CN111755547B - 一种基于凸点封装的抗蠕变易回收晶硅双面发电组件 - Google Patents
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Abstract
一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,发电组件包括自上而下依次层叠设置的玻璃前板、第一封装胶膜层、晶硅双面电池片、第二封装胶膜层和玻璃/透明背板,第一封装胶膜层从上而下依次为胶膜外层、胶膜中间层和胶膜内层,第二封装胶膜层从上而下依次为胶膜内层、胶膜中间层和胶膜外层;胶膜中间层内外两面均设有凸点,胶膜外层和胶膜内层均设有与凸点相适配的凹槽;凸起和凹槽之间经过高温形成微交联;本发明基于凸点封装的双面发电组件既保证了组件背面优异的抗PID衰减性能,又保证了组件的抗蠕变性能,凸点封装保证了胶膜与玻璃和电池片的耐热可靠性粘接,不会发生蠕变问题,同时凹槽的微交联结构使组件的回收分离过程变得简单易行。
Description
技术领域
本发明涉及光伏发电技术领域,更具体的是涉及一种基于凸点封装的抗蠕变易回收晶硅双面发电组件及其成型方法。
背景技术
光伏组件层压件结构一般为玻璃/胶膜/电池片/胶膜/背板,胶膜一般为EVA或POE,通过真空热压,胶膜中的交联剂热解产生自由基,引发高分子链发生交联反应,形成三维空间网络结构,完成对电池片的封装。背板一般为高分子材料或玻璃,通过玻璃、胶膜和背板的联合封装保证了组件在户外发电的长期稳定性;
现有的具有双面发电功能的晶硅组件,由于PERC电池片背面的抗PID性能不及正面,因此业内普遍采用POE胶膜进行封装,以避免发生电势诱导衰减(PID),保证长期可靠性。但是,由于使用常规通用材料和封装方法进行制作,在胶膜内部完全交联形成三维空间网络,组件虽有较好的抗蠕变性能,但到达生命周期后,这种全三维网络结构的胶膜将给组件回收处理带来极大困难。经过交联后的胶膜,失去再次热熔加工性能,热法处理过程需通过500℃左右的高温处理才能解离,回收处理耗能高,难以同时实现高纯度回收与环境友好性。
发明内容
本发明目的是为了解决以上现有技术的不足,提出了一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,其特征在于,所述的发电组件包括自上而下依次层叠设置的玻璃前板、第一封装胶膜层、晶硅双面电池片、第二封装胶膜层和玻璃/透明背板,所述的第一封装胶膜层从上而下依次为胶膜外层、胶膜中间层和胶膜内层,第二封装胶膜层从上而下依次为胶膜内层、胶膜中间层和胶膜外层;所述的胶膜中间层内外两面均设有凸点,胶膜外层和胶膜内层均设有与所述凸点相适配的凹槽;所述的凸点和凹槽之间、胶膜外层和胶膜内层通过高温形成微交联。
优选地,所述的凸点高度为50-250μm。
优选地,所述的胶膜中间层材料为乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
优选地,所述的胶膜外层和胶膜内层材料为乙烯-醋酸乙烯酯共聚物、乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
一种基于凸点封装的抗蠕变易回收晶硅双面发电组件用封装胶膜层的成型方法,包括如下步骤:
(1)将胶膜中间层材料熔融挤出成片状中间层,将所述片状中间层通过设有若干个凹陷的辊轮,并经所述的辊轮对所述的片状中间层进行挤压,得到具有凸点结构的挤压中间层;
(2)将所述挤压中间层通过电子辐照预交联处理后得到预交联中间层,挤压中间层的辐照加工速度10-18m/min,辐照电子束流强度为4-8mA;
(3)将胶膜外层和胶膜内层材料分别涂布于预交联中间层的两侧,分别形成胶膜外层和胶膜内层,成型过程中与预交联中间层形成微交联,得到封装胶膜层,其中成型温度120-160℃,时间10-100s。真空热压使胶膜中间层内产生化学交联,形成三维空间网络凸点封装;胶膜外层、胶膜内层、胶膜外层与胶膜中间层之间、胶膜内层与胶膜中间层之间进一步发生微交联反应,降低其流动性。
有益效果:
本发明中基于凸点封装的双面发电组件既保证了组件背面优异的抗PID衰减性能,又保证了组件的抗蠕变性能,凸点封装有效保证了胶膜与玻璃和晶硅双面电池片形成耐热可靠粘接,即便组件发生热斑,温度升高,也能通过局部三维网络结构保证粘接结构的稳定性,不会发生蠕变问题。另外,凸点封装的双面发电组件进行回收时,利用多层不同结构的胶膜,在胶膜中实现三维网络贯穿整个胶膜而不会分布于整个表面,降低了胶膜的流动性,提升了熔点,又使其满足回收分离时只需要将组件加热至150℃以上,玻璃/胶膜、胶膜/电池片、胶膜/背板之间微交联部分的胶膜就能受热再次熔融,此时仅有交联部分与其它材料牢固粘连,通过低温简易切割即能实现有效分离,使组件材料回收分离过程变得简单易行,大幅度降低了处理能耗。
附图说明
图1为易回收双面发电组件结构示意图;
图中,1-玻璃前板、2-第一封装胶膜层、21-胶膜外层、211-凹槽、22-胶膜中间层、221-凸点、23-胶膜内层、3-晶硅双面电池片、4-第二封装胶膜层、5-玻璃/透明背板。
具体实施方式
为了加深对本发明的理解,下面将结合实施例对本发明作进一步详述,该实施例仅用于解释本发明,并不构成对本发明保护范围的限定。
一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,所述的发电组件包括自上而下依次层叠设置的玻璃前板、第一封装胶膜层、晶硅双面电池片、第二封装胶膜层和玻璃/透明背板,所述的第一封装胶膜层从上而下依次为胶膜外层、胶膜中间层和胶膜内层,第二封装胶膜层从上而下依次为胶膜内层、胶膜中间层和胶膜外层;所述的胶膜中间层内外两面均设有凸点,胶膜外层和胶膜内层均设有与所述凸点相适配的凹槽;所述的凸点和凹槽之间、胶膜外层和胶膜内层通过高温形成微交联。
一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,所述的发电组件包括自上而下依次层叠设置的玻璃前板1、第一封装胶膜层2、晶硅双面电池片3、第二封装胶膜层4和玻璃/透明背板5,所述的第一封装胶膜层2从上而下依次为胶膜外层21、胶膜中间层22和胶膜内层23,第二封装胶膜层4从上而下依次为胶膜内层23、胶膜中间层22和胶膜外层21;所述的胶膜中间层22内外两面均设有凸点221,胶膜外层21和胶膜内层23均设有与所述凸点相适配的凹槽211;所述的凸点221和凹槽211之间、胶膜外层21和胶膜内层23通过高温形成微交联。
在上述技术方案中,所述的凸点高度为200μm。
在上述技术方案中,所述的胶膜中间层材料为乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
在上述技术方案中,所述的胶膜外层和胶膜内层材料为乙烯-醋酸乙烯酯共聚物、乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
一种基于凸点封装的抗蠕变易回收晶硅双面发电组件用封装胶膜层的成型方法,包括如下步骤:
(1)将胶膜中间层材料熔融挤出成片状中间层,将所述片状中间层通过设有若干个凹陷的辊轮,并经所述的辊轮对所述的片状中间层进行挤压,得到具有凸点结构的挤压中间层;
(2)将所述挤压中间层通过电子辐照预交联处理后得到预交联中间层,挤压中间层的辐照加工速度10m/min,辐照电子束流强度为6mA;
(3)将胶膜外层和胶膜内层材料分别涂布于预交联中间层的两侧,分别形成胶膜外层和胶膜内层,成型过程中与预交联中间层形成微交联,得到封装胶膜层,其中成型温度130℃,时间60s。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (5)
1.一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,其特征在于,所述的发电组件包括自上而下依次层叠设置的玻璃前板、第一封装胶膜层、晶硅双面电池片、第二封装胶膜层和玻璃/透明背板,所述的第一封装胶膜层从上而下依次为胶膜外层、胶膜中间层和胶膜内层,第二封装胶膜层从上而下依次为胶膜内层、胶膜中间层和胶膜外层;所述的胶膜中间层内外两面均设有凸点,胶膜外层和胶膜内层均设有与所述凸点相适配的凹槽;所述的凸点和凹槽之间、胶膜外层和胶膜内层通过高温形成微交联;其中使用真空热压使胶膜中间层内产生化学交联,形成三维空间网络凸点封装;胶膜外层、胶膜内层、胶膜外层与胶膜中间层之间、胶膜内层与胶膜中间层之间形成微交联。
2.根据权利要求1所述的一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,其特征在于,所述的凸点高度为50-250μm。
3.根据权利要求1所述的一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,其特征在于,所述的胶膜中间层材料为乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
4.根据权利要求1所述的一种基于凸点封装的抗蠕变易回收晶硅双面发电组件,其特征在于,所述的胶膜外层和胶膜内层材料为乙烯-醋酸乙烯酯共聚物、乙烯-丁烯共聚物或乙烯-辛烯共聚物中的任意一种。
5.如权利要求1所述的一种基于凸点封装的抗蠕变易回收晶硅双面发电组件的成型方法,其特征在于,包括如下步骤:
(1)将胶膜中间层材料熔融挤出成片状中间层,将所述片状中间层通过设有若干个凹陷的辊轮,并经所述的辊轮对所述的片状中间层进行挤压,得到具有凸点结构的挤压中间层;
(2)将所述挤压中间层通过电子辐照预交联处理后得到预交联中间层,挤压中间层的辐照加工速度10-18m/min,辐照电子束流强度为4-8mA;
(3)将胶膜外层和胶膜内层材料分别涂布于预交联中间层的两侧,分别形成胶膜外层和胶膜内层,成型过程中与预交联中间层形成微交联,得到所述的封装胶膜层,其中成型温度120-160℃,时间10-100s。
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