CN111822288B

CN111822288B - Substrate baking apparatus and substrate baking method

Info

Publication number: CN111822288B
Application number: CN201910391446.4A
Authority: CN
Inventors: 陈安顺
Original assignee: Group Up Industrial Co ltd
Current assignee: Group Up Industrial Co ltd
Priority date: 2019-04-19
Filing date: 2019-05-10
Publication date: 2022-07-22
Anticipated expiration: 2039-05-10
Also published as: TW202040078A; TWI684739B; CN111822288A

Abstract

The invention discloses a substrate baking method, which comprises the following steps: a feeding step: controlling a feeding device to flatly place a plurality of substrates into a substrate bearing frame one by one; the method comprises the following steps: controlling the moving-in device to convey the substrate bearing frame body bearing the plurality of substrates into a baking channel of the baking device; moving: controlling a channel transfer mechanism in the baking device to enable a substrate bearing frame body arranged in a baking channel to move in the baking channel; a leaving step: the control shifting-out device is used for enabling the substrate bearing frame body bearing the plurality of substrates to leave the baking channel from one outlet end of the baking device; a discharging step: the unloading device is controlled to unload the plurality of substrates one by one from the substrate bearing frame body.

Description

Substrate baking equipment and substrate baking method

Technical Field

The present invention relates to a substrate baking apparatus and a substrate baking method, and more particularly to a substrate baking apparatus and a substrate baking method suitable for a circuit board.

Background

Most of the existing circuit board processing equipment has a substrate spraying device, a mechanical arm and a baking oven. After the base plate is sprayed with paint on the surface by the base plate spraying device, the mechanical arm transfers the base plate to the clamp in the baking furnace one by one. This approach has a number of problems, for example, the robot arm is expensive, which results in an expensive overall circuit board processing equipment; furthermore, the process of transferring the substrate to the jig by using the robot arm takes a lot of time, which results in low efficiency of the whole substrate processing.

Disclosure of Invention

The invention discloses a substrate baking device and a substrate baking method, which are mainly used for solving the problems that the equipment cost is high and a large amount of time is consumed for transferring a large number of substrates into a baking device in the conventional substrate baking method and equipment.

The embodiment of the invention discloses a substrate baking device, which comprises: the baking device comprises a baking channel, two ends of the baking channel are respectively an inlet end and an outlet end, and the baking device can be controlled to enable the baking channel to reach a preset temperature; a substrate supporting frame for supporting a plurality of substrates, the substrate supporting frame comprising: a connecting wall; a plurality of extension walls which are formed by extending one side of the connecting wall to the same direction, wherein a through hole is concavely formed in the wide side surface of each extension wall and penetrates through the extension walls; each extending wall is provided with a plurality of supporting structures, one part of each supporting structure is positioned in the through hole, and each through hole is divided into a plurality of accommodating gaps by the plurality of supporting structures; wherein each support structure of each extension wall is configured to support a portion of each substrate, and the plurality of support structures of the plurality of extension walls are configured to collectively support a plurality of substrates; wherein, the plurality of substrates supported by the plurality of support structures of the plurality of extension walls are correspondingly positioned in the plurality of accommodating gaps of the plurality of extension walls; the feeding device is arranged adjacent to the inlet end and used for horizontally arranging the substrates on the supporting structures of the substrate bearing frame body one by one; a plurality of substrates arranged in the substrate bearing frame by the feeding device, wherein the substrates are respectively supported by one of the supporting structures of the extension walls; the moving-in device is arranged near the inlet end and is used for moving the substrate bearing frame body bearing the plurality of substrates into the baking channel from the feeding device; the channel transfer mechanism is arranged in the baking device and used for moving the substrate bearing frame bodies arranged in the baking channel from the inlet end to the outlet end; the moving-out device is arranged close to the outlet end and is used for moving the substrate bearing frame body bearing the plurality of substrates out of the outlet end of the baking channel to a discharging device; the unloading device is used for unloading a plurality of substrates arranged on the substrate bearing frame body one by one.

Preferably, loading attachment still contains: a carrying platform for carrying the substrate carrying frame; the lifting mechanism is connected with the carrying platform and is used for moving the carrying platform along a longitudinal direction; a substrate conveying device, which comprises a plurality of roller assemblies used for conveying a plurality of substrates; wherein, a plurality of roller assemblies and a plurality of extension walls of the substrate bearing frame body arranged on the carrier are arranged in a staggered way; wherein, when the base plate sets up on a plurality of wheel components, and a plurality of extension walls of base plate bearing frame body pass through the space between a plurality of wheel components, a plurality of bearing structure will be able to correspond the base plate that supports and set up on wheel components.

Preferably, the discharge device further comprises: a carrying platform for carrying the substrate carrying frame; the lifting mechanism is connected with the carrying platform and is used for moving the carrying platform along a longitudinal direction; a substrate conveying device, which comprises a plurality of roller assemblies used for conveying a plurality of substrates; wherein, a plurality of roller components and a plurality of extension walls of the substrate bearing frame body arranged on the carrying platform are arranged in a staggered way; wherein, when the base plate sets up on a plurality of wheel components, and a plurality of extension walls of base plate bearing frame body pass through the space between a plurality of wheel components, a plurality of bearing structure will support the base plate that sets up on wheel component correspondingly.

