CN204243080U - COB information issuing module - Google Patents
COB information issuing module Download PDFInfo
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- CN204243080U CN204243080U CN201420701352.5U CN201420701352U CN204243080U CN 204243080 U CN204243080 U CN 204243080U CN 201420701352 U CN201420701352 U CN 201420701352U CN 204243080 U CN204243080 U CN 204243080U
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- information issuing
- issuing module
- chip mounting
- mounting slot
- led wafer
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Abstract
The utility model provides a kind of COB information issuing module, comprise circuit board, this circuit board is provided with multiple chip mounting slot, the bottom of each chip mounting slot arranges two circuit contacts respectively, each chip mounting slot corresponding arranges a LED wafer, two electrodes of this LED wafer are soldered to circuit contact corresponding on circuit board respectively by gold thread, are filled with the epoxy resin flooding LED wafer in this chip mounting slot.The COB information issuing module that the utility model provides carries out die bond by LED wafer being directly soldered on corresponding circuit contact with gold thread, instead of carry out plug-in mounting or paster production by direct insertion or SMD LED lamp bead, production technology simplifies greatly, production efficiency improves a lot, and the thickness of whole COB information issuing module reduces, and size can be wider, stability improves, and advantageously in heat radiation and installation and maintenance.
Description
Technical field
The utility model relates to a kind of COB(Chip On Board, chip on board) information issuing module, especially relate to the simple and COB information issuing module that stability is high of a kind of structure and production technology.
Background technology
Existing LED(Light-Emitting Diode, light-emitting diode) display screen makes and all adopts direct insertion or bonded LED lamp pearl.LED lamp bead all needs to produce separately and encapsulation, then the LED lamp bead of having produced is carried out color-division, then selects the LED lamp bead chip mounter of respective batch or inserter to be installed on pcb board, then welds.This complex manufacturing, cost is high; And poor stability, visual angle is little, resistance to shock, anticorrosive property and anticollision poor performance; In addition, after LED lamp bead luminescence, heat not easily distributes, and concentrates in LED lamp bead, PCB become large, wide and thick; Also need base engagement, need multiple screws to be fixed, thus make complex manufacturing, installation effectiveness is low, and maintenance difficulties is large simultaneously.
Utility model content
The technical problem that the utility model solves is, provides a kind of structure and production technology simple and the COB information issuing module that stability is high.
The technical scheme that the utility model solves the problems of the technologies described above is, a kind of COB information issuing module is provided, comprise circuit board, this circuit board is provided with multiple chip mounting slot, the bottom of each chip mounting slot arranges two circuit contacts respectively, each chip mounting slot corresponding arranges a LED wafer, and two electrodes of this LED wafer are soldered to circuit contact corresponding on circuit board respectively by gold thread, are filled with the epoxy resin flooding LED wafer in this chip mounting slot.
Preferably, diffusant is mixed with in this epoxy resin.
Preferably, the maximum angle of emergence of this LED wafer is 150 °.
Preferably, the plurality of chip mounting slot distribution in array on circuit boards.
Preferably, the rectangular structure of this COB information issuing module, it arranges an installation through hole respectively near four edges.
The COB information issuing module that the utility model provides carries out die bond by LED wafer being directly soldered on corresponding circuit contact with gold thread, instead of carry out plug-in mounting or paster production by direct insertion or SMD LED lamp bead, production technology simplifies greatly, production efficiency improves a lot, and the thickness of whole COB information issuing module reduces, and size can be wider, stability improves, and advantageously in heat radiation and installation and maintenance.
Accompanying drawing explanation
The front view of a kind of COB information issuing module that Fig. 1 provides for the utility model one embodiment, this COB information issuing module arranges multiple luminescence unit;
Fig. 2 is the amplification view of the luminescence unit of the information issuing module of COB shown in Fig. 1;
The luminous visual angle schematic diagram that Fig. 3 is the luminescence unit of the information issuing module of COB shown in Fig. 1.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail below by embodiment.
