TW202038349A - Resin sealing device and resin sealing method for avoiding generation of insufficient bottom filling, voids, bubbles, and other molding defects even for larger semiconductor chips - Google Patents

Abstract

The present invention provides a resin sealing device and a resin sealing method, which do not cause insufficient bottom filling, voids, bubbles, and other molding defects, even for larger semiconductor chips in recent years. The resin sealing device comprises: an advancing and retreating member (11) that can advance and retreat from a cavity recess (7) toward the surface (1A) of a substrate (1), and surrounds at least a part of the entire circumference of a side surface (2A) of a semiconductor chip (2); and a control section, which injects sealing resin (13) into the cavity recess (7) in a state where the advancing and retreating member (11) enters the cavity recess (7) to reach the position of the connection surface (2C) of the semiconductor chip (2), , such that the sealing resin is filled in the gap between the surface of the substrate and the connection surface (2C) of the semiconductor chip (2) and the gap between the surface (1A) of the substrate and the advancing and retreating member (11), and then the advancing and retreating member (11) is retreated from the cavity recess (7), so as to fill up the sealing resin in the entire circumference of the side surface (2A) of the semiconductor chip (2).

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing device and a resin sealing method for resin sealing a molded article made by connecting a semiconductor wafer to the surface of a substrate by flip chip.

After the semiconductor chip is connected to the surface of the substrate by flip chip, in order to protect the connection part, and to alleviate the influence of the thermal stress between the substrate and the semiconductor chip, the liquid sealing material is used for underfilling, but in recent years In order to reduce assembly costs and man-hours, so-called molded underfill (MUF) has been performed. As a conventional resin sealing device based on MUF, for example, a resin sealing device described in Patent Document 1 is known. Fig. 11(a) is a schematic bottom view of the molding die of the resin sealing device described in Patent Document 1, Fig. 11(b) is a cross-sectional view along AA in Fig. 11(a), and Fig. 11 (c) is a cross-sectional view along BB in FIG. 11(a) showing a state before and after completion of resin filling.

As shown in FIG. 11, the resin sealing device has an upper mold 104 and a lower mold 103. The upper mold 104 and the lower mold 103 clamp a molded object made by connecting a semiconductor wafer 106 to a substrate 102 by flip chip. In the upper mold 104, movable blocks (round forks) 110 are provided on both sides of the semiconductor wafer 106 (both sides with respect to the direction in which the resin is filled in the underfill), and the movable blocks can protrude into the mold Cavities 107.

With regard to this resin sealing device, as shown in the left half of Figure 11(c), the movable blocks 110 previously provided on both sides of the semiconductor wafer 106 are protruded into the cavity recess 107, thereby making the The mold film 118 is pressed against the substrate 102, so that the sealing resin 122 is preferentially sent to the gap 121 between the semiconductor wafer 106 and the substrate 102 to perform underfill molding. Prior art literature Patent literature

Patent Document 1: Japanese Patent Application Publication No. 2002-9096

The problem to be solved by the invention

In the above-mentioned conventional resin sealing device, the movable block 110 is only raised and lowered on both side surfaces of the semiconductor wafer 106 (both sides with respect to the direction of filling the underfill portion with resin), and the semiconductor wafer 106 Since both side surfaces are closed, it can be expected that the sealing resin 122 is preferentially fed to the gap 121 between the semiconductor wafer 106 and the substrate 102. However, in the case of large-sized semiconductor wafers that have been made in recent years, when the sides of the semiconductor wafer are closed, the connecting electrodes between the large-area semiconductor wafer and the substrate will become resistance to resin flow, and the sealing resin will only If the flow is in one direction, it will not flow sufficiently to the gap part, resulting in insufficient underfill. Moreover, if the both sides are opened to fill the remaining space with resin, the resin pressure will also be applied to the part that has been filled with resin at the same time, and the filled resin will be pushed to both sides, which will affect the flow from the gate side to the vent side. The unidirectional resin flow that goes out creates resistance, which leads to poor flow balance, voids, air bubbles, etc. are generated in the gap between the overlapping resins, resulting in poor overall molding quality.