Preferably, the substrate baking apparatus further comprises a reflow device disposed adjacent to the outlet end, the reflow device being used to move the substrate carrying frame body, which is unloaded one by the moving-out device, to a position adjacent to the inlet end; the feeding device is used for horizontally arranging the substrates one by one in the substrate bearing frame returned by the reflux device.

The embodiment of the invention also discloses a substrate baking method, which comprises the following steps: a material loading step: controlling the feeding device to flatly place the plurality of substrates into the substrate bearing frame one by one so that the plurality of substrates are supported by the plurality of supporting structures; an entering step: controlling the moving-in device to send the substrate bearing frame body bearing a plurality of substrates into the baking channel from the inlet end; a moving step: controlling the channel transfer mechanism to enable the substrate bearing frame body arranged in the baking channel to move from the inlet end to the outlet end; a leaving step: controlling the shifting-out device to enable the substrate bearing frame body bearing the plurality of substrates to leave the baking channel from the outlet end; a material feeding step: controlling the unloading device to unload the plurality of substrates one by one from the substrate bearing frame body; when the unloading device unloads a plurality of substrates from the substrate bearing frame body, the following steps are executed: a reflux step: moving the substrate carrying frame body which does not carry any substrate from a position adjacent to the outlet end to a position adjacent to the inlet end; in the loading step, the loading device is used for arranging a plurality of substrates in the substrate bearing frame body adjacent to the inlet end one by one.

The embodiment of the invention also discloses a substrate baking method, which comprises the following steps: a feeding step: controlling a feeding device to place a plurality of substrates one by one in a substrate bearing frame; the plurality of substrates arranged in the substrate bearing frame body are arranged at intervals; an entering step: controlling a moving-in device to convey the substrate bearing frame body bearing a plurality of substrates into a baking channel of a baking device from an inlet end of the baking device; a moving step: controlling a channel transfer mechanism in the baking device to enable the substrate bearing frame arranged in the baking channel to move in the baking channel; a leaving step: controlling a shifting-out device to enable the substrate bearing frame body bearing the plurality of substrates to leave the baking channel from an outlet end of the baking device; a discharging step: controlling a discharging device to discharge the plurality of substrates one by one from the substrate carrying frame body.

Preferably, the substrate carrying frame body includes: a connecting wall; a plurality of extension walls which are formed by extending one side of the connecting wall to the same direction, wherein a through hole is concavely formed in the wide side surface of each extension wall and penetrates through the extension walls; each extending wall is provided with a plurality of supporting structures, one part of each supporting structure is positioned in the through hole, and each through hole is divided into a plurality of accommodating gaps by the plurality of supporting structures; wherein each support structure of the extension walls is configured to support a portion of each substrate, and the plurality of support structures of the plurality of extension walls are configured to support a plurality of substrates together; the plurality of substrates supported by the plurality of support structures of the plurality of extension walls are correspondingly positioned in the plurality of accommodating gaps of the plurality of extension walls.

Preferably, the discharge device further comprises: a carrying platform for carrying the substrate carrying frame; the lifting mechanism is connected with the carrying platform and is used for moving the carrying platform along a longitudinal direction; a substrate conveying device, which comprises a plurality of roller assemblies used for conveying a plurality of substrates; wherein, a plurality of roller assemblies and a plurality of extension walls of the substrate bearing frame body arranged on the carrier are arranged in a staggered way; wherein, when the base plate sets up on a plurality of wheel components, and a plurality of extension walls of base plate bearing frame body pass through the space between a plurality of wheel components, a plurality of bearing structure will support the base plate that sets up on wheel component correspondingly.

Preferably, when the unloading device unloads the plurality of substrates from the substrate carrying frame, the following steps are performed: a reflux step: moving the substrate carrying frame body which does not carry any substrate from a position adjacent to the outlet end to a position adjacent to the inlet end; in the loading step, the loading device is used for arranging a plurality of substrates in the substrate bearing frame body adjacent to the inlet end one by one.

In summary, the substrate baking method and the substrate baking apparatus of the present invention can greatly increase the speed of transferring a large number of substrates into the baking device, thereby greatly increasing the efficiency of baking a large number of substrates.

For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

FIG. 1 is a schematic side view of a substrate baking apparatus according to the present invention.

FIG. 2 is a schematic flow chart illustrating a substrate baking method according to the present invention.

Fig. 3 is a schematic perspective view of a substrate supporting frame and a loading device according to the present invention.

Fig. 4 is a schematic side view of the substrate supporting frame and the loading device of the present invention.

Fig. 5 is a schematic top view of the substrate supporting frame and the loading device of the present invention.

Fig. 6 to 8 are schematic diagrams illustrating the operation of the loading device of the substrate baking apparatus of the present invention to dispose the substrate in the substrate supporting frame.

Fig. 9 is a schematic view of one embodiment of a transfer-in device (transfer-out device) of the substrate baking apparatus of the present invention.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the general principles of the invention, and not for the purpose of limiting the same.

Referring to fig. 1, a schematic side view of a substrate baking apparatus according to the present invention is shown. As shown, the substrate baking apparatus a includes: a plurality of substrate supporting frames 1, a loading device 2, a baking device 4, a channel transfer mechanism 5, a transfer device 6, a removal device 7, a discharge device 8, a reflow device 90 and a rotation device 91. In various applications, the substrate baking apparatus a may not include the reflow device 90 and the rotating device 91.

