CN111746085A - 一种抗菌抗静电薄膜及其制备方法 - Google Patents

一种抗菌抗静电薄膜及其制备方法 Download PDF

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CN111746085A
CN111746085A CN202010510542.9A CN202010510542A CN111746085A CN 111746085 A CN111746085 A CN 111746085A CN 202010510542 A CN202010510542 A CN 202010510542A CN 111746085 A CN111746085 A CN 111746085A
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film
layer
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antistatic
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何健
张乐进
黑彦飞
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Anhui Xingzhong New Material Co ltd
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Abstract

本发明提供了一种抗菌抗静电薄膜，包括薄膜本体，所述薄膜本体从上往下方向上依次设有上层薄膜、基层薄膜和下层薄膜，所述基层薄膜的表面涂有抗静电层，所述抗静电层的表面设有抗菌层，所述抗菌层的表面粘合有上层薄膜，所述基层薄膜的底面涂有抗辐射层，所述抗辐射层底面粘合有下层薄膜，本发明通过赋予PE薄膜本体抗菌抗静电性能，具有较为可观的市场前景。

Description

一种抗菌抗静电薄膜及其制备方法
技术领域
本发明主要涉及PE薄膜技术领域，具体涉及一种抗菌抗静电薄膜及其制备方法。
背景技术
PE薄膜即聚乙烯薄膜，气质通过平挤上吹工艺生产的聚乙烯薄膜，又称未拉伸聚乙烯薄膜。与聚丙烯薄膜、聚酯薄膜与聚氯乙烯薄膜相比，PE薄膜不仅成本较低，而且具有良好的柔韧性、热封性能与纵横向性能；并且PE薄膜经过电晕处理后还可进行镀铝、印刷，或与其他材料复合，得到性能更佳的薄膜，因此PE薄膜被广泛用作食品、日用品和电子产品等的包装材料，是目前应用作为广泛的塑料包装材料。除此之外，PE薄膜在具有优良的水蒸气与气体阻隔性能，特别适合用作卫生用品包装薄膜。
然而现有的PE薄膜在抗菌抗静电方面有所缺陷，当用PE薄膜包装的产品需要长时间保存时，此时常规的PE薄膜无法满足市场的需求，因此，本发明研究了一种抗菌抗静电薄膜，用以填充市场的空白。
发明内容
本发明主要提供了一种抗菌抗静电薄膜及其制备方法，用以解决上述背景技术中提出的技术问题。
本发明解决上述技术问题采用的技术方案为：一种抗菌抗静电薄膜，包括薄膜本体，所述薄膜本体从上往下方向上依次设有上层薄膜、基层薄膜和下层薄膜，所述基层薄膜的表面涂有抗静电层，所述抗静电层的表面设有抗菌层，所述抗菌层的表面粘合有上层薄膜，所述基层薄膜的底面涂有抗辐射层，所述抗辐射层底面粘合有下层薄膜。
其中，所述基层薄膜包括质量百分比为50%-65%的线性低密度聚乙烯树脂、质量百分比为25%-35%的低密度聚乙烯树脂和质量百分比为25%-35%的高密度聚乙烯树脂；
所述上层薄膜包括质量百分比为60%-70%的低密度聚乙烯树脂、质量百分比为10%-15%的线性低密度聚乙烯树脂和质量百分比为20%-30%的高密度聚乙烯树脂；
所述下层薄膜包括质量百分比为65%-75%的高密度聚乙烯树脂、质量百分比为10%-20%的线性低密度聚乙烯树脂和质量百分比为20%-30%的低密度聚乙烯树脂；
所述抗静电层由质量百分比为50%-65%的聚乙烯醇、质量百分比为20%-30%的聚对笨二甲酸二乙酯、质量百分比为10%-15%的钛粉和质量百分比为10%-20%的乙醇溶液混合而成。
所述抗菌层由质量百分比为50%-60%的甲基丙烯酸树脂、质量百分比为5%-15%的纳米银和质量百分比为30%-40%的季胺盐类聚合物混合而成。
所述抗辐射层由质量百分比为70%-80%聚乙烯树脂、质量百分比为10%-15%纳米二氧化硅和质量百分比为10%-20%的甘油混合而成。
其中，所述基层薄膜（102）、上层薄膜（101）、下层薄膜（103）的厚度比为2：1：1。
其中，所述粘合剂采用醋酸乙烯树脂与二甲基硅油的混合物制备而成。
一种抗菌抗静电薄膜的制备方法，包括如下步骤：
S01：制备薄膜本体，将上层薄膜、基层薄膜和下层薄膜的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜、基层薄膜和下层薄膜，待用；
S02：制备抗静电层，向反应釜一依次加入质量百分比为50%-65%的聚乙烯醇、质量百分比为20%-30%的聚对笨二甲酸二乙酯、质量百分比为10%-15%的钛粉和质量百分比为10%-20%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用；
S03：制备抗菌层，向反应釜二依次加入质量百分比为50%-60%的甲基丙烯酸树脂、质量百分比为5%-15%的纳米银和质量百分比为30%-40%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用；
