CN111595861A - Confocal imaging detection device and method for simultaneously and completely aplanatic crystal grain adjacent surfaces by using glass optical wedge for image splitting - Google Patents
Confocal imaging detection device and method for simultaneously and completely aplanatic crystal grain adjacent surfaces by using glass optical wedge for image splitting Download PDFInfo
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Abstract
The invention provides a novel detection device and a novel detection method for realizing the separation of double-sided imaging space of a semiconductor crystal grain by respectively adopting glass optical wedges in adjacent double-sided imaging optical paths based on the basic structural principle of an adjacent-surface complete aplanatic confocal imaging device.
Description
The technical field is as follows:
the invention belongs to the field of optical detection and machine vision, and particularly relates to a device and a method for synchronously and completely aplanatic confocal imaging detection of crystal grain adjacent surfaces by using glass optical wedge for image splitting.
Background art:
the complete aplanatic confocal imaging of the semiconductor crystal grain double-sided imaging detection light path is one of the main core technical problems to be solved, and based on different methods, the patent applications already filed by the research of the semiconductor crystal grain adjacent double-sided simultaneous defect imaging detection technology comprise:
the optical detection device and method provided in fig. 1 well solve the problem of "quasi" confocal imaging detection of the adjacent surface of the semiconductor crystal grain, but there is still an optical path difference between the adjacent double-sided imaging optical paths, and in order to obtain simultaneous confocal imaging of the adjacent surface, it is necessary to compensate the small optical path difference by selecting a telecentric imaging lens with a large depth of field, so that it is necessary to find a new way for complete aplanatic confocal imaging detection of the adjacent surface of the crystal grain;
FIG. 2 is a new method for implementing complete aplanatic confocal imaging detection of adjacent surfaces of semiconductor crystal grains by using a single set of imaging system based on a time difference resolution imaging method;
FIG. 3 provides a new method for simultaneous and complete aplanatic confocal imaging detection of adjacent surfaces of semiconductor crystal grains based on a two-color separation imaging method;
FIG. 4 is a diagram illustrating a polarization beam splitter to obtain two illumination beams with mutually perpendicular polarization directions for respectively illuminating two adjacent surfaces of a semiconductor die to be tested; in addition, a method based on polarized light separation imaging (polarization split imaging for short) is provided, and a device and a method for realizing simultaneous and complete aplanatic confocal imaging detection of adjacent surfaces of semiconductor crystal grains by using a polarization camera are provided;
fig. 5 provides a new method for realizing simultaneous and complete aplanatic confocal imaging detection of adjacent surfaces of semiconductor crystal grains by combining a polarization splitting prism assembly and using a common CMOS or CCD camera, still based on the principle of polarized light splitting imaging (referred to as "polarization splitting").
However, the above-mentioned apparatus and method use either a polarization optical element or a CMOS polarization camera, which makes the optical and precision mechanical structure of the detection system more complicated, and increases the cost of the detection apparatus.
The invention content is as follows:
the invention provides a device and a method for synchronously and completely aplanatic confocal imaging detection of crystal grain adjacent surfaces by using glass optical wedges for image splitting.
The invention discloses a confocal imaging detection device with complete aplanatic optical path for crystal grain adjacent surfaces by using glass optical wedge image splitting, which is characterized in that: the device comprises a CMOS or CCD camera, a telecentric imaging lens, a cubic beam splitting and image combining device, a semiconductor crystal grain and a transparent glass objective table for bearing the semiconductor crystal grain, wherein the CMOS or CCD camera, the telecentric imaging lens, the cubic beam splitting and image combining device, the semiconductor crystal grain and the transparent glass objective table are sequentially arranged in the light path direction; the side right-angle rotating image prism, the second glass optical wedge and the cubic beam splitting and image combining device are positioned on the optical axis of the telecentric imaging lens, meanwhile, a first right-angle surface of the side right-angle rotating image prism is opposite to a first surface of the cubic beam splitting and image combining device, a second right-angle surface of the side right-angle rotating image prism is opposite to the side surface of the semiconductor crystal grain, and the inclined surface of the side right-angle rotating image prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right-angle surfaces of the skyhook right-angle rotating image prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface of the cubic beam splitting and image combining device; the surface of the first glass optical wedge close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface of the second glass optical wedge close to the cubic beam splitter and imager and the normal direction of the optical axis of the telecentric imaging lens form a glass optical wedge angle, a coaxial external illumination light source is arranged beside a fourth surface opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are subjected to confocal imaging on the sensor surface of the camera through a right-angle image rotating prism, the glass optical wedge and the cubic beam splitter and imager respectively in a complete aplanatism way so as to obtain independent images of the two surfaces of the semiconductor crystal grain on a CMOS or CCD camera.
