CN111580625A

CN111580625A - Heat dissipation device of server GPU

Info

Publication number: CN111580625A
Application number: CN202010348104.7A
Authority: CN
Inventors: 黄永
Original assignee: Waixin Technology Shanghai Co ltd
Current assignee: Waixin Technology Shanghai Co ltd
Priority date: 2020-04-28
Filing date: 2020-04-28
Publication date: 2020-08-25
Anticipated expiration: 2040-04-28
Also published as: CN111580625B

Abstract

The invention discloses a heat dissipation device of a server GPU, which comprises a circuit board for mounting the heat dissipation device, wherein a mounting frame is fixed on the outer wall of the top of the circuit board through a bolt, a conical pipe is arranged on the inner wall of the mounting frame, fans are fixed on the inner walls of two sides of the conical pipe through bolts, screw holes are formed in the outer walls of two sides of the mounting frame, fixing bolts are screwed on the inner walls of the two screw holes, heat dissipation holes distributed at equal intervals are formed in the outer wall of the conical pipe, threaded holes are formed in the outer walls of two sides of the conical pipe, the two fixing bolts are screwed on the inner walls of the two threaded holes, and a first heat exchange pipe is fixed on the inner wall. According to the invention, the heat exchange tubes are arranged on the conical tube and the heat conducting block, the micro pump drives the cooling liquid in the two heat exchange tubes to flow, so that the heat on the GPU can be conveniently and quickly led out, the heat is dissipated by the fan, and the heat conducting block is provided with the telescopic rod and the spring which are matched, so that the heat conducting block can be conveniently attached to the GPU.

Description

Heat dissipation device of server GPU

Technical Field

The invention relates to the technical field of GPU (graphics processing unit), in particular to a heat dissipation device of a GPU (graphics processing unit) of a server.

Background

The GPU reduces the dependence of the graphics card on the CPU, and performs part of the original CPU work, and particularly, the core technologies adopted by the GPU in 3D graphics processing include hardware T & L (geometric transformation and illumination processing), cubic environment texture mapping and vertex mixing, texture compression and bump mapping, a dual-texture four-pixel 256-bit rendering engine, and the like, and the hardware T & L technology can be said to be a mark of the GPU.

The GPU can generate a large amount of heat in a work book, the existing heat dissipation devices are used for dissipating heat through matching of a heat sink and a fan, the heat conduction efficiency of the heat sink is relatively low, the heat conduction speed is fixed, and the heat dissipation efficiency of the existing heat dissipation devices is low.

Disclosure of Invention

Based on the technical problems in the background art, the invention provides a heat dissipation device of a server GPU.

The invention provides a heat dissipation device of a server GPU, which comprises a circuit board for mounting the heat dissipation device, wherein a mounting frame is fixed on the outer wall of the top of the circuit board through a bolt, a conical pipe is arranged on the inner wall of the mounting frame, fans are fixed on the inner walls of two sides of the conical pipe through bolts, screw holes are formed in the outer walls of two sides of the mounting frame, fixing bolts are screwed on the inner walls of the two screw holes, heat dissipation holes distributed at equal intervals are formed in the outer wall of the conical pipe, threaded holes are formed in the outer walls of two sides of the conical pipe, the two fixing bolts are screwed on the inner walls of the two threaded holes, a first heat exchange pipe is fixed on the inner wall of the conical pipe through a bolt, telescopic rods are fixed on two sides of the outer wall of the bottom of the conical.

Preferably, the outer walls of the bottoms of the two telescopic rods are fixedly provided with the same heat conducting block through bolts, and the outer wall of the top of the heat conducting block is provided with a mounting groove.

Preferably, the inner wall of mounting groove all is fixed with the second heat exchange tube through the bolt, and the inner wall of mounting groove is fixed with the heat-conducting plate through the bolt.

Preferably, the outer wall of the top of the heat conducting plate is fixed with a temperature sensor through a bolt, and the temperature sensor is connected with a controller through a signal wire.

Preferably, the outer wall of the bottom of the conical pipe is fixedly provided with a micro pump through a bolt, the micro pump is respectively connected to the first heat exchange pipe and the second heat exchange pipe through pipelines, and the first heat exchange pipe is connected to the second heat exchange pipe through a pipeline.

Preferably, the micro pump is connected with a switch through a lead, and the switch is connected with the controller through a lead.

According to the invention, the heat exchange tubes are arranged on the conical tube and the heat conduction block, the micro pump drives the cooling liquid in the two heat exchange tubes to flow, so that heat on the GPU can be conveniently and quickly led out, the heat is dissipated by the fan, the heat conduction block is conveniently attached to the GPU by arranging the telescopic rod and the spring in a matched manner, and the heat conduction block and the GPU are prevented from being influenced in heat dissipation due to gaps.

Drawings

Fig. 1 is a schematic top view of a heat dissipation device of a server GPU according to the present invention;

fig. 2 is a schematic side view of a heat dissipation device of a server GPU according to the present invention;

fig. 3 is a schematic cross-sectional structural view of a conical tube of the heat dissipation device of the server GPU according to the present invention;

fig. 4 is a schematic structural diagram of a heat conduction block of a heat dissipation device of a server GPU according to the present invention.

