CN101421835A - Method of resin encapsulation molding for electronic part and resin encapsulation molding apparatus for electronic part - Google Patents
Method of resin encapsulation molding for electronic part and resin encapsulation molding apparatus for electronic part Download PDFInfo
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- CN101421835A CN101421835A CNA2007800132066A CN200780013206A CN101421835A CN 101421835 A CN101421835 A CN 101421835A CN A2007800132066 A CNA2007800132066 A CN A2007800132066A CN 200780013206 A CN200780013206 A CN 200780013206A CN 101421835 A CN101421835 A CN 101421835A
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Abstract
A method of resin encapsulation molding for electronic part, and apparatus therefor, capable of unfailingly preventing any occurrence of void in molded package. The resin encapsulation molding apparatus includes first die (111), second die (112), pot block (140) and vacuum means. The first die (111) has a first die face and is fitted with substratum (400) having an electronic part mounted thereon. The second die (112) has not only a second die face opposed to the first die face but also cavity (114) for accommodating the electronic part. The pot block (140), while the first die (111) and the second die (112) are in the state of locking together, injects a resin material from a clearance thereof. The vacuum means evacuates the space created among the first die face, second die face and pot block (140) at the time of injection of the resin material.
Description
Technical field
The present invention relates to be used for resin sealing shaping device with the method for the used for electronic device resin material seal molding of smaller types such as semiconductor chip and the electronic device that uses in order to implement this method, be particularly related to the resin-sealed quality improving when using the resin-seal molding mould, the structure of this mould is batch tank unit on the resin-seal molding mould of electronic device (pot block), its side with respect to this mould is freely engaged and separates.
Background technology
In recent years, (be designated hereinafter simply as electronic device for electronic device with smaller types such as semiconductor chips.) semiconductor package body that forms with the resin material seal molding (is designated hereinafter simply as packaging body.), its high performance of special requirement.Specifically, for example as the large substrate of so-called MAP type etc., strong request its highly integrated and high reliability and compactization.
Therefore, when the shaping semiconductor package body, must carry out resin-seal molding, make its keep highly integrated by the state of the quality of resin-seal molding product under, its profile is frivolous as much as possible and short and small.
As by the quality of the packaging body of resin-seal molding product, importantly improve the resin material that is used for electronic component encapsulation and (be designated hereinafter simply as substrate when keeping above-mentioned resin-seal molding with lead frame that electronic device has been installed and substrate etc.) cementability (or sealing).
Here, during with the electronic device resin-seal molding on the substrate, the operation below general the enforcement.At first, substrate is placed on the assigned position of mould cavity part, this mould cavity part is set at the mould composition surface (die joint (parting line surface) of resin-seal molding mould.Be designated hereinafter simply as the P.L face.)。Then, carry out matched moulds with P.L face closure.Then, molten resin material is injected in the die cavity.By this, with electronic component encapsulation in being configured as the packaging body corresponding with the shape of this die cavity.
The handover that is arranged at the mould cavity part of P.L face and molten resin material constitutes spatial portion in the mould with path etc., and the gas that produces when therefore residuing in the heating and melting of air, moisture and the resin material of spatial portion in this mould etc. is sneaked in the molten resin material.As a result, exist them in packaging body, to form space (bubble), also become the problem of the reason etc. of the cementability that weakens substrate and packaging body.Therefore, before in die cavity, injecting molten resin material, earlier the space that is formed in the mould is vacuumized (decompression), will residue in the outwards portion's eliminatings (for example with reference to 05-No. 008250 communique of Japanese patent laid-open (patent documentation 1)) energetically such as air in the space in the mould by this.
In addition, known a kind of structure, this structure is a main purpose with the effective rate of utilization of the used resin material of the resin-seal molding that improves electronic device, the injection cylinder (resin material is supplied with jar of usefulness) that makes molten resin when the P.L of resin-seal molding mould face closure with respect to the engage sides of mould with separate (for example opening clear 59-No. 052842 communique (patent documentation 2)) with reference to the Japan Patent spy.
Patent documentation 1: 05-No. 008250 communique of Japanese patent laid-open
Patent documentation 2: the Japan Patent spy opens clear 59-No. 052842 communique
The announcement of invention
Above-mentioned in die cavity, inject molten resin material before, the invention (patent documentation 1) that earlier space in the mould vacuumized, with the air in the space that residues in the mould etc. energetically outwards portion get rid of.By this, can prevent the interstitial situation in packaging body that the existence because of this residual air etc. causes.In addition, can expect can not to make the action effect of degradation under the cementability of substrate and packaging body.
In addition, the above-mentioned injection cylinder (jar) of molten resin that makes in the engage sides and separated structures (patent documentation 2) with respect to mould, will be used to transfer the resin passage shortening of molten resin material when the P.L of resin-seal molding mould face is closed.By this, can improve the effective rate of utilization of resin material.
Yet, the injection cylinder (jar) that makes molten resin when the P.L of closed resin-seal molding mould face is closed with respect to not have announcement that the space in the mould is vacuumized in the engage sides of mould and the separated structures (patent documentation 2).
Therefore, the purpose of this invention is to provide the method for resin-seal molding and the device thereof of electronic device, this method and device can positively prevent to form the space in the packaging body that is shaped.