Therefore, the object of the present invention is to provide a resin sealing device and a resin sealing method that can avoid insufficient underfilling and poor molding such as voids and bubbles even for semiconductor wafers that have been made larger in recent years. Means to solve the problem

The resin sealing device of the present invention clamps a molded article between a first mold and a second mold. The molded article is made by connecting a semiconductor wafer on the surface of a substrate by flip-chip connection with a connecting electrode, and injecting a sealing resin into The cavity recess including the gap portion between the surface of the substrate and the connecting surface of the semiconductor wafer is resin-sealed and molded, wherein the resin sealing device includes: an advance and retreat member that advances and retreats into the cavity recess toward the surface of the substrate The advancing and retreating member that surrounds at least a part of the entire circumference of the side surface of the semiconductor wafer; and the control section is in a state in which the advancing and retreating member enters the cavity concave portion to the position of the semiconductor wafer connection surface, and is directed to the cavity concave portion Inject the sealing resin, fill the gap between the surface of the substrate and the connection surface of the semiconductor wafer, and the gap between the surface of the substrate and the advance and retreat member, and then retreat the advance and retreat member from the cavity of the cavity to the semiconductor The side surface of the wafer is filled with sealing resin all around.

The resin sealing method of the present invention uses a first mold and a second mold to clamp a molded object. The molded object is made by connecting a semiconductor wafer on the surface of a substrate by flip-chip through a connecting electrode, and injecting a sealing resin into The cavity recess including the gap portion between the surface of the substrate and the connection surface of the semiconductor wafer is resin-sealed and molded, wherein the resin sealing method includes: the advance and retreat member enters the cavity recess to the connection of the semiconductor wafer Fill the gap between the surface of the substrate and the connection surface of the semiconductor wafer and the gap between the surface of the substrate and the advance and retreat member by injecting the sealing resin into the cavity recess, and fill the gap portion between the surface of the substrate and the advance and retreat member. It advances and retreats toward the surface of the substrate in the cavity recess, the advance and retreat member includes at least a part of the entire circumference of the side surface of the semiconductor wafer; and the advance and retreat member retreats from the cavity recess and fills the entire circumference of the semiconductor wafer with sealing resin.

According to these inventions, the advancing and retreating member surrounding at least a part of the entire circumference of the side surface of the semiconductor wafer enters the cavity recess to the position of the connection surface of the semiconductor wafer, that is, the entire circumference of the side surface of the semiconductor wafer is not Sealing, but in a state where there is not only a gap between the surface of the substrate and the semiconductor wafer, but also a gap between the surface of the substrate and the advance and retreat member, the sealing resin is injected into the cavity recess, so it is injected The sealing resin is not only directly filled in the gap between the surface of the substrate and the semiconductor wafer, but also filled in the gap between the surface of the substrate and the semiconductor wafer in a roundabout way. The sealing resin It sufficiently flows to the gap between the surface of the substrate and the connection surface of the semiconductor wafer.

In addition, the advancing and retreating member is divided into a plurality of parts when viewed from the surface side of the substrate, and it is preferable that the control unit individually controls the advancing and retreating of a plurality of parts of the advancing and retreating member. Thereby, by individually controlling the advance and retreat of the advance and retreat members divided into plural parts, the flow of the injected sealing resin can be optimized. Effect of invention

(1) According to the present invention, the injected sealing resin is filled in the gap between the surface of the substrate and the semiconductor wafer in a roundabout way in the gap between the substrate and the advance and retreat member, and the sealing resin sufficiently flows to the surface of the substrate and The gap between the connecting surfaces of semiconductor wafers, even for semiconductor wafers that have been made larger in recent years, can avoid insufficient underfilling, and can avoid voids caused by insufficient underfilling. Moreover, the resin is poured from The port side flows unidirectionally to the vent side, so the resin flow balance is better, and high-quality molding without voids, bubbles, etc. can be achieved.