Furthermore, the distance between the center of the cubic beam splitting image combiner and the center of the inclined plane of the side right-angle relay prism is D/2+ D, the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism are on the same horizontal height, the distance between the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism is D/2+ D, the working distance WD of a side imaging optical path is = D/2+ D/2, the working distance WD of the top imaging optical path is = WD = D/2+ D/2, D is the width of a transparent glass objective table, and D is the side length; the semiconductor crystal grain top imaging optical path working distance WD = D/2+ D/2=30mm, and the side imaging optical path working distance WD = D/2+ D/2=30 mm.
Furthermore, the glass optical wedge makes the double-sided imaging light beam generate angular displacement gamma towards the two sides of the center (optical axis) of the cubic beam splitter-combiner respectively1And gamma2And γ1And gamma2Is determined by the thickness t of the glass wedge, the refractive index n of the glass, and the wedge angle α1And α2And the angle theta between the normal to the surface of the glass wedge and the optical axis1And theta2(ii) a The cubic beam splitter outputs spatially separated angular displacements of the images of adjacent faces of the semiconductor die of γ = γ1+γ2The thickness t =2mm of the first glass optical wedge and the second glass optical wedge, the angle α =2 degrees of the glass optical wedge, the material of the glass optical wedge is K9, and the angular displacement gamma generated by the glass optical wedge is obtained through calculation1=γ2=（n-1）xα=1.03°，γ=2.06°。
Furthermore, the size of the top right-angle transfer prism is 15 × 15mm, the size of the side right-angle transfer prism is 15 × 15mm, and the size of the cubic beam splitter/combiner is 15 × 15 mm; the center of the cubic beam splitting and image combining device, the center of the reflecting surface of the right-angle rotating image prism and the center of the semiconductor crystal grain are connected to form a square symmetrical optical path structure with the side length of D/2+ D =37.5 mm.
Further, the two glass wedges produce a two-image separation = γ xL =1.8mm, the focal length f =51.5mm, WD =110mm, L =50 mm; the angular displacement error of the double images generated by the angular tolerance (less than or equal to 30 arc seconds) of the cubic beam splitter and the right-angle relay prism is controlled within 2 arc minutes.
Furthermore, the angle error and the assembly error of the cubic beam splitter or the right-angle relay prism cause the angle deviation of the space optical path of the double-sided imaging, in a meridian plane (a y-z plane, a z axis is along the direction of an optical axis), the error of the compensation meridian plane is corrected by finely adjusting theta 1 and theta 2 by rotating the glass micro-wedge around an x axis, and the deviation of the relative space position or the angular displacement of the double-sided imaging is caused by the angle manufacturing error and the assembly error of the cubic beam splitter or the right-angle relay prism; similarly, the deviation of the relative spatial position or angular displacement of the two-sided image due to the manufacturing and assembly errors of the cube beam combiner or right angle relay prism can also be corrected and compensated by rotating the glass wedge with the thickness t by a slight angle around the y-axis to generate the linear displacement in the sagittal plane (x-z plane).
Furthermore, the coaxial external illumination light source is monochromatic light, or a quasi-monochromatic light source or white light with a certain spectral bandwidth.