The substrate supporting frame 1 is used for supporting a plurality of substrates P, such as various circuit boards. The baking device includes a baking channel 41. The two ends of the baking channel 41 are respectively an inlet end 41A and an outlet end 41B. The baking device 4 can be controlled to bring the baking path 41 to a predetermined temperature. The feeding device 2 is disposed adjacent to the inlet end, and the feeding device 2 is configured to place a plurality of substrates P in the substrate supporting frame 1.

The toasting device 4 may comprise a plurality of heaters, for example, and the heaters may be controlled to reach the predetermined temperature in the toasting channel 41. In a specific application, the baking channel 41 may be divided into a plurality of sections, and the temperatures of the sections may be different from each other, for example, the temperatures of the sections of the baking channel 41 adjacent to the inlet end 41A may be gradually increased, and the temperatures of the sections of the baking channel 41 adjacent to the outlet end 41B may be gradually decreased to the room temperature.

The channel transfer mechanism 5 is disposed in the baking apparatus 4, and the channel transfer mechanism 5 is used for moving the substrate carrying frames 1 disposed in the baking channel 41 from the inlet end 41A to the outlet end 41B. The components of the channel transfer mechanism 5 are not limited herein, and any mechanism capable of moving the substrate holding frame 1 in the baking channel 41 falls within the range of the channel transfer mechanism 5, for example, the channel transfer mechanism 5 can use a mechanism such as a conveyor belt to convey the substrate holding frame 1; alternatively, the passage transfer mechanism 5 may be a mechanism such as a slide rail to transport the substrate holding frame 1.

The moving-in device 6 is disposed adjacent to the feeding device 2 and the inlet port 41A, and the moving-in device 6 is used for conveying the substrate carrier frame 1 carrying a plurality of substrates P by the feeding device 2 into the baking channel 41 through the inlet port 41A. The moving-in device 6 may comprise a slide rail 61 and a clamping jaw assembly 62. The clamping jaw assembly 62 can be controlled to clamp the substrate supporting frame 1, and the clamping jaw assembly 62 can be controlled to move on the slide rail 61, and the clamping jaw assembly 62 can move between the feeding device 2 and the baking channel 41 along the slide rail 61. In a specific application, the clamping jaw assembly 62 can also be controlled to move up and down relative to the slide rail 61, thereby facilitating clamping of the substrate carrying frame 1.

The removing device 7 is disposed adjacent to the outlet end 41B, and the removing device 7 is used for removing the substrate carrying frame 1 carrying a plurality of substrates P from the outlet end 41B of the baking channel 41 to the unloading device 8. The unloading device 8 is used to unload the plurality of substrates P arranged on the substrate holding frame 1 one by one. In practical applications, the removing device 7 may include a clamping jaw assembly 72 and a slide rail 71. The jaw assembly 72 can be controlled to clamp the substrate carrying frame 1, and the jaw assembly 72 can be controlled to move on the slide rails 71, and the jaw assembly 72 can move along the slide rails 71 between the baking path 41 and the unloading device 8. In a specific application, the clamping jaw assembly 72 can also be controlled to move up and down relative to the slide rail 71, thereby facilitating clamping of the substrate carrying frame 1.

The return device 90 is arranged adjacent to the discharge device 8. The reflow device 90 is used for transferring the substrate carrying frame 1, from which the plurality of substrates P are unloaded by the unloading device 8, from the outlet end 41B adjacent to the baking channel 41 to the inlet end 41A adjacent to the baking channel 41.

Please refer to fig. 2, which is a flow chart illustrating a substrate baking method according to the present invention. The substrate baking method of the present invention may be performed using the above substrate baking apparatus a, but is not limited to being performed using only the above substrate baking apparatus a. The substrate baking method comprises the following steps:

a feeding step S1: controlling the feeding device 2 to flatly place a plurality of substrates P into the substrate bearing frame body 1 one by one; wherein, a plurality of substrates P arranged in the substrate bearing frame body 1 are arranged at intervals;

a step S2: controlling the moving-in device 6 to transfer the substrate carrying frame 1 carrying a plurality of substrates P from the inlet end 41A of the baking device 4 into the baking channel 41 of the baking device 4;

a moving step S3: controlling a channel transfer mechanism 5 in the baking device 4 to move the substrate carrying frame 1 disposed in the baking channel 41;

a leave step S4: the removing device 7 is controlled to remove the substrate bearing frame 1 bearing a plurality of substrates P from the baking channel 41 to the unloading device 8 through the outlet end 41B of the baking device 4;

a blanking step S5: controlling the unloading device 8 to unload the plurality of substrates P one by one from the substrate carrying frame 1;

when the unloading device 8 unloads a plurality of substrates P from the substrate carrying frame 1, the following steps are performed:

a return step S6: moving the substrate holding frame 1, which does not hold any substrate P, from a position adjacent to the outlet end 41B to a position adjacent to the inlet end 41A; in the loading step, the loading device 2 sets a plurality of substrates P one by one on the substrate supporting frame 1 located at the inlet end 41A.