S04：制备抗辐射层，向反应釜三依次加入质量百分比为70%-80%聚乙烯树脂、质量百分比为10%-15%纳米二氧化硅和质量百分比为10%-20%的甘油，搅拌均匀后制成抗辐射涂液，待用；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜二；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜底面，通过红外加热，辊压贴合，冷却定型后制得薄膜三；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜，在薄膜三的抗菌层的表面通过粘合剂粘合有上层薄膜，通过红外加热，辊压贴合，冷却成型后制得抗菌抗静电薄膜。
与现有技术相比，本发明的有益效果为：
本发明通过将薄膜本体从上往下方向上依次设有上层薄膜、基层薄膜和下层薄膜，所述基层薄膜的表面涂有抗静电层，所述抗静电层的表面设有抗菌层，所述抗菌层的表面粘合有上层薄膜，所述基层薄膜的底面涂有抗辐射层，所述抗辐射层底面粘合有下层薄膜，从而赋予PE薄膜本体抗菌抗静电性能，具有较为可观的市场前景。
以下将结合附图与具体的实施例对本发明进行详细的解释说明。
附图说明
图1为本发明的薄膜本体结构示意图。
图中：1-薄膜本体；101-上层薄膜；102-基层薄膜；103-下层薄膜；104-抗静电层；105-纳米透气层；106-防水层。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更加全面的描述，附图中给出了本发明的若干实施例，但是本 发明可以通过不同的形式来实现，并不限于文本所描述的实施例，相反的，提供这些实施例是为了使对本发明公开的内容更加透彻全面。
实施例1，参照图1，一种抗菌抗静电薄膜的制备方法，包括如下步骤：
S01：制备薄膜本体1，将上层薄膜101、基层薄膜102和下层薄膜103的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜101、基层薄膜102和下层薄膜103，待用；
S02：制备抗静电层104，向反应釜一依次加入质量百分比为50%的聚乙烯醇、质量百分比为20%的聚对笨二甲酸二乙酯、质量百分比为10%的钛粉和质量百分比为20%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用，其中，反应釜一的搅拌温度为100℃；
S03：制备抗菌层105，向反应釜二依次加入质量百分比为55%的甲基丙烯酸树脂、质量百分比为5%的纳米银和质量百分比为40%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用，反应釜二的搅拌温度为110℃；
S04：制备抗辐射层106，向反应釜三依次加入质量百分比为75%聚乙烯树脂、质量百分比为15%纳米二氧化硅和质量百分比为10%的甘油，搅拌均匀后制成抗辐射涂液，待用，反应釜三的搅拌温度为120℃；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜102的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一，红外线加热的温度180℃；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层104的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜二，红外线加热的温度180℃；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜102底面，通过红外加热，辊压贴合，冷却定型后制得薄膜三，红外线加热的温度190℃；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜103，在薄膜三的抗菌层105的表面通过粘合剂粘合有上层薄膜101，在210℃温度下通过红外加热，辊压贴合，冷却成型后制得实施例1。
实施例2，参照图1，一种抗菌抗静电薄膜的制备方法，包括如下步骤：
S01：制备薄膜本体1，将上层薄膜101、基层薄膜102和下层薄膜103的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜101、基层薄膜102和下层薄膜103，待用；
S02：制备抗静电层104，向反应釜一依次加入质量百分比为60%的聚乙烯醇、质量百分比为20%的聚对笨二甲酸二乙酯、质量百分比为10%的钛粉和质量百分比为10%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用，其中，反应釜一的搅拌温度为100℃；
S03：制备抗菌层105，向反应釜二依次加入质量百分比为55%的甲基丙烯酸树脂、质量百分比为15%的纳米银和质量百分比为30%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用，反应釜二的搅拌温度为110℃；
S04：制备抗辐射层106，向反应釜三依次加入质量百分比为70%聚乙烯树脂、质量百分比为10%纳米二氧化硅和质量百分比为20%的甘油，搅拌均匀后制成抗辐射涂液，待用，反应釜三的搅拌温度为120℃；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜102的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一，红外线加热的温度180℃；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层104的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜二，红外线加热的温度180℃；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜102底面，通过红外加热，辊压贴合，冷却定型后制得薄膜三，红外线加热的温度190℃；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜103，在薄膜三的抗菌层105的表面通过粘合剂粘合有上层薄膜101，在210℃温度下通过红外加热，辊压贴合，冷却成型后制得实施例2。
实施例3，参照图1，一种抗菌抗静电薄膜的制备方法，包括如下步骤：
S01：制备薄膜本体1，将上层薄膜101、基层薄膜102和下层薄膜103的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜101、基层薄膜102和下层薄膜103，待用；
S02：制备抗静电层104，向反应釜一依次加入质量百分比为50%的聚乙烯醇、质量百分比为25%的聚对笨二甲酸二乙酯、质量百分比为10%的钛粉和质量百分比为15%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用，其中，反应釜一的搅拌温度为100℃；
S03：制备抗菌层105，向反应釜二依次加入质量百分比为50%的甲基丙烯酸树脂、质量百分比为10%的纳米银和质量百分比为40%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用，反应釜二的搅拌温度为110℃；
S04：制备抗辐射层，向反应釜三依次加入质量百分比为80%聚乙烯树脂、质量百分比为10%纳米二氧化硅和质量百分比为10%的甘油，搅拌均匀后制成抗辐射涂液，待用，反应釜三的搅拌温度为120℃；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜102的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一，红外线加热的温度180℃；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层104的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜二，红外线加热的温度180℃；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜102底面，通过红外加热，辊压贴合，冷却定型后制得薄膜三，红外线加热的温度190℃；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜103，在薄膜三的抗菌层105的表面通过粘合剂粘合有上层薄膜101，在210℃温度下通过红外加热，辊压贴合，冷却成型后制得实施例3。
实施例4，参照图1，一种抗菌抗静电薄膜的制备方法，包括如下步骤：
S01：制备薄膜本体1，将上层薄膜101、基层薄膜102和下层薄膜103的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜101、基层薄膜102和下层薄膜103，待用；
S02：制备抗静电层104，向反应釜一依次加入质量百分比为55%的聚乙烯醇、质量百分比为25%的聚对笨二甲酸二乙酯、质量百分比为10%的钛粉和质量百分比为10%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用，其中，反应釜一的搅拌温度为100℃；
S03：制备抗菌层105，向反应釜二依次加入质量百分比为60%的甲基丙烯酸树脂、质量百分比为15%的纳米银和质量百分比为35%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用，反应釜二的搅拌温度为110℃；
S04：制备抗辐射层106，向反应釜三依次加入质量百分比为70%聚乙烯树脂、质量百分比为15%纳米二氧化硅和质量百分比为15%的甘油，搅拌均匀后制成抗辐射涂液，待用，反应釜三的搅拌温度为120℃；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜102的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一，红外线加热的温度180℃；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层104的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜二，红外线加热的温度180℃；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜102底面，通过红外加热，辊压贴合，冷却定型后制得薄膜三，红外线加热的温度190℃；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜103，在薄膜三的抗菌层105的表面通过粘合剂粘合有上层薄膜101，在210℃温度下通过红外加热，辊压贴合，冷却成型后制得实施例4。
通过抑菌环法定性实验对实施例1-4的抗菌性能进行测定，分别为大肠杆菌和金黄色葡萄球菌下的抑菌环实验。此外运用四探针电阻率测试仪进行表面电阻率的表征分析，测试结果如下表。
Figure 39715DEST_PATH_IMAGE002
由上表可知，本发明制得的薄膜具有较好的抗菌以及抗静电性能。
上述结合附图对本发明进行了示例性描述，显然本发明具体实现并不受上述方式的限制，只要采用了本发明的方法构思和技术方案进行的这种非实质改进，或未经改进将本发明的构思和技术方案直接应用于其他场合的，均在本发明的保护范围之内。