The invention discloses a confocal imaging detection method for simultaneously and completely aplanatically imaging crystal grain adjacent surfaces by using a glass optical wedge, which is characterized in that: the confocal imaging detection device comprises a CMOS or CCD camera, a telecentric imaging lens, a cubic beam splitting and image combining device, a semiconductor crystal grain and a transparent glass object stage for bearing the semiconductor crystal grain, wherein the CMOS or CCD camera, the telecentric imaging lens, the cubic beam splitting and image combining device, the semiconductor crystal grain and the transparent glass object stage are sequentially arranged in the light path direction; the side right-angle rotating image prism, the second glass optical wedge and the cubic beam splitting and image combining device are positioned on the optical axis of the telecentric imaging lens, meanwhile, a first right-angle surface of the side right-angle rotating image prism is opposite to a first surface of the cubic beam splitting and image combining device, a second right-angle surface of the side right-angle rotating image prism is opposite to the side surface of the semiconductor crystal grain, and the inclined surface of the side right-angle rotating image prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right-angle surfaces of the skyhook right-angle rotating image prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface of the cubic beam splitting and image combining device; the surface of the first glass optical wedge close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface of the second glass optical wedge close to the cubic beam splitter and imager and the normal direction of the optical axis of the telecentric imaging lens form a glass optical wedge angle, a coaxial external illumination light source is arranged beside a fourth surface opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are subjected to confocal imaging on the sensor surface of the camera by a right-angle image rotating prism, the glass optical wedge and the cubic beam splitter and imager in a complete aplanatism way so as to obtain independent images of the two surfaces of the semiconductor crystal grain on a CMOS or CCD camera; when in use, the utility model is used for cleaning the inner wall of the tank,
double-sided illumination light path:
the coaxial external illumination light source is divided into two illumination light beams when passing through the cubic beam splitter and combiner: a beam of light passes through the skyhook right-angle relay prism and the first glass optical wedge and then illuminates the skyhook of the semiconductor crystal grain to be tested on the glass loading turntable; the other beam of illumination light illuminates the side surface of the semiconductor crystal grain to be tested after passing through the side right-angle relay prism and the second glass optical wedge, and the two beams of illumination light respectively illuminate two adjacent surfaces of the semiconductor crystal grain;
imaging detection light path:
two adjacent surfaces of the illuminated semiconductor crystal grain generate diffused light, and an imaging light beam of the skyhook of the semiconductor crystal grain is incident to a thickness t and a light wedge angle α through a skyhook right-angle relay prism1The imaging light beam emitted from the first glass optical wedge generates an angular displacement gamma towards one side of the optical axis1Then reflected by the cube beam combiner to the reference output surface, and the imaging beam from the side of the semiconductor crystal grain is incident via the side right-angle turning prism to the thickness t and wedge angle α2The imaging light beam emitted from the second glass optical wedge generates an angular displacement gamma towards the other side of the optical axis2Then transmitted by the cubic beam splitter and reach the reference output surface, and the angular displacement of the adjacent surface output by the cubic beam splitter and the cubic beam combiner is gamma = gamma1+γ2And images with independent two surfaces are respectively obtained on a CMOS or CCD camera.
The detection device and the method have the advantages that:
1) the invention can realize the simultaneous complete aplanatic confocal imaging detection of two adjacent surfaces of the semiconductor crystal grain without using a large-depth-of-field telecentric lens to compensate the optical path difference of the two adjacent surfaces;
2) the glass optical wedge in the imaging optical path can obtain the expected angular displacement gamma or space separation of double-sided imaging, the interval of double images can be adjusted, and the thickness t and the refractive index n of the glass for a given parallel flat plate depend on the angle alpha of the glass optical wedge;
3) the invention can also use the glass optical wedge angle to correct and compensate the deviation of the relative spatial position or angular displacement of double-sided imaging caused by the angle manufacturing error and assembly error of the cubic prism or the right-angle relay prism;
4) the invention adopts a common glass optical wedge angle and a CMOS or CCD camera, does not need to use a polarization optical element and a polarization CMOS sensor (camera), can effectively reduce the cost of the detection device and improve the cost performance of the detection device;
5) the device for simultaneously imaging and detecting the adjacent double surfaces of the semiconductor crystal grains has the advantages of simple and compact structure, easy assembly and debugging and good reliability.
