CN111799233A - 具有连接至半导体管芯的上表面处的端子的导电夹的四边封装 - Google Patents
具有连接至半导体管芯的上表面处的端子的导电夹的四边封装 Download PDFInfo
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- CN111799233A CN111799233A CN202010273675.9A CN202010273675A CN111799233A CN 111799233 A CN111799233 A CN 111799233A CN 202010273675 A CN202010273675 A CN 202010273675A CN 111799233 A CN111799233 A CN 111799233A
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Abstract
一种封装半导体器件包括:具有管芯附接表面的载体;安装在管芯附接表面上的半导体管芯,其包括设置在上侧上的第一和第二导电端子;在半导体管芯之上延伸并且电连接至第一导电端子的第一夹;在半导体管芯之上延伸并且电连接至第二导电端子的第二夹;以及包封半导体管芯的电绝缘包封主体。第一夹的外端从包封主体露出,并且为第一导电端子提供外部电接触点。第二夹的外端与第一夹从包封主体的相同的或不同的侧面露出,并且为第二导电端子提供外部电接触点。
Description
技术领域
本发明的实施例涉及半导体封装和半导体封装的制造方法。
背景技术
半导体封装通常用于在半导体管芯与诸如印刷电路板(PCB)的外部设备之间提供连接兼容性。另外,半导体封装保护半导体管芯免受有可能造成损坏的环境条件(例如,温度变化、湿度、尘粒等)的影响。
需要高电压和/或电流转换的功率应用对于半导体封装的设计具有特殊的设计要求。功率半导体封装应当在半导体管芯与外部端子之间提供低电阻电连接。此外,功率半导体封装应当被设计为适应可能引起封装材料的热膨胀的高温操作。用于管理这些高电流和高温的常规的解决方案包括缩短接合线长度以及使用有保险丝的引线。然而,这些解决方案在现代化功率应用中正在达到实际的极限。此外,有保险丝的引线设计对于给定尺寸的封装而言,减少了I/O(输入/输出)数量。
因此,存在对在小的封装占据区域内具有高电流承载能力、低热电阻和高I/O数量的功率半导体封装的需求。
发明内容
公开了一种封装半导体器件。根据实施例,所述封装半导体器件包括:包括管芯附接表面的载体;安装在管芯附接表面上的半导体管芯,所述半导体管芯包括设置在半导体管芯的与载体相对的上侧上的第一和第二导电端子;在半导体管芯的上侧之上延伸并且电连接至第一导电端子的第一夹;在半导体管芯的上侧之上延伸并且电连接至第二导电端子的第二夹;以及包封半导体管芯的电绝缘包封主体。第一夹的外端从包封主体的侧面露出,并且为第一导电端子提供外部电接触点。第二夹的外端与第一夹的外端从包封主体的相同的或不同的侧面露出,并且为第二导电端子提供外部电接触点。
单独地或者组合地,所述封装半导体器件还包括多条第一导电引线,所述多条第一导电引线均背离载体的第一侧延伸,并且第一夹相对于第一导电引线被横断地定向。
单独地或者组合地,所述半导体管芯还包括设置在上侧上的多个附加导电端子,所述封装半导体器件还包括将所述附加导电端子中的每者分别电连接至第一引线之一的导电连接器,并且第一夹相对于所述导电连接器被横断地定向。
单独地或组合地,所述包封主体包括在半导体管芯的上侧之上延伸的上表面、与上表面相对的下表面以及在上表面和下表面之间延伸的第一侧面和第二侧面,第一侧面和第二侧面形成相互成角度的相交,第一引线中的每者从第一侧面伸出,并且第一夹从第二侧面伸出。
单独地或组合地,第二夹从包封主体的第二侧面伸出。
单独地或者组合地,包封主体包括均在上表面和下表面之间延伸的第三侧面和第四侧面,第一侧面、第二侧面、第三侧面和第四侧面共同形成矩形,并且第二夹从包封主体的第三侧面和第四侧面伸出。
单独地或者组合地,所述封装半导体器件还包括多条第二导电引线,所述多条第二导电引线均朝与第一导电引线相反的方向背离载体的第二侧延伸,第二导电引线中的每者从包封主体的第三侧面伸出,并且第二夹从包封主体的第四侧面伸出。