In brief, the substrate baking method of the present invention is to firstly place a plurality of substrates P in the substrate supporting frame 1 by the loading device 2, and then to arrange the substrate supporting frame 1 and the plurality of substrates P supported by the substrate supporting frame in the baking channel 41 of the baking device 4 by the moving-in device 6. After the substrate supporting frame 1 and the substrate P supported by the substrate supporting frame have been baked, the channel transferring mechanism 5 of the baking apparatus 4 can cooperate with the removing device 7 to remove the substrate supporting frame 1 and the plurality of substrates P supported by the substrate supporting frame from the baking channel 41. Then, the plurality of substrates P carried by the substrate carrying frame 1 are unloaded one by the unloading device 8; finally, the substrate supporting frame 1, which does not support any substrate P, is moved from a position adjacent to the outlet 41B of the baking channel 41 to a position adjacent to the inlet 41A of the baking channel 41 by the reflow apparatus 90.

Most of the conventional substrate baking methods use a robot arm to set the circuit boards coated with paint on the surface one by one on the hangers, and then move the hangers in a baking apparatus to perform a baking operation. After the circuit board is baked, the circuit board is moved down one by one from the hanger by another mechanical arm. The baking method has many problems, for example, the method uses two high precision robots to mount the circuit board on the cradle or remove the circuit board from the cradle, and therefore the equipment cost is high. In addition, in the substrate baking method, since the circuit board is mounted on the hanger by the robot arm or the circuit board is moved up and down by the hanger, a lot of time is required for mounting and removing the circuit board during the baking operation of a large number of substrates, and the efficiency of the entire baking operation process is low.

In contrast, the substrate baking method of the present invention is to place a plurality of substrates P in the substrate supporting frame 1, and then to place the whole substrate supporting frame 1 and the plurality of substrates P supported thereby in the baking device 4, so that the speed of moving a large number of substrates P into the baking device 4 can be greatly increased, thereby improving the efficiency of the whole baking operation. The substrate housing 1 may be transferred by a simple clamping mechanism, that is, the substrate housing 1 does not need to be transferred by a high-cost robot.

Referring to fig. 3 to 5, in practical applications, the substrate supporting frame 1 may include: a connecting wall 11, four extending walls 12 and a plurality of supporting structures 13. In a specific implementation, the connecting wall 11 may be in a hollow frame shape as shown in fig. 3, but the connecting wall 11 is not limited to be in a frame shape, and in a different embodiment, the connecting wall 11 may also be in a non-hollow sheet structure.

The four extending walls 12 are formed by extending one side of the connecting wall 11 in the same direction (the-Y-axis direction of the coordinates shown in fig. 3). The number of the extension walls 12 can be determined according to the requirement (e.g., the size of the substrate P), and is not limited to four as shown in the figure, but the minimum number of the extension walls 12 is two. The exterior of the extension wall 12 may be a hollow frame as shown in fig. 3, but not limited thereto, and in different embodiments, each extension wall 12 may also be a non-hollow sheet structure.

Each of the extension walls 12 has a through hole 121 (shown in fig. 4) concavely formed in the wide side thereof. Each penetration hole 121 penetrates the extension wall 12. The shape of each through hole 121 is, for example, a rectangle, but not limited thereto, and may be any shape according to the requirement.

Each extension wall 12 is provided with a plurality of support structures 13, a portion of each support structure 13 is located in the through hole 121, and each through hole 121 is divided into a plurality of receiving gaps S by the plurality of support structures 13. Specifically, each support structure 13 is a bar-shaped structure (such as a steel cable), and two opposite ends of each support structure 13 are two inner side walls 122 (shown in fig. 4) facing each other and fixed to the corresponding extension walls 12 to form through holes 121. The number of the supporting structures 13 disposed on each extending wall 12 can be selected according to the requirement, and the number shown in the drawings of the present embodiment is only an exemplary one.

Each extension wall 12 has the same number of support structures 13, and the arrangement positions of the support structures 13 of each extension wall 12 are substantially the same as the arrangement positions of the support structures 13 of the adjacent extension walls 12, and any support structure 13 of any extension wall 12 can support one substrate P together with one support structure 13 corresponding to the rest extension walls 12; that is, each support structure 13 is used to support a portion of the substrate P, and a plurality of support structures 13 adjacent to each other on different extension walls 12 can support one substrate P together. The plurality of substrates P supported by the plurality of supporting structures 13 of the plurality of extending walls 12 are correspondingly located in the plurality of receiving gaps S of the plurality of extending walls 12, so that, in practical applications, the width of the receiving gap S formed between two adjacent supporting structures 13 is greater than the thickness of the substrate P to be carried.

In practical applications, the number of the supporting structures 13 of each extending wall 12 may vary according to requirements, and the number of the supporting structures 13 of each extending wall 12 substantially corresponds to the number of the substrates P that can be carried by the substrate carrying frame 1. For example, if any one of the extension walls 12 has 10 support structures 13, the substrate carrying frame 1 can carry 10 substrates P.

As shown in fig. 4, in an embodiment where the supporting structures 13 are used to support a thin circuit board, each supporting structure 13 may include a flat section 131 and two inclined sections 132, the flat section 131 is located between the two inclined sections 132, the two inclined sections 132 are disposed adjacent to the inner sidewall 122 forming the through hole 121, and each inclined section 132 of each supporting structure 13 is inclined toward the flat section 131. That is, each support structure 13 may appear like an upwardly notched arc in the view shown in fig. 4.