The method of resin-seal molding of electronic device of the present invention possesses preparatory process, supplies with operation, and the matched moulds operation engages operation, decompression operation, injection process, separation circuit, forming process and die sinking operation.In the preparatory process, prepare resin molding apparatus, this resin molding apparatus possesses die assembly, this die assembly comprises the 1st mould and the 2nd mould, the 1st mould has the 1st die face, and the 2nd mould has 2nd die face relative with the 1st die face, and has the die cavity of taking in electronic device.Supply with in the operation, the resin-sealed preceding substrate that electronic device has been installed is supplied to the assigned position of placed side.In the matched moulds operation, by carrying out the matched moulds of die assembly, electronic device on the substrate before resin-sealed and periphery thereof are inserted in the die cavity, this die cavity is arranged between the 1st die face and the 2nd die face.Engage in the operation, the jar unit that resin material is injected usefulness is engaged in the side of the die assembly after the matched moulds operation.In the decompression operation, the space that constitutes between the 1st die face, the 2nd die face and jar unit is vacuumized, this space forms after engaging operation.In the injection process, resin material directly is injected in the die cavity from the jar unit.In the separation circuit, the jar unit is separated from die assembly.In the forming process, solidify, electronic device and the periphery thereof that is flush-mounted in the die cavity sealed with resin material by making resin material.In the die sinking operation, after forming process, open the 1st mould and the 2nd mould, take out the substrate behind resin-sealed after the resin-seal molding operation.
In addition, in the resin molding method of electronic device of the present invention, be preferably in supplying with operation the substrate between the 1st die face and the 2nd die face before the resin-seal molding of supply odd number piece.
In addition, in the resin molding method of electronic device of the present invention, be preferably in supplying with operation, the side of base board end surface before resin-sealed and die assembly is settled at grade.
In addition, in the resin molding method of electronic device of the present invention, be preferably in preparatory process, the resin molding apparatus of a plurality of die assemblies that has been ready to laminated configuration is exerted pressure to a plurality of die assemblies in the matched moulds operation simultaneously.
In addition, the resin molding apparatus of electronic device of the present invention possesses the 1st mould, the 2nd mould, jar unit and the mechanism of decompressor.The 1st mould has the 1st die face, and the substrate that has carried electronic device is installed.The 2nd mould has 2nd die face relative with the 1st die face, and has the die cavity of taking in electronic device.The jar unit injects resin material from the side of die assembly under the state of the die assembly closure that comprises the 1st mould and the 2nd mould.The mechanism of decompressor vacuumizes the space that constitutes between the 1st die face, the 2nd die face and jar unit when injecting resin material.
In addition, in the resin molding apparatus of electronic device of the present invention, be preferably the substrate supply unit is set, the substrate of this substrate supply unit before the 1st mould is supplied with odd number piece resin-sealed.
In addition, in the resin molding apparatus of electronic device of the present invention, be preferably feed mechanism is set, when the substrate of in die cavity, supplying with before resin-sealed, this feed mechanism is supplied with resin-sealed preceding substrate, and resin-sealed preceding base board end surface is placed at grade with the side that comprises the die assembly of the 1st mould and the 2nd mould.
In addition, in the resin molding apparatus of electronic device of the present invention, be preferably a plurality of die assemblies of laminated configuration, and pressue device is set, this pressue device is exerted pressure to a plurality of die assemblies simultaneously.
In addition, in the resin molding apparatus of electronic device of the present invention, be preferably a jar unit and comprise jar (pot) and a plunger, this jar is disposed at its inside with resin material, this plunger will be supplied to a jar interior resin material and be extruded in the die cavity, the 1st die face, the 2nd die face and comprise the 1st mould and the composition surface of the die assembly of the 2nd mould and jar unit on also possess resinous coat, this resinous coat possesses sealing function.
In addition, in the resin sealing shaping device of electronic device of the present invention, be preferably the mechanism of decompressor and be connected, and comprise the exhaust pathway that is arranged at jar unit with the space.
By method of resin-seal molding and the device that adopts electronic device of the present invention, can positively prevent from the packaging body that is shaped, to form the space resin-seal molding product of the electronic device that possesses high-quality property and high reliability of therefore can being shaped.
Simple declaration to accompanying drawing
Fig. 1 is local excision's cutaway view of major part of the resin sealing shaping device of the expression method of resin-seal molding that is used to implement electronic device of the present invention.
Fig. 2 is local excision's longitudinal sectional view of the major part of the resin-seal molding portion in the resin sealing shaping device of schematic representation Fig. 1, be the assigned position that the substrate before the resin-seal molding is positioned over the mould composition surface (P.L face) of each die assembly after the die sinking, and the key diagram when in jar, supplying with resin material.
Fig. 3 is corresponding to the resin-seal molding portion of Fig. 2, is the local excision's cutaway view on the III-III line of Fig. 2, and schematic representation is arranged on the mould composition surface of die assembly and the configuration relation of the containment member on jar unit.
Fig. 4 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 2, the laying state of the substrate before the resin-seal molding on the expression mould composition surface and to the resin material supply condition in the jar.
Fig. 5 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 2, represent each die assembly the matched moulds state, make state after the engage sides of containment member on the leading section that is provided in jar unit and each die assembly, with between the 1st die face of each die assembly and the 2nd die face and the state of discharging such as the residual air in the space that constitutes between each die assembly and jar unit to the external forced ground of die assembly.