单独地或组合地,第一夹从包封主体的第二侧面和第四侧面伸出,并且第三夹从包封主体的第三侧面伸出。
单独地或组合地,所述封装半导体器件还包括多条第三导电引线,多条第三导电引线均背对载体的第三侧并且背离载体的第三侧延伸,第三导电引线垂直于第一导电引线延伸,第三引线中的每者从包封主体的第四侧面伸出,并且第二夹从包封主体的第三侧面伸出。
单独地或者组合地,所述半导体管芯还包括设置在上侧上的第三导电端子,所述封装半导体器件还包括在半导体管芯的上侧之上延伸并且电连接至第三导电端子的第三夹,并且第三夹从包封主体的第四侧面伸出。
单独地或者组合地,第一夹和第二夹的背对半导体管芯的上表面的上表面完全被包封主体的包封材料所覆盖。
单独地或者组合地,第一夹和第二夹的背对半导体管芯的上表面的上表面从包封主体的包封材料露出。
单独地或者组合地,半导体管芯包括集成于其中的第一开关器件和第二开关器件,第一开关器件和第二开关器件中的每者包括控制端子、第一输出端子和第二输出端子,第一导电端子是通往第一开关器件的第一输出端子的接合焊盘连接,并且第二导电端子是通往第二开关器件的第一输出端子的接合焊盘连接。
单独地或者组合地,第一开关器件的第一输出端子和第二开关器件的第一输出端子均为漏极端子,其中,第一开关器件的第二输出端子和第二开关器件的第二输出端子均为源极端子,并且其中,第一开关器件的第二输出端子和第二开关器件的第二输出端子均直接面向载体并且与所述载体电连接。
根据另一个实施例,所述封装半导体器件包括:包括管芯附接表面的载体;安装在管芯附接表面上的半导体管芯;包封半导体管芯的电绝缘包封主体;以及部分地从电绝缘包封主体露出并且在半导体管芯的与载体相对的上侧之上延伸的第一夹和第二夹。半导体管芯包括集成于其中的第一开关器件和第二开关器件。第一开关器件和第二开关器件中的每者包括控制端子、第一输出端子和第二输出端子,第一夹经由所述上表面处的接合焊盘连接电连接至第一开关器件的第一输出端子。第二夹经由所述上表面处的接合焊盘连接电连接至第二开关器件的第一输出端子。
单独地或者组合地,所述封装半导体器件还包括:多条第一导电引线,所述多条第一导电引线与第一夹和第二夹从包封主体的不同的侧面伸出;以及将第一导电引线连接至设置在半导体管芯的上表面上的附加端子的电连接器,第一引线为第一开关器件和第二开关器件的控制端子提供单独的外部电接触点,并且至少第一夹相对于所述第一导电引线被横断地定向,并且相对于所述电连接器被横断地定向。
公开了一种形成封装半导体器件的方法。根据实施例,所述方法包括:提供包括管芯附接表面的载体;将半导体管芯安装在管芯附接表面上,使得第一导电端子和第二导电端子设置在半导体管芯的与载体相对的上侧上;提供在半导体管芯的上侧之上延伸并且电连接至所述第一导电端子的第一夹;提供在半导体管芯的上侧之上延伸并且电连接至第二导电端子的第二夹;以及提供包封半导体管芯的电绝缘包封主体。第一夹和第二夹的外端从包封主体露出。
单独地或者组合地,所述方法还包括:提供多条第一导电引线,所述多条第一导电引线均背离载体的第一侧延伸;以及将第一夹附接至第一导电端子使得第一夹相对于第一导电引线被横断地定向。
单独地或者组合地,所述半导体管芯还包括设置在上侧上的多个附加导电端子,并且所述方法还包括:提供将所述附加导电端子中的每者分别电连接至第一引线之一的导电连接器;以及将第一夹附接至第一导电端子,使得第一夹相对于所述导电连接器被横断地定向。
单独地或者组合地,提供包封主体包括采用包封主体的包封材料完全覆盖第一夹和第二夹的背对半导体管芯的上表面的上表面。
单独地或者组合地,所述方法还包括在完全覆盖第一夹和第二夹的上表面之后,将包封材料从包封主体去除,使得第一夹和第二夹的上表面露出并且与包封主体的上表面共面。
本领域技术人员在阅读了下面的具体实施方式并且在查看了附图之后将认识到附加的特征和优点。
附图说明
附图中的元件未必是相对于彼此按比例绘制的。类似的附图标记表示对应的类似的部分。可以对各种例示实施例中的特征进行组合,除非它们彼此排斥。在附图中描绘了实施例并且将在下文中的描述中对实施例进行详述。
包括图1A、图1B、图2A和图2B的图1-图2示出了根据实施例的半导体封装。