Through the design of the two inclined sections 132 and the gentle sections 131, when the substrate P with a relatively thin thickness is disposed on the supporting structure 13, two side edges of the substrate P will correspondingly abut against the two inclined sections 132 of the supporting structure 13, and the center position of the substrate P will be slightly bent inward under the action of gravity and accordingly abut against the gentle sections 131 of the supporting structure 13, so that the paint will not easily contaminate the substrate carrying frame 1 when the surface of the substrate P is painted with the paint. It should be noted that, in different embodiments, each support structure 13 may not have the inclined section 132, and each support structure 13 may have a straight strip shape.

As described above, the substrate supporting frame 1 mainly utilizes the plurality of supporting structures 13 disposed in the extending walls 12 to support the plurality of substrates P together, and the substrate supporting frame 1 can achieve the technical effect of stably supporting a plurality of substrates P in a large quantity. The substrate carrying frame 1 also has the technical effects of simple structure and low manufacturing cost. In addition, the substrate support frame 1 has a technical effect that it can be easily transported when a plurality of substrates P are supported. It should be noted that the materials of the connecting wall 11, the extending wall 12 and the supporting structure 13 can be selected according to the temperature in the baking device 4, such as stainless steel, but not limited thereto.

Referring to fig. 3 and 8, it is particularly noted that when the substrate supporting frame 1 of the present invention is used for supporting a circuit board with a painted surface, the extending walls 12 of the substrate supporting frame 1 may extend along a normal direction of the connecting wall 11 (a-Y-axis direction of a coordinate shown in fig. 3), wide side surfaces of the extending walls 12 adjacent to each other are disposed facing each other, and the supporting structures 13 are also disposed along a normal direction of the connecting wall 11 (a-Y-axis direction of a coordinate shown in fig. 3), so that when the substrate P is supported by the supporting structures 13 of the extending walls 12, the substrate P may be in a substantially flat state, and the paint on the surface of the substrate P will not be easily stained to the adjacent components. In other words, when a plurality of substrates P are disposed in the substrate carrying frame 1, the wide side surface of the substrate P is the wide side surface 111 (shown in fig. 5) extending substantially perpendicular to the connecting wall 11 and formed with the extending wall 12.

As shown in fig. 3 to 5, the feeding device 2 includes a carrier 21, a lifting mechanism 22, and a substrate conveying device 3. The stage 21 is for carrying the substrate holding frame 1. The stage 21 is connected to an elevating mechanism 22, and the elevating mechanism 22 can be controlled to move the stage 21 in the longitudinal direction (for example, the Z-axis direction of the coordinates shown in the figure). The shape of the stage 21 and the connection manner of the stage 21 and the lifting mechanism 22 are not limited herein, and any structure capable of smoothly carrying the substrate supporting frame 1 can be used as the stage 21, and any mechanism capable of moving the stage 21 in the longitudinal direction (preferably vertically up and down) falls within the scope of the implementation of the lifting mechanism 22.

The substrate transport apparatus 3 includes a plurality of roller assemblies 31. Each of the roller assemblies 31 can be controlled to rotate in the same direction, and a plurality of roller assemblies 31 can be simultaneously rotated to transfer the substrate P. Specifically, the substrate transportation device 3 may include a first fixing structure 32, the first fixing structure 32 is configured to be fixedly disposed on the machine body, and the plurality of roller assemblies 31 are fixedly disposed on the first fixing structure 32. Each roller assembly 31 may include a support frame 311, a first roller 312 and a second roller 313. One end of the supporting frame 311 is fixed to the first fixing structure 32, and the other end of the supporting frame 311 is provided with a second fixing structure 314. One end of the first roller 312 is fixed to the first fixing structure 32, the other end of the first roller 312 is connected to the second roller 313, and the end of the second roller 313 opposite to the end connected to the first roller 312 is fixed to the second fixing structure 314.

As shown in fig. 4, the first roller 312 and the second roller 313 of each roller assembly 31 may be disposed to be inclined toward a position where they are connected to each other, that is, the first roller 312 and the second roller 313 may be arranged in a substantially V-shape as viewed from a side view of each roller assembly 31. Of course, in different applications, the first roller 312 and the second roller 313 of each roller assembly 31 may be disposed in a non-inclined manner, and the first roller 312 and the second roller 313 may be arranged in a substantially straight line when viewed from the side of each roller assembly 31. In addition, each roller assembly 31 may only include a single roller.

It should be noted that each roller assembly 31 may further include a spring 315. The spring 315 is disposed at a position where the first roller 312 and the second roller 313 are connected.

As shown in fig. 3 and 4, when the stage 21 is at the initial position (i.e. the substrate carrier 1 is not carrying the substrate P at all), the substrate carrier 1 disposed on the stage 21 is correspondingly located under the substrate conveying device 3, but the substrate carrier 1 is not in contact with the substrate conveying device 3, and the plurality of extending walls 12 and the plurality of roller assemblies 31 of the substrate carrier 1 are alternately disposed, i.e. each extending wall 12 is correspondingly located in a gap formed between two adjacent roller assemblies 31; meanwhile, the connecting wall 11 of the substrate supporting frame 1 is located away from the first fixing structure 32 of the substrate conveying device 3, that is, the connecting wall 11 of the substrate supporting frame 1 is located at the right side of fig. 3, and the first fixing structure 32 is correspondingly located at the left side of fig. 3, so that when the carrier 21 is driven by the lifting mechanism 22 to move along the longitudinal direction, the connecting wall 11 will not collide with the first fixing structure 32, and the extending walls 12 will correspondingly pass through the gaps between the roller assemblies 31, and the extending walls 12 and the roller assemblies 31 will not collide with each other; in contrast, when the substrate carrying frame 1 moves along the longitudinal direction along with the stage 21, the plurality of roller assemblies 31 can pass through the gaps between the plurality of extending walls 12, and the spacing distance D1 (shown in fig. 5) between two extending walls 12 adjacent to each other is larger than the width of a single roller assembly 31.