Fig. 6 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 5, represent between the 1st die face of each die assembly and the 2nd die face and each die assembly and jar unit leading section between the state of matched moulds completely after the complete closure.
Fig. 7 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 6, and jar state of interior resin material is transferred in the expression pressurization.
Fig. 8 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 7, makes jar unit finish the state that retreats behind the expression resin-seal molding.
Fig. 9 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 8, represents the die opening state of each die assembly.
Figure 10 is the local excision's cutaway view corresponding to the resin-seal molding portion of Fig. 9, the taking-up state of the substrate behind the expression resin-seal molding.
Figure 11 is local excision's cutaway view of resin-seal molding portion, and expression is equipped on other shape example and structure example of containment member of the leading section of jar unit.
Symbol description
100 resin-seal molding portions, 110 die assemblies, 110a side, 111 the 1st moulds, 112 the 2nd moulds, 113 placed sides, 114 die cavitys, 115 handover paths, 116 pins, 120 mould open/close mechanisms, 130 pressure mechanisms, 140 jars of unit, 141 jars, 142 plungers, 150 reciprocating drive mechanisms, 200 substrates are supplied with unloading device, and 201 substrates are supplied with and taken out member, and 300 resin materials are carried feed mechanism, 301 resin materials, 302 resin materials are carried supply member, the substrate before 400 resin-seal moldings, 400a end, substrate behind 402 resin-seal moldings (resin-seal molding product), 500 mechanisms of decompressor, 501,502, the 502a containment member, 503,504,505 exhaust pathways.
The best mode that carries out an invention
Resin sealing shaping device in the execution mode comprises resin-seal molding portion 100, and unloading device 200 supplied with by substrate and resin material is carried feed mechanism 300.Resin-seal molding portion 100 is with the electronic device resin-seal molding on the substrate.Substrate is supplied with unloading device 200 and the substrate before the resin-seal molding is carried the aftermentioned assigned position that is supplied in the resin-seal molding portion 100, and the substrate that resin-seal molding finishes is taken out from resin-seal molding portion 100, take out of from resin-seal molding portion 100.Resin material carries feed mechanism 300 resin material to be carried the aftermentioned assigned position that is supplied in the resin-seal molding portion 100.
In addition, resin-seal molding portion 100 comprises die assembly 110, mould open/close mechanism 120, pressure mechanism 130, jar unit 140 and reciprocating drive mechanism 150.Die assembly 110 is the members that are used for the electronic device resin-seal molding.Mould open/close mechanism 120 is the members that are used for die assembly 110 die sinkings and matched moulds.Pressure mechanism 130 is the pressue devices that are used for this die assembly 110 being applied under with the state of die assembly 110 matched moulds required clamping pressure.Jar unit 140 is members that the resin material that is disposed at the side of die assembly 110 is supplied with usefulness.Reciprocating drive mechanism 150 is for jar unit 140 freely being engaged with respect to the side 110a of die assembly 110 and separating the member that sets.
In addition, die assembly 110 comprises the 1st mould 111 with the 1st die face and the 2nd mould 112 with the 2nd die face.Resin-seal molding portion 100 comprises at least one group of above die assembly 110, has disclosed in the legend 2 groups of die assemblies 110 structure of forming of laminated configuration along the vertical direction, and this die assembly 110 is made of the 1st mould 111 and the 2nd mould 112.
In addition, the 1st die face in the 1st mould 111 is mould composition surface (a P.L face).That is, the 1st die face is the placed side 113 as the substrate supply unit of supplying substrate 400, is arranged at the 1st mould 111.The substrate supply unit that this placed side 113 is odd number pieces, this substrate supply unit are used for placing has installed a substrate 400 of electronic device (not shown).That is, only substrate 400 is supplied to and is positioned over placed side 113 in one group of above-mentioned die assembly 110.In addition, the step that the substrate orientation that is provided with shapes such as recesses in the past the die face is used is set on the placed side 113.Therefore, placed side 113 forms flat shape.And, and be provided with the die cavity 114 that ester moulding is used on the die face (the 2nd die face) of placed side 113 relative the 2nd moulds 112 that set of the 1st mould 111.The side 110a of the die assembly 110 when in addition, the 1st mould 111 is with the 2nd mould 112 matched moulds is communicated with path 115 with the handover of molten resin material with die cavity 114 Jie.
In addition, pin 116 that can the upright decision substrate position of establishing required form and requirement is used on the assigned position of the 1st die face (placed side 113 of substrate) of the 1st mould 111.In addition, can on the corresponding position of the 2nd die face and position pin 116 of the 2nd mould 112 and quantity, set and be used to pin-and-hole (pin hole) (not shown) that pin 116 is embedded.By this, substrate 400 can be guided to the assigned position of placed side 113, and positively be placed on this position.
In addition, the afore mentioned rules position is meant that the side 110a of end (end face) 400a of substrate 400 and die assembly 110 is positioned in the position in the same plane.At this moment, do not produce the gap between the end 400a of resin-sealed prebasal plate and the side 110a of die assembly 110, so in the resin-seal molding operation, can be efficiently and the part that positively prevents molten resin material be immersed into the bottom surface side of substrate 400 and form the disadvantage of resin burr etc. at its real estate.
