistantly arranged, pad group 41 on the second circuit board 12 is equidistantly arranged, first circuit board 11 comprises the two-tier circuit layer at least, and second circuit board 12 comprises one deck circuit layer at least; Described LED lamp 5 has 4 or 6 pins 51, and is corresponding with pin 51 quantity of LED lamp 5, and described pad matrix 411 has 4 or 6 pads 4, and described pad 4 is planar pad.
First circuit board 11 and second circuit board 12 are when being combined into display unit mainboard 1, can use various ways to realize being electrically connected, for example directly first circuit board 11 and second circuit board 12 are welded together, or at first circuit board 11 and second circuit board 12 corresponding through hole is set, realize being electrically connected by through hole, the design of metallized semi-pore 3 can allow first circuit board 11 and second circuit board 12 when being combined into display unit mainboard 1 in the present embodiment, realize quickly and easily being electrically connected, become an organic whole.Drive IC 2 embedded being installed in the display unit mainboard 1 can be reduced the bossing on the display unit mainboard 1, thereby reduce the stopping of light, improve the transmittance of the LED display finished product of producing with this LED display display unit.At least 2 pad groups 41 can guarantee to form on the every display unit mainboard 1 more pad matrix 411, thereby more LED lamp 5 is installed, the equidistant arrangement of pad group 41 can guarantee that LED lamp 5 is evenly distributed on LED display, this kind design can allow the assembling of LED display simpler, LED lamp 5 is as the pixel on the LED display simultaneously, only has even distribution, could allow the whole display effect of LED display reach desirable state, pad matrix 411 has 4 or 6 pads 4, can adapt to well the packaged type that existing LED lamp 5 on the market has 4 pins 51 or 6 pins 51; Planar pad is conducive to LED lamp 5 pasters and installs.
The first embodiment block diagram of the automatic production method of the above-mentioned LED display cell board of the present invention comprises as shown in figure 10:
Described 3 steps can realize the automated production of LED display cell board, enhance productivity.
The preferred embodiment of the automatic production method of LED display cell board of the present invention, concrete, shown in Figure 11 A, the first side of first circuit board 11 and the first side of second circuit board 12 arrange pad group 41 and specifically comprise:
Step 101: on the jigsaw for the production of first circuit board 11,43 equidistantly bore more than one group of mounting hole 42 along separatrix, the first side, and on the jigsaw for the production of second circuit board 12,43 equidistantly bore more than one group of mounting hole 42 along separatrix, the first side;
Step 102: metallization mounting hole 42;
Step 103: continue to use in separatrix, the first side 43 excision formings of the jigsaw of producing first circuit board 11, one group of mounting hole 42 has formed pad group 41 after the cutting; Continue to use in separatrix, the first side 43 excision formings of the jigsaw of producing second circuit board 12, one group of mounting hole 42 after the cutting has formed pad group 41;
Concrete, first circuit board 11, second circuit board 12 are connected to form display unit mainboard 1 and specifically comprise:
Connect first circuit board 11, second circuit board 12, the first side of first circuit board 11 and the first side of second circuit board 12 form combined side, and pad group 41 positions on the pad group 41 on the first side of first circuit board 11 and the first side of second circuit board 12 are corresponding one by one.
Concrete, shown in Figure 11 B, the pad 4 that the pin 51 of LED lamp 5 is welded in pad matrix 411 specifically comprises:
Step 301: make combined side that the first side of the first side of first circuit board 11 and second circuit board 12 forms up;
Step 302: make steel mesh, the steel mesh position is corresponding one by one with pad 4 on the described combined side;
Step 303: brush tin cream at pad 4 by the steel mesh position;
Step 304: robotization paster LED lamp 5 on the pad 4 that is brushed with tin cream;
Step 305: have the pad 4 of LED lamp 5 to cross Reflow Soldering high temperature tin stove the robotization paster.
The operation chart of step 101 is shown in Figure 12 A, the implementation of step 301 is shown in Figure 12 B, the operation chart of step 304 is shown in Figure 12 C, in conjunction with said method embodiment, the present invention can form pad matrix 411 in the side of display unit mainboard 1 efficiently and accurately, the pin 51 of LED lamp 5 is efficiently pasted on the pad 4 of pad matrix 411 with the automated production mode rapidly, improved production efficiency.