(2) The advancing and retreating member is divided into plural parts when viewed from the surface side of the substrate, and the control unit individually controls the advancing and retreating of the plural parts of the advancing and retreating member, thereby optimizing the flow of the injected sealing resin. It is possible to reduce unfilled conditions, to reduce the generation of voids and bubbles, and to achieve higher-quality molding.

Fig. 1 is a schematic front sectional view of a mold of a resin sealing device according to an embodiment of the present invention, Fig. 2 is a bottom view of the upper mold in Fig. 1, and Figs. 3 to 5 are diagrams showing how the resin sealing device of this embodiment is performed The schematic front sectional view of the resin sealing molding project.

The resin sealing device according to the embodiment of the present invention is shown in FIGS. 1 and 2, and resin sealing is performed on a molded article 4 made by connecting a semiconductor wafer 2 on the surface of a substrate 1 via a connecting electrode 3 in a flip chip manner. Molded device. The resin sealing device has an upper mold 5 as a first mold and a lower mold 6 as a second mold, and the upper mold 5 and the lower mold 6 can clamp the molded article 4.

The upper mold 5 is formed with a cavity recess 7 that accommodates the semiconductor wafer 2 mounted on the substrate 1, and resin paths such as gate 8A and runner 8B, which communicate with the cavity recess 7. Furthermore, the upper mold 5 has a vent hole 9 for exhaust gas formed on the side opposite to the side where the gate 8A is located via the cavity recess 7. The bottom surface 7A of the cavity recess 7 has a through hole 10 corresponding to the outer circumference of the side surface 2A of the semiconductor wafer 2 and the outer circumference of the resin-sealed molded product.

Furthermore, the upper mold 5 has an advance and retreat member 11 corresponding to the through hole 10. The advancing and retreating member 11 is driven by the driving part 20 and, as shown in FIG. 3, advances and retreats into the cavity recess 7 toward the surface 1A of the substrate 1. The drive unit 20 is controlled by the control unit 21. When the advancing and retracting member 11 enters the cavity recess 7, when viewed from the surface 1A side of the substrate 1, it has a substantially square shape surrounding the entire circumference of the side surface 2 of the semiconductor wafer 2.

The lower mold 6 has a substrate placing portion 12 on which the substrate 1 is placed, a heating vessel 14 for heating and melting the sealing resin 13, and the sealing resin 13 from the heating vessel 14 to the cavity through the gate 8A and runner 8B The recess 7 presses the push post 15. In addition, when resin sealing is performed on the square semiconductor wafer 2 having a size of 30 mm to 40 mm, the injection pressure of the sealing resin 13 is 7 MPa to 8 MPa.

In the resin sealing method of the resin sealing device described above, as shown in FIG. 1, the substrate 1 (molding object 4) to which the semiconductor wafer 2 is connected by flip-chip via the connecting electrode 3 is carried into the substrate mounting of the lower mold 6. In the section 12, after pouring the sealing resin 13 into the heating vessel 14, the upper mold 5 and the lower mold 6 sandwich the substrate 1 with the release film 16 therebetween. At this time, the bottom surface 7A of the cavity recess 7 presses the surface 2B of the semiconductor wafer 2 to prevent the surface 2B of the semiconductor wafer 2 from being impregnated with resin (refer to FIG. 3).

Next, as shown in FIG. 3, the advance and retreat member 11 is entered into the cavity recess 7 to the position of the connection surface 2C of the semiconductor wafer 2, and the tip surface 11A of the advance and retreat member 11 and the connection surface 2C of the semiconductor wafer 2 are in the same plane . Thereby, the underfill space 7B of the cavity recess 7 constituted by the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor wafer 2 and the gap portion between the surface 1A of the substrate 1 and the advance and retreat member 11, The thickness is equivalent to the height of the connection electrode 3 (0.05 mm to 0.1 mm), and it becomes a substantially uniform thin plate-like space.

