CN111681978A - 一种晶圆清洗装置 - Google Patents
一种晶圆清洗装置 Download PDFInfo
- Publication number
- CN111681978A CN111681978A CN202010804243.6A CN202010804243A CN111681978A CN 111681978 A CN111681978 A CN 111681978A CN 202010804243 A CN202010804243 A CN 202010804243A CN 111681978 A CN111681978 A CN 111681978A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- wafer
- mounting plate
- driving
- fixedly installed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 155
- 238000009434 installation Methods 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- 230000001681 protective effect Effects 0.000 claims description 21
- 239000003595 mist Substances 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000000872 buffer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 238000012797 qualification Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 124
- 239000007921 spray Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000005201 scrubbing Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 238000011010 flushing procedure Methods 0.000 description 6
- 239000000779 smoke Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010804243.6A CN111681978B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010804243.6A CN111681978B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆清洗装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111681978A true CN111681978A (zh) | 2020-09-18 |
CN111681978B CN111681978B (zh) | 2020-12-01 |
Family
ID=72458278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010804243.6A Active CN111681978B (zh) | 2020-08-12 | 2020-08-12 | 一种晶圆清洗装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111681978B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112366133A (zh) * | 2021-01-13 | 2021-02-12 | 中电鹏程智能装备有限公司 | 针对半导体产品的擦拭清洗装置及其清洗方法 |
CN112420565A (zh) * | 2020-12-08 | 2021-02-26 | 广东先导先进材料股份有限公司 | 晶圆清洗装置及方法 |
CN112485641A (zh) * | 2020-11-18 | 2021-03-12 | 江门诺华精密电子有限公司 | 一种线路板的自动检测装置及其检测方法 |
CN112547603A (zh) * | 2020-11-13 | 2021-03-26 | 马鞍山锲恒精密组件科技有限公司 | 一种半导体晶圆表面清洗装置 |
CN115582333A (zh) * | 2022-10-24 | 2023-01-10 | 智程半导体设备科技(昆山)有限公司 | 半导体晶圆翻转式清洗装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697137A (ja) * | 1992-09-14 | 1994-04-08 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2003100684A (ja) * | 2001-09-25 | 2003-04-04 | Okamoto Machine Tool Works Ltd | 基板の研磨装置および基板の研磨・洗浄・乾燥方法 |
JP2004111815A (ja) * | 2002-09-20 | 2004-04-08 | Nec Yamagata Ltd | 保護テープの剥離方法及びその装置 |
CN109346424A (zh) * | 2018-10-29 | 2019-02-15 | 浙江金瑞泓科技股份有限公司 | 一种硅片刷片机 |
US20190299354A1 (en) * | 2016-11-15 | 2019-10-03 | Sumco Corporation | Wafer edge polishing apparatus and method |
CN210223964U (zh) * | 2019-08-14 | 2020-03-31 | 常州科沛达清洗技术股份有限公司 | 晶圆片刷洗甩干机构 |
-
2020
- 2020-08-12 CN CN202010804243.6A patent/CN111681978B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697137A (ja) * | 1992-09-14 | 1994-04-08 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2003100684A (ja) * | 2001-09-25 | 2003-04-04 | Okamoto Machine Tool Works Ltd | 基板の研磨装置および基板の研磨・洗浄・乾燥方法 |
JP2004111815A (ja) * | 2002-09-20 | 2004-04-08 | Nec Yamagata Ltd | 保護テープの剥離方法及びその装置 |
US20190299354A1 (en) * | 2016-11-15 | 2019-10-03 | Sumco Corporation | Wafer edge polishing apparatus and method |
CN109346424A (zh) * | 2018-10-29 | 2019-02-15 | 浙江金瑞泓科技股份有限公司 | 一种硅片刷片机 |
CN210223964U (zh) * | 2019-08-14 | 2020-03-31 | 常州科沛达清洗技术股份有限公司 | 晶圆片刷洗甩干机构 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112547603A (zh) * | 2020-11-13 | 2021-03-26 | 马鞍山锲恒精密组件科技有限公司 | 一种半导体晶圆表面清洗装置 |
CN112485641A (zh) * | 2020-11-18 | 2021-03-12 | 江门诺华精密电子有限公司 | 一种线路板的自动检测装置及其检测方法 |
CN112420565A (zh) * | 2020-12-08 | 2021-02-26 | 广东先导先进材料股份有限公司 | 晶圆清洗装置及方法 |
CN112366133A (zh) * | 2021-01-13 | 2021-02-12 | 中电鹏程智能装备有限公司 | 针对半导体产品的擦拭清洗装置及其清洗方法 |
CN115582333A (zh) * | 2022-10-24 | 2023-01-10 | 智程半导体设备科技(昆山)有限公司 | 半导体晶圆翻转式清洗装置 |
CN115582333B (zh) * | 2022-10-24 | 2023-09-01 | 苏州智程半导体科技股份有限公司 | 半导体晶圆翻转式清洗装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111681978B (zh) | 2020-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee after: Yuanxu Semiconductor Technology Co.,Ltd. Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: SHANDONG NOVOSHINE OPTOELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Wafer cleaning device Effective date of registration: 20220411 Granted publication date: 20201201 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201201 Pledgee: Weifang Jinma road sub branch of Bank of Weifang Co.,Ltd. Pledgor: Yuanxu Semiconductor Technology Co.,Ltd. Registration number: Y2022980004083 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240617 Address after: Floors 1-3, Sapphire Factory, No. 233-4 Sufu Road, Suxi Town, Yiwu City, Jinhua City, Zhejiang Province, 322000 Patentee after: BOE Huacan Jingtu Technology (Zhejiang) Co.,Ltd. Country or region after: China Address before: 261000 west area of the third photoelectric Park, north of Yuqing street, west of Yinfeng Road, high tech Zone, Weifang City, Shandong Province Patentee before: Yuanxu Semiconductor Technology Co.,Ltd. Country or region before: China |