Another preferred embodiment of the automatic production method of LED display cell board of the present invention is as described below:
On the jigsaw for the production of first circuit board 11,31 equidistantly bore more than one group of circular hole 32 along separatrix, the second side, and on the jigsaw for the production of second circuit board 12,31 equidistantly bore more than one group of circular hole 32 along separatrix, the second side;
With circular hole 32 metallization;
Along separatrix, the second side 31 excision formings, form metallized semi-pore 3 by circular hole behind the excision forming 32;
The pad 4 of the metallized semi-pore 3 of second circuit board 12 and the pad group 41 of the first side of second circuit board 12 is corresponding and be electrically connected one by one, and the metallized semi-pore 3 of first circuit board 11 is electrically connected with drive IC 2.
Also comprise in the step 2:
The metallized semi-pore 3 of first circuit board 11 and the one by one corresponding electric connection of the metallized semi-pore 3 of second circuit board 12.
Another embodiment of a kind of LED display display unit of the present invention automatic production method is as described below:
The pad group 41 of first circuit board 11 and the pad group 41 of second circuit board 12 one by one corresponding and mutually the scheme that adopts of isolation be: between first circuit board 11 and second circuit board 12, insulation course 13 is set;
Or in the first side of first circuit board 11 near the position chamfering of second circuit board 12, in the first side of second circuit board 12 near the position chamfering of first circuit board 11, when first circuit board 11 and second circuit board 12 are connected to form display unit mainboard 1 on the first side the position of first circuit board 11 and second circuit board 12 form V-shaped groove;
Or when boring mounting hole 42, the degree of depth of mounting hole 42 is the 60-90% of circuit board thickness, in the side direction that first circuit board 11 and second circuit board 12 all will not bore when being connected to form display unit mainboard 1.
Use such scheme, all the pad group 41 of first circuit board 11 and second circuit board 12 can be kept apart, reach the designing requirement of product.
Another embodiment of a kind of LED display display unit of the present invention automatic production method is as described below: drive IC 2 embedded being installed in the display unit mainboard 1; Pad group 41 on described first circuit board 11 and the second circuit board 12 is at least respectively 2, pad 4 numbers of each pad group 41 are 2 or 3, pad group 41 on the first circuit board 11 is equidistantly arranged, pad group 41 on the second circuit board 12 is equidistantly arranged, first circuit board 11 comprises the two-tier circuit layer at least, and second circuit board 12 comprises one deck circuit layer at least; Described LED lamp 5 has 4 or 6 pins 51, and is corresponding with pin 51 quantity of LED lamp 5, and described pad matrix 411 has 4 or 6 pads 4, and described pad 4 is planar pad.
In the present embodiment, first circuit board 11 and second circuit board 12 are when being combined into display unit mainboard 1, can use various ways to realize being electrically connected, for example directly first circuit board 11 and second circuit board 12 are welded together, or at first circuit board 11 and second circuit board 12 corresponding through hole is set, realize being electrically connected by through hole, the design of metallized semi-pore 3 can allow first circuit board 11 and second circuit board 12 when being combined into display unit mainboard 1 in the present embodiment, realize quickly and easily being electrically connected, become an organic whole.Drive IC 2 embedded being installed in the display unit mainboard 1 can be reduced the bossing on the display unit mainboard 1, thereby reduce the stopping of light, improve the transmittance of the LED display finished product of producing with this LED display display unit.At least 2 pad groups 41 can guarantee to form on the every display unit mainboard 1 more pad matrix 411, thereby more LED lamp 5 is installed, the equidistant arrangement of pad group 41 can guarantee that LED lamp 5 is evenly distributed on LED display, this kind design can allow the assembling of LED display simpler, LED lamp 5 is as the pixel on the LED display simultaneously, only has even distribution, could allow the whole display effect of LED display reach desirable state, pad matrix 411 has 4 or 6 pads 4, can adapt to well the packaged type that existing LED lamp 5 on the market has 4 pins 51 or 6 pins 51; Planar pad is conducive to LED lamp 5 pasters and installs.