Then, as shown in FIG. 4, the pusher 15 is raised, the sealing resin 13 is injected from the heating container 14 through the runner 8B and the gate 8A into the cavity recess 7, and the sealing resin 13 is filled on the surface 1A of the substrate 1 and The underfill space 7B of the cavity recess 7 formed by the gap portion between the connection surfaces 2C of the semiconductor wafer 2 and the gap portion between the surface 1A of the substrate 1 and the advance and retreat member 11 is used for underfill molding. Since the underfill space 7B has almost no projections and depressions, the fluid resistance is small, and the injected sealing resin 13 can flow in smoothly.

After the underfill molding, as shown in FIG. 5, the advance and retract member 11 is retracted from the cavity recess 7 to a predetermined position (in the example shown, the front end surface 11A of the advance and retract member 11 is retracted to the bottom surface 7A of the cavity recess 7) , And further inject the sealing resin 13 to fill the entire circumference of the side surface 2A of the semiconductor wafer 2 with the sealing resin to complete the resin sealing. The operation of the resin sealing device described above is controlled by the control unit 21.

As described above, in the resin sealing device and the resin sealing method of the present embodiment, the advancing and retreating member 11 surrounding the entire circumference of the side surface 2A of the semiconductor wafer 2 is advanced into the cavity recess 7 and out of the position of the connection surface 2C of the semiconductor wafer 2 In this state, the sealing resin 13 is injected. Thereby, the injected sealing resin 13 can not only be directly filled in the gap between the surface 1A of the substrate 1 and the semiconductor wafer 2, but also can be filled in the gap between the substrate 1 and the advance and retreat member 11 in a roundabout manner. In the gap between the surface 1A of the substrate 1 and the semiconductor wafer 2, the sealing resin can sufficiently flow to the gap between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor wafer 2, even if it is made larger in recent years For semiconductor wafers, insufficient underfilling can also be avoided, and the resin flows unidirectionally from the gate side to the vent side. Therefore, the resin flow is balanced and high-quality molding without voids, bubbles, etc. can be achieved.

In addition, in the above embodiment, as shown in FIG. 3, when the advance and retreat member 11 is advanced into and out of the position of the connection surface 2C of the semiconductor wafer 2 into the cavity recess 7, the front end surface 11A of the advance and retreat member 11 is connected to the semiconductor wafer 2 The connecting surfaces 2C are on the same plane, but they are not necessarily on the same plane. The key is not to close the side surface 2A of the semiconductor wafer 2 all around, but to have a gap not only between the surface 1A of the substrate 1 and the semiconductor wafer 2, but also between the surface 1A of the substrate 1 and the advance and retreat member 11. In the partial state, a structure in which the sealing resin 13 is injected into the cavity recess 7 is sufficient.

Next, referring to FIG. 6, a modification example of the advance and retreat member 11 will be described. (A) to (c) of Fig. 6 are bottom views of the upper mold showing a modification of the advance and retreat member, respectively.

In the example shown in FIG. 6(a), the outer peripheral corner 17A of the advancing and retreating member 17 viewed from the advancing and retreating direction of the advancing and retreating member 17 and the cavity recessed portion 10 corresponding to the outer peripheral corner 17A of the advancing and retreating member 17 All the inner peripheral corners 10A are curved surfaces. The radius R of the curved surface is 1 mm or more, more desirably 2 mm or more, and still more desirably 3 mm or more. Thereby, when the substrate 1 is clamped by the upper mold 5 and the lower mold 6 with the release film 16 therebetween, the outer peripheral corner portion 17A of the member 17 and the inner peripheral corner portion of the cavity recess 10 of the mold release film 16 can be prevented The part sandwiched by 10A is damaged.