Set the mechanism of decompressor 500, this mechanism of decompressor 500 can promptly be set at the vacuum decompression state with the mould composition surface (P.L face) and jar 141 interior spatial portions that constitute of die assembly 110.
This mechanism of decompressor 500 is set, after its joint operation at the side 110a of the matched moulds operation of die assembly 110 and jar 140 pairs of die assemblies 110 in unit is finished, will comprise spatial portions that constitute in the mould composition surface (P.L face) and jars 141 of mould of die cavity 114 of shaping usefulness and promptly be set at the vacuum decompression state.
That is, jars 141 are set to directly or by exhaust pathway (not shown) be communicated with vacuum source (not shown), if make vacuum source work, then are depressurized in the jar 141, residue in its inner air etc. and are attracted eliminating by the exhaust pathway quilt forcibly to the outside.
In addition, be provided with the containment member 501 that possesses required thermal endurance and flexible strip on the 2nd die face of the 2nd mould 112, make its covering be supplied to the 1st mould 111 placed side 113 substrate 400 around.
In addition, be positioned at the containment member 502 that has set rectangle on the leading section of side 110a side of die assembly 110 in jar unit 140, sealing member 502 is used to make this leading section to be engaged in the side 110a of this die assembly 110.
In addition, space Jie because of containment member 501 and outside partition is connected with vacuum source (not shown) side with exhaust pathway 503.And the space that cuts off because of containment member 502 and outside is situated between and is connected with vacuum source (not shown) side with exhaust pathway 504.Therefore, if the work of this vacuum source, then the residual air in two spaces that cut off because of two containment members 501,502 and outside etc. is attracted eliminating forcibly by two exhaust pathways 503,504 to the outside.
Therefore, 501,502, two exhaust pathways 503,504 of two containment members and vacuum source have constituted decompression (vacuum) mechanism 500.
In addition, the mechanism of decompressor 500 can not possess containment member 501,502.At this moment, for example to the composition surface of side 110a with the end face of jar unit 140 of the mould composition surface (P.L face) of die assembly 110, mould 110, and jars 141 impose surface treatment with the chimeric surface of setting-in plunger 142 thereon etc., the resinous coat that possesses sealing function, for example PTFE (polytetrafluoroethylene), PFA (tetrafluoroethene), PEEK (polyether-ether-ketone) etc. are used in this surface treatment.
Therefore, utilize this structure, can under the situation of not using containment members such as 0 shape ring, efficiently and positively reach the sealing function and the sealing effectiveness at each position in the past.
In addition, as shown in Figure 2, the mechanism of decompressor 500 can further possess exhaust pathway 505, and also alternative exhaust pathway 504 possesses exhaust pathway 505.Specifically, when die assembly 110 matched moulds, exhaust pathway 505 is connected with the injection path (resin of legend is transferred with path 115) of molten resin material, and this injection path is arranged between the die cavity 114 of jar 141 and die assembly 110.Exhaust pathway 505 and exhaust pathway 503 are connected with opening with exhaust respectively, exhaust pathway between the outside of this exhaust pathway 503 and die cavity 114 that is arranged at die assembly 110 and die assembly 110 is connected, and this exhaust is situated between with opening and is communicated with the vacuum source with suitable exhaust pathway (not shown).
Therefore, at this moment, after after the matched moulds operation of die assembly 110 or jar unit 140 finishes with respect to the joint operation of the side 110a of die assembly 110, all can be efficiently and positively reach effect, effect from each position exhaust.Therefore, a mould composition surface (P.L face) and jar 141 interior spatial portions that constitute that comprise the die assembly 110 of die cavity 114 promptly can be set at the vacuum decompression state.
In addition, in the exhaust pathway 503,504,505, folding means such as spring member and promotion member can be set, these folding means are used for the peristome of the external communications of folding and jar unit 140.
In addition, mould open/close mechanism 120 is to be used for two groups of die assemblies, 110 die sinkings simultaneously of stacked along the vertical direction (overlapping) configuration or the mechanism of matched moulds.Disclosed following structure in the legend: utilize oil pressure, pneumatics or suitable driving mechanism such as electronic, make the side in the 1st mould 111 or the 2nd mould 112 mobile along the vertical direction.
In addition, as this mould open/close mechanism 120, can adopt and utilize the suitable mould open/close mechanism of so-called rack-and-pinion (rackpinion) mechanism or crank (crank) mechanism etc. to substitute this mould open/close mechanism 120.
In addition, pressure mechanism 130 is the mechanisms that are used for this mould being applied under with the state of die assembly 110 matched moulds required clamping pressure, in this pressure mechanism 130, is provided with oil pressure, pneumatics or suitable pressurization means such as electronic.
In addition, for example mould open/close mechanism 120 can be driven by identical drive source with pressure mechanism 130.In addition, by having two kinds of functions of this mould open/close mechanism 120 and pressure mechanism 130 simultaneously, can constitute mould open/close mechanism 120 and pressure mechanism 130 by same mechanism.
In addition, jar unit 140 is disposed at the side of die assembly 110.In addition, jar unit 140 is set, it is freely engaged with respect to the side 110a of die assembly 110 by reciprocating drive mechanism 150 and separates, this die assembly 110 is in the matched moulds state that its mould composition surface (P.L face) engages.
