CN111799187A - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
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- CN111799187A CN111799187A CN202010151886.5A CN202010151886A CN111799187A CN 111799187 A CN111799187 A CN 111799187A CN 202010151886 A CN202010151886 A CN 202010151886A CN 111799187 A CN111799187 A CN 111799187A
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- semiconductor chip
- advancing
- substrate
- resin
- retreating member
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- 239000011347 resin Substances 0.000 title claims abstract description 144
- 229920005989 resin Polymers 0.000 title claims abstract description 144
- 238000007789 sealing Methods 0.000 title claims abstract description 128
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 238000000465 moulding Methods 0.000 claims abstract description 37
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 235000016496 Panda oleosa Nutrition 0.000 claims description 5
- 240000000220 Panda oleosa Species 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
Abstract
The invention provides a resin sealing device and a resin sealing method which can prevent insufficient bottom filling and poor molding such as gap and bubble even aiming at a relatively large semiconductor chip in recent years. The resin sealing device comprises: an advancing-retreating member (11) which can enter into the cavity concave portion (7) toward the surface (1A) of the substrate (1) and retreat from the cavity concave portion, and which surrounds at least a part of the entire circumference of the side surface (2A) of the semiconductor chip (2); and a control part which injects sealing resin (13) into the cavity recess under the state that the advancing and retreating member enters the cavity recess to the position of the connecting surface (2C) of the semiconductor chip (2), fills the sealing resin into the gap part between the surface of the substrate and the connecting surface (2C) of the semiconductor chip (2) and the gap part between the surface (1A) of the substrate and the advancing and retreating member, retreats the advancing and retreating member from the cavity recess, and fills the sealing resin into the whole circumference of the side surface of the semiconductor chip.
Description
Technical Field
The present invention relates to a resin sealing apparatus and a resin sealing method for resin sealing a molding object formed by flip-chip bonding a semiconductor chip to a surface of a substrate.
Background
After a semiconductor chip is flip-chip connected to the surface of a substrate, underfill with a liquid sealing material is performed to protect the connection portion and to alleviate the influence of thermal stress between the substrate and the semiconductor chip. As a conventional resin sealing apparatus using MUF, for example, a resin sealing apparatus described in patent document 1 is known. Fig. 11 (a) is a schematic bottom view of a molding die of the resin sealing device described in patent document 1, fig. 11 (B) is a sectional view taken along a-a in fig. 11 (a), and fig. 11 (c) is a sectional view taken along B-B in fig. 11 (a) showing a state before and after completion of resin filling.
As shown in fig. 11, the resin sealing apparatus includes an upper mold 104 and a lower mold 103, the upper mold 104 and the lower mold 103 being capable of sandwiching a molding object formed by flip-chip bonding a semiconductor chip 106 to a substrate 102, and the upper mold 104 is provided with movable blocks (fillet forks) 110 which are capable of protruding into cavity recesses 107, with respect to both side surfaces (both side surfaces with respect to a direction in which an underfill portion is filled with resin) of the semiconductor chip 106.
As shown in the left half of fig. 11 (c), in this resin sealing apparatus, movable blocks 110 provided on both side surfaces of a semiconductor chip 106 in advance are projected into a cavity recess 107, and a release film 118 is brought into a state of pressure contact with a substrate 102, whereby a sealing resin 122 is preferentially pressure-fed to a gap portion 121 between the semiconductor chip 106 and the substrate 102, and underfill molding is performed.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2002-9096
Disclosure of Invention
Problems to be solved by the invention
In the conventional resin sealing apparatus described above, the movable block 110 is lifted and lowered only on both side surfaces (both side surfaces with respect to the direction in which the underfill portion is filled with the resin) of the semiconductor chip 106, and by closing both side surfaces of the semiconductor chip 106, it is expected that the sealing resin 122 is preferentially fed to the gap portion 121 between the semiconductor chip 106 and the substrate 102. However, there is a problem that: in the case of a semiconductor chip which is made relatively large in recent years, when both side surfaces of the semiconductor chip are closed, a connection electrode between the semiconductor chip and the substrate having a large area becomes resistance to the flow of the resin, and if the sealing resin flows only in one direction, the sealing resin cannot sufficiently flow to the gap portion, and underfill is insufficient. Moreover, there is a problem that: when the both side surfaces are opened and the resin is filled into the remaining space, resin pressure is simultaneously applied to the part already filled with the resin, and the filled resin is pushed toward the both side surfaces, which causes resistance to the unidirectional resin flow from the gate side to the vent hole side, which deteriorates the flow balance, and causes voids, bubbles, and the like in the gap between the overlapped resins, which deteriorates the molding quality as a whole.
Accordingly, an object of the present invention is to provide a resin sealing apparatus and a resin sealing method, by which occurrence of insufficient underfill and molding defects such as voids and air bubbles can be avoided even for a semiconductor chip which is recently made relatively large.
Means for solving the problems
A resin sealing apparatus according to the present invention is a resin sealing apparatus which holds a molding object, which is formed by flip-chip bonding a semiconductor chip to a surface of a substrate via a bonding electrode, between a first mold and a second mold, and which performs resin sealing molding by injecting a sealing resin into a cavity recess including a gap portion between the surface of the substrate and a bonding surface of the semiconductor chip, the resin sealing apparatus including: a retractable member which can enter into the cavity recess toward the surface of the substrate and retract from the cavity recess, the retractable member enclosing at least a part of the entire periphery of the side surface of the semiconductor chip; and a control section for injecting a sealing resin into the cavity recess in a state where the advancing-retreating member is advanced into the cavity recess to a position of the connection surface of the semiconductor chip, filling the sealing resin into a gap portion between the surface of the substrate and the connection surface of the semiconductor chip and a gap portion between the surface of the substrate and the advancing-retreating member, then retracting the advancing-retreating member from the cavity recess, and filling the entire periphery of the side surface of the semiconductor chip with the sealing resin.
A resin sealing method according to the present invention is a method of clamping a molding object, which is formed by flip-chip bonding a semiconductor chip to a surface of a substrate via a bonding electrode, between a first mold and a second mold, and injecting a sealing resin into a cavity recess including a gap portion between the surface of the substrate and a bonding surface of the semiconductor chip to perform resin sealing molding, the method including: injecting a sealing resin into the cavity recess so as to fill a gap portion between the surface of the substrate and the connection surface of the semiconductor chip and a gap portion between the surface of the substrate and the advancing-retreating member, which is capable of entering the cavity recess toward the surface of the substrate and retreating from the cavity recess and surrounds at least a part of the entire periphery of the side surface of the semiconductor chip; and retracting the retractable member from the cavity recess, and filling the entire periphery of the side surface of the semiconductor chip with the sealing resin.
In the above-described invention, the sealing resin is injected into the cavity portion in a state where the advancing-retreating member surrounding at least a part of the entire periphery of the side surface of the semiconductor chip is advanced to the position of the connection surface of the semiconductor chip in the cavity portion, that is, in a state where the entire periphery of the side surface of the semiconductor chip is not closed but a gap portion is present not only between the surface of the substrate and the semiconductor chip but also between the surface of the substrate and the advancing-retreating member, and therefore, the injected sealing resin is directly filled not only in the gap portion between the surface of the substrate and the semiconductor chip but also in the gap portion between the surface of the substrate and the semiconductor chip in a state where the gap portion between the substrate and the advancing-retreating member is circuitously filled, and the sealing resin sufficiently flows to the gap portion between the surface of the substrate and the connection surface of the semiconductor chip.
Preferably, the advancing-retreating member is divided into a plurality of portions when viewed from the front surface side of the substrate, and the control unit individually controls the advancing and retreating of the plurality of portions of the advancing-retreating member. Thus, the flow of the injected sealing resin can be optimized by individually controlling the advance and retreat of the advancing and retreating members divided into a plurality of portions.
