CN111755582A - 一种光源配光高显生鲜照明制备工艺 - Google Patents
一种光源配光高显生鲜照明制备工艺 Download PDFInfo
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Abstract
本发明公开了一种光源配光高显生鲜照明制备工艺,包括如下步骤:S1、备料,选择LED芯片为主体发光材料,选择梯台结构的LED管座管座为LED芯片的保护管座基材,并且准备碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶作为YAG荧光粉的制备材料;S2、YAG荧光粉制备;S3、LED管座制备;S4、LED芯片安装,将LED芯片通过刺晶、引线、灌胶、烘烤,封装在制备后的管座内部;S5、封装,将制备好的YAG荧光粉填充至LED管座的内部,并通过封装材料进行封装。本发明通过使用YAG荧光粉调配,使LED生鲜灯提高高显指数和显色指数,并且改善传统生鲜灯的应用局限性,可以应用于公共大环境,并且YAG荧光粉能搭配全光谱,从而提升生鲜显色效果。
Description
技术领域
本发明属于生鲜照明领域,更具体地说,尤其涉及一种光源配光高显生鲜照明制备工艺。
背景技术
LED生鲜灯属于LED灯范畴,即,也可称其为LED灯,并且由于在使用状态下表现为悬挂式使用,因此也可称为LED吊灯,LED生鲜灯适用于超市生鲜区、菜市、水果连锁店,用于鲜肉、冰肉、卤肉、蔬菜、水果、海鲜、面包、熟食照明等。LED生鲜灯灯具特点:诸如散热性能更好,温度更低,寿命更长;灯罩内部反光性能好;可随时自由调节灯的高度;外观时尚新颖,装饰效果极佳。其光源上主要存在下述优点:高品质COB光源,亮度高,显色性好;温度低,对食物没有影响;光照面均匀,色彩亮丽、自然、逼真;光衰小,光色恒定;
但是,现有的LED生鲜灯大多是红白光搭配使用,应用局限性较大,而且一定程度上增加了使用成本。
为此,我们提出了一种光源配光高显生鲜照明制备工艺,通过使用YAG荧光粉调配,使LED生鲜灯提高高显指数和显色指数,并且改善传统生鲜灯的应用局限性,可以应用于公共大环境,并且YAG荧光粉能搭配全光谱,从而提升生鲜显色效果。
发明内容
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种光源配光高显生鲜照明制备工艺。
为实现上述目的,本发明提供如下技术方案:
一种光源配光高显生鲜照明制备工艺,包括如下步骤:
S1、备料,选择LED芯片为主体发光材料,选择梯台结构的LED管座管座为LED芯片的保护管座基材,并且准备碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶作为YAG荧光粉的制备材料;
S2、YAG荧光粉制备,分别称取碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠与柠檬酸钠进行研磨并混合,混合后的粉末通过160目-180目的筛网进行筛分,筛分后的粉末煅烧3-5小时,煅烧后的粉末与聚丙烯酰胺进行混合;
S3、LED管座制备,通过金属有机化学气相沉积工艺依次将缓冲层、N型氮化镓层、P型氮化镓层沉积在保护管座内壁上;
S4、LED芯片安装,将LED芯片通过刺晶、引线、灌胶、烘烤,封装在制备后的管座内部;
S5、封装,将制备好的YAG荧光粉填充至LED管座的内部,并通过封装材料进行封装,所述封装材料包括双酚A/B型环氧树脂、弹性硅胶、2.5μm金丝引线和杯状支架。
优选的,所述碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠通过研磨机进行研磨,所述YAG荧光粉的具体制备步骤包括:
1)首先将碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶依次加入到研磨机中进行研磨,研磨时间为60min-90min,将研磨后的粉料通过筛网筛选之后通过粉末煅烧炉进行煅烧,煅烧时长为3h-5h;
2)将三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠加入到研磨机中进行研磨,并将研磨后的粉料与上述煅烧后的粉料进行混合,并通过160目-180目的筛网对混合后的粉料进行筛分;
3)将上述筛分后的混合粉料与聚丙烯酰胺混合,并再次进行煅烧,煅烧时长为2h-3h。
优选的,所述碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠的混合粉料通过粉末煅烧机进行煅烧,所述混合粉料在氢气和氮气按体积比1:3混合的混合气体保护下,以8-10℃/min速率升温至800-1000℃,并保温煅烧2h-3h,煅烧后冷却至常温。
优选的,所述粉末煅烧机采用真空镀铝石墨坩埚为粉末存放容器,所述真空镀铝石墨坩埚的密度为1.82-1.85g/cm3;硬度为:65HSD;颗粒度为:8-10μm。
优选的,所述LED管座的内壁上还设置有发光层,所述发光层包括周期性层叠的量子阱层和量子垒层,所述周期性层叠的量子阱层、量子垒层至少其中之一为高速量子阱层、低速量子垒层,形成所述高速量子阱层时载片盘的转速大于形成所述低速量子垒层时载片盘的转速,所述高速量子阱层与所述低速量子垒层距离所述P型氮化镓层的距离小于距离所述N型氮化镓层的距离。