On the jar unit 140, be provided with jar 141, plunger 142, reciprocating drive mechanism (not shown) and heater (not shown).Jar 141 is members that resin material is supplied with usefulness, and this jar 141 is corresponding to the quantity of two groups of die assemblies 110 of configuration and the position of their mould composition surface (P.L face) dispose up and down.Plunger 142 is to being supplied to the member of the resin materials pressurization usefulness in the jar 141.Reciprocating drive mechanism is to make plunger 142 reciprocating suitable mechanisms.Heater is to be used for and will to be supplied to the suitable heater of resin material 301 heating and melting in the jar 141.
Therefore, utilize this structure, can utilize the reciprocating drive mechanism 150 of jar unit 140, whole jar unit 140 is moved, be engaged to the position that the 1st die face and the 2nd die face with die assembly 110 match, and jar unit 140 is retreated, separate from this position.In addition, can utilize the reciprocating drive mechanism of plunger 142 that plunger 142 is retreated, make the space (with reference to Fig. 2) that is formed for supplying with resin material 301 in jars 141 the open front portion by this.In addition, can advance from the position that retreats, with resin material 301 pressurizations that are supplied to after jars 141 by making plunger 142.
In addition, the mould composition surface (P.L face) of the 1st mould 111 in the die assembly 110 and the 2nd mould 112 is engaged with jar 141 in jar unit 140 and be communicated with (with reference to Fig. 5), and 301 pressurizations of the resin materials in the jar 141 after will melting with heater heats with plunger 142 can directly inject molten resin materials 301 Jie in should jar 141 with path 115 with handover and be filled in the die cavity 114 by this.
In addition, substrate is supplied with unloading device 200 and is used substrate supply taking-up member 201 that the substrate before the resin-seal molding 400 is moved into to the assigned position of resin-seal molding portion 100, promptly, move into respectively between the 1st mould 111 and the 2nd mould 112 in the two groups of die assemblies 110 up and down after the die sinking, this substrate is supplied with and is taken out member 201 and possess claw (catching chuck) or other suitable snap device (not shown).In addition, substrate is set supplies with unloading device 200, make it this substrate 400 can be positioned over the placed side 113 of the 1st mould 111.The substrate 402 that this substrate is supplied with after unloading device 200 also uses snap device with resin-seal molding (becomes the resin-seal molding product.With reference to Figure 10) clamp, behind the resin-seal molding die sinking placed side 113 take out.In addition, substrate is set supplies with unloading device 200, it can between the 1st mould 111 two groups of die assemblies 110 and the 2nd mould 112 be taken out of this substrate 402 to the outside up and down from each.
Therefore, utilize this structure, the substrate before the resin-seal molding 400 can be positioned over the assigned position of resin-seal molding portion 100, and the substrate behind the resin-seal molding 402 can be taken out to the outside of resin-seal molding portion 100.
In addition, resin material carries feed mechanism 300 to use resin material to carry supply member 302 resin material 301 to be supplied to the assigned position of resin-seal molding portion 100.That is, resin material is set carries feed mechanism 300, make it can make jar unit 140 and plunger 142 retreat to the desired position (with reference to Fig. 1), resin material 301 is supplied in the space of the open front portion that is arranged at this jar 141.
In addition, this resin material is carried in the supply member 302, be provided with the hole portion of resin material input usefulness and extrude member etc., the hole portion of this resin material input usefulness is corresponding to the quantity of two groups of die assemblies 110 and the position of their mould composition surface (P.L face) dispose up and down, this is extruded member and is used for the resin material 301 that drops in this hole portion is extruded, and is supplied in jars 141.
Therefore, utilize this structure, jar unit 140 is retreated to the desired position, with resin material 301 be supplied in each jar unit 140 the jar 141 in.
The resin-seal molding that carries out the electronic device in the present embodiment for example as described below.
At first, under the die opening state of two groups of die assemblies 110 up and down of Figure 1 and Figure 2, substrate is supplied with unloading device 200 substrate before the resin-seal molding 400 is moved between each the 1st mould 111 and the 2nd mould 112, and this substrate 400 is positioned over the placed side 113 of the 1st mould 111.Then, or parallel with it, the reciprocating drive mechanism 150 of utilization jar unit makes whole jar of unit 140 retreat from the side 110a of die assembly 110, and the reciprocating drive mechanism that utilizes plunger retreats plunger 142, is configured for supplying with in the open front portion of jar 141 space of resin material 301.Then, Jie carries supply member 302 to supply with resin material 301 (with reference to Fig. 2) in this space with resin material.
Then, utilize the mould open/close mechanism 120 beginnings matched moulds of two groups of die assemblies 110 up and down.
Then, or parallel with it, and the reciprocating drive mechanism 150 of utilization jar unit makes whole jar of unit 140 advance to the side of mould 110a, makes its front end face be engaged in the side 110a of die assembly 110.When having disposed containment member 502 on jar unit 140, make the containment member 502 of the leading section of jar unit 140 be engaged in the side 110a (with reference to Fig. 4 and Fig. 5) of die assembly 110.