ADVANTAGEOUS EFFECTS OF INVENTION
(1) According to the present invention, the injected sealing resin is roundly filled in the gap portion between the surface of the substrate and the semiconductor chip in the gap portion between the substrate and the advancing/retreating member, and the sealing resin sufficiently flows into the gap portion between the surface of the substrate and the connection surface of the semiconductor chip, so that even in the case of a semiconductor chip which is recently made larger, occurrence of underfill failure can be avoided, occurrence of voids due to underfill failure can be avoided, and the resin flows in one direction from the gate side to the vent side, and therefore, the resin flow balance is good, and high-quality molding without voids, bubbles, or the like can be realized.
(2) The advancing-retreating member is divided into a plurality of portions when viewed from the front surface side of the substrate, and the control unit individually controls the advancing and retreating of the plurality of portions of the advancing-retreating member, whereby the flow of the injected sealing resin can be optimized, the occurrence of unfilled portions can be reduced, the occurrence of voids and the occurrence of bubbles can be reduced, and higher-quality molding can be realized.
Drawings
Fig. 1 is a schematic front sectional view of a mold of a resin sealing apparatus according to an embodiment of the present invention.
Fig. 2 is a bottom view of the upper die of fig. 1.
Fig. 3 is a schematic front cross-sectional view showing a resin sealing and molding process performed by the resin sealing apparatus of the present embodiment.
Fig. 4 is a schematic front cross-sectional view showing a resin sealing and molding process performed by the resin sealing apparatus of the present embodiment.
Fig. 5 is a schematic front cross-sectional view showing a resin sealing and molding process performed by the resin sealing apparatus of the present embodiment.
Fig. 6 (a) to (c) are bottom views of the upper die showing modifications of the retractable member.
Fig. 7 (a) and (b) are bottom views of the upper die showing other modifications of the advancing-retreating member.
Fig. 8 is a schematic front sectional view of a mold of the resin sealing device of the example of fig. 7 (b).
Fig. 9 is a schematic front cross-sectional view showing a resin sealing molding process performed by the resin sealing apparatus of the example of fig. 7 (b).
Fig. 10 is a schematic front cross-sectional view showing a resin sealing molding process performed by the resin sealing apparatus of the example of fig. 7 (b).
Fig. 11 is a schematic bottom view of a molding die of a conventional resin sealing apparatus, fig. 11 (B) is a sectional view taken along a-a in fig. 11 (a), and fig. 11 (c) is a sectional view taken along B-B in fig. 11 (a) showing a state before and after completion of resin filling.
Description of the reference numerals
1. A substrate; 2. a semiconductor chip; 3. connecting the electrodes; 4. molding the object; 5. an upper die; 6. a lower die; 7. a cavity recess; 7B, filling space at the bottom; 8A, a pouring gate; 8B, a cold material well; 10. a through hole; 11. 17, 18, 19, an advancing-retreating member; 12. a substrate mounting section; 13. a sealing resin; 14. heating the container; 15. a push rod; 16. demolding the film; 20. a drive section; 21. a control unit; 22. table; 30. 31, 32, 40, 41, 42, an advancing-retreating member.
Detailed Description
Fig. 1 is a schematic front cross-sectional view of a mold of a resin sealing device according to an embodiment of the present invention, fig. 2 is a bottom view of an upper mold in fig. 1, and fig. 3 to 5 are schematic front cross-sectional views showing a resin sealing molding process performed by the resin sealing device according to the embodiment.
As shown in fig. 1 and 2, the resin sealing apparatus according to the embodiment of the present invention is an apparatus for resin sealing and molding a molding object 4 formed by flip-chip bonding a semiconductor chip 2 to a surface of a substrate 1 via a bonding electrode 3. The resin sealing apparatus includes an upper mold 5 as a first mold and a lower mold 6 as a second mold, and the upper mold 5 and the lower mold 6 can sandwich the molding object 4.
The upper mold 5 is formed with: a cavity recess 7 for accommodating the semiconductor chip 2 mounted on the substrate 1; and resin paths such as a gate 8A and a cold trap 8B, which communicate with the cavity recess 7. Further, a vent hole 9 for exhausting air is formed in the upper mold 5 on the side opposite to the gate 8A across the cavity concave portion 7. The bottom surface 7A of the cavity recess 7 has a through hole 10 corresponding to the outer periphery of the side surface 2A of the semiconductor chip 2 and the outer periphery of the resin-sealed molded article.
The upper mold 5 has an advancing-retreating member 11 corresponding to the through hole 10. The advancing and retreating member 11 is driven by the driving section 20, and enters into the cavity-recessed portion 7 toward the front surface 1A of the substrate 1 or retreats from the cavity-recessed portion 7 as shown in fig. 3. The driving unit 20 is controlled by the control unit 21. When the advancing/retreating member 11 enters the cavity concave portion 7, it has a substantially japanese kana ロ shape surrounding the entire periphery of the side surface 2 of the semiconductor chip 2 when viewed from the front surface 1A side of the substrate 1.
The lower die 6 has: a substrate mounting section 12 on which the substrate 1 is mounted; a heating container 14 for heating and melting the sealing resin 13; and a pusher 15 for pressure-feeding the sealing resin 13 from the heating container 14 to the cavity recess 7 through the gate 8A and the cooling well 8B. When resin-sealing a rectangular semiconductor chip 2 having a size of 30mm to 40mm, the injection pressure of the sealing resin 13 is 7MPa to 8 MPa.
As shown in fig. 1, the resin sealing method by the resin sealing apparatus described above is a method in which a substrate 1 (molding object 4) to which a semiconductor chip 2 is flip-chip connected via a connection electrode 3 is placed on a substrate placement portion 12 of a lower mold 6, a sealing resin 13 is poured into a heating container 14, and then the substrate 1 is sandwiched between an upper mold 5 and the lower mold 6 via a release film 16. At this time, bottom surface 7A of cavity concave portion 7 presses surface 2B of semiconductor chip 2 to prevent surface 2B of semiconductor chip 2 from being impregnated with resin (see fig. 3).
Next, as shown in fig. 3, the advancing/retreating member 11 is advanced into the cavity concave portion 7 to a position of the connection surface 2C of the semiconductor chip 2, and the distal end surface 11A of the advancing/retreating member 11 is flush with the connection surface 2C of the semiconductor chip 2. Thus, the bottom filling space 7B of the cavity recess 7, which is formed by the gap portion between the front surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2 and the gap portion between the front surface 1A of the substrate 1 and the advancing/retreating member 11, becomes a thin plate-like space having a thickness corresponding to the height (0.05mm to 0.1mm) of the connection electrode 3 and a thickness that is substantially uniform.
Then, as shown in fig. 4, the push rod 15 is raised, the sealing resin 13 is injected from the heating container 14 into the cavity concave portion 7 through the cold box 8B and the gate 8A, and the sealing resin 13 is filled into the bottom filling space 7B of the cavity concave portion 7, which is formed by a gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2 and a gap portion between the surface 1A of the substrate 1 and the advancing/retreating member 11, to perform the bottom filling molding. Since the underfill space 7B has almost no irregularities, the fluid resistance is small, and the sealing resin 13 injected can smoothly flow in.
After the underfill molding, as shown in fig. 5, the retractable member 11 is retracted from the cavity-concave portion 7 to a predetermined position (in the illustrated example, the distal end surface 11A of the retractable member 11 is retracted to the bottom surface 7A of the cavity-concave portion 7), and the sealing resin 13 is further injected to fill the entire circumference of the side surface 2A of the semiconductor chip 2 with the sealing resin, thereby completing the resin sealing. The operation of the resin sealing device is controlled by a control unit 21.