In the figure: 1 circuit board, 2 mounting brackets, 3 circular cone pipes, 4 fans, 5 fixing bolts, 6 heat dissipation holes, 7 threaded holes, 8 micropumps, 9 telescopic rods, 10 springs, 11 heat conduction blocks, 12 first heat exchange tubes, 13 second heat exchange tubes, 14 heat conduction plates and 15 temperature sensors.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-4, a heat abstractor of server GPU, including circuit board 1 of installation heat abstractor, circuit board 1 top outer wall has mounting bracket 2 through the bolt fastening, and the inner wall of mounting bracket 2 is provided with circular cone pipe 3, the both sides inner wall of circular cone pipe 3 has fan 4 through the bolt fastening, the screw has all been seted up to the both sides outer wall of mounting bracket 2, and the equal spiro union of inner wall of two screws has fixing bolt 5, louvre 6 that the equidistance distributes is all seted up to the outer wall of circular cone pipe 3, threaded hole 7 has all been seted up to the both sides outer wall of circular cone pipe 3, two fixing bolt 5 spiro unions are on the inner wall of two threaded hole 7, the inner wall of circular cone pipe 3 passes through the bolt fastening and has first heat exchange tube 12, the both sides of the outer wall of circular cone pipe 3 bottom all.

According to the invention, the same heat conducting block 11 is fixed on the outer walls of the bottoms of two telescopic rods 9 through bolts, a mounting groove is formed in the outer wall of the top of the heat conducting block 11, second heat exchange tubes 13 are fixed on the inner walls of the mounting groove through bolts, a heat conducting plate 14 is fixed on the inner wall of the mounting groove through bolts, a temperature sensor 15 is fixed on the outer wall of the top of the heat conducting plate 14 through bolts, the temperature sensor 15 is connected with a controller through a signal line, a micropump 8 is fixed on the outer wall of the bottom of a conical tube 3 through bolts, the micropump 8 is respectively connected onto a first heat exchange tube 12 and a second heat exchange tube 13 through pipelines, the first heat exchange tube 12 is connected onto the second heat exchange tube 13 through a pipeline, the micropu.

The working principle is as follows: during the use, with circular cone pipe 3 through fixing bolt 5 fixed on mounting bracket 2, compress tightly spring 10 on the telescopic link 9 during the installation, then at fixing bolt 5, the heat that GPU during operation produced absorbs through second heat exchange tube 13 in the heat conduction piece 11, when temperature sensor 15 detected the high temperature, micropump 8 started the coolant liquid that drives in first heat exchange tube 12 and the second heat exchange tube 13 and circulated, further helped GPU dispels the heat.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. The heat dissipation device of the GPU of the server comprises a circuit board (1) provided with the heat dissipation device, and is characterized in that the outer wall of the top of the circuit board (1) is fixedly connected with a mounting rack (2), the inner wall of the mounting rack (2) is provided with a conical pipe (3), the inner walls of two sides of the conical pipe (3) are fixedly connected with fans (4), the outer walls of two sides of the mounting rack (2) are respectively provided with a screw hole, the inner walls of the two screw holes are respectively screwed with a fixing bolt (5), the outer wall of the conical pipe (3) is respectively provided with heat dissipation holes (6) distributed at equal intervals, the outer walls of two sides of the conical pipe (3) are respectively provided with a threaded hole (7), the two fixing bolts (5) are screwed on the inner walls of the two threaded holes (7), the inner wall of the conical pipe (3) is fixedly connected with a first heat exchange pipe (12, and the outer walls of the two telescopic rods (9) are sleeved with springs (10).

2. The heat dissipation device of the server GPU according to claim 1, wherein the bottom outer walls of the two telescopic rods (9) are fixedly connected with the same heat conduction block (11), and the top outer wall of the heat conduction block (11) is provided with an installation groove.

3. A heat sink for a server GPU according to claim 2, characterized in that the inner walls of the mounting groove are fixedly connected with a second heat exchanging pipe (13), and the inner walls of the mounting groove are fixedly connected with a heat conducting plate (14).

4. The heat dissipation device of the server GPU according to claim 3, wherein a temperature sensor (15) is fixedly connected to the outer wall of the top of the heat conduction plate (14), and the temperature sensor (15) is connected with a controller through a signal line.

5. A heat dissipation device of a server GPU according to claim 4, characterized in that a micropump (8) is fixedly connected to the outer wall of the bottom of the conical tube (3), the micropump (8) is respectively connected to the first heat exchange tube (12) and the second heat exchange tube (13) through a pipeline, and the first heat exchange tube (12) is connected to the second heat exchange tube (13) through a pipeline.

6. The heat dissipation device of a server GPU according to claim 5, characterized in that the micropump (8) is connected with a switch through a wire, and the switch is connected with the controller through a wire.