Description of the drawings:
FIGS. 1-5 illustrate conventional semiconductor die adjacent surface detection optics;
wherein 1 is a black-and-white camera, 2 is a telecentric imaging lens, 3a or 3b is a rotating image prism, 3 is an image combination optical element, 4 is a semiconductor crystal grain, 5 is a transparent glass object stage, 6 or 6a or 6b is a rotating image prism, 7 or 7a and 7b light sources, and 8 and 9 are optical filters; 8a is a polarizing prism; 8b is a roof prism;
FIG. 6 is a schematic diagram of the apparatus of the present invention;
FIG. 7 is a schematic diagram of a glass wedge principle.
FIG. 8 is a schematic view of a corresponding dimensional embodiment of the apparatus of the present invention;
the specific implementation mode is as follows:
as shown in fig. 6, the confocal imaging detection apparatus using the crystal grain adjacent surfaces of the glass optical wedge for simultaneous and complete aplanatism confocal imaging comprises a CMOS or CCD camera 1, a telecentric imaging lens 2, a cubic beam splitting and image combining device 3, a semiconductor crystal grain 6 and a transparent glass stage 7 for holding the semiconductor crystal grain, which are sequentially arranged in the optical path direction, a sky-surface right-angle relay prism 4a, a first glass optical wedge 5a, a side-surface right-angle relay prism 4b and a second glass optical wedge 5b are sequentially arranged on the optical path between the semiconductor crystal grain 6 and the cubic beam splitting and image combining device 3, respectively, the side-surface right-angle relay prism 4b and the sky-surface right-angle relay prism 4a are located right above the front side part and the sky surface of the semiconductor crystal grain 6, and the cubic beam splitting and image combining device 3, the first glass optical wedge 5a and the sky-surface right-angle relay prism 4a are at the same horizontal height; the side right-angle image-rotating prism 4b, the second glass optical wedge 5b and the cubic beam splitting and image combining device 3 are positioned on the optical axis A of the telecentric imaging lens, meanwhile, a first right-angle surface 401b of the side right-angle image-rotating prism is opposite to a first surface 301 of the cubic beam splitting and image combining device, a second right-angle surface 402b of the side right-angle image-rotating prism is opposite to the side surface of a semiconductor crystal grain, and an inclined surface 403b of the side right-angle image-rotating prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right- angle surfaces 401a and 402a of the skyhook right-angle relay prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface 302 of the cubic beam splitting and image combining device; the surface 501a of the first glass optical wedge 5a close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface 501b of the second glass optical wedge 5b close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle in a normal direction, a coaxial external illumination light source 8 is arranged beside a fourth surface 304 opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are imaged on the sensor surface of the camera in a completely equal optical path way through right-angle image-rotating prisms 4a and 4b, glass optical wedges 5a and 5b and the cubic beam splitter and imager 3 respectively, so that independent images of the two surfaces of the semiconductor crystal grain are obtained on a CMOS or CCD camera.
The distance between the center of the cubic beam splitting image combiner and the center of the inclined plane of the side right-angle relay prism is D/2+ D, the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism are on the same horizontal height, the distance between the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism is D/2+ D, the working distance WD of a side imaging light path is = D/2+ D/2, the working distance WD of the top imaging light path is = WD = D/2+ D/2, D is the width of a transparent glass object stage, and D is the; the semiconductor crystal grain top imaging optical path working distance WD = D/2+ D/2=30mm, and the side imaging optical path working distance WD = D/2+ D/2=30 mm.
The glass optical wedge makes the double-sided imaging light beam generate angular displacement gamma towards the two sides of the center (optical axis) of the cubic beam splitter/combiner1And gamma2And γ1And gamma2Is determined by the thickness t of the glass wedge, the refractive index n of the glass, and the wedge angle α1And α2And glassIncluded angle theta between surface normal of glass optical wedge and optical axis1And theta2As shown in fig. 7. The cubic beam splitter outputs spatially separated angular displacements of the images of adjacent faces of the semiconductor die of γ = γ1+γ2The thickness t =2mm of the first glass optical wedge and the second glass optical wedge, the angle α =2 degrees of the glass optical wedge, the material of the glass optical wedge is K9, and the angular displacement gamma generated by the glass optical wedge is obtained through calculation1=γ2=（n-1）xα=1.03°，γ=2.06°。
As shown in fig. 8, the size of the above-mentioned right-angle relay prism is 15 × 15mm, the size of the side right-angle relay prism is 15 × 15mm, and the size of the cubic beam splitter/combiner is 15 × 15 mm; the center of the cubic beam splitting and image combining device, the center of the reflecting surface of the right-angle rotating image prism and the center of the semiconductor crystal grain are connected to form a square symmetrical optical path structure with the side length of D/2+ D =37.5 mm.