Refer to Fig. 1, the utility model one embodiment provides a kind of COB information issuing module 1, comprise the circuit board 11 of the rectangular tabular of a cardinal principle, this circuit board 11 arranges an installation through hole 16 respectively near four edges, and the installation for this COB information issuing module 1 is fixed.This circuit board 11 is provided with the chip mounting slot (referring to Fig. 2 label 111) of multiple array distribution, each chip mounting slot corresponding defines a luminescence unit (not shown).
Referring to Fig. 2, is the amplification view of a luminescence unit.Comprise LED wafer 12, chip mounting slot 111, two gold threads 14 and to be filled in chip mounting slot 111 and to flood the epoxy resin 15 of LED wafer 12.Wherein the bottom of chip mounting slot 111 arranges two circuit contacts 13 respectively, and LED wafer 12 is placed in the bottom of chip mounting slot 111, and these two gold threads 14 connect two electrodes of LED wafer 12 respectively and are soldered to corresponding circuit contact 13.
Refer to Fig. 3, the light that this LED wafer 12 sends is after epoxy resin 15 reflects, and its maximum shooting angle reaches 150 °, and larger visual angle adds the visual range of this COB information issuing module 1.
In other examples, diffusant can also be mixed as required in epoxy resin.
The COB information issuing module 1 that the utility model provides carries out die bond by LED wafer 12 being directly soldered on corresponding circuit contact 13 with gold thread 14, instead of carry out plug-in mounting or paster production by direct insertion or SMD LED lamp bead, production technology simplifies greatly, production efficiency improves a lot, and the thickness of whole COB information issuing module 1 reduces, and size can be wider, stability improves, and advantageously in heat radiation and installation and maintenance.
Above content is in conjunction with concrete execution mode further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made.
Claims (5)
1. a COB information issuing module, it is characterized in that, comprise circuit board, this circuit board is provided with multiple chip mounting slot, the bottom of each chip mounting slot arranges two circuit contacts respectively, each chip mounting slot corresponding arranges a LED wafer, and two electrodes of this LED wafer are soldered to circuit contact corresponding on circuit board respectively by gold thread, are filled with the epoxy resin flooding LED wafer in this chip mounting slot.
2. COB information issuing module as claimed in claim 1, is characterized in that, be mixed with diffusant in this epoxy resin.
3. COB information issuing module as claimed in claim 1, it is characterized in that, the maximum angle of emergence of this LED wafer is
150°。
4. COB information issuing module as claimed in claim 1, is characterized in that, the distribution in array on circuit boards of the plurality of chip mounting slot.
5. the COB information issuing module as described in any one of claim 1-4, is characterized in that, the rectangular structure of this COB information issuing module, it arranges an installation through hole respectively near four edges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701352.5U CN204243080U (en) | 2014-11-20 | 2014-11-20 | COB information issuing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701352.5U CN204243080U (en) | 2014-11-20 | 2014-11-20 | COB information issuing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204243080U true CN204243080U (en) | 2015-04-01 |
Family
ID=52772534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420701352.5U Active CN204243080U (en) | 2014-11-20 | 2014-11-20 | COB information issuing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204243080U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105090874A (en) * | 2015-07-13 | 2015-11-25 | 易美芯光（北京）科技有限公司 | Lateral backlight source module structure |
| CN107911951A (en) * | 2017-11-22 | 2018-04-13 | 田国辉 | A kind of luminescent wafer fixes the method for packing of pcb board |
-
2014
- 2014-11-20 CN CN201420701352.5U patent/CN204243080U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105090874A (en) * | 2015-07-13 | 2015-11-25 | 易美芯光（北京）科技有限公司 | Lateral backlight source module structure |
| CN107911951A (en) * | 2017-11-22 | 2018-04-13 | 田国辉 | A kind of luminescent wafer fixes the method for packing of pcb board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |