CN111746065A - 一种导热硅胶垫 - Google Patents
一种导热硅胶垫 Download PDFInfo
- Publication number
- CN111746065A CN111746065A CN202010719151.8A CN202010719151A CN111746065A CN 111746065 A CN111746065 A CN 111746065A CN 202010719151 A CN202010719151 A CN 202010719151A CN 111746065 A CN111746065 A CN 111746065A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- gel pad
- grooves
- heat
- pad body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/043—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
Abstract
本发明涉及硅胶垫领域,具体的说是一种导热硅胶垫,包括硅胶垫本体、第一散热机构和第二散热机构,所述硅胶垫本体的上表面开设有若干个纵向设置、等距分布的切槽,所述第一散热机构设置在切槽内,所述第一散热机构包括贴附槽、铜片和弧形斗槽,两个相同的所述贴附槽分别开设在切槽两侧的硅胶垫本体上,且每一个贴附槽内均固定嵌合有纵向设置的铜片,所述切槽的底部开设有弧形斗槽,所述第二散热机构安装在弧形斗槽下方的硅胶垫本体内,所述第二散热机构包括圆形腔、铜棒和贴合胶,所述圆形腔开设在弧形斗槽下方的硅胶垫本体上并与弧形斗槽相互连通。本发明提供的导热硅胶垫具有便于曲卷且不易开裂的优点。
Description
技术领域
本发明涉及硅胶垫领域,具体的说是一种导热硅胶垫。
背景技术
在日常生活中,人们会广泛应用到各种各样的电子产品,而所有的电子产品都涉及散热问题,因为电子产品中的电子元件在使用过程中温度会升高,尤其是晶体管和一些半导体部件特别容易发热,当电子元件的使用温度很高时,会导致电子元件性能下降,因而需要对电子元件进行散热。
在散热元件与发热元件连接时,通常需要用填充材料和导热材料来填充发热元件与散热元件之间的间隙,而现有的一些导热硅胶垫对于圆柱状或弧度较大的电子元件进行散热时,由于曲卷程度大而导致导热硅胶垫容易开裂,同时由于导热硅胶垫进行曲卷而导致内部热量很难传导出来。因此,有必要提供一种导热硅胶垫解决上述技术问题。
发明内容
针对现有技术中的问题,本发明提供了一种导热硅胶垫。
本发明解决其技术问题所采用的技术方案是:一种导热硅胶垫,包括硅胶垫本体、第一散热机构和第二散热机构,所述硅胶垫本体的上表面开设有若干个纵向设置、等距分布的切槽;所述第一散热机构设置在切槽内,所述第一散热机构包括贴附槽、铜片和弧形斗槽,两个相同的所述贴附槽分别开设在切槽两侧的硅胶垫本体上,且每一个贴附槽内均固定嵌合有纵向设置的铜片,所述切槽的底部开设有弧形斗槽;所述第二散热机构安装在弧形斗槽下方的硅胶垫本体内,所述第二散热机构包括圆形腔、铜棒和贴合胶,所述圆形腔开设在弧形斗槽下方的硅胶垫本体上并与弧形斗槽相互连通,所述铜棒的下半圆通过贴合胶与圆形腔的下半圆内壁固定连接。
优选的,所述第二散热机构还包括翅片条,若干个规格相同的所述翅片条环形设置并固定安装在铜棒上半圆的外壁上。
优选的,所述切槽两侧的硅胶垫本体上开设有若干个与翅片条相互匹配的翅片槽。
优选的,所述硅胶垫本体包括硅胶基底、石墨层、阻燃层和耐磨层,所述硅胶基底的上表面由下至上依次固定嵌合有石墨层和阻燃层,且硅胶基底的下表面固定胶合有耐磨层。
优选的,所述硅胶垫本体的下表面开设有若干个均匀分布的弧形槽,相邻所述切槽之间的缓冲垫本体形成条状的硅胶垫条,所述切槽的宽度为5-8mm,且切槽的深度为12-15mm。
与相关技术相比较,本发明提供的导热硅胶垫具有如下有益效果:
(1)本发明提供的导热硅胶垫,本发明硅胶垫本体上的切槽避免了硅胶垫本体在贴附在圆柱或弧形状设备上弯折时,不会出现开裂现象,从而提高了硅胶垫本体的使用寿命;硅胶垫本体卷成中空柱形或弧形时,因此切槽张开并使得两个铜片之间的间距增大,使得中间的气流流动的更快、更加快速的带走铜片上的热量,因此提高了硅胶垫本体的热量的传导。
(2)本发明提供的导热硅胶垫,本发明在两个铜片间距增大的同时,铜棒上嵌合在翅片槽内的翅片条在两个硅胶垫条张开后滑出翅片槽,因此提高了铜棒上翅片条与空气的接触面积,进一步提高了硅胶垫本体的热传导效果。