The two glass wedges produce a two-image separation = γ xL =1.8mm, focal length f =51.5mm, WD =110mm, L =50 mm; the angular displacement error of the double images generated by the angular tolerance (less than or equal to 30 arc seconds) of the cubic beam splitter and the right-angle relay prism is controlled within 2 arc minutes.
The angle error and the assembly error of the cubic beam splitting and image combining device or the right-angle rotating image prism cause the angle deviation of a double-sided imaging space optical path, and in a meridian plane (a y-z plane, a z axis is along the direction of an optical axis), the error of a compensation meridian plane can be corrected by finely adjusting theta 1 and theta 2 by rotating a glass optical wedge around an x axis; because the angle error and the assembly error of the cubic beam splitter or the right-angle relay prism cause the angle deviation of the double-sided imaging space light path, similarly, the glass optical wedge with the thickness of t can be rotated by a tiny angle around the y axis to generate linear displacement in the sagittal plane (x-z plane) to correct and compensate the error of the sagittal plane.
Furthermore, the coaxial external illumination light source is monochromatic light, or a quasi-monochromatic light source or white light with a certain spectral bandwidth.
The cubic beam splitting/image combining device, which can be also called as a cubic beam splitting/image combining device or a cubic image combining device, is a common optical device, and can plate a transmission and reflection ratio of 50% on the inclined plane of a right-angle prism: 50% of light splitting film, and the inclined planes of the two right-angle reflecting prisms are glued.
The invention discloses a confocal imaging detection method for simultaneously and completely aplanatically imaging crystal grain adjacent surfaces by using a glass optical wedge, which is characterized in that: the confocal imaging detection device comprises a CMOS or CCD camera, a telecentric imaging lens, a cubic beam splitting and image combining device, a semiconductor crystal grain and a transparent glass object stage for bearing the semiconductor crystal grain, wherein the CMOS or CCD camera, the telecentric imaging lens, the cubic beam splitting and image combining device, the semiconductor crystal grain and the transparent glass object stage are sequentially arranged in the light path direction; the side right-angle rotating image prism, the second glass optical wedge and the cubic beam splitting and image combining device are positioned on the optical axis of the telecentric imaging lens, meanwhile, a first right-angle surface of the side right-angle rotating image prism is opposite to a first surface of the cubic beam splitting and image combining device, a second right-angle surface of the side right-angle rotating image prism is opposite to the side surface of the semiconductor crystal grain, and the inclined surface of the side right-angle rotating image prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right-angle surfaces of the skyhook right-angle rotating image prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface of the cubic beam splitting and image combining device; the surface of the first glass optical wedge close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface of the second glass optical wedge close to the cubic beam splitter and imager and the normal direction of the optical axis of the telecentric imaging lens form a glass optical wedge angle, a coaxial external illumination light source is arranged beside a fourth surface opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are subjected to confocal imaging on the sensor surface of the camera by a right-angle image rotating prism, the glass optical wedge and the cubic beam splitter and imager in a complete aplanatism way so as to obtain independent images of the two surfaces of the semiconductor crystal grain on a CMOS or CCD camera; when in use, the utility model is used for cleaning the inner wall of the tank,
double-sided illumination light path:
the coaxial external illumination light source is divided into two illumination light beams when passing through the cubic beam splitter and combiner: a beam of light passes through the skyhook right-angle relay prism and the first glass optical wedge and then illuminates the skyhook of the semiconductor crystal grain to be tested on the glass loading turntable; the other beam of illumination light illuminates the side surface of the semiconductor crystal grain to be tested after passing through the side right-angle relay prism and the second glass optical wedge, and the two beams of illumination light respectively illuminate two adjacent surfaces of the semiconductor crystal grain;
imaging detection light path:
two adjacent surfaces of the illuminated semiconductor crystal grain generate diffused light, and an imaging light beam of the skyhook of the semiconductor crystal grain is incident to a thickness t and a light wedge angle α through a skyhook right-angle relay prism1The imaging light beam emitted from the first glass optical wedge generates an angular displacement gamma towards one side of the optical axis1Then reflected by the cube beam combiner to the reference output surface, and the imaging beam from the side of the semiconductor crystal grain is incident via the side right-angle turning prism to the thickness t and wedge angle α2The imaging light beam emitted from the second glass optical wedge generates an angular displacement gamma towards the other side of the optical axis2Then transmitted by the cubic beam splitter and reach the reference output surface, and the angular displacement of the adjacent surface output by the cubic beam splitter and the cubic beam combiner is gamma = gamma1+γ2，The crystal grain adjacent surface space equivalent interval = γ xL (L is the distance between the glass optical wedge and the reference output surface of the cubic beam combiner 3) corresponding to the angular displacement, and two independent images are respectively obtained on the CMOS or CCD camera.