As shown in fig. 6, in practical applications, one side of the substrate conveying device 3 may be disposed adjacent to a substrate conveying device B of a substrate painting apparatus, and the substrate conveying device B of the substrate painting apparatus can be controlled to convey the substrate P with paint on the surface thereof by the painting operation into the substrate conveying device 3 and the substrate carrying frame 1.

Specifically, the substrate conveying device B of the substrate painting apparatus, the loading device 2 of the substrate baking apparatus a, and the substrate conveying device 3 may be connected to a control device (not shown), such as various computer apparatuses, and the control device may control the substrate painting apparatus and the substrate baking apparatus a to move the substrate P with paint on the surface thereof to the substrate carrying frame 1.

The way of the control device specifically controlling the substrate conveying device B and the substrate baking device a of the substrate painting device may be: the loading device 2 is first controlled to move so that the carrier 21 moves along the longitudinal direction toward the direction close to the plurality of roller assemblies 31 until one of the support structures 13 of each of the extension walls 12 of the substrate carrying frame 1 disposed on the carrier 21 is disposed adjacent to the plurality of roller assemblies 31. Then, the control device controls the substrate conveying device B and the plurality of roller assemblies 31 of the substrate painting apparatus to move the substrate P from the substrate conveying device B to the plurality of roller assemblies 31.

As shown in fig. 6 to 8, when the substrate P is moved onto the roller assemblies 31, since one of the supporting structures 13 of each extending wall 12 is disposed adjacent to a plurality of the roller assemblies 31, the substrate P can be simultaneously supported by a plurality of the supporting structures 13 and a plurality of the roller assemblies 31.

When the substrate P is supported by the plurality of support structures 13 and the plurality of roller assemblies 31 at the same time, the control device controls the feeding device 2 to operate, so that the carrier 21 moves along the longitudinal direction again, at this time, the substrate P, which is originally simultaneously disposed on the plurality of roller assemblies 31 and the plurality of support structures 13, will be jacked up by the plurality of support structures 13, and the substrate P will move relative to the plurality of roller assemblies 31 along with the substrate carrier 1, and then the substrate P will leave the plurality of roller assemblies 31, and the substrate P will be supported only by the plurality of support structures 13 in the substrate carrier 1.

As described above, the control device repeatedly controls the loading device 2, the substrate conveying device 3, and the substrate conveying device B of the substrate painting apparatus to operate, so that the substrates P can be arranged in the substrate carrier 1 one by one, and the control device can control the transfer device 6 to transfer the substrate carrier 1 carrying a plurality of substrates P to the baking channel 41 after all the supporting structures 13 of the substrate carrier 1 carry the substrates P.

It is particularly emphasized that, in different embodiments, when the substrate P is disposed on the plurality of roller assemblies 31, the plurality of supporting structures 13 of the substrate supporting frame 1 may not support the substrate P together with the plurality of roller assemblies 31, and the plurality of supporting structures 13 are only correspondingly located below the substrate P, and then, when the control device controls the substrate supporting frame 1 to move along the longitudinal direction, the plurality of supporting structures 13 located below the substrate P will jack up the substrate P, and the substrate P originally supported by the plurality of roller assemblies 31 will be supported by the plurality of supporting structures 13.

Referring back to fig. 5, when the substrate supporting frame 1 is disposed on the carrier 21, the plurality of extending walls 12 are correspondingly located between the plurality of roller assemblies 31, and when the substrate supporting frame 1 moves along the carrier 21 in the longitudinal direction, the substrate supporting frame 1 does not contact the roller assemblies 31, so in different embodiments, in the process of disposing the first substrate P in the substrate supporting frame 1, the substrate P may also be moved onto the plurality of roller assemblies 31 first, and then the feeding device 2 is controlled to move, so that the substrate supporting frame 1 moves relative to the roller assemblies 31. In other words, the flow of the control device controlling the substrate transportation device 3 and the loading device 2 is not limited to the above description, and may be changed according to the needs in practical applications.

In practice, the discharging device 8 may have the same components as the loading device 2, and the discharging device 8 has the same connection relationship between the components as described above with respect to the loading device 2, but the discharging device 8 acts in the opposite way to the loading device 2. Specifically, as shown in fig. 4, 6, and 7, the loading device 2 gradually raises the elevating mechanism 22 upward, and sets the substrates P conveyed by the substrate conveying device 3 one by one in the substrate holding frame 1 in accordance with the substrate conveying device 3. Conversely, the unloading device 8 gradually lowers the lifting mechanism 22 to gradually lower the substrate supporting frame 1 relative to the plurality of roller assemblies 31, and during the process of gradually lowering the substrate supporting frame 1, the substrate P originally located in the substrate supporting frame 1 is supported by the plurality of roller assemblies 31, and the roller assemblies 31 can transfer the substrate P elsewhere.