In addition, in operation, and after jar unit 140 being engaged in the operation of side 110a of die assembly 110, utilize the mechanism of decompressor 500 to reduce pressure with these die assembly 110 matched moulds.In this operation, residue in die assembly 110 mould composition surface (P.L face) air etc. (for example, be not only air, moisture in the atmosphere, the gas that produces when also having the heating and melting of resin material etc.) by transferring as the resin in the injection path of molten resin material with path 115 and exhaust pathway 503,504 (or the exhaust pathway 503,505 that is connected with exhaust pathway, or exhaust pathway 503,504,505) is forced to and, is excluded by this promptly to the attraction of the outside of die assembly 110.In addition, meanwhile, residue in air in jars 141 etc. by with jar 141 in the exhaust pathways that are connected be forced to and, be excluded by this promptly to the attraction of the outside of die assembly 110.
In addition, the mechanism of decompressor 500 possessed containment member at 501,502 o'clock, in this operation, was attracted to get rid of to the outside forcibly with two exhaust pathways 503,504 by Jie such as residual air in containment member 501,502 and the outside space that cuts off.
In addition, this decompression operation of making vacuum state be preferably when matched moulds fully and during resin-seal molding (with reference to Fig. 6 and Fig. 7) proceed, this complete matched moulds and resin-seal molding are to carry out continuously behind the matched moulds of as shown in Figure 5 intermediateness (or readiness).
As shown in Figure 6, if carry out the matched moulds completely of two groups of die assemblies 110 up and down, then this die assembly 110 is respectively applied plus-pressure, each die assembly 110 of laminated configuration is applied impartial clamping pressure simultaneously, this plus-pressure is produced by the pressurization means of pressure mechanism 130.
In addition, if carry out the joint fully of the side 110a of the 140 pairs of die assemblies 110 in jar unit, then the mould composition surface of the 1st mould 111 in each die assembly 110 and the 2nd mould 112 engages with jar 141 in jar unit 140, become the state of connection, and, utilize heater to make to supply to resin material 301 heat fused in this jar 141.Therefore, by making before the plunger 142 and then, molten resin material directly being injected in the die cavity 114 by transferring with path 115 with 301 pressurizations of the resin materials in the jar 141.By this, can be with the electronic device resin-seal molding (with reference to Fig. 7) on the substrate 400 that is flush-mounted in the die cavity 114.
Then, through after required curing time (curing time), utilize the reciprocating drive mechanism 150 of jar unit to make jar unit 140 courts retreat mobile (with reference to Fig. 8) away from the direction of the side 110a of die assembly 110.
Then, or parallel, remove the clamping pressure of two groups of die assemblies 110 up and down with it, and mould open/close mechanism 120 two groups of die assembly 110 die sinkings up and down, this clamping pressure is by the pressurization means generations (with reference to Fig. 8 and Fig. 9) of pressure mechanism 130.
Then, the snap device that substrate is supplied with unloading device 200 blocks the substrate behind the resin-seal molding 402 (resin-seal molding product) and take out on the placed side 113 after the die sinking, and this substrate 402 is taken out of to outside (with reference to Figure 10).
In addition, Figure 11 represents to be equipped on other shape example and structure example of containment member 502 of the leading section of jar unit 140.
Promptly, containment member 502 shown in Figure 2 is set to simultaneously the shape that engages with each containment member 501 of whole side 110a that is equipped on die assembly 110, and containment member 502a shown in Figure 11 is set to the shape that engages with each each containment member 501 that is equipped on the side 110a of die assembly 110 respectively, and both are different in this.
Can know clearly that the containment member of above-mentioned shape can reach the action effect identical with the action effect of above-mentioned containment member 502.
The possibility of utilizing on the industry
The method of resin-seal molding of electronic device of the present invention and device are will be for the base of semiconductor device Useful during electronic device resin-seal molding on the plate.
Claims (according to the modification of the 19th of treaty)
1. the method for resin-seal molding of electronic device is characterized in that, possesses:
Prepare the operation of die assembly (110), this die assembly (110) comprises the 1st mould (111) and the 2nd mould (112), the 1st mould (111) has the 1st die face, the 2nd mould (112) has 2nd die face relative with described the 1st die face, and has the die cavity (114) of taking in electronic device;
Prepare jar operation of unit (140), this jar unit (140) can supply with resin material (301) to described die assembly (110);
Supply with operation, this is supplied with in the operation, the resin-sealed preceding substrate (400) that described electronic device has been installed is positioned over described the 1st die face, and the jar (141) in being arranged on described jar of unit (140) is supplied with described resin material (301);
The matched moulds operation in this matched moulds operation, by carrying out the matched moulds of described die assembly (110), is inserted electronic device and periphery thereof on the described substrate (400) before resin-sealed in the described die cavity (114);
Engage operation, this engages in the operation, described jar of unit (140) is engaged in the side of described die assembly (110);
The decompression operation in this decompression operation, vacuumizes the space that constitutes between described the 1st die face, described the 2nd die face and the described jar of unit (140), and this space forms after described joint operation;
Injection process in this injection process, directly is injected into described jar (141) of resin material (301) from described jar of unit (140) in the described die cavity (114);
Separation circuit in this separation circuit, separates described jar of unit (140) from described die assembly (110);
Forming process in this forming process, is solidified by making described resin material (301), and the electronic device and the periphery thereof that will be flush-mounted in the described die cavity (114) seal with described resin material (301);
The die sinking operation in this die sinking operation, after described forming process, is opened described the 1st mould (111) and described the 2nd mould (112), takes out the substrate (402) behind resin-sealed after the described forming process.