Know-why of the present invention has below been described in conjunction with specific embodiments.These are described just in order to explain principle of the present invention, and can not be interpreted as by any way limiting the scope of the invention.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (10)
1. LED display display unit, comprise display unit mainboard (1), drive IC (2), LED lamp (5), it is characterized in that, described display unit mainboard (1) comprises the first circuit board (11) of setting, second circuit board (12), the first side of the first side of first circuit board (11) and second circuit board (12) is respectively arranged with the pad group (41) that is comprised of a plurality of pads (4), the pad group (41) of first circuit board (11) and the one by one corresponding and mutually isolation of the pad group (41) of second circuit board (12), a pad group (41) of first circuit board (11) forms a pad matrix (411) with a corresponding pad group (41) of second circuit board (12), drive IC (2) is arranged at first circuit board (11), drive IC (2) is electrically connected with the pad (4) of pad matrix (411), and the pin (51) of LED lamp (5) is welded in the pad (4) of pad matrix (411).
2. a kind of display screen display unit according to claim 1 is characterized in that, also comprises insulation course (13), and described insulation course (13) is arranged between first circuit board (11) and the second circuit board (12).
3. a kind of display screen display unit according to claim 1 is characterized in that, described display unit mainboard (1) position that first circuit board (11) and second circuit board (12) have a common boundary on the first side is provided with V-shaped groove.
4. a kind of display screen display unit according to claim 1 is characterized in that, the height of the pad (4) of the pad group (41) of described first circuit board (11) is the 60-90% of first circuit board (11) thickness; The height of the pad (4) of the pad group (41) of described second circuit board (12) is the 60-90% of second circuit board (12) thickness.
5. a kind of display screen display unit according to claim 1, it is characterized in that, the second side of second circuit board (12) is provided with metallized semi-pore (3), and the pad (4) of the metallized semi-pore (3) of second circuit board (12) and the pad group (41) of the first side of second circuit board (12) is corresponding and be electrically connected one by one; The second side of first circuit board (11) is provided with metallized semi-pore (3), the metallized semi-pore (3) of first circuit board (11) and the one by one corresponding and electric connection of the metallized semi-pore (3) of second circuit board (12), the metallized semi-pore (3) of first circuit board (11) is electrically connected with drive IC (2); Drive IC (2) is embedded to be installed in the display unit mainboard (1); Pad group (41) on described first circuit board (11) and the second circuit board (12) is at least respectively 2, pad (4) number of each pad group (41) is 2 or 3, pad group (41) on the first circuit board (11) is equidistantly arranged, pad group (41) on the second circuit board (12) is equidistantly arranged, first circuit board (11) comprises the two-tier circuit layer at least, and second circuit board (12) comprises one deck circuit layer at least; Described LED lamp (5) has 4 or 6 pins (51), and corresponding with pin (51) quantity of LED lamp (5), described pad matrix (411) has 4 or 6 pads (4), and described pad (4) is planar pad.
6. the automatic production method of a LED display cell board claimed in claim 1 is characterized in that, comprising:
Step 1 is made first circuit board (11), second circuit board (12); In the first side of first circuit board (11) and the first side of second circuit board (12) the pad group (41) that is comprised of a plurality of pads (4) is set respectively, the upper drive IC (2) of installing of first circuit board (11), drive IC (2) is electrically connected with the pad group (41) of first circuit board (11);
Step 2, first circuit board (11), second circuit board (12) are connected to form display unit mainboard (1), the pad group (41) of first circuit board (11) and the one by one corresponding and mutually isolation of the pad group (41) of second circuit board (12), a pad group (41) of first circuit board (11) forms a pad matrix (411) with a relative pad group (41) of second circuit board (12), and drive IC (2) is electrically connected with the pad group (41) of second circuit board (12);
Step 3 is welded in the pin (51) of LED lamp (5) pad (4) of pad matrix (411).