As described above, in the resin sealing apparatus and the resin sealing method according to the present embodiment, the sealing resin 13 is injected in a state in which the advancing/retreating member 11 surrounding the entire circumference of the side surface 2A of the semiconductor chip 2 is advanced into the cavity concave portion 7 to a position of the connection surface 2C of the semiconductor chip 2. Thus, the injected sealing resin 13 can be directly filled in not only the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2 but also the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2 in the gap portion between the substrate 1 and the advancing/retreating member 11, and the sealing resin can sufficiently flow in the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2, and therefore, even for a semiconductor chip which is relatively large in recent years, occurrence of underfill failure can be avoided, and further, the resin flows in one direction from the gate side to the vent side, and therefore, the resin flow balance is good, and high-quality molding without voids, bubbles, or the like can be realized.
In the above embodiment, as shown in fig. 3, when the advancing/retreating member 11 is advanced into the cavity concave portion 7 to the position of the connection surface 2C of the semiconductor chip 2, the distal end surface 11A of the advancing/retreating member 11 and the connection surface 2C of the semiconductor chip 2 are flush with each other, but they may not necessarily be flush with each other. The key point is that the following structure is made: instead of sealing the entire periphery of the side surface 2A of the semiconductor chip 2, the sealing resin 13 may be injected into the cavity concave portion 7 in a state where not only a gap portion exists between the surface 1A of the substrate 1 and the semiconductor chip 2 but also a gap portion exists between the surface 1A of the substrate 1 and the advancing/retreating member 11.
Next, a modification of the advancing-retreating member 11 will be described with reference to fig. 6. Fig. 6 (a) to (c) are bottom views of the upper die showing modifications of the retractable member.
In the example shown in fig. 6 (a), the outer peripheral corner 17A of the advancing-retreating member 17 and the inner peripheral corner 10A of the cavity recess 10 corresponding to the outer peripheral corner 17A of the advancing-retreating member 17 are curved when viewed from the advancing-retreating direction of the advancing-retreating member 17. The radius R of the curved surface is 1mm or more, more preferably 2mm or more, and still more preferably 3mm or more. Thus, when the substrate 1 is sandwiched between the upper mold 5 and the lower mold 6 via the release film 16, the portion of the release film 16 sandwiched between the outer peripheral corner 17A of the retractable member 17 and the inner peripheral corner 10A of the cavity recess 10 can be prevented from being damaged.
In the example shown in fig. 6 (b), the advancing/retreating member 18 has a substantially japanese kana コ shape surrounding a portion of the entire periphery of the side surface 2A of the semiconductor chip 2 except for the gate 8A side portion, when viewed from the front surface 1A side of the substrate 1. Even with this configuration, when the sealing resin 13 is injected in a state where the retractable member 18 is inserted into the cavity recess 7 to the position of the connection surface 2C of the semiconductor chip 2, the injected sealing resin 13 is not only directly filled in the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2, but also is filled in the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2 while the gap portion between the substrate 1 and the retractable member 18 is detoured, and the sealing resin can sufficiently flow into the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2. Further, since the advancing-retreating member 18 is not present in the portion of the cavity concave portion 7 facing the gate 8A, the injection amount of the sealing resin 13 per unit time can be increased by increasing the thickness of the gate 8A.
In the example shown in fig. 6 (c), the advancing/retreating member 19 has a substantially reverse コ shape that surrounds the side surface 2A of the semiconductor chip 2 over the entire circumference thereof except for the portion near the vent hole 9, when viewed from the front surface 1A of the substrate 1. Even with this configuration, when the sealing resin 13 is injected in a state where the retractable member 19 is inserted into the cavity recess 7 to the position of the connection surface 2C of the semiconductor chip 2, the injected sealing resin 13 is not only directly filled in the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2, but also is filled in the gap portion between the surface 1A of the substrate 1 and the semiconductor chip 2 while the gap portion between the substrate 1 and the retractable member 19 is detoured, and the sealing resin can sufficiently flow into the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2. In the case where the vent hole 9 side is opened as described above, if the filling rate is not uniform at each position due to the resin flow resistance caused by the connection electrode 3 in the underfill space 7B, the position having a low filling rate is filled while the sealing resin 13 is filled into the space on the vent hole 9 side, and the problem of non-filling can be solved.