2. the method for resin-seal molding of electronic device as claimed in claim 1 is characterized in that, in the described supply operation, and the substrate (400) between described the 1st die face (111) and described the 2nd die face (112) before the resin-seal molding of supply odd number piece.
3. the method for resin-seal molding of electronic device as claimed in claim 1 is characterized in that, in the described supply operation, with side (110a) arrangement of the end face of described substrate (400) before resin-sealed and described die assembly (110) at grade.
4. the method for resin-seal molding of electronic device as claimed in claim 2 is characterized in that, in the described preparatory process, and the described resin molding apparatus of a plurality of described die assemblies (110) that need be ready to laminated configuration,
In the described matched moulds operation, simultaneously described a plurality of die assemblies (110) are exerted pressure.
5. the resin sealing shaping device of electronic device is characterized in that, possesses:
The 1st mould (111), the 1st mould (111) has the 1st die face, and the substrate (400) that has carried electronic device is installed;
The 2nd mould (112), the 2nd mould (112) have 2nd die face relative with described the 1st die face, and have the die cavity (114) of taking in described electronic device;
Jar unit (140), this jar unit (140) comprises the jar (141) of inner configurable resin material (301), under the state of die assembly (110) closure that comprises described the 1st mould (111) and described the 2nd mould (112), can be installed on the side of described die assembly (110), be used for described resin material (301) is directly injected described die cavity from described jar (141);
The mechanism of decompressor (500), this mechanism of decompressor (500) vacuumize the space that constitutes between described the 1st die face, described the 2nd die face and the described jar of unit (140) when directly injecting described resin material (301).
6. the resin sealing shaping device of electronic device as claimed in claim 5 is characterized in that, is provided with substrate supply unit (113), the substrate (400) of this substrate supply unit (113) before described the 1st mould (111) is supplied with odd number piece described resin-sealed.
7. the resin sealing shaping device of electronic device as claimed in claim 5, it is characterized in that, be provided with feed mechanism (200), when in described die cavity (114), supplying with described substrate (400) before resin-sealed, this feed mechanism (200) is supplied with described substrate (400) before resin-sealed, and the end face (400a) that makes described substrate (400) before resin-sealed is placed at grade with the side (110a) of described die assembly (110).
8. the resin sealing shaping device of electronic device as claimed in claim 6, it is characterized in that, laminated configuration a plurality of described die assemblies (110), and be provided with pressue device (130), this pressue device (130) is exerted pressure to a plurality of described die assemblies (110) simultaneously.
9. the resin sealing shaping device of electronic device as claimed in claim 5, it is characterized in that, described jar of unit (140) also comprises plunger (142), and the described resin material (301) that this plunger (142) will be supplied in described jar (141) is extruded in the described die cavity (114)
Described the 1st die face, described the 2nd die face and comprise described the 1st mould (111) and the composition surface of the die assembly (110) of described the 2nd mould (112) and described jar unit (140) on also possess resinous coat, this resinous coat possesses sealing function.
10. as the resin sealing shaping device of claim 5 or the described electronic device of claim 9, it is characterized in that the described mechanism of decompressor (500) is connected with described space, and comprise the exhaust pathway that is arranged at described jar of unit (140).
Claims (10)
1. the method for resin-seal molding of electronic device is characterized in that, possesses:
Preparatory process, in this preparatory process, prepare resin molding apparatus, this resin molding apparatus possesses die assembly (110), this die assembly (110) comprises the 1st mould (111) and the 2nd mould (112), the 1st mould (111) has the 1st die face, and the 2nd mould (112) has 2nd die face relative with described the 1st die face, and has the die cavity (114) of taking in described electronic device;
Supply with operation, this is supplied with in the operation, and the described resin-sealed preceding substrate (400) that electronic device has been installed is positioned over described the 1st die face;
The matched moulds operation in this matched moulds operation, by carrying out the matched moulds of described die assembly (110), is inserted electronic device and periphery thereof on the described substrate (400) before resin-sealed in the described die cavity (114);
Engage operation, this engages in operation, and the jar unit (140) that resin material is injected usefulness is engaged in the side of described die assembly (110);
The decompression operation in this decompression operation, vacuumizes the space that constitutes between described the 1st die face, described the 2nd die face and the described jar of unit (140), and this space forms after described joint operation;
Injection process in this injection process, directly is injected into resin material (301) in the described die cavity (114) from described jar of unit (140);
Separation circuit in this separation circuit, separates described jar of unit (140) from described die assembly (110);
Forming process in this forming process, is solidified by making described resin material (301), and the electronic device and the periphery thereof that will be flush-mounted in the described die cavity (114) seal with described resin material (301);
The die sinking operation in this die sinking operation, after described forming process, is opened described the 1st mould (111) and described the 2nd mould (112), takes out the substrate (402) behind resin-sealed after the described forming process.
2. the method for resin-seal molding of electronic device as claimed in claim 1 is characterized in that, in the described supply operation, and the substrate (400) between described the 1st die face (111) and described the 2nd die face (112) before the resin-seal molding of supply odd number piece.
3. the method for resin-seal molding of electronic device as claimed in claim 1 is characterized in that, in the described supply operation, with side (110a) arrangement of the end face of described substrate (400) before resin-sealed and described die assembly (110) at grade.