The optical device is similar to the structure of a Michelson double-beam equal-arm interferometer, the angular displacement gamma of a crystal grain double-sided imaging optical path is realized by respectively using glass optical wedges (glass optical wedges for short, namely the first glass optical wedge and the second glass optical wedge) with smaller refraction prism wedge angles in adjacent double-sided imaging optical paths, the object space equivalent interval of crystal grain adjacent surfaces corresponding to the angular displacement = gamma xL (L is an object distance), and the device obtains space separation imaging of the adjacent surfaces under the condition of meeting the full aplanatism confocal of double-sided imaging, so that the simultaneous full aplanatism confocal imaging detection of the adjacent double surfaces of semiconductor crystal grains can be realized.
The space position of the double images of the adjacent surfaces of the semiconductor crystal grains of the device on the sensor surface of the CMOS camera is separated into 'or the equivalent interval' =/beta (beta is the magnification ratio of a telecentric imaging lens) of the adjacent double surfaces of the object crystal grains, and the adjacent double surfaces of the semiconductor crystal grains can be imaged to meet the complete aplanatism confocal condition.
The detection device and the method have the advantages that:
1) the invention can realize the simultaneous complete aplanatic confocal imaging detection of two adjacent surfaces of the semiconductor crystal grain without using a large-depth-of-field telecentric lens to compensate the optical path difference of the two adjacent surfaces;
2) the glass optical wedge in the imaging optical path can obtain the expected angular displacement gamma or space separation of double-sided imaging, the interval of double images can be adjusted, and the thickness t and the refractive index n of the glass for a given parallel flat plate depend on the angle alpha of the glass optical wedge;
3) the invention can also use the glass optical wedge angle to correct and compensate the deviation of the relative spatial position or angular displacement of double-sided imaging caused by the angle manufacturing error and assembly error of the cubic prism or the right-angle relay prism;
4) the invention adopts a common glass optical wedge angle and a CMOS or CCD camera, does not need to use a polarization optical element and a polarization CMOS sensor (camera), and simultaneously has stronger functions of double-sided image splitting and manufacturing error compensation; the device can effectively reduce the cost of the detection device and improve the cost performance of the detection device;
5) the device for simultaneously imaging and detecting the adjacent double surfaces of the semiconductor crystal grains has the advantages of simple and compact structure, easy assembly and debugging and good reliability.
Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present invention and not to limit the same; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art will understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (8)
1. A confocal imaging detection device with complete aplanatism simultaneously for crystal grain adjacent surfaces by using glass optical wedge image splitting is characterized in that: the device comprises a CMOS or CCD camera, a telecentric imaging lens, a cubic beam splitting and image combining device, a semiconductor crystal grain and a transparent glass objective table for bearing the semiconductor crystal grain, wherein the CMOS or CCD camera, the telecentric imaging lens, the cubic beam splitting and image combining device, the semiconductor crystal grain and the transparent glass objective table are sequentially arranged in the light path direction; the side right-angle rotating image prism, the second glass optical wedge and the cubic beam splitting and image combining device are positioned on the optical axis of the telecentric imaging lens, meanwhile, a first right-angle surface of the side right-angle rotating image prism is opposite to a first surface of the cubic beam splitting and image combining device, a second right-angle surface of the side right-angle rotating image prism is opposite to the side surface of the semiconductor crystal grain, and the inclined surface of the side right-angle rotating image prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right-angle surfaces of the skyhook right-angle rotating image prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface of the cubic beam splitting and image combining device; the surface of the first glass optical wedge close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface of the second glass optical wedge close to the cubic beam splitter and imager and the normal direction of the optical axis of the telecentric imaging lens form a glass optical wedge angle, a coaxial external illumination light source is arranged beside a fourth surface opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are subjected to confocal imaging on the sensor surface of the camera through a right-angle image rotating prism, the glass optical wedge and the cubic beam splitter and imager respectively in a complete aplanatism way so as to obtain independent images of the two surfaces of the semiconductor crystal grain on a CMOS or CCD camera.
