CN111730773B - 一种多线切割装置 - Google Patents
一种多线切割装置 Download PDFInfo
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- CN111730773B CN111730773B CN202010468660.8A CN202010468660A CN111730773B CN 111730773 B CN111730773 B CN 111730773B CN 202010468660 A CN202010468660 A CN 202010468660A CN 111730773 B CN111730773 B CN 111730773B
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- wire
- cutting
- shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
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Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010468660.8A CN111730773B (zh) | 2020-05-28 | 2020-05-28 | 一种多线切割装置 |
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CN202010468660.8A CN111730773B (zh) | 2020-05-28 | 2020-05-28 | 一种多线切割装置 |
Publications (2)
Publication Number | Publication Date |
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CN111730773A CN111730773A (zh) | 2020-10-02 |
CN111730773B true CN111730773B (zh) | 2022-04-08 |
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CN202010468660.8A Active CN111730773B (zh) | 2020-05-28 | 2020-05-28 | 一种多线切割装置 |
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CN (1) | CN111730773B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116901274A (zh) * | 2023-09-13 | 2023-10-20 | 杭州泓芯微半导体有限公司 | 一种高速石英管多线切割装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100366A (ja) * | 1984-10-22 | 1986-05-19 | Sumitomo Metal Ind Ltd | ワイヤ式多条切断装置 |
JP2001328058A (ja) * | 2000-05-24 | 2001-11-27 | Toshiba Ceramics Co Ltd | ワイヤソーおよびこれを用いた切断方法 |
JP2009090387A (ja) * | 2007-10-04 | 2009-04-30 | Denso Corp | 炭化珪素基板製造用ワイヤーソー装置 |
CN101628452A (zh) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | 一种硅片切割方法 |
CN102407478A (zh) * | 2010-02-23 | 2012-04-11 | 株式会社安永 | 线锯装置以及使用该线锯装置的晶片制造方法 |
CN209533888U (zh) * | 2018-10-23 | 2019-10-25 | 苏州市汇峰机械设备有限公司 | 一种多线切割机减震装置 |
CN209999502U (zh) * | 2018-11-07 | 2020-01-31 | 西安烽火光伏科技股份有限公司 | 一种硅片切割用具有防断线功能的导轮装置 |
-
2020
- 2020-05-28 CN CN202010468660.8A patent/CN111730773B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100366A (ja) * | 1984-10-22 | 1986-05-19 | Sumitomo Metal Ind Ltd | ワイヤ式多条切断装置 |
JP2001328058A (ja) * | 2000-05-24 | 2001-11-27 | Toshiba Ceramics Co Ltd | ワイヤソーおよびこれを用いた切断方法 |
JP2009090387A (ja) * | 2007-10-04 | 2009-04-30 | Denso Corp | 炭化珪素基板製造用ワイヤーソー装置 |
CN101628452A (zh) * | 2009-07-31 | 2010-01-20 | 宁波升日太阳能电源有限公司 | 一种硅片切割方法 |
CN102407478A (zh) * | 2010-02-23 | 2012-04-11 | 株式会社安永 | 线锯装置以及使用该线锯装置的晶片制造方法 |
CN209533888U (zh) * | 2018-10-23 | 2019-10-25 | 苏州市汇峰机械设备有限公司 | 一种多线切割机减震装置 |
CN209999502U (zh) * | 2018-11-07 | 2020-01-31 | 西安烽火光伏科技股份有限公司 | 一种硅片切割用具有防断线功能的导轮装置 |
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CN111730773A (zh) | 2020-10-02 |
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Effective date of registration: 20210927 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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