4. the method for resin-seal molding of electronic device as claimed in claim 2 is characterized in that, in the described preparatory process, and the described resin molding apparatus of a plurality of described die assemblies (110) that need be ready to laminated configuration,
In the described matched moulds operation, simultaneously described a plurality of die assemblies (110) are exerted pressure.
5. the resin sealing shaping device of electronic device is characterized in that, possesses:
The 1st mould (111), the 1st mould (111) has the 1st die face, and the substrate (400) that has carried electronic device is installed;
The 2nd mould (112), the 2nd mould (112) have 2nd die face relative with described the 1st die face, and have the die cavity (114) of taking in described electronic device;
Jar unit (140), this jar unit (140) inject resin material (301) from the side of described die assembly (110) under the state of die assembly (110) closure that comprises described the 1st mould (111) and described the 2nd mould (112);
The mechanism of decompressor (500), this mechanism of decompressor (500) vacuumize the space that constitutes between described the 1st die face, described the 2nd die face and the described jar of unit (140) when injecting described resin material (301).
6. the resin sealing shaping device of electronic device as claimed in claim 5 is characterized in that, is provided with substrate supply unit (113), the substrate (400) of this substrate supply unit (113) before described the 1st mould (111) is supplied with odd number piece described resin-sealed.
7. the resin sealing shaping device of electronic device as claimed in claim 5, it is characterized in that, be provided with feed mechanism (200), when in described die cavity (114), supplying with described substrate (400) before resin-sealed, this feed mechanism (200) is supplied with described substrate (400) before resin-sealed, and the end face (400a) that makes described substrate (400) before resin-sealed is placed at grade with the side (110a) of described die assembly (110).
8. the resin sealing shaping device of electronic device as claimed in claim 6, it is characterized in that, laminated configuration a plurality of described die assemblies (110), and be provided with pressue device (130), this pressue device (130) is exerted pressure to a plurality of described die assemblies (110) simultaneously.
9. the resin sealing shaping device of electronic device as claimed in claim 5, it is characterized in that, described jar of unit (140) comprises jar (141) and a plunger (142), this jar (141) is disposed at its inside with described resin material (301), the described resin material (301) that this plunger (142) will be supplied in described jar (141) is extruded in the described die cavity (114)
Described the 1st die face, described the 2nd die face and comprise described the 1st mould (111) and the composition surface of the die assembly (110) of described the 2nd mould (112) and described jar unit (140) on also possess resinous coat, this resinous coat possesses sealing function.
10. as the resin sealing shaping device of claim 5 or the described electronic device of claim 9, it is characterized in that the described mechanism of decompressor (500) is connected with described space, and comprise the exhaust pathway that is arranged at described jar of unit (140).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP108865/2006 | 2006-04-11 | ||
| JP2006108864A JP2007281364A (en) | 2006-04-11 | 2006-04-11 | Resin sealing and molding method and apparatus for electronic component |
| JP108864/2006 | 2006-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101421835A true CN101421835A (en) | 2009-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800132066A Pending CN101421835A (en) | 2006-04-11 | 2007-04-02 | Method of resin encapsulation molding for electronic part and resin encapsulation molding apparatus for electronic part |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007281364A (en) |
| CN (1) | CN101421835A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386110A (en) * | 2010-08-30 | 2012-03-21 | 东和株式会社 | Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product |
| CN102800601A (en) * | 2011-05-27 | 2012-11-28 | 台湾积体电路制造股份有限公司 | Package-on-package process for applying molding compound |
| CN107379381A (en) * | 2016-04-28 | 2017-11-24 | 东和株式会社 | Resin sealing apparatus and method of resin-sealing |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5385886B2 (en) * | 2010-11-02 | 2014-01-08 | Ｔｏｗａ株式会社 | Resin sealing molding method and apparatus for electric circuit parts |
| CN112497601B (en) * | 2021-02-03 | 2021-04-23 | 宁波中车时代传感技术有限公司 | Glue pouring mold and glue pouring method for surface treatment of magnetic suspension gap sensor |
-
2006
- 2006-04-11 JP JP2006108864A patent/JP2007281364A/en active Pending
-
2007
- 2007-04-02 CN CNA2007800132066A patent/CN101421835A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386110A (en) * | 2010-08-30 | 2012-03-21 | 东和株式会社 | Manufacture method for resin seal molding product and manufacture apparatus for resin seal molding product |
| CN102386110B (en) * | 2010-08-30 | 2017-12-19 | 东和株式会社 | The manufacture method of resin-seal molding product and the manufacture device of resin-seal molding product |
| CN102800601A (en) * | 2011-05-27 | 2012-11-28 | 台湾积体电路制造股份有限公司 | Package-on-package process for applying molding compound |
| US8927391B2 (en) | 2011-05-27 | 2015-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package process for applying molding compound |
| CN102800601B (en) * | 2011-05-27 | 2015-11-25 | 台湾积体电路制造股份有限公司 | For applying the laminate packaging technique of moulding compound |
| US10134703B2 (en) | 2011-05-27 | 2018-11-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on-package process for applying molding compound |
| CN107379381A (en) * | 2016-04-28 | 2017-11-24 | 东和株式会社 | Resin sealing apparatus and method of resin-sealing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007281364A (en) | 2007-10-25 |
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Open date: 20090429 |