Next, another modification of the advancing-retreating member 11 will be described. Fig. 7 (a) and (b) are bottom views of upper molds showing other modifications of the advancing and retreating member, respectively, fig. 8 is a schematic front cross-sectional view of a mold of the resin sealing device of the example of fig. 7 (b), and fig. 9 and 10 are schematic front cross-sectional views showing a resin sealing molding process performed by the resin sealing device of the example of fig. 7 (b).
In the example shown in fig. 7 (a) and (b), the advancing-retreating member 30 and the advancing-retreating member 40 are divided into a plurality of portions when viewed from the front surface 1A side of the substrate 1. The advancing and retreating member 30 shown in fig. 7 (a) includes: a first advancing-retreating member 31 having a substantially japanese kana コ shape surrounding a portion of the entire periphery of the side surface 2A of the semiconductor chip 2 except for the portion on the side of the gate 8A, as viewed from the front surface 1A of the substrate 1, similarly to the advancing-retreating member 18 (see fig. 6 (b)); and a second advancing/retreating member 32 that fills the open portion of the first advancing/retreating member 31.
On the other hand, the advancing and retreating member 40 shown in fig. 7 (b) includes: a first advancing-retreating member 41 having a substantially reverse コ -shaped configuration surrounding the portion of the entire circumference of the side surface 2A of the semiconductor chip 2 except for the portion thereof closer to the vent hole 9, as viewed from the front surface 1A of the substrate 1, similarly to the aforementioned advancing-retreating member 19 (see fig. 6 (c)); and a second advancing-retreating member 42 that fills the opened portion of the first advancing-retreating member 41.
Taking the example shown in fig. 7 (B) for explanation, as shown in fig. 8, the first advancing-retreating member 41 and the second advancing-retreating member 42 are driven by the separate driving portions 20A and 20B, respectively, so as to enter the cavity-recessed portion 7 toward the surface 1A of the substrate 1 or retreat from the cavity-recessed portion 7. The controller 21 controls the driving units 20A and 20B to individually control the advance and retreat of the first advancing and retreating member 41 and the second advancing and retreating member 42.
In this example, as described above, the substrate 1 (object to be molded 4) to which the semiconductor chip 2 is flip-chip connected via the connection electrode 3 is placed on the substrate mounting portion 12 of the lower die 6, the sealing resin 13 is poured into the heating container 14, the upper die 5 and the lower die 6 sandwich the release film 16 to hold the substrate 1, and then the first retractable member 41 and the second retractable member 42 are advanced into the cavity recess 7 to the position of the connection surface 2C of the semiconductor chip 2, so that the tip end surface 41A of the first retractable member 41 and the tip end surface 42A of the second retractable member 42 are flush with the connection surface 2C of the semiconductor chip 2.
Next, as shown in fig. 9, the push rod 15 is raised, the sealing resin 13 is injected from the heating container 14 into the cavity concave portion 7 through the cold box 8B and the gate 8A, and the sealing resin is filled into the underfill space 7B of the cavity concave portion 7, which is formed by the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor chip 2 and the gap portion between the surface 1A of the substrate 1 and the first advancing/retracting member 41 and the second advancing/retracting member 42, to perform underfill molding.
After the predetermined time a has elapsed, only the second advancing-retreating member 42 is retreated to the predetermined position, and after the predetermined time B has elapsed, as shown in fig. 10, both the first advancing-retreating member 41 and the second advancing-retreating member 42 are retreated from the inside of the cavity concave portion 7 to the predetermined positions (positions where the tip surface 41A of the first advancing-retreating member 41 and the tip surface 42A of the second advancing-retreating member 42 are retreated to the bottom surface 7A of the cavity concave portion 7), and further, the sealing resin 13 is injected, and the entire circumference of the side surface 2A of the semiconductor chip 2 is filled with the sealing resin, thereby completing the resin sealing.