图3示出了根据实施例的结合到图1-图2的半导体封装中的半导体管芯的示意性等同方案。
包括图4A和图4B的图4示出了根据另一个实施例的半导体封装。
包括图5A和图5B的图5示出了根据另一个实施例的半导体封装。
包括图6A和图6B的图6示出了根据另一个实施例的半导体封装。
包括图7A和图7B的图7示出了根据另一个实施例的半导体封装。
包括图8A和图8B的图8示出了根据另一个实施例的半导体封装。
包括图9A、图9B、图9C和图9D的图9示出了根据另一个实施例的形成半导体封装的方法中的步骤。
包括图10A、图10B、图10C和图10D的图10示出了根据另一个实施例的形成半导体封装的方法中的其他步骤。
具体实施方式
本文描述的实施例提供了具有有利的多通道夹构造的封装半导体器件。在一个示例性实施例中,封装半导体器件包括功率半导体管芯(例如,200V或更高额定功率MOSFET)以及与功率半导体管芯的上侧的导电端子电连接的两个或更多导电夹。这些夹从半导体管芯通过包封主体的侧面连续延伸,从而为管芯的导电端子提供外部电接触点。除了夹,封装半导体器件还包括为半导体管芯的端子提供附加的外部电接触点的导电引线。夹相对于引线以及处于管芯与引线之间的相关联的接合线被横断地定向。作为这种设计的结果,夹为高电流通道(例如,MOSFET器件的漏极输出端)提供专用的低电阻连接,并且为引线建立附加的I/O容量。
图1A、图1B、图2A和图2B示出了半导体封装100的实施例。图1A从截面视角示出了所完成的半导体封装100。图1B从相对于图1A的截面视角旋转了90度的第二截面视角示出了所完成的半导体封装100。图2A示出了在组装期间且没有包封材料的半导体封装100的平面图。图2B示出了所完成的半导体封装100的平面图。
半导体封装100包括载体结构。在这个实施例中,将载体结构实施为引线框架,该引线框架包括处于中央位置的管芯底座(paddle)102以及远离管芯底座102延伸的多条导电引线104。管芯底座102包括容纳在其上的一个或多个半导体管芯的安装的平面管芯附接表面106。一般而言,包括管芯底座102和引线104的载体结构可以包括诸如铜、铝等及其合金的导电金属。在所描绘的实施例中,引线框架具有下陷构造,其中,管芯底座102垂直偏移到引线104下方。在其他实施例中,管芯底座102和引线104相互共面或者接近共面。
半导体管芯108安装在载体的管芯附接表面106上。半导体管芯108被安装为使得半导体管芯108的背侧110面对并且附接至管芯附接表面106,并且半导体管芯108的上侧112背对载体。如图1A所示,半导体管芯108的上侧112包括第一导电端子114和第二导电端子116。如图1B所示,半导体管芯108的上侧112包括附加导电端子118。这些附加导电端子118是与被结合到半导体管芯108中的器件的I/O端子有区别的端子。根据实施例,导电端子114、116、118中的每者是导电接合焊盘。
半导体封装100包括第一导电夹120和第二导电夹122。第一导电夹120和第二导电夹122均在半导体管芯108的上侧112之上延伸。因而,第一导电夹120和第二导电夹122布置在半导体管芯108的与载体相对的一侧上。第一导电夹120附接至第一导电端子114并且与之电连接。第二导电夹122附接至第二导电端子116并且与之电连接。可以使用导电粘合剂(例如,焊料、烧结剂、导电胶、导电胶带等)来实施该连接。任选地,可以在夹与导电端子之间提供中间结构,例如,焊料球、柱等。
半导体封装100包括电绝缘包封主体124。包封主体124的材料被形成为完全包封(即覆盖并包围)半导体管芯108以及与半导体管芯108的端子的相关联的电连接。
包封主体124包括相对面对的上表面126和下表面128。在所描绘的实施例中,包封主体124的上表面126在第一导电夹120和第二导电夹122的上表面之上延伸并与之间隔开。因此,第一导电夹120和第二导电夹122的上表面完全被包封主体124的包封材料所覆盖。在所描绘的实施例中,包封主体124的下表面128与载体的下侧共面。作为结果,载体的下侧从包封主体124露出,并且可以提供电端子和/或热沉接口。在其他实施例中,载体的下侧可以被包封材料所覆盖。