2. The confocal imaging detection device with complete aplanatic simultaneous and adjacent surfaces of crystal grains for image splitting by using the glass optical wedge as claimed in claim 1, wherein: the distance between the center of the cubic beam splitting image combiner and the center of the inclined plane of the side right-angle relay prism is D/2+ D, the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism are on the same horizontal height, the distance between the cubic beam splitting image combiner and the inclined plane of the top right-angle relay prism is D/2+ D, the working distance WD of a side imaging light path is = D/2+ D/2, the working distance WD of the top imaging light path is = WD = D/2+ D/2, D is the width of a transparent glass object stage, and D is the; the semiconductor crystal grain top imaging optical path working distance WD = D/2+ D/2=30mm, and the side imaging optical path working distance WD = D/2+ D/2=30 mm.
3. The confocal imaging detection device with complete aplanatic simultaneous and close to crystal grain surfaces split by using the glass optical wedge as claimed in claim 1 or 2, wherein: the glass optical wedge makes the double-sided imaging light beam generate angular displacement gamma towards the two sides of the center (optical axis) of the cubic beam splitter/combiner1And gamma2And γ1And gamma2Is determined by the thickness t of the glass wedge, the refractive index n of the glass, and the wedge angle α1And α2The cube beam splitter outputs spatially separated angular displacements of the images of adjacent faces of the semiconductor die of γ = γ1+γ2The thickness t =2mm of the first glass optical wedge and the second glass optical wedge, the angle α =2 degrees of the glass optical wedge, the material of the glass optical wedge is K9, and the angular displacement gamma generated by the glass optical wedge is obtained through calculation1=γ2=（n-1）xα=1.03°，γ=2.06°。
4. The confocal imaging detection device with complete aplanatic simultaneous and adjacent surfaces of crystal grains for image splitting by using the glass optical wedge as claimed in claim 3, wherein: the size of the top right-angle transfer prism is 15 × 15mm, the size of the side right-angle transfer prism is 15 × 15mm, and the size of the cubic beam splitter/combiner is 15 × 15 mm; the center of the cubic beam splitting and image combining device, the center of the reflecting surface of the right-angle rotating image prism and the center of the semiconductor crystal grain are connected to form a square symmetrical optical path structure with the side length of D/2+ D =37.5 mm.
5. The confocal imaging detection device with complete aplanatic simultaneous and close to crystal grain surfaces split by using the glass optical wedge as claimed in claim 4, wherein: the two glass wedges produce a two-image separation = γ xL =1.8mm, focal length f =51.5mm, WD =110mm, L =50 mm; the angular displacement error of the double images generated by the angular tolerance (less than or equal to 30 arc seconds) of the cubic beam splitter and the right-angle relay prism is controlled within 2 arc minutes.
6. The confocal imaging detection device with complete aplanatic simultaneous and adjacent surfaces of crystal grains for image splitting by using the glass optical wedge as claimed in claim 1, wherein: the angle error and the assembly error of the cubic beam splitter/combiner or the right-angle relay prism cause the angle deviation of a double-sided imaging space light path, in a meridian plane (a y-z plane, a z axis is along the direction of an optical axis), the error of a compensation meridian plane is corrected by finely adjusting theta 1 and theta 2 by rotating a glass micro-wedge around an x axis, and the deviation of the relative space position or the angular displacement of double-sided imaging is caused by the angle manufacturing error and the assembly error of the cubic beam splitter/combiner or the right-angle relay prism; similarly, the deviation of the relative spatial position or angular displacement of the two-sided image due to the manufacturing and assembly errors of the cube beam combiner or right angle relay prism can also be corrected and compensated by rotating the glass wedge with the thickness t by a slight angle around the y-axis to generate the linear displacement in the sagittal plane (x-z plane).