In the example shown in FIG. 6(b), the advancing and retracting member 18 is viewed from the surface 1A side of the substrate 1 and is roughly enclosing the side surface 2A of the semiconductor wafer 2 except for the gate 8A side portion.コ shape. Even in the structure, when the sealing resin 13 is injected in a state where the advancing and retracting member 18 enters and exits the position of the connection surface 2C of the semiconductor wafer 2 into the cavity recess 7, the injected sealing resin 13 is not only directly filled into the substrate The gap between the surface 1A of 1 and the semiconductor wafer 2 is also filled in the gap between the surface 1A of the substrate 1 and the semiconductor wafer 2 in a circuitous manner in the gap between the substrate 1 and the advancing and retracting member 18. The sealing resin can It sufficiently flows to the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor wafer 2. Furthermore, since the advancing and retreating member 18 does not exist in the portion of the cavity recess 7 facing the gate 8A, by increasing the thickness of the gate 8A, the injection amount of the sealing resin 13 per unit time can be increased.

In the example shown in FIG. 6(c), the advancing and retreating member 19 is viewed from the surface 1A side of the substrate 1 and is roughly formed by a portion surrounding the side surface 2A of the semiconductor wafer 2 except for the portion on the side of the vent 9 Reverse コ shape. Even in this structure, when the sealing resin 13 is injected in a state where the advancing and retracting member 19 enters and exits the position of the connection surface 2C of the semiconductor wafer 2 into the cavity recess 7, the injected sealing resin 13 is not only directly filled The gap between the surface 1A of the substrate 1 and the semiconductor wafer 2 is also filled in the gap between the substrate 1 and the advancing and retracting member 19 in a roundabout manner to seal the gap between the surface 1A of the substrate 1 and the semiconductor wafer 2 The resin can sufficiently flow to the gap portion between the surface 1A of the substrate 1 and the connection surface 2C of the semiconductor wafer 2. In addition, in the case where the vent hole 9 side is open as described above, when the resin flow resistance caused by the connection electrode 3 in the underfill space 7B makes the filling speed of each position uneven, the sealing resin 13 faces the vent hole 9 side During the space filling period, fill the position with a slower filling speed, so as to solve the problem of not being filled.

Next, another modification example of the advance and retreat member 11 will be described. 7(a) and (b) are bottom views of the upper mold of another modification of the advance and retreat member, and FIG. 8 is a schematic front sectional view of the mold of the resin sealing device in the example of FIG. 7(b), 9 and 10 are schematic front cross-sectional views showing the resin sealing molding process performed by the resin sealing device of the example of FIG. 7(b).

In the example shown in (a) and (b) of FIG. 7, the advancing and retracting member 30 and the advancing and retracting member 40 are divided into plural parts when viewed from the surface 1A side of the substrate 1. The advancing and retreating member 30 shown in FIG. 7(a) is formed of the side surface 2A including the semiconductor wafer 2 when viewed from the surface 1A side of the substrate 1 in the same way as the foregoing advancing and retreating member 18 (see FIG. 6(b).) The roughly U-shaped first advancing and retreating member 31 in the entire circumference except for the gate 8A side portion, and the second advancing and retreating member 32 that fills the open portion of the first advancing and retreating member 31 are constituted.

On the other hand, the advancing and retreating member 40 shown in FIG. 7(b) is composed of the same as the foregoing advancing and retreating member 19 (see FIG. 6(c).), when viewed from the surface 1A side of the substrate 1, it surrounds the semiconductor wafer The side surface 2A of 2 has a roughly reversed U-shape from the part excluding the part on the side of the vent hole 9 and the second advance and retreat member 42 that fills the open portion of the first advance and retreat member 41.

Taking the example shown in FIG. 7(b) for explanation, as shown in FIG. 8, the first advance and retreat member 41 and the second advance and retreat member 42 are driven by separate driving portions 20A and 20B, respectively, so as to face the surface of the substrate 1. 1A advances and retreats in the cavity recess 7. The driving part 20A and the driving part 20B are controlled by the control part 21, so that the first advancing and retreating member 41 and the second advancing and retreating member 42 are individually controlled to advance and retreat.