包封主体124包括在包封主体124的上表面126与下表面128之间垂直延伸的侧面130。在所描绘的实施例中,每个侧面130包括分别不垂直于上侧和下侧的两个成角度的面。也就是说,侧面130在垂直方向内呈略微的V形。替代地,侧面130可以垂直于上表面126和下表面128。根据实施例,包封主体124包括形成相互成角度的相交的第一侧面132和第二侧面134(如图2B中所示)。这意味着,从包封主体124的平面视角,第一侧面132和第二侧面134在不同的方向上延伸,并且在包封主体124的拐角处相互遇到。例如,在所描绘的实施例中的每者中,包封主体124包括共同地形成矩形的第一侧面132、第二侧面134、第三侧面136和第四侧面138。也就是说,当从平面视角来看(例如,如图2B中所示)时,第一侧面132与第二侧面134以九十度角相交,第二侧面134与第三侧面136以九十度角相交,等等。更一般而言,包封主体124的侧面可以被配置为各种各样的闭合几何形状中的任何闭合几何形状,包括锐角和钝角的闭合几何形状。
第一导电夹120和第二导电夹122的外端140从包封主体124露出。作为结果,第一导电夹120的外端140为第一导电端子114提供了外部电接触点。类似地,第二导电夹122的外端140为第二导电端子116提供了外部电接触点。第二导电夹122的外端140与第一导电夹120的外端140可以从包封主体124的相同的或不同的侧面130露出。例如,在图1-图2的实施例中,第一导电夹120从包封主体124的第二侧面134伸出,并且第二导电夹122从包封主体124的第四侧面138伸出。因而,与第一导电夹120的外端140从其露出的包封主体124的侧面130(第二侧面134)相比,第二导电夹122的外端140从包封主体124的不同的侧面130(第四侧面138)露出。
如图所示,第一导电夹120和第二导电夹122在几个位置处发生弯曲,使得这些夹的外端140与包封主体124的下表面128共面,由此提供与所谓的鸥翼式引线构造类似的几何形状。更一般而言,第一导电夹120和第二导电夹122可以被配置为提供各种各样的封装端子构造中的任何封装端子构造,例如,表面安装构造、通孔构造、无引线构造等。
半导体封装100包括多条第一导电引线142,多条第一导电引线142均背离载体的第一侧延伸,并且从包封主体124的第一侧面132伸出。另外,半导体封装100还包括多条第二导电引线144,多条第二导电引线144均背离载体的第二侧延伸,并且从包封主体124的第三侧面136伸出。因而,第一导电引线142和第二导电引线144朝相反的方向背离载体延伸。第一导电引线142和第二导电引线144可以被提供为引线框架结构的部分。图2A示出了未修整的引线框架结构的示例。第一导电引线142和第二导电引线144电连接至设置在半导体管芯108的上侧112上的附加导电端子118。因而,第一导电引线142和第二导电引线144的外端以与上文描述的夹类似的方式提供了通往半导体管芯108的不同端子的外部接入点。半导体封装100包括在附加端子与引线104中的各个引线之间延伸的导电连接器146,以提供必要的电连接。如图所示,这些导电连接器146是通过导电接合线提供的。更一般而言,这些导电连接器146可以包括各种各样的已知连接器中的任何连接器,例如,夹、带等。
根据实施例,至少第一导电夹120相对于第一导电引线142被横断地定向。如本文所使用的,“定向”是指元件的电流流动方向。因而,相对于彼此被“横断地”定向的两个导电元件在非平行的方向(即,相交的方向)上传导电流。在所描绘的实施例中,第一导电夹120的电流沿平行于第一侧面132并且垂直于第二侧面134的方向流动。相反,第一导电引线142的电流沿平行于第二侧面134并且垂直于第一侧面132的方向流动。因而,在本文所使用的“定向”的含义范围内,第一导电夹120和第一引线被相互垂直地定向。