优选的,所述YAG荧光粉覆盖在所述LED管座上未设置有所述LED芯片的区域,且YAG荧光粉的厚度小于所述LED芯片的高度。
优选的,所述研磨机设置为内衬可拆换立式螺旋搅拌球磨机,所述研磨机包括给料部、出料部、回转部和传动部,所述研磨机的中空轴采用铸钢件中空轴,所述研磨机的回转大齿轮采用铸钢件滚齿加工,且研磨机的筒体内镶有耐磨衬板。
优选的,所述杯状支架包括基板和侧壁,所述侧壁与所述基板共同形成所述杯状支架的空腔,所述弹性硅胶固定粘合在所述LED管座的内壁上,且所述双酚A/B型环氧树脂的施加厚度小于所述LED芯片的高度。
优选的,所述LED管座背面形成呈不均匀分布的所述散热槽,使得所述LED芯片产生的热量在各散热槽处产生温度差,所述散热槽内填充导热层,所述导热层设置为导入石墨烯的导热层。
本发明的技术效果和优点:本发明提供的一种光源配光高显生鲜照明制备工艺,与传统的固态产品相比,本发明通过使用YAG荧光粉调配,使LED生鲜灯提高高显指数和显色指数,并且改善传统生鲜灯的应用局限性,可以应用于公共大环境,并且YAG荧光粉能搭配全光谱,从而提升生鲜显色效果。
附图说明
图1为本发明的光源配光高显生鲜照明制备工艺工艺流程图;
图2为本发明的YAG荧光粉制备工艺流程图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合具体实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明提供了一种光源配光高显生鲜照明制备工艺,包括如下步骤:
S1、备料,选择LED芯片为主体发光材料,选择梯台结构的LED管座管座为LED芯片的保护管座基材,并且准备碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶作为YAG荧光粉的制备材料;
S2、YAG荧光粉制备,分别称取碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠与柠檬酸钠进行研磨并混合,混合后的粉末通过160目-180目的筛网进行筛分,筛分后的粉末煅烧3-5小时,煅烧后的粉末与聚丙烯酰胺进行混合;
S3、LED管座制备,通过金属有机化学气相沉积工艺依次将缓冲层、N型氮化镓层、P型氮化镓层沉积在保护管座内壁上;
S4、LED芯片安装,将LED芯片通过刺晶、引线、灌胶、烘烤,封装在制备后的管座内部;
S5、封装,将制备好的YAG荧光粉填充至LED管座的内部,并通过封装材料进行封装,封装材料包括双酚A/B型环氧树脂、弹性硅胶、2.5μm金丝引线和杯状支架。
其中,碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠通过研磨机进行研磨,YAG荧光粉的具体制备步骤包括:
1)首先将碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶依次加入到研磨机中进行研磨,研磨时间为60min-90min,将研磨后的粉料通过筛网筛选之后通过粉末煅烧炉进行煅烧,煅烧时长为3h-5h;
2)将三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠加入到研磨机中进行研磨,并将研磨后的粉料与上述煅烧后的粉料进行混合,并通过160目-180目的筛网对混合后的粉料进行筛分;
3)将上述筛分后的混合粉料与聚丙烯酰胺混合,并再次进行煅烧,煅烧时长为2h-3h。
其中,碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠的混合粉料通过粉末煅烧机进行煅烧,混合粉料在氢气和氮气按体积比1:3混合的混合气体保护下,以8-10℃/min速率升温至800-1000℃,并保温煅烧2h-3h,煅烧后冷却至常温。
其中,粉末煅烧机采用真空镀铝石墨坩埚为粉末存放容器,真空镀铝石墨坩埚的密度为1.82-1.85g/cm3;硬度为:65HSD;颗粒度为:8-10μm。
其中,LED管座的内壁上还设置有发光层,发光层包括周期性层叠的量子阱层和量子垒层,周期性层叠的量子阱层、量子垒层至少其中之一为高速量子阱层、低速量子垒层,形成高速量子阱层时载片盘的转速大于形成低速量子垒层时载片盘的转速,高速量子阱层与低速量子垒层距离P型氮化镓层的距离小于距离N型氮化镓层的距离。
其中,YAG荧光粉覆盖在LED管座上未设置有LED芯片的区域,且YAG荧光粉的厚度小于LED芯片的高度。
其中,研磨机设置为内衬可拆换立式螺旋搅拌球磨机,研磨机包括给料部、出料部、回转部和传动部,研磨机的中空轴采用铸钢件中空轴,研磨机的回转大齿轮采用铸钢件滚齿加工,且研磨机的筒体内镶有耐磨衬板。
其中,杯状支架包括基板和侧壁,侧壁与基板共同形成杯状支架的空腔,弹性硅胶固定粘合在LED管座的内壁上,且双酚A/B型环氧树脂的施加厚度小于LED芯片的高度。
其中,LED管座背面形成呈不均匀分布的散热槽,使得LED芯片产生的热量在各散热槽处产生温度差,散热槽内填充导热层,导热层设置为导入石墨烯的导热层。