In this way, by dividing the advancing-retreating member 40 into a plurality of portions, i.e., the first advancing-retreating member 41 and the second advancing-retreating member 42, when viewed from the front surface 1A side of the substrate 1 and individually controlling the advance and retreat of the plurality of portions of the advancing-retreating member 40 by the control section 21, the flow of the injected sealing resin 13 can be optimized, the occurrence of unfilled portions can be reduced, the occurrence of voids and bubbles can be reduced, and higher-quality molding can be realized.
In addition, the following structure may be adopted: in the control of the driving portion 20A and the driving portion 20B by the control portion 21, a table for specifying the advancing and retreating conditions of the first advancing and retreating member 41 and the second advancing and retreating member 42 is stored in advance in the resin sealing device in accordance with the structure of the molding object, and the conditions are specified using the table at the time of resin sealing.
Industrial applicability
The resin sealing apparatus and the resin sealing method of the present invention are effective as an apparatus and a method for resin sealing a molding object formed by flip-chip bonding a semiconductor chip to a surface of a substrate, and are particularly preferable as a resin sealing apparatus and a resin sealing method as follows: even for a semiconductor chip which is made larger in recent years, occurrence of insufficient underfill and molding defects such as voids and bubbles can be avoided.
Claims (7)
1. A resin sealing device which is formed by flip-chip bonding a semiconductor chip to a surface of a substrate via a bonding electrode, and which is resin-sealed by injecting a sealing resin into a cavity including a gap between the surface of the substrate and a bonding surface of the semiconductor chip, wherein a first mold and a second mold sandwich a molding object,
the resin sealing device comprises:
a retractable member that can enter the cavity recess portion toward the surface of the substrate and retract from the cavity recess portion, the retractable member surrounding at least a part of the entire periphery of the side surface of the semiconductor chip; and
and a control unit that injects the sealing resin into the cavity recess in a state where the advancing-retreating member is advanced into the cavity recess to a position of the connection surface of the semiconductor chip, fills the sealing resin in a gap portion between the surface of the substrate and the connection surface of the semiconductor chip and a gap portion between the surface of the substrate and the advancing-retreating member, then retracts the advancing-retreating member from the cavity recess, and fills the sealing resin in the entire periphery of the side surface of the semiconductor chip.
2. The resin sealing device according to claim 1,
an outer peripheral corner of the advancing-retreating member and an inner peripheral corner of the cavity recess are curved when viewed from an advancing-retreating direction of the advancing-retreating member.
3. The resin sealing device according to claim 1 or 2,
the advancing/retreating member has a substantially japanese kana ロ shape surrounding the entire periphery of the side surface of the semiconductor chip when viewed from the front surface side of the substrate.
4. The resin sealing device according to claim 1 or 2,
the advancing/retreating member has a substantially japanese kana コ shape in which a portion of the entire periphery of the side surface of the semiconductor chip excluding the gate side portion is surrounded, as viewed from the surface side of the substrate.
5. The resin sealing device according to claim 1 or 2,
the advancing/retreating member has a substantially reverse コ shape that surrounds the entire periphery of the side surface of the semiconductor chip except for the vent-hole side portion when viewed from the front surface side of the substrate.
6. The resin sealing device according to any one of claims 1 to 5,
the advancing-retreating member is divided into a plurality of portions as viewed from the surface side of the substrate,
the control portion individually controls the advance and retreat of the plurality of portions of the advancing-retreating member.