根据实施例,至少第一导电夹120相对于导电连接器146被横断地定向。通过使所述夹中的至少一些相对于导电连接器146和引线104中的一些被横断地定向,实现了空间高效的设计。这是因为,该封装设计使用半导体管芯108上方的二维平面中的每个可用的方向来从半导体管芯108汲取电流和/或向半导体管芯108输送电流。根据实施例,第一导电夹120和第二导电夹122具有变化的宽度。例如,如图2A所示,第一导电夹120和第二导电夹122均包括第一区段148和宽于第一区段148的第二区段150。这些区段148、150的宽度是在垂直于夹的电流流动方向的方向上测量的。每个夹的第一区段148在半导体管芯108之上延伸,并且与半导体管芯108发生接触。每个夹的第二区段150从包封主体124露出。作为这一变化的宽度轮廓的结果,在封装的外侧提供了大的电接触面积,并且同时在包封主体124内提供了较小的夹占据区域,以适应空间限制。
参考图3,其示出了根据实施例的半导体管芯108的示意性等同方案。在这种构造中,半导体管芯108包括第一开关器件152和第二开关器件154。第一开关器件152和第二开关器件154均包括控制端子156、第一输出端子158和第二输出端子160。在这个实施例中,第一开关器件152和第二开关器件154是N沟道MOSFET器件,其中,栅极提供控制端子156,漏极提供第一输出端子158,并且源极提供第二输出端子160。以通常已知的方式,将这些器件配置为基于超过器件的阈值电压的栅极-源极偏压来控制在源极端子与漏极端子之间流动的电流。
可以分别在第一导电端子114和第二导电端子116处接入第一开关器件152和第二开关器件154的输出信号。可以看出,第一开关器件152的第一输出端子158独立地连接至第一端口162,可以经由第一导电端子114的接合焊盘连接对第一端口162进行电接入。类似地,第二开关器件154的第一输出端子158独立地连接至第二端口164,可以经由第二导电端子116的接合焊盘连接对第二端口164进行电接入。第一开关器件152和第二开关器件154的控制端子156独立地连接至附加端口166,附加端口166可以经由附加导电端子118的接合焊盘连接进行电接入。第一开关器件152和第二开关器件154第二输出端子160可以连接至第三端口168。在垂直器件的情况下,该第三端口168可以经由(例如)处于半导体管芯108的背表面110处的接合焊盘连接进行电接入。
尽管图3所示的实施例仅包括两个开关器件,但是上文描述的概念可以扩展至具有附加的开关器件(例如,三个或更多半导体器件)以及附加的输出通道(例如,三个或更多输出通道)的半导体管芯。
根据实施例,半导体管芯108被配置为功率开关器件,即,额定用于大电压(例如,200V、400V、600V等)的开关的器件。这些器件可以包括功率开关器件,例如,功率MOSFET(金属氧化物半导体场效应晶体管)器件、IGBT(绝缘栅双极晶体管)器件、HEMT(高电子迁移率晶体管)器件。更一般而言,半导体管芯108可以具有宽范围的各种各样的器件构造。这些器件构造包括诸如晶体管、二极管、晶闸管等的分立的器件。这些器件构造还包括诸如控制器、放大器等的集成器件。这些器件构造包括垂直器件构造以及横向器件构造,垂直器件构造即为在垂直于管芯的上表面126和下表面128的方向上导电的器件,横向器件构造即为在平行于管芯的上表面126和下表面128的方向上导电的器件。
参考图4,其描绘了根据另一个实施例的半导体封装100。在这个实施例中,第二导电夹122从包封主体124的第二侧面134伸出。因此,第二导电夹122的外端140与第一导电夹120的外端140从包封主体124的相同的侧面130露出。在这个实施例中,半导体封装100包括多条第三导电引线170,多条第三导电引线170均背离载体的第三侧延伸。第三导电引线170垂直于第一导电引线142和第二导电引线144,并且从包封主体124的第四侧面138伸出。这些第三导电引线170用电连接以与前文描述的类似的方式电连接至处于半导体管芯108的上侧112上的端子。图4的封装构造的一个优点在于提高的引线数量以及因而得到的提高的I/O数量,其归因于在包封主体124的三侧提供了密集间隔的引线。
参考图5,其描绘了根据另一个实施例的半导体封装100。在这个实施例中,第二导电夹122从包封主体124的第三侧面136伸出。因此,第二导电夹122的外端140与第一导电夹120的外端140从包封主体124的不同的侧面露出。在这个实施例中,半导体封装100包括以与参考图4描述的相同的方式配置的多条第三导电引线170。因而,与图1-图2的实施例相比,半导体封装100为半导体管芯108的各个端子提供了电接入点的替代布置。图5的实施例提供了将逻辑引脚更加紧密地布置在一起的优点,其能够有利地改善上面安装有半导体封装100的PCB的布局。