附图说明
图1为本发明提供的导热硅胶垫的一种较佳实施例的结构示意图;
图2为图1所示的A处的放大结构示意图;
图3为图2所示的第二散热机构的结构示意图;
图4为图1所示的硅胶垫本体的结构示意图。
图中标号:1、硅胶垫本体,11、硅胶基底,12、石墨层,13、阻燃层,14、耐磨层,2、切槽,3、第一散热机构,31、贴附槽,32、铜片,33、弧形斗槽,4、第二散热机构,41、圆形腔,42、铜棒,43、贴合胶,44、翅片条,5、翅片槽,6、弧形槽。
具体实施方式
下面结合附图和实施方式对本发明作进一步说明。
请结合参阅图1、图2、图3和图4,一种导热硅胶垫,包括硅胶垫本体1、第一散热机构3和第二散热机构4,所述硅胶垫本体1的上表面开设有若干个纵向设置、等距分布的切槽2,相邻所述切槽2之间的缓冲垫本体1形成条状的硅胶垫条,所述切槽2的宽度为5-8mm,且切槽2的深度为12-15mm,从而在将硅胶垫本体贴附在圆柱形电子设备或弧形状设备上对其进行热传导时,硅胶垫本体1上的切槽2避免了硅胶垫本体1在弯折时而导致的开裂现象,从而提高了硅胶垫本体1的使用寿命。所述硅胶垫本体1包括硅胶基底11、石墨层12、阻燃层13和耐磨层14,所述硅胶基底11的上表面由下至上依次固定嵌合有石墨层12和阻燃层13,且硅胶基底11的下表面固定胶合有耐磨层14,石墨层12有效的提高了硅胶垫热量的传导效率,而阻燃层13采用阻燃纤维,因而降低了硅胶垫本体1贴附的电子仪器温度过高而导致硅胶垫表面出现熔胶的现象,耐磨层14采用三氯化二铝材料制成,从而提高了硅胶垫的耐磨性。
参考图1和图2所示,所述第一散热机构3设置在切槽2内,所述第一散热机构3包括贴附槽31、铜片32和弧形斗槽33,两个相同的所述贴附槽31分别开设在切槽2两侧的硅胶垫本体1上,且每一个贴附槽31内均固定嵌合有纵向设置的铜片32,所述切槽2的底部开设有弧形斗槽33。在使用时,在将硅胶垫本体1贴附在圆柱形电子设备上对其进行热传导时,将开设有切槽2一面的硅胶垫本体1置在外侧,从而硅胶垫本体1卷成中空柱形或弧形时,切槽2张开并使得两个铜片32之间的间距增大,使得中间的气流流动的更快、更加快速的带走铜片32上的热量,因此提高了硅胶垫本体1的热传导效果。
参考图2和图4所示,所述第二散热机构4安装在弧形斗槽33下方的硅胶垫本体1内,所述第二散热机构4包括圆形腔41、铜棒42和贴合胶43,所述圆形腔41开设在弧形斗槽33下方的硅胶垫本体1上并与弧形斗槽33相互连通,所述铜棒42的下半圆通过贴合胶43与圆形腔41的下半圆内壁固定连接,而所述第二散热机构4还包括翅片条44,若干个规格相同的所述翅片条44环形设置并固定安装在铜棒42上半圆的外壁上,而所述切槽2两侧的硅胶垫本体1上开设有若干个与翅片条44相互匹配的翅片槽5。在使用时,在两个铜片32间距增大的同时,铜棒42上嵌合在翅片槽5内的翅片条44在两个硅胶垫条张开后滑出翅片槽5,因此提高了铜棒42上翅片条44与空气的接触面积,进一步提高了硅胶垫本体1的热传导效果,所述硅胶垫本体1的下表面开设有若干个均匀分布的弧形槽6,便于将硅胶垫本体1的下表面贴附在柱状电子仪器上。
本发明提供的导热硅胶垫的工作原理如下:将硅胶垫本体1贴附在圆柱形电子设备上对其进行热传导时,由于硅胶垫本体1的下表面开设有若干个均匀分布的弧形槽6,使得硅胶垫本体1贴附在柱状电子仪器或弧形状设备上的摩擦力更强,而开设有切槽2一面的硅胶垫本体1置在外侧,从而硅胶垫本体1卷成中空柱形,因为硅胶垫本体1上的切槽2,从而避免了硅胶垫本体1在弯折时硅胶垫本体1的外侧面出现开裂现象,从而提高了硅胶垫本体1的使用寿命,硅胶垫本体1卷成中空柱形时,切槽2张开并使得两个铜片32之间的间距增大,使得中间的气流流动的更快、更加快速的带走铜片32上的热量,因此提高了硅胶垫本体1的热传导效果,在两个铜片32间距增大的同时,铜棒42上嵌合在翅片槽5内的翅片条44在两个硅胶垫条张开后滑出翅片槽5,因此提高了铜棒42上翅片条44与空气的接触面积,进一步提高了硅胶垫本体1的热传导效果(硅胶垫本体1展开时翅片条44嵌合在硅胶垫本体1上开设的翅片槽5内),硅胶垫本体1中的石墨层12有效的提高了硅胶垫热量的传导效率,而阻燃层13采用阻燃纤维,因而降低了硅胶垫本体1贴附的电子仪器温度过高而导致硅胶垫表面出现熔胶的现象,耐磨层14采用三氯化二铝材料制成,从而提高了硅胶垫的耐磨性。