The reflow device 90 is disposed adjacent to the outlet port 41B, and the reflow device 90 is used for transferring the substrate carrying frame 1, which is unloaded one by the removing device 7, to the inlet port 41A. The feeding device 2 is configured to place a plurality of substrates P one by one in the substrate carrying frame 1 returned by the reflow device 90. In practical applications, the reflow apparatus 90 may include a conveyor belt or a plurality of roller bars, and the conveyor belt or the roller bars can be controlled to support the substrate supporting frame 1, so that the substrate supporting frame 1 moves from a position adjacent to the outlet end 41B to a position adjacent to the inlet end 41A.

In practical applications, a rotating device 91 may be disposed between the reflow apparatus 90 and the discharging apparatus 8, and the rotating device 91 may include a rotating platform 911. After the unloading operation by the unloading device 8, the substrate holding frame 1, on which the plurality of substrates P are not mounted, may be transferred to the turntable 911, and the turntable 911 may rotate the substrate holding frame 1 by a predetermined angle (for example, 90 degrees) and then the substrate holding frame 1 may be introduced into the reflow device 90. By rotating the substrate holding frame 1 and then entering the reflow apparatus 90, the substrate holding frame 1 can be more easily transported in the reflow apparatus 90.

Referring to fig. 9, a schematic diagram of a transfer device of a substrate baking apparatus according to an embodiment of the invention is shown. As shown, the moving-in device 6 may include a slide rail 61, a clamping jaw assembly 62 and a longitudinal slide rail 63. The jaw assembly 62 is connected to a longitudinal slide 63, and the jaw assembly 62 can be controlled to move in a longitudinal direction (the Z-axis direction of the coordinates shown in the figures). The longitudinal slide 63 is connected to the slide 61, and the longitudinal slide 63 can be controlled to move in a transverse direction (the X-axis direction of the coordinates shown in the figure). That is, the moving-in device 6 can be controlled to move the jaw assembly 62 in the longitudinal direction, the lateral direction.

In practical applications, the jaw assembly 62 may include a plurality of jaws 621. Each jaw 621 may be a fixed structure or may be a motorized member (e.g., a motorized clamp), without limitation. The slide rail 61, the clamping jaw assembly 62 and the longitudinal slide rail 63 can cooperate with each other to fixedly hold the substrate supporting frame 1 disposed on the feeding device 2. As shown in fig. 1 and 9, specifically, after the loading device 2 makes the substrate supporting frame 1 supported by the loading device carry a plurality of substrates, the related control device (such as a computer device, etc.) can control the moving-in device 6 to move the clamping jaw assembly 62 to a position adjacent to the substrate supporting frame 1, and then the control device can control the moving-in device 6 to make the clamping jaw assembly 62 hold (for example, by using a hook manner or an electric clamping manner) the substrate supporting frame 1; next, the control device may control the chuck assembly 62 to move in the longitudinal direction, so as to separate the substrate holding frame 1 from the stage 21. The control device then controls the moving-in device 6 to move the clamping jaw assembly 62 and the substrate carrying frame 1 held thereby in the transverse direction to move into the baking device 4. When the clamping jaw assembly 62 and the substrate carrying frame 1 held by the clamping jaw assembly are transferred to the baking device 4, the control device can control the moving-in device 6 to move again, so that the clamping jaw assembly 62 no longer holds the substrate carrying frame 1, and the substrate carrying frame 1 is placed in the baking device 4. When the transfer device 6 has placed the substrate carrier 1 held by it in the baking device 4, the control device will control the transfer device 6 to move, so that the clamping jaw assembly 62 moves to the periphery of the loading device 2.

In short, the substrate carrying frame 1 is moved from the loading device 2 to the baking device 4 by the moving-in device 6 in the following manner: the control device controls the clamping jaw assembly 62 of the moving-in device 6 to fix the substrate bearing frame 1, and then controls the clamping jaw assembly 62 to move along the longitudinal direction, so that the substrate bearing frame 1 fixed by the clamping jaw assembly 62 leaves the carrier 21; then, the control device moves the control jaw assembly 62 in the transverse direction to make the substrate carrying frame 1 held by the moving-in device 6 enter the baking device 4; finally, the control device controls the action of the clamping jaw assembly 62, so that the clamping jaw assembly 62 no longer holds the substrate carrying frame 1, and the substrate carrying frame 1 is placed in the baking device 4.

In the embodiment shown in fig. 9 and described above, the moving-in device 6 is taken as an example, and in practical applications, the moving-out device 7 may have the same components and transfer the substrate holding frame 1 from the baking device 4 to the unloading device 8 in the same manner, which is not described herein again.

In summary, the substrate baking method of the present invention is to dispose the substrate supporting frame carrying a plurality of substrates in the baking apparatus, so as to greatly increase the speed of moving a large number of substrates into the baking apparatus; and the substrate carrying frame body can be moved into the baking device by a cheaper means compared with a mechanical arm, so the substrate carrying device has the technical effect of lower production cost.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that the equivalent technical changes made by using the contents of the present specification and the drawings are included in the protection scope of the present invention.