参考图6,描绘了根据另一个实施例的半导体封装100。在这个实施例中,第一导电夹120完全跨越半导体管芯108延伸,并且在包封主体124的两个侧面处露出。更具体而言,第一导电夹120从包封主体124的第二侧面134和第四侧面138伸出。第二导电夹122以与图5的实施例类似的方式从包封主体124的第三侧面136伸出。因而,第二导电夹122的外端140与第一导电夹120的两个外端140从包封主体124的不同的侧面130露出。图6的封装配置的一个优点在于,关于具有第一导电夹120的外部连接具有更大的灵活性,因为可以在半导体封装100的两侧对第一导电夹120进行接入。
参考图7,描绘了根据另一个实施例的半导体封装100。在这个实施例中,半导体管芯108还包括设置在上侧上的第三导电端子172。第三导电端子172可以是通往集成在半导体管芯108内的另一开关器件的输出端子(例如,漏极、集电极等)的接合焊盘连接。半导体封装100另外地包括第三导电夹174。第三导电夹174可以与本文描述的第一导电夹120和第二导电夹122类似或等同。第三导电夹174在半导体管芯108的上侧112之上延伸,并且以与前文参考第一导电夹120和第二导电夹122描述的类似的方式电连接至第三导电端子172。第三导电夹174从包封主体124的第四侧面138伸出。第二导电夹122以与前文所述的类似的方式从包封主体124的第三侧面136伸出。作为结果,第三导电夹174的外端140在不同于第一导电夹120和第二导电夹122的外端140的侧面处为第三导电端子172提供外部电接触点。
参考图8,描绘了根据另一个实施例的半导体封装100。在这个实施例中,第一导电夹120和第二导电夹122的背对半导体管芯108的上侧112的上侧176从包封主体124露出。此外,第一导电夹120和第二导电夹122的上表面176与包封主体124的上表面126共面。如图8B的平面图构造中所示,第一导电夹120和第二导电夹122的上表面176被处于包封主体124的上侧的包封材料包围。图8的构造的一个优点在于,能够在器件操作期间通过第一导电夹120和第二导电夹122的露出的上表面176将热量从封装辐射出去。可以通过在第一导电夹120和第二导电夹122的露出的上表面的顶上放置热沉来增强这一效果。
参考图9-图10,示出了用于制造半导体封装100的所选的方法步骤。
在图9A中,提供了引线框架178。引线框架178包括多个单元引线框架,其均包含管芯焊盘180以及针对完整的器件的引线构造,例如,如图2A所示。在图9B中,在每个单元引线框架的管芯附接表面106上形成粘合剂182。这种粘合剂182可以是电绝缘胶带或电绝缘胶。替代地,如果需要管芯108的下表面与管芯底座102之间的电连接,粘合剂182可以是导电粘合剂,例如,导电胶、焊料、烧结剂等。在图9C中,将半导体管芯108放置于粘合剂上,并且因此被附接至每个引线框架178的相应的管芯底座102。在图9D中,将导电粘合剂184(例如,导电胶、焊料、烧结剂等)放置于半导体管芯108的上侧112上。更具体而言,导电粘合剂182被提供到前面各图所描述和示出的第一导电端子114和第二导电端子116上。
在图10A中,将第一导电夹120附接并且电连接至半导体管芯108。尽管出于例示目的仅示出了一个夹,但是这一技术可以用于附接本文所述的第一导电夹120、第二导电夹122和第三导电夹174中的任何一个。在图10B中,形成了通往附加端子118的导电连接器146。图10B的视图相对于图10A的视图旋转了90度。根据实施例,在图10A的夹附接步骤和图10B的引线接合步骤之间将引线框架178旋转了大约90度。通过这种方式,能够实现如前所述的夹和电连接器的横断的定向。在图10C中,在每个单元引线框架上形成包封材料(例如,模制化合物),由此包封半导体管芯108和相关联的电连接。这一操作可以根据各种各样的已知的技术完成,例如注塑模制、转移模制、压缩模制等。在形成包封材料之前,可以执行引线修整步骤(未示出),从而将引线中的至少一些引线相互分开和/或与管芯底座102分开。任选地,在形成包封材料之后,所述方法还可以包括将包封材料从包封主体124去除,使得第一导电夹120和第二导电夹122的上表面露出并且与包封主体124的上表面共面,例如,如图8所示。例如,这一操作可以通过研磨技术完成。在图10D中,将器件与引线框架178分开(例如,通过机械切割),由此形成分立的半导体封装。接下来,可以执行引线修整步骤,从而将引线与引线框架178分开。例外,可以使引线和/或夹弯曲,以提供预期的引线构造,在这种情况下其为鸥翼构造。