7. The confocal imaging detection device with complete aplanatic simultaneous and adjacent surfaces of crystal grains for image splitting by using the glass optical wedge as claimed in claim 1, wherein: the coaxial external illumination light source is monochromatic light, or a quasi-monochromatic light source or white light with a certain spectral bandwidth.
8. A confocal imaging detection method for simultaneously and completely aplanatically imaging crystal grain adjacent surfaces by using glass optical wedge split images is characterized in that: the confocal imaging detection device comprises a CMOS or CCD camera, a telecentric imaging lens, a cubic beam splitting and image combining device, a semiconductor crystal grain and a transparent glass object stage for bearing the semiconductor crystal grain, wherein the CMOS or CCD camera, the telecentric imaging lens, the cubic beam splitting and image combining device, the semiconductor crystal grain and the transparent glass object stage are sequentially arranged in the light path direction; the side right-angle rotating image prism, the second glass optical wedge and the cubic beam splitting and image combining device are positioned on the optical axis of the telecentric imaging lens, meanwhile, a first right-angle surface of the side right-angle rotating image prism is opposite to a first surface of the cubic beam splitting and image combining device, a second right-angle surface of the side right-angle rotating image prism is opposite to the side surface of the semiconductor crystal grain, and the inclined surface of the side right-angle rotating image prism is obliquely arranged with the optical axis of the telecentric imaging lens; two right-angle surfaces of the skyhook right-angle rotating image prism are respectively opposite to the skyhook of the semiconductor crystal grain and the second surface of the cubic beam splitting and image combining device; the surface of the first glass optical wedge close to the cubic beam splitter and imager and the optical axis of the telecentric imaging lens form a glass optical wedge angle, the surface of the second glass optical wedge close to the cubic beam splitter and imager and the normal direction of the optical axis of the telecentric imaging lens form a glass optical wedge angle, a coaxial external illumination light source is arranged beside a fourth surface opposite to the second surface of the cubic beam splitter and imager, and the top surface and the side surface of the semiconductor crystal grain are subjected to confocal imaging on the sensor surface of the camera by a right-angle image rotating prism, the glass optical wedge and the cubic beam splitter and imager in a complete aplanatism way so as to obtain independent images of the two surfaces of the semiconductor crystal grain on a CMOS or CCD camera; when in use, the utility model is used for cleaning the inner wall of the tank,
double-sided illumination light path:
the coaxial external illumination light source is divided into two illumination light beams when passing through the cubic beam splitter and combiner: a beam of light passes through the skyhook right-angle relay prism and the first glass optical wedge and then illuminates the skyhook of the semiconductor crystal grain to be tested on the glass loading turntable; the other beam of illumination light illuminates the side surface of the semiconductor crystal grain to be tested after passing through the side right-angle relay prism and the second glass optical wedge, and the two beams of illumination light respectively illuminate two adjacent surfaces of the semiconductor crystal grain;
imaging detection light path:
two adjacent surfaces of the illuminated semiconductor crystal grain generate diffused light, and an imaging light beam of the skyhook of the semiconductor crystal grain is incident to a thickness t and a light wedge angle α through a skyhook right-angle relay prism1The imaging light beam emitted from the first glass optical wedge generates an angular displacement gamma towards one side of the optical axis1Then pass throughThe cube beam combiner reflects onto the reference output surface, and the imaging beam from the side of the semiconductor die is incident via a side cube corner prism onto a thick t wedge α2The imaging light beam emitted from the second glass optical wedge generates an angular displacement gamma towards the other side of the optical axis2Then transmitted by the cubic beam splitter and reach the reference output surface, and the angular displacement of the adjacent surface output by the cubic beam splitter and the cubic beam combiner is gamma = gamma1+γ2And images with independent two surfaces are respectively obtained on a CMOS or CCD camera.
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