7. A resin sealing method in which a molding object formed by flip-chip bonding a semiconductor chip to a surface of a substrate via a bonding electrode is sandwiched between a first mold and a second mold, and a sealing resin is injected into a cavity including a gap portion between the surface of the substrate and a bonding surface of the semiconductor chip to perform resin sealing molding,
the resin sealing method includes:
injecting the sealing resin into the cavity recess so as to fill a gap portion between the surface of the substrate and the connection surface of the semiconductor chip and a gap portion between the surface of the substrate and the advancing/retreating member, the advancing/retreating member being capable of entering the cavity recess toward the surface of the substrate and retreating from the cavity recess and surrounding at least a part of the entire periphery of the side surface of the semiconductor chip; and
and retracting the retractable member from the cavity recess, and filling the sealing resin to the entire periphery of the side surface of the semiconductor chip.
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| JP2019-074277 | 2019-04-09 | ||
| JP2019074277A JP6678973B1 (en) | 2019-04-09 | 2019-04-09 | Resin sealing device and resin sealing method |
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| CN111799187A true CN111799187A (en) | 2020-10-20 |
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| JP (1) | JP6678973B1 (en) |
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| JP6845903B1 (en) | 2019-09-18 | 2021-03-24 | Ｔｏｗａ株式会社 | Molding mold, resin molding equipment and manufacturing method of resin molded products |
| JP7360374B2 (en) | 2020-11-04 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
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|---|---|---|---|---|
| JP2000124344A (en) * | 1998-10-12 | 2000-04-28 | Matsushita Electronics Industry Corp | Resin-sealed semiconductor device and its manufacture |
| JP2002118130A (en) * | 2000-10-06 | 2002-04-19 | Apic Yamada Corp | Resin sealing method for matrix package |
| CN101123195A (en) * | 2006-08-11 | 2008-02-13 | 松下电器产业株式会社 | Resin molding semiconductor device and its manufacturing device and method |
| JP2009194175A (en) * | 2008-02-14 | 2009-08-27 | Sharp Corp | Resin sealing method and resin sealing apparatus |
| JP2011029471A (en) * | 2009-07-28 | 2011-02-10 | Renesas Electronics Corp | Method of manufacturing semiconductor device, and device for manufacturing semiconductor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3205320B2 (en) * | 1998-01-23 | 2001-09-04 | アピックヤマダ株式会社 | Resin sealing method and resin sealing device for semiconductor device |
| JP2002009096A (en) * | 2000-06-20 | 2002-01-11 | Apic Yamada Corp | Method and apparatus for resin sealing |
| JP6444381B2 (en) * | 2014-04-18 | 2018-12-26 | アピックヤマダ株式会社 | Resin mold and resin molding method |
| JP6320172B2 (en) * | 2014-05-29 | 2018-05-09 | Ｔｏｗａ株式会社 | Resin sealing method and resin sealing device for electronic parts |
| JP6749167B2 (en) * | 2016-07-21 | 2020-09-02 | アピックヤマダ株式会社 | Resin molding equipment |
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2019
- 2019-04-09 JP JP2019074277A patent/JP6678973B1/en active Active
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2020
- 2020-01-20 TW TW109101921A patent/TWI720789B/en active
- 2020-03-06 CN CN202010151886.5A patent/CN111799187A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124344A (en) * | 1998-10-12 | 2000-04-28 | Matsushita Electronics Industry Corp | Resin-sealed semiconductor device and its manufacture |
| JP2002118130A (en) * | 2000-10-06 | 2002-04-19 | Apic Yamada Corp | Resin sealing method for matrix package |
| CN101123195A (en) * | 2006-08-11 | 2008-02-13 | 松下电器产业株式会社 | Resin molding semiconductor device and its manufacturing device and method |
| JP2009194175A (en) * | 2008-02-14 | 2009-08-27 | Sharp Corp | Resin sealing method and resin sealing apparatus |
| JP2011029471A (en) * | 2009-07-28 | 2011-02-10 | Renesas Electronics Corp | Method of manufacturing semiconductor device, and device for manufacturing semiconductor |
Also Published As
| Publication number | Publication date |
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| TW202038349A (en) | 2020-10-16 |
| JP6678973B1 (en) | 2020-04-15 |
| JP2020174089A (en) | 2020-10-22 |
| TWI720789B (en) | 2021-03-01 |
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