以上显示和描述了本发明的基本原理、主要特征和优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施方式和说明书中的描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入本发明要求保护的范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (5)
1.一种导热硅胶垫,其特征在于,包括硅胶垫本体(1)、第一散热机构(3)、第二散热机构(4)、所述硅胶垫本体(1)的上表面开设有若干个纵向设置、等距分布的切槽(2);所述第一散热机构(3)设置在切槽(2)内,所述第一散热机构(3)包括贴附槽(31)、铜片(32)和弧形斗槽(33),两个相同的所述贴附槽(31)分别开设在切槽(2)两侧的硅胶垫本体(1)上,且每一个贴附槽(31)内均固定嵌合有纵向设置的铜片(32),所述切槽(2)的底部开设有弧形斗槽(33);所述第二散热机构(4)安装在弧形斗槽(33)下方的硅胶垫本体(1)内,所述第二散热机构(4)包括圆形腔(41)、铜棒(42)和贴合胶(43),所述圆形腔(41)开设在弧形斗槽(33)下方的硅胶垫本体(1)上并与弧形斗槽(33)相互连通,所述铜棒(42)的下半圆通过贴合胶(43)与圆形腔(41)的下半圆内壁固定连接。
2.根据权利要求1所述的导热硅胶垫,其特征在于,所述第二散热机构(4)还包括翅片条(44),若干个规格相同的所述翅片条(44)环形设置并固定安装在铜棒(42)上半圆的外壁上。
3.根据权利要求1所述的导热硅胶垫,其特征在于,所述切槽(2)两侧的硅胶垫本体(1)上开设有若干个与翅片条(44)相互匹配的翅片槽(5)。
4.根据权利要求1所述的导热硅胶垫,其特征在于,所述硅胶垫本体(1)包括硅胶基底(11)、石墨层(12)、阻燃层(13)和耐磨层(14),所述硅胶基底(11)的上表面由下至上依次固定嵌合有石墨层(12)和阻燃层(13),且硅胶基底(11)的下表面固定胶合有耐磨层(14)。
5.根据权利要求1所述的导热硅胶垫,其特征在于,所述硅胶垫本体(1)的下表面开设有若干个均匀分布的弧形槽(6);相邻所述切槽(2)之间的缓冲垫本体(1)形成条状的硅胶垫条,所述切槽(2)的宽度为5-8mm,且切槽(2)的深度为12-15mm。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010719151.8A CN111746065B (zh) | 2020-07-23 | 2020-07-23 | 一种导热硅胶垫 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010719151.8A CN111746065B (zh) | 2020-07-23 | 2020-07-23 | 一种导热硅胶垫 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111746065A true CN111746065A (zh) | 2020-10-09 |
CN111746065B CN111746065B (zh) | 2022-02-22 |
Family
ID=72711818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010719151.8A Active CN111746065B (zh) | 2020-07-23 | 2020-07-23 | 一种导热硅胶垫 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111746065B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01231398A (ja) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板とその製造方法 |
CN204560108U (zh) * | 2015-04-28 | 2015-08-12 | 东莞市零度导热材料有限公司 | 一种紧密贴合发热芯片的导热垫片 |
CN109219325A (zh) * | 2018-11-14 | 2019-01-15 | 深圳市陆博新材料有限公司 | 一种导热垫片 |
CN210328367U (zh) * | 2019-05-13 | 2020-04-14 | 深圳市美成胶粘制品有限公司 | 导热硅胶垫 |
-
2020