Claims

1. A substrate baking apparatus, comprising:

the baking device comprises a baking channel, wherein the two ends of the baking channel are respectively an inlet end and an outlet end, and the baking device can be controlled to enable the baking channel to reach a preset temperature;

a substrate carrying frame for carrying a plurality of substrates, the substrate carrying frame comprising:

a connecting wall;

a plurality of extension walls extending in the same direction from one side of the connection wall, each of the extension walls having a through hole formed in a concave shape on a wide side thereof, the through holes being provided so as to penetrate the extension walls; each extension wall is provided with a plurality of support structures, a part of each support structure is positioned in the through hole, and each through hole is divided into a plurality of accommodating gaps by the support structures;

wherein each of the support structures of each of the extension walls is configured to support a portion of each of the substrates, and a plurality of the support structures of a plurality of the extension walls are configured to collectively support a plurality of the substrates;

wherein the plurality of substrates supported by the plurality of support structures of the plurality of extension walls are correspondingly positioned in the plurality of receiving gaps of the plurality of extension walls;

the feeding device is arranged adjacent to the inlet end and is used for horizontally arranging the substrates on the supporting structures of the substrate bearing frame body one by one; a plurality of substrates disposed in the substrate carrier frame by the loading device, each of the substrates being supported by one of the support structures of each of the extension walls;

the moving-in device is arranged close to the inlet end and is used for moving the substrate bearing frame body bearing a plurality of substrates into the baking channel from the feeding device;

a channel transfer mechanism disposed in the baking device, the channel transfer mechanism being configured to move the substrate carrier frames disposed in the baking channel from the inlet end to the outlet end;

the moving-out device is arranged close to the outlet end and is used for moving the substrate bearing frame body bearing a plurality of substrates out of the outlet end of the baking channel to a discharging device; the unloading device is used for unloading the substrates arranged on the substrate bearing frame body one by one.

2. The substrate baking apparatus of claim 1, wherein the loading device further comprises:

the carrying platform is used for carrying the substrate carrying frame body;

the lifting mechanism is connected with the carrying platform and is used for moving the carrying platform along a longitudinal direction;

a substrate conveying device comprising a plurality of roller assemblies for conveying a plurality of substrates;

wherein the plurality of roller assemblies and the plurality of extending walls of the substrate bearing frame body arranged on the carrier are arranged in a staggered manner;

when the substrate is disposed on the plurality of roller assemblies and the plurality of extending walls of the substrate bearing frame body pass through gaps between the plurality of roller assemblies, the plurality of supporting structures can correspondingly support the substrate disposed on the roller assemblies.

3. The substrate baking apparatus of claim 1, wherein the unloading unit further comprises:

the carrying platform is used for carrying the substrate carrying frame body;

the lifting mechanism is connected with the carrying platform and is used for enabling the carrying platform to move along a longitudinal direction;

4. The substrate baking apparatus of claim 1, further comprising a reflow device disposed adjacent to the outlet end, the reflow device being used to transfer the substrate carrier frame, which is unloaded one by the removing device, to a position adjacent to the inlet end; the feeding device is used for horizontally arranging the substrates one by one in the substrate bearing frame returned by the reflux device.

5. A substrate baking method, comprising:

a material loading step: controlling a feeding device to flatly place a plurality of substrates one by one into a substrate bearing frame body; the substrates arranged in the substrate bearing frame body are arranged at intervals;

an entering step: controlling a moving-in device to convey the substrate bearing frame body bearing a plurality of substrates into a baking channel of a baking device from an inlet end of the baking device;

a moving step: controlling a channel transfer mechanism in the baking device to enable the substrate bearing frame arranged in the baking channel to move in the baking channel;

a leaving step: controlling a shifting-out device to enable the substrate bearing frame body bearing the plurality of substrates to leave the baking channel from an outlet end of the baking device;

a discharging step: controlling a discharging device to discharge the substrates one by one from the substrate bearing frame body; wherein, the substrate bearing frame body comprises: a connecting wall;

a plurality of extension walls which are formed by extending one side of the connection wall in the same direction, wherein a through hole is concavely formed in the wide side surface of each extension wall, and the through hole is arranged through the extension walls; each extending wall is provided with a plurality of supporting structures, a part of each supporting structure is positioned in the through hole, and each through hole is divided into a plurality of accommodating gaps by the plurality of supporting structures;

wherein each of said support structures of said extension walls is adapted to support a portion of each of said substrates, and a plurality of said support structures of a plurality of said extension walls are adapted to collectively support a plurality of said substrates;

the plurality of substrates supported by the plurality of support structures of the plurality of extension walls are correspondingly positioned in the plurality of accommodating gaps of the plurality of extension walls.

6. The substrate baking method according to claim 5, wherein the loading device further comprises:

the carrying platform is used for carrying the substrate carrying frame body;

when the substrate is disposed on the plurality of roller assemblies and the plurality of extending walls of the substrate carrying frame pass through gaps between the plurality of roller assemblies, the plurality of supporting structures can correspondingly support the substrate disposed on the roller assemblies.

7. The substrate baking method according to claim 5, wherein the unloading device further comprises:

the carrying platform is used for carrying the substrate carrying frame body;

8. The substrate baking method according to claim 5, wherein when the unloading device unloads a plurality of substrates from the substrate carrying frame, the following steps are performed:

a reflux step: moving the substrate carrier frame, which is not carrying any substrate, from a position adjacent to the outlet end to a position adjacent to the inlet end; in the loading step, the loading device arranges the substrates one by one in the substrate bearing frame body adjacent to the inlet end.