综上所述:本发明提供的一种光源配光高显生鲜照明制备工艺,与传统的固态产品相比,本发明通过使用YAG荧光粉调配,使LED生鲜灯提高高显指数和显色指数,并且改善传统生鲜灯的应用局限性,可以应用于公共大环境,并且YAG荧光粉能搭配全光谱,从而提升生鲜显色效果。
最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (9)
1.一种光源配光高显生鲜照明制备工艺,其特征在于:包括如下步骤:
S1、备料,选择LED芯片为主体发光材料,选择梯台结构的LED管座管座为LED芯片的保护管座基材,并且准备碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶作为YAG荧光粉的制备材料;
S2、YAG荧光粉制备,分别称取碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠与柠檬酸钠进行研磨并混合,混合后的粉末通过160目-180目的筛网进行筛分,筛分后的粉末煅烧3-5小时,煅烧后的粉末与聚丙烯酰胺进行混合;
S3、LED管座制备,通过金属有机化学气相沉积工艺依次将缓冲层、N型氮化镓层、P型氮化镓层沉积在保护管座内壁上;
S4、LED芯片安装,将LED芯片通过刺晶、引线、灌胶、烘烤,封装在制备后的管座内部;
S5、封装,将制备好的YAG荧光粉填充至LED管座的内部,并通过封装材料进行封装,所述封装材料包括双酚A/B型环氧树脂、弹性硅胶、2.5μm金丝引线和杯状支架。
2.根据权利要求1所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠通过研磨机进行研磨,所述YAG荧光粉的具体制备步骤包括:
1)首先将碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶依次加入到研磨机中进行研磨,研磨时间为60min-90min,将研磨后的粉料通过筛网筛选之后通过粉末煅烧炉进行煅烧,煅烧时长为3h-5h;
2)将三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠加入到研磨机中进行研磨,并将研磨后的粉料与上述煅烧后的粉料进行混合,并通过160目-180目的筛网对混合后的粉料进行筛分;
3)将上述筛分后的混合粉料与聚丙烯酰胺混合,并再次进行煅烧,煅烧时长为2h-3h。
3.根据权利要求2所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述碳酸钙、氧化锌、二氧化钛、二氧化锰、硝酸铕和碳酸锶以及三氧化钼、氧化铕、碳酸镁、碳酸钠、酒石酸钠的混合粉料通过粉末煅烧机进行煅烧,所述混合粉料在氢气和氮气按体积比1:3混合的混合气体保护下,以8-10℃/min速率升温至800-1000℃,并保温煅烧2h-3h,煅烧后冷却至常温。
4.根据权利要求3所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述粉末煅烧机采用真空镀铝石墨坩埚为粉末存放容器,所述真空镀铝石墨坩埚的密度为1.82-1.85g/cm3;硬度为:65HSD;颗粒度为:8-10μm。
5.根据权利要求1所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述LED管座的内壁上还设置有发光层,所述发光层包括周期性层叠的量子阱层和量子垒层,所述周期性层叠的量子阱层、量子垒层至少其中之一为高速量子阱层、低速量子垒层,形成所述高速量子阱层时载片盘的转速大于形成所述低速量子垒层时载片盘的转速,所述高速量子阱层与所述低速量子垒层距离所述P型氮化镓层的距离小于距离所述N型氮化镓层的距离。
6.根据权利要求1所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述YAG荧光粉覆盖在所述LED管座上未设置有所述LED芯片的区域,且YAG荧光粉的厚度小于所述LED芯片的高度。
7.根据权利要求2所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述研磨机设置为内衬可拆换立式螺旋搅拌球磨机,所述研磨机包括给料部、出料部、回转部和传动部,所述研磨机的中空轴采用铸钢件中空轴,所述研磨机的回转大齿轮采用铸钢件滚齿加工,且研磨机的筒体内镶有耐磨衬板。
8.根据权利要求1所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述杯状支架包括基板和侧壁,所述侧壁与所述基板共同形成所述杯状支架的空腔,所述弹性硅胶固定粘合在所述LED管座的内壁上,且所述双酚A/B型环氧树脂的施加厚度小于所述LED芯片的高度。
9.根据权利要求1所述的一种光源配光高显生鲜照明制备工艺,其特征在于:所述LED管座背面形成呈不均匀分布的所述散热槽,使得所述LED芯片产生的热量在各散热槽处产生温度差,所述散热槽内填充导热层,所述导热层设置为导入石墨烯的导热层。
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