- 2020-07-23 CN CN202010719151.8A patent/CN111746065B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01231398A (ja) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | セラミック多層配線基板とその製造方法 |
CN204560108U (zh) * | 2015-04-28 | 2015-08-12 | 东莞市零度导热材料有限公司 | 一种紧密贴合发热芯片的导热垫片 |
CN109219325A (zh) * | 2018-11-14 | 2019-01-15 | 深圳市陆博新材料有限公司 | 一种导热垫片 |
CN210328367U (zh) * | 2019-05-13 | 2020-04-14 | 深圳市美成胶粘制品有限公司 | 导热硅胶垫 |
Also Published As
Publication number | Publication date |
---|---|
CN111746065B (zh) | 2022-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI307750B (en) | Outdoor high power light-emitting diode illuminating equipment | |
CN101408302A (zh) | 具良好散热性能的光源模组 | |
US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
KR101971550B1 (ko) | 섬모를 이용한 방열장치 | |
CN103906413B (zh) | 散热模块 | |
CN105333407A (zh) | 散热结构及制造方法 | |
CN111746065B (zh) | 一种导热硅胶垫 | |
CN111430619A (zh) | 一种具有散热功能的新能源汽车动力电池托盘 | |
JPH0955456A (ja) | 半導体装置の冷却構造 | |
TWI599308B (zh) | 散熱裝置 | |
CN211378597U (zh) | 一种散热性好的集成电路板 | |
CN209497135U (zh) | 一种散热型稳压电源柜 | |
CN209402952U (zh) | 一种辐射散热器 | |
CN207118189U (zh) | 一种新型高效散热片 | |
CN206562400U (zh) | 一种cpu散热用导热泡棉垫片 | |
CN207854267U (zh) | 印刷电路板 | |
CN208589434U (zh) | 一种柔性膜片散热器 | |
CN214580888U (zh) | 一种led灯散热结构、车灯及车辆 | |
CN220173644U (zh) | 一种绝缘型导热硅胶片 | |
CN110769657A (zh) | 一体化均温板散热器 | |
CN209374433U (zh) | 复合散热结构 | |
CN207305233U (zh) | 一种散热器 | |
CN209065823U (zh) | 超低热阻导热硅脂 | |
CN208338122U (zh) | 电子组件 | |
CN104456205B (zh) | 一种led灯具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220127 Address after: 523000 plant D, 6 / F, building m, jinxiongda Science Park, Xingyuan Road, Datang Lang village, Dalingshan Town, Dongguan City, Guangdong Province Applicant after: DONGGUAN SHENGYUAN NEW MATERIAL TECHNOLOGY CO.,LTD. Address before: 201500 Shanghai Fengjing industrial park near 180 Wangwei East Road, Jinshan District, Shanghai Applicant before: Yang Fan |
|
GR01 | Patent grant | ||
GR01 | Patent grant |