如本文所使用的,术语“具有”、“包含”、“包括”等是开放性术语,所述术语指示所陈述的要素或特征的存在,但不排除附加的要素或特征。除非上下文清楚地做出了另外的指示,否则冠词“一”和“所述”意在包括复数形式以及单数形式。
尽管在本文中已经示出和描述了具体的实施例,但是本领域技术人员将认识到可以将所示出和描述的具体的实施例替换为各种各样的替代和/或等同的实施方式,而不脱离本发明的范围。本申请意在涵盖本文讨论的具体实施例的任何调整形式或变化形式。因此,意在使本发明仅由权利要求及其等同方案限定。
Claims (21)
1.一种封装半导体器件,包括:
载体,所述载体包括管芯附接表面;
半导体管芯,所述半导体管芯安装在所述管芯附接表面上,并且包括设置在所述半导体管芯的与所述载体相对的上侧上的第一导电端子和第二导电端子;
第一夹,所述第一夹在所述半导体管芯的所述上侧之上延伸并且电连接至所述第一导电端子;
第二夹,所述第二夹在所述半导体管芯的所述上侧之上延伸并且电连接至所述第二导电端子;以及
电绝缘包封主体,所述电绝缘包封主体包封所述半导体管芯,
其中,所述第一夹的外端从所述包封主体的侧面露出,并且为所述第一导电端子提供外部电接触点,并且
其中,所述第二夹的外端与所述第一夹的所述外端从所述包封主体的相同的或不同的侧面露出,并且为所述第二导电端子提供外部电接触点。
2.根据权利要求1所述的封装半导体器件,还包括:
多条第一导电引线,所述多条第一导电引线均背离所述载体的第一侧延伸,
其中,所述第一夹相对于所述第一导电引线被横断地定向。
3.根据权利要求2所述的封装半导体器件,其中,所述半导体管芯还包括设置在所述上侧上的多个附加导电端子,其中,所述封装半导体器件还包括将所述附加导电端子中的每者分别连接至所述第一引线之一的导电连接器,并且其中,所述第一夹相对于所述导电连接器被横断地定向。
4.根据权利要求2所述的封装半导体器件,其中,所述包封主体包括在所述半导体管芯的所述上侧之上延伸的上表面、与所述上表面相对的下表面以及在所述上表面与所述下表面之间延伸的第一侧面和第二侧面,其中,所述第一侧面和所述第二侧面形成相互成角度的相交,其中,所述第一引线中的每者从所述第一侧面伸出,并且其中,所述第一夹从所述第二侧面伸出。
5.根据权利要求4所述的封装半导体器件,其中,所述第二夹从所述包封主体的所述第二侧面伸出。
6.根据权利要求4所述的封装半导体器件,其中,所述包封主体包括均在所述上表面与所述下表面之间延伸的第三侧面和第四侧面,其中,所述第一侧面、所述第二侧面、所述第三侧面和所述第四侧面共同形成矩形,并且其中,所述第二夹从所述包封主体的所述第三侧面和所述第四侧面伸出。
7.根据权利要求6所述的封装半导体器件,还包括:
多条第二导电引线,所述多条第二导电引线均朝与所述第一导电引线相反的方向背离所述载体的第二侧延伸,
其中,所述第二导电引线中的每者从所述包封主体的所述第三侧面伸出,并且
其中,所述第二夹从所述包封主体的所述第四侧面伸出。
8.根据权利要求6所述的封装半导体器件,其中,所述第一夹从所述包封主体的所述第二侧面和所述第四侧面伸出,并且其中,所述第三夹从所述包封主体的所述第三侧面伸出。
9.根据权利要求6所述的封装半导体器件,还包括:
多条第三导电引线,所述多条第三导电引线均背对所述载体的第三侧并且背离所述载体的第三侧延伸,
其中,所述第三导电引线垂直于所述第一导电引线延伸,
其中,所述第三引线中的每者从所述包封主体的所述第四侧面伸出,并且
其中,所述第二夹从所述包封主体的所述第三侧面伸出。
10.根据权利要求6所述的封装半导体器件,其中,所述半导体管芯还包括设置在所述上侧上的第三导电端子,其中,所述封装半导体器件还包括在所述半导体管芯的所述上侧之上延伸并且电连接至所述第三导电端子的第三夹,并且其中,所述第三夹从所述包封主体的所述第四侧面伸出。