7. automatic production method according to claim 6, it is characterized in that, in the first side of the first side of first circuit board (11) and second circuit board (12) the pad group (41) that is comprised of a plurality of pads (4) is set respectively and specifically comprises:
On the jigsaw for the production of first circuit board (11), equidistantly bore more than one group of mounting hole (42) along separatrix, the first side (43), on the jigsaw for the production of second circuit board (12), equidistantly bore more than one group of mounting hole (42) along separatrix, the first side (43);
Metallization mounting hole (42);
Continue to use in separatrix, the first side (43) excision forming of the jigsaw of producing first circuit board (11), one group of mounting hole (42) has formed pad group (41) after the cutting; Continue to use in separatrix, the first side (43) excision forming of the jigsaw of producing second circuit board (12), the one group of mounting hole (42) after the cutting has formed pad group (41);
Described first circuit board (11), second circuit board (12) are connected to form display unit mainboard (1) and comprise:
Connect first circuit board (11) and second circuit board (12), the first side of the first side of first circuit board (11) and second circuit board (12) forms combined side;
The pad (4) that the pin (51) of described LED lamp (5) is welded in pad matrix (411) specifically comprises:
Make combined side that the first side of the first side of first circuit board (11) and second circuit board (12) forms up;
Make steel mesh, the steel mesh position is corresponding one by one with pad (4) on the described combined side;
Brush tin cream by the steel mesh position at pad (4);
Be brushed with the upper robotization paster LED lamp (5) of the pad of tin cream (4);
There is the pad (4) of LED lamp (5) to cross Reflow Soldering high temperature tin stove the robotization paster.
8. automatic production method according to claim 6 is characterized in that, also comprises in the step 1:
On the jigsaw for the production of first circuit board (11), equidistantly bore more than one group of circular hole (32) along separatrix, the second side (31), on the jigsaw for the production of second circuit board (12), equidistantly bore more than one group of circular hole (32) along separatrix, the second side (31);
Circular hole (32) is metallized;
Along separatrix, the second side (31) excision forming, form metallized semi-pore (3) by circular hole behind the excision forming (32);
The pad (4) of the metallized semi-pore (3) of second circuit board (12) and the pad group (41) of the first side of second circuit board (12) is corresponding and be electrically connected one by one, and the metallized semi-pore (3) of first circuit board (11) is electrically connected with drive IC (2).
Also comprise in the step 2:
The metallized semi-pore (3) of first circuit board (11) and the one by one corresponding electric connection of the metallized semi-pore (3) of second circuit board (12).
9. a kind of automatic production method according to claim 6 is characterized in that:
The pad group (41) of described first circuit board (11) and the pad group (41) of second circuit board (12) one by one corresponding and mutually the scheme that adopts of isolation be: between first circuit board (11) and second circuit board (12), insulation course (13) is set;
Or in the first side of first circuit board (11) near the position chamfering of second circuit board (12), in the first side of second circuit board (12) near the position chamfering of first circuit board (11), when first circuit board (11) and second circuit board (12) are connected to form display unit mainboard (1) on the first side the position formation V-shaped groove of first circuit board (11) and second circuit board (12) boundary;
Or when boring mounting hole (42), the degree of depth of mounting hole (42) is the 60-90% of circuit board thickness, in the side direction that first circuit board (11) and second circuit board (12) all will not bore when being connected to form display unit mainboard (1).
10. automatic production method according to claim 6 is characterized in that, described drive IC (2) is embedded to be installed in the display unit mainboard (1); Pad group (41) on described first circuit board (11) and the second circuit board (12) is at least respectively 2, pad (4) number of each pad group (41) is 2 or 3, pad group (41) on the first circuit board (11) is equidistantly arranged, pad group (41) on the second circuit board (12) is equidistantly arranged, first circuit board (11) comprises the two-tier circuit layer at least, and second circuit board (12) comprises one deck circuit layer at least; Described LED lamp (5) has 4 or 6 pins (51), and corresponding with pin (51) quantity of LED lamp (5), described pad matrix (411) has 4 or 6 pads (4), and described pad (4) is planar pad.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100111885A CN103065561A (en) | 2013-01-11 | 2013-01-11 | LED display screen display unit and automatic production method thereof |
| PCT/CN2014/070305 WO2014108068A1 (en) | 2013-01-11 | 2014-01-08 | Led display screen display unit and automatic production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100111885A CN103065561A (en) | 2013-01-11 | 2013-01-11 | LED display screen display unit and automatic production method thereof |
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| CN103065561A true CN103065561A (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013100111885A Pending CN103065561A (en) | 2013-01-11 | 2013-01-11 | LED display screen display unit and automatic production method thereof |
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| CN (1) | CN103065561A (en) |
| WO (1) | WO2014108068A1 (en) |
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