In this example, in the same manner as described above, the substrate 1 (molding object 4) to which the semiconductor wafer 2 is flip-chip connected via the connection electrode 3 is placed in the substrate mounting portion 12 of the lower mold 6 and placed in the heating container 14 After pouring the sealing resin 13 into the upper mold 5 and the lower mold 6, the substrate 1 is clamped with the release film 16 therebetween, and then the first advance and retreat member 41 and the second advance and retreat member 42 are moved into the cavity recess 7 into the semiconductor The connection surface 2C of the wafer 2 is positioned such that the tip surface 41A of the first advancing and retracting member 41 and the tip surface 42A of the second advancing and retracting member 42 are in the same plane as the connecting surface 2C of the semiconductor wafer 2.

Next, as shown in FIG. 9, the pusher 15 is raised, and the sealing resin 13 is injected from the heating container 14 through the runner 8B and the gate 8A into the cavity recess 7, and the sealing resin is filled on the surface 1A of the substrate 1 and the semiconductor The gap portion between the connection surface 2C of the wafer 2 and the gap portion between the surface 1A of the substrate 1 and the first advance and retreat member 41 and the second advance and retreat member 42 constitute the underfill space 7B of the cavity recess 7 to perform the bottom Filling and molding.

Then, after a predetermined time A has elapsed, only the second advancing and retreating member 42 is retracted to a predetermined position, and after a predetermined time B has elapsed, as shown in FIG. 10, both the first advancing and retreating member 41 and the second advancing and retreating member 42 are removed from the mold. The cavity recess 7 is retracted to a predetermined position (the front end surface 41A of the first advancing and retreating member 41 and the end surface 42A of the second advancing and retreating member 42 are retracted to the position of the bottom surface 7A of the cavity recess 7), and the sealing resin 13 is further injected. The side surface 2A of the semiconductor wafer 2 is filled with sealing resin over the entire circumference to complete resin sealing.

In this way, the advancing and retreating member 40 is divided into plural parts of the first advancing and retreating member 41 and the second advancing and retreating member 42 when viewed from the surface 1A side of the substrate 1, and the advancing and retreating member 40 is individually controlled by the control unit 21 to advance and retreat, thereby The flow of the injected sealing resin 13 can be optimized, unfilled conditions can be reduced, the generation of voids and bubbles can be reduced, and higher-quality molding can be achieved.

In addition, the control of the drive units 20A and 20B by the control unit 21 can also store a table that predetermines the advance and retreat conditions of the first advance and retreat member 41 and the second advance and retreat member 42 in accordance with the structure of the molded product in the resin sealing device. When sealing, use this table to determine the conditions. Industrial availability

The resin sealing device and the resin sealing method of the present invention are effective as a device and method for resin sealing a molded article made by flip-chip connection of semiconductor wafers on the surface of a substrate. In particular, it is ideally suited for For semiconductor wafers that have been made larger in recent years, resin sealing devices and resin sealing methods that can avoid insufficient underfilling and poor molding such as voids and bubbles.

1: substrate 2: Semiconductor wafer 3: Connect the electrodes 4: molding object 5: Upper die 6: Lower die 7: cavity recess 7B: Fill space at the bottom 8A: Gate 8B: runner 10: Through hole 11, 17, 18, 19: advance and retreat components 12: Board placement section 13: Sealing resin 14: Heating container 15: Push column 16: Release film 20: Drive 21: Control Department 22: table 30, 31, 32, 40, 41, 42: advance and retreat components

[Fig. 1] A schematic front sectional view of a mold of a resin sealing device according to an embodiment of the present invention. [Fig. 2] A bottom view of the upper mold in Fig. 1. [Fig. 3] A schematic front cross-sectional view showing a resin sealing molding process performed by the resin sealing device of this embodiment. [Fig. 4] A schematic front cross-sectional view showing a resin sealing molding process performed by the resin sealing device of this embodiment. [Fig. 5] A schematic front cross-sectional view showing a resin sealing molding process performed by the resin sealing device of this embodiment. [Fig. 6] (a) to (c) are bottom views of the upper mold showing a modification of the advance and retreat member, respectively. [Fig. 7] (a) and (b) are bottom views of the upper mold showing other modifications of the advance and retreat member. [Fig. 8] A schematic front sectional view of a mold of the resin sealing device of the example of Fig. 7(b). [Fig. 9] A schematic front sectional view showing a resin sealing molding process performed by the resin sealing device of the example of Fig. 7(b). [Fig. 10] A schematic front sectional view showing a resin sealing molding process performed by the resin sealing device of the example of Fig. 7(b). [Fig. 11] A schematic bottom view of the molding die of the previous resin sealing device, Fig. 11(b) is a cross-sectional view along AA in Fig. 11(a), and Fig. 11(c) shows that the resin filling is completed A cross-sectional view along BB in FIG. 11(a) of the state before and after.

