CN111600600B - 振动器件、电子设备以及移动体 - Google Patents
振动器件、电子设备以及移动体 Download PDFInfo
- Publication number
- CN111600600B CN111600600B CN202010563333.0A CN202010563333A CN111600600B CN 111600600 B CN111600600 B CN 111600600B CN 202010563333 A CN202010563333 A CN 202010563333A CN 111600600 B CN111600600 B CN 111600600B
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- temperature
- thermistor
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- quartz
- electrode
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- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000010453 quartz Substances 0.000 abstract description 127
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 127
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- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
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- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
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- 239000004642 Polyimide Substances 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- 239000008103 glucose Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 229910052750 molybdenum Inorganic materials 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/08—Holders with means for regulating temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010563333.0A CN111600600B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-154618 | 2014-07-30 | ||
| JP2014154618A JP6618675B2 (ja) | 2014-07-30 | 2014-07-30 | 振動デバイス、電子機器及び移動体 |
| CN202010563333.0A CN111600600B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
| CN201510441705.1A CN105322954B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510441705.1A Division CN105322954B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111600600A CN111600600A (zh) | 2020-08-28 |
| CN111600600B true CN111600600B (zh) | 2023-10-20 |
Family
ID=55180918
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010563333.0A Active CN111600600B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
| CN201510441705.1A Active CN105322954B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
| CN202010563329.4A Active CN111641408B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510441705.1A Active CN105322954B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
| CN202010563329.4A Active CN111641408B (zh) | 2014-07-30 | 2015-07-24 | 振动器件、电子设备以及移动体 |
Country Status (3)
| Country | Link |
|---|---|
| US (6) | US10009004B2 (OSRAM) |
| JP (1) | JP6618675B2 (OSRAM) |
| CN (3) | CN111600600B (OSRAM) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9660610B2 (en) * | 2014-05-30 | 2017-05-23 | Kyocera Crystal Device Corporation | Crystal device and mounting arrangement |
| JP6618675B2 (ja) | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
| USD760230S1 (en) | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
| JP5900582B1 (ja) * | 2014-11-21 | 2016-04-06 | 株式会社大真空 | 圧電振動デバイス |
| WO2018063234A1 (en) * | 2016-09-29 | 2018-04-05 | Halliburton Energy Services, Inc. | Downhole generation of microwaves from light |
| JP6548151B2 (ja) * | 2016-10-11 | 2019-07-24 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
| CN107508595B (zh) * | 2016-11-03 | 2022-06-24 | 台湾晶技股份有限公司 | 由内嵌加热式陶瓷封装组成的恒温控制晶体振荡器 |
| US10333930B2 (en) * | 2016-11-14 | 2019-06-25 | General Electric Company | System and method for transparent multi-factor authentication and security posture checking |
| CN110832773B (zh) * | 2017-07-21 | 2023-11-21 | 京瓷株式会社 | 电子部件收纳用封装、电子装置以及电子模块 |
| JP2019118073A (ja) * | 2017-12-27 | 2019-07-18 | セイコーエプソン株式会社 | 振動デバイス、振動デバイスの製造方法、電子機器および移動体 |
| JP2019134226A (ja) * | 2018-01-29 | 2019-08-08 | 京セラ株式会社 | 水晶振動子 |
| JP2019186647A (ja) * | 2018-04-04 | 2019-10-24 | 京セラ株式会社 | 水晶デバイス及びその水晶デバイスを用いた電子機器 |
| JP2020043434A (ja) * | 2018-09-07 | 2020-03-19 | 京セラ株式会社 | 水晶デバイス |
| JP6780688B2 (ja) * | 2018-10-18 | 2020-11-04 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
| JP2020088633A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
| CN111224635B (zh) | 2018-11-27 | 2024-01-19 | 京瓷株式会社 | 压电器件以及电子设备 |
| JP7093293B2 (ja) * | 2018-11-27 | 2022-06-29 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
| US10924106B2 (en) * | 2019-01-02 | 2021-02-16 | General Electric Company | Miller transition control gate drive circuit |
| JP7375331B2 (ja) * | 2019-04-26 | 2023-11-08 | セイコーエプソン株式会社 | 振動デバイスおよび電子機器 |
| JP7413682B2 (ja) * | 2019-08-29 | 2024-01-16 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
| CN111045317B (zh) * | 2019-12-26 | 2022-02-25 | 展讯通信（上海）有限公司 | 设备时钟的校准方法、装置及系统、自校准方法及设备 |
| CN112087210B (zh) * | 2020-09-15 | 2022-09-09 | 深圳市深汕特别合作区应达利电子科技有限公司 | 热敏电阻谐振器及其制作方法 |
| WO2022174440A1 (zh) * | 2021-02-22 | 2022-08-25 | 京东方科技集团股份有限公司 | 压电元件、压电振动器及其制作和驱动方法、电子设备 |
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| JP2014175998A (ja) * | 2013-03-12 | 2014-09-22 | Kyocera Crystal Device Corp | 水晶振動子 |
| JP6618675B2 (ja) * | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
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2014
- 2014-07-30 JP JP2014154618A patent/JP6618675B2/ja active Active
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2015
- 2015-07-24 CN CN202010563333.0A patent/CN111600600B/zh active Active
- 2015-07-24 CN CN201510441705.1A patent/CN105322954B/zh active Active
- 2015-07-24 CN CN202010563329.4A patent/CN111641408B/zh active Active
- 2015-07-29 US US14/812,103 patent/US10009004B2/en active Active
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2018
- 2018-05-23 US US15/987,234 patent/US10396754B2/en active Active
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2019
- 2019-07-10 US US16/507,165 patent/US11101785B2/en active Active
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2021
- 2021-07-07 US US17/369,005 patent/US11641186B2/en active Active
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2023
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| US20230208390A1 (en) | 2023-06-29 |
| US10396754B2 (en) | 2019-08-27 |
| US11641186B2 (en) | 2023-05-02 |
| US20210336599A1 (en) | 2021-10-28 |
| JP6618675B2 (ja) | 2019-12-11 |
| CN105322954A (zh) | 2016-02-10 |
| US12278615B2 (en) | 2025-04-15 |
| US20190334501A1 (en) | 2019-10-31 |
| US20180269851A1 (en) | 2018-09-20 |
| CN111641408A (zh) | 2020-09-08 |
| JP2016032243A (ja) | 2016-03-07 |
| US11979138B2 (en) | 2024-05-07 |
| CN111641408B (zh) | 2023-10-27 |
| CN105322954B (zh) | 2020-07-07 |
| US20160035962A1 (en) | 2016-02-04 |
| US10009004B2 (en) | 2018-06-26 |
| US20240250660A1 (en) | 2024-07-25 |
| US11101785B2 (en) | 2021-08-24 |
| CN111600600A (zh) | 2020-08-28 |
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