Claims (5)

1.一种抗菌抗静电薄膜，包括薄膜本体（1），所述薄膜本体（1）从上往下方向上依次设有上层薄膜（101）、基层薄膜（102）和下层薄膜（103），其特征在于：所述基层薄膜（102）的表面涂有抗静电层（104），所述抗静电层（104）的表面设有抗菌层（105），所述抗菌层（105）的表面粘合有上层薄膜（101），所述基层薄膜（102）的底面涂有抗辐射层（106），所述抗辐射层（106）底面粘合有下层薄膜（103）。
2.根据权利要求1所述的一种抗菌抗静电薄膜，其特征在于：所述基层薄膜（102）包括质量百分比为50%-65%的线性低密度聚乙烯树脂、质量百分比为25%-35%的低密度聚乙烯树脂和质量百分比为25%-35%的高密度聚乙烯树脂；
所述上层薄膜（101）包括质量百分比为60%-70%的低密度聚乙烯树脂、质量百分比为10%-15%的线性低密度聚乙烯树脂和质量百分比为20%-30%的高密度聚乙烯树脂；
所述下层薄膜（103）包括质量百分比为65%-75%的高密度聚乙烯树脂、质量百分比为10%-20%的线性低密度聚乙烯树脂和质量百分比为20%-30%的低密度聚乙烯树脂；
所述抗静电层（104）由质量百分比为50%-65%的聚乙烯醇、质量百分比为20%-30%的聚对笨二甲酸二乙酯、质量百分比为10%-15%的钛粉和质量百分比为10%-20%的乙醇溶液混合而成；
所述抗菌层（105）由质量百分比为50%-60%的甲基丙烯酸树脂、质量百分比为5%-15%的纳米银和质量百分比为30%-40%的季胺盐类聚合物混合而成；
所述抗辐射层（106）由质量百分比为70%-80%聚乙烯树脂、质量百分比为10%-15%纳米二氧化硅和质量百分比为10%-20%的甘油混合而成。
3.根据权利要求2所述的一种抗菌抗静电薄膜，其特征在于：所述基层薄膜（102）、上层薄膜（101）、下层薄膜（103）的厚度比为2：1：1。
4.根据权利要求1所述的一种抗菌抗静电薄膜，其特征在于：所述粘合剂采用醋酸乙烯树脂与二甲基硅油的混合物制备而成。
5.根据权利要求1-6任一所述的一种抗菌抗静电薄膜的制备方法，其特征在于：包括如下步骤：
S01：制备薄膜本体（1），将上层薄膜（101）、基层薄膜（102）和下层薄膜（103）的制造原料分别按质量百分比混合均匀，然后分别送到三组挤膜机中挤出，得到熔膜，分别为上层薄膜（101）、基层薄膜（102）和下层薄膜（103），待用；
S02：制备抗静电层（104），向反应釜一依次加入质量百分比为50%-65%的聚乙烯醇、质量百分比为20%-30%的聚对笨二甲酸二乙酯、质量百分比为10%-15%的钛粉和质量百分比为10%-20%的乙醇溶液，搅拌至均匀后制成抗静电涂液，待用；
S03：制备抗菌层（105），向反应釜二依次加入质量百分比为50%-60%的甲基丙烯酸树脂、质量百分比为5%-15%的纳米银和质量百分比为30%-40%的季胺盐类聚合物，搅拌均匀后制成抗菌涂液，待用；
S04：制备抗辐射层（106），向反应釜三依次加入质量百分比为70%-80%聚乙烯树脂、质量百分比为10%-15%纳米二氧化硅和质量百分比为10%-20%的甘油，搅拌均匀后制成抗辐射涂液，待用；
S05：将步骤SO2制得的抗静电涂液均匀的涂抹在基层薄膜（102）的表面，通过红外加热，辊压贴合，冷却定型后制得薄膜一；
S06：将步骤S03制备的抗菌涂液均匀的涂抹在薄膜一的抗静电层（102）的表面，红外加热，辊压贴合，冷却定型后制得薄膜二；
S07：将步骤S04制得的抗辐射涂液均匀的涂抹在薄膜二的基层薄膜（102）底面，红外加热，辊压贴合，冷却定型后制得薄膜三；
S08：在薄膜三的底面通过粘合剂粘合有下层薄膜（103），在薄膜三的抗菌层的表面通过粘合剂粘合有上层薄膜（101），红外加热，辊压贴合，冷却成型后制得抗菌抗静电薄膜。
CN202010510542.9A 2020-06-08 2020-06-08 一种抗菌抗静电薄膜及其制备方法 Pending CN111746085A (zh)

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