1: substrate

1A: Surface

2: Semiconductor wafer

2A: side

2B: Surface

3: Connect the electrodes

4: molding object

5: Upper die

6: Lower die

7B: Fill space at the bottom

8A: Gate

8B: runner

10: Through hole

11: advance and retreat components

11A: Top side

12: Board placement section

13: Sealing resin

14: Heating container

15: Push column

Claims (7)

A resin sealing device uses a first mold and a second mold to clamp a molded object. The molded object is made by connecting a semiconductor wafer on the surface of a substrate by a flip chip using a connecting electrode to seal Resin is injected into the cavity recess including the gap between the surface of the substrate and the connecting surface of the semiconductor wafer to perform resin sealing molding, which is characterized by including: The advance and retreat member is an advance and retreat member that advances and retreats in the cavity recess toward the surface of the substrate, and surrounds at least a part of the entire circumference of the side surface of the semiconductor wafer; and The control unit injects the sealing resin into the cavity recess and fills the sealing resin on the surface of the substrate while the advance and retreat member enters the cavity recess to the position of the connection surface of the semiconductor wafer. The gap portion between the connection surface with the semiconductor wafer and the gap portion between the surface of the substrate and the advance and retreat member, and then the advance and retreat member is retracted from the cavity recess and filled the entire circumference of the side surface of the semiconductor wafer The aforementioned sealing resin. The resin sealing device described in claim 1, wherein: When viewed from the advancing and retreating direction of the advancing and retreating member, the outer peripheral corners of the advancing and retreating member and the inner peripheral corners of the cavity recess are both curved. The resin sealing device described in claim 1 or 2, wherein: The advancing and retreating member has a substantially square shape that surrounds the entire circumference of the side surface of the semiconductor wafer when viewed from the surface side of the substrate. The resin sealing device described in claim 1 or 2, wherein: The advancing and retreating member is formed in a roughly U shape that surrounds the entire circumference of the side surface of the semiconductor wafer except for the gate side portion when viewed from the surface side of the substrate. The resin sealing device described in claim 1 or 2, wherein: The advancing and retreating member has a substantially reverse U-shape that surrounds the entire circumference of the side surface of the semiconductor wafer except for the portion on the side of the vent when viewed from the surface side of the substrate. The resin sealing device described in any one of claims 1 to 5, wherein: The advance and retreat member is divided into plural parts when viewed from the surface side of the substrate, The control unit individually controls the advance and retreat of the plural parts of the advance and retreat member. A resin sealing method. In the resin sealing method, a first mold and a second mold are used to clamp a molded object, and the molded object is made by connecting a semiconductor chip on the surface of a substrate by flip chip connection with a connection electrode , Inject a sealing resin into the cavity recess including the gap between the surface of the substrate and the connection surface of the semiconductor wafer to perform resin sealing molding, which is characterized by including: The advance and retreat member is moved into the cavity recessed portion to the position of the connection surface of the semiconductor wafer, the sealing resin is injected into the cavity recess, and the sealing resin is filled between the surface of the substrate and the connection surface of the semiconductor wafer The gap portion between the surface of the substrate and the advance and retreat member, wherein the advance and retreat member advances and retreats in the cavity recess toward the surface of the substrate, and the advance and retreat member surrounds the entire circumference of the side surface of the semiconductor wafer At least part of; and The advance and retreat member is retracted from the cavity recess, and the sealing resin is filled all around the side surface of the semiconductor wafer.

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