11.根据权利要求4所述的封装半导体器件,其中,所述第一夹和所述第二夹的背对所述半导体管芯的所述上表面的上表面完全被所述包封主体的包封材料所覆盖。
12.根据权利要求4所述的封装半导体器件,其中,所述第一夹和所述第二夹的背对所述半导体管芯的所述上表面的上表面从所述包封主体的包封材料露出。
13.根据权利要求1所述的封装半导体器件,其中,所述半导体管芯包括集成于其中的第一开关器件和第二开关器件,其中,所述第一开关器件和所述第二开关器件中的每者包括控制端子、第一输出端子和第二输出端子,其中,所述第一导电端子是通往所述第一开关器件的所述第一输出端子的接合焊盘连接,并且其中,所述第二导电端子是通往所述第二开关器件的所述第一输出端子的接合焊盘连接。
14.根据权利要求13所述的封装半导体器件,其中,所述第一开关器件的所述第一输出端子和所述第二开关器件的所述第一输出端子均为漏极端子,其中,所述第一开关器件的所述第二输出端子和所述第二开关器件的所述第二输出端子均为源极端子,并且其中,所述第一开关器件的所述第二输出端子和所述第二开关器件的所述第二输出端子均直接面对所述载体并且与所述载体电连接。
15.一种封装半导体器件,包括:
载体,所述载体包括管芯附接表面;
半导体管芯,所述半导体管芯安装在所述管芯附接表面上;
电绝缘包封主体,所述电绝缘包封主体包封所述半导体管芯;以及
第一夹和第二夹,所述第一夹和所述第二夹在所述半导体管芯的与所述载体相对的上侧之上延伸并且从所述包封主体的侧面伸出,
其中,所述半导体管芯包括集成于其中的第一开关器件和第二开关器件,
其中,所述第一开关器件和所述第二开关器件中的每者包括控制端子、第一输出端子和第二输出端子,
其中,所述第一夹经由所述上表面处的接合焊盘连接电连接至所述第一开关器件的所述第一输出端子,并且
其中,所述第二夹经由所述上表面处的接合焊盘连接电连接至所述第二开关器件的所述第一输出端子。
16.根据权利要求15所述的封装半导体器件,还包括:
多条第一导电引线,所述多条第一导电引线与所述第一夹和所述第二夹从所述包封主体的不同的侧面伸出;以及
电连接器,所述电连接器将所述第一导电引线连接至设置在所述半导体管芯的所述上表面上的附加端子,
其中,所述第一引线为所述第一开关器件和所述第二开关器件的所述控制端子提供单独的外部电接触点,并且
其中,至少所述第一夹相对于所述第一导电引线被横断地定向,并且相对于所述电连接器被横断地定向。
17.一种形成封装半导体器件的方法,所述方法包括:
提供包括管芯附接表面的载体;
将半导体管芯安装在所述管芯附接表面上,使得第一导电端子和第二导电端子设置在所述半导体管芯的与所述载体相对的上侧上;
提供在所述半导体管芯的所述上侧之上延伸并且电连接至所述第一导电端子的第一夹;
提供在所述半导体管芯的所述上侧之上延伸并且电连接至所述第二导电端子的第二夹;以及
提供包封所述半导体管芯的电绝缘包封主体,
其中,所述第一夹和所述第二夹的外端从所述包封主体露出。
18.根据权利要求17所述的方法,还包括:
提供多条第一导电引线,所述多条第一导电引线均背离所述载体的第一侧延伸,以及
将所述第一夹附接至所述第一导电端子,使得所述第一夹相对于所述第一导电引线被横断地定向。
19.根据权利要求18所述的方法,其中,所述半导体管芯还包括设置在所述上侧上的多个附加导电端子,其中,所述方法还包括:
提供将所述附加导电端子中的每者分别电连接至所述第一引线之一的导电连接器;以及
将所述第一夹附接至所述第一导电端子,使得所述第一夹相对于所述导电连接器被横断地定向。
20.根据权利要求17所述的方法,其中,提供所述包封主体包括用所述包封主体的包封材料完全覆盖所述第一夹和所述第二夹的背对所述半导体管芯的所述上表面的上表面。
21.根据权利要求20所述的方法,还包括在完全覆盖所述第一夹和所述第二夹的所述上表面之后,将包封材料从所述包封主体去除,使得所述第一夹和所述第二夹的所述上表面露出并且与所述包封主体的上表面共面。
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