CN111554595A - Semiconductor chip preparation device - Google Patents
Semiconductor chip preparation device Download PDFInfo
- Publication number
- CN111554595A CN111554595A CN202010391267.3A CN202010391267A CN111554595A CN 111554595 A CN111554595 A CN 111554595A CN 202010391267 A CN202010391267 A CN 202010391267A CN 111554595 A CN111554595 A CN 111554595A
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- Prior art keywords
- gas
- adsorption
- semiconductor chip
- pipe
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010391267.3A CN111554595B (en) | 2020-05-11 | 2020-05-11 | Semiconductor chip preparation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010391267.3A CN111554595B (en) | 2020-05-11 | 2020-05-11 | Semiconductor chip preparation device |
Publications (2)
Publication Number | Publication Date |
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CN111554595A true CN111554595A (en) | 2020-08-18 |
CN111554595B CN111554595B (en) | 2021-03-23 |
Family
ID=72001379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010391267.3A Active CN111554595B (en) | 2020-05-11 | 2020-05-11 | Semiconductor chip preparation device |
Country Status (1)
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CN (1) | CN111554595B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118073264A (en) * | 2024-04-25 | 2024-05-24 | 常州九天未来微电子有限公司 | Semiconductor packaging chip pickup device |
US12007433B2 (en) | 2021-01-26 | 2024-06-11 | Changxin Memory Technologies, Inc. | Mechanical arm and mechanical arm assembly, test system and method, storage medium and electronic device |
Citations (17)
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JPH10139157A (en) * | 1996-11-12 | 1998-05-26 | Canon Sales Co Inc | Substrate carrier device |
JP2001179078A (en) * | 1999-12-24 | 2001-07-03 | Tokyo Electron Ltd | Baffle plate, manufacturing device and method therefor and gas treating device including baffle plate |
US20030055533A1 (en) * | 1998-12-02 | 2003-03-20 | Paul Bacchi | Method of using a specimen sensing end effector to determine angular orientation of a specimen |
US20040000796A1 (en) * | 2002-06-28 | 2004-01-01 | Young-Man Choi | Wafer transfer apparatus and device and method for cleaning robot arm in wafer transfer apparatus |
US20040159333A1 (en) * | 2001-08-30 | 2004-08-19 | Micron Technology, Inc. | Spindle chuck cleaner |
KR20060108086A (en) * | 2005-04-12 | 2006-10-17 | 삼성전자주식회사 | Robot arm of wafer handler |
CN201841546U (en) * | 2010-07-20 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Mechanical arm and protective suite |
CN102086515A (en) * | 2009-12-02 | 2011-06-08 | 东京毅力科创株式会社 | Substrate processing apparatus |
CN203738818U (en) * | 2014-03-20 | 2014-07-30 | 中芯国际集成电路制造(北京)有限公司 | Anti-pollution system used for mechanical arm |
CN104867849A (en) * | 2015-05-28 | 2015-08-26 | 北京七星华创电子股份有限公司 | Wafer back surface pollution prevention device |
US20160053373A1 (en) * | 2014-08-19 | 2016-02-25 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrate |
CN108336002A (en) * | 2018-03-16 | 2018-07-27 | 德淮半导体有限公司 | The method of clearing apparatus and cleaning wafer, mechanical arm |
CN208521911U (en) * | 2018-08-08 | 2019-02-19 | 德淮半导体有限公司 | From cleaning vacuum line system |
CN208848875U (en) * | 2018-11-09 | 2019-05-10 | 德淮半导体有限公司 | Mechanical arm and transmission device |
CN110335838A (en) * | 2019-07-05 | 2019-10-15 | 北京北方华创微电子装备有限公司 | Transmitting device, transmission chamber and the method for preventing manipulator from corroding |
CN209551724U (en) * | 2018-12-29 | 2019-10-29 | 徐州鑫晶半导体科技有限公司 | Mechanical arm and manipulator and polissoir with it |
CN111066122A (en) * | 2017-09-22 | 2020-04-24 | 株式会社国际电气 | Substrate processing apparatus, method for manufacturing semiconductor device, and program |
-
2020
- 2020-05-11 CN CN202010391267.3A patent/CN111554595B/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10139157A (en) * | 1996-11-12 | 1998-05-26 | Canon Sales Co Inc | Substrate carrier device |
US20030055533A1 (en) * | 1998-12-02 | 2003-03-20 | Paul Bacchi | Method of using a specimen sensing end effector to determine angular orientation of a specimen |
JP2001179078A (en) * | 1999-12-24 | 2001-07-03 | Tokyo Electron Ltd | Baffle plate, manufacturing device and method therefor and gas treating device including baffle plate |
US20040159333A1 (en) * | 2001-08-30 | 2004-08-19 | Micron Technology, Inc. | Spindle chuck cleaner |
US20040000796A1 (en) * | 2002-06-28 | 2004-01-01 | Young-Man Choi | Wafer transfer apparatus and device and method for cleaning robot arm in wafer transfer apparatus |
KR20060108086A (en) * | 2005-04-12 | 2006-10-17 | 삼성전자주식회사 | Robot arm of wafer handler |
CN102086515A (en) * | 2009-12-02 | 2011-06-08 | 东京毅力科创株式会社 | Substrate processing apparatus |
CN201841546U (en) * | 2010-07-20 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Mechanical arm and protective suite |
CN203738818U (en) * | 2014-03-20 | 2014-07-30 | 中芯国际集成电路制造(北京)有限公司 | Anti-pollution system used for mechanical arm |
US20160053373A1 (en) * | 2014-08-19 | 2016-02-25 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrate |
CN104867849A (en) * | 2015-05-28 | 2015-08-26 | 北京七星华创电子股份有限公司 | Wafer back surface pollution prevention device |
CN111066122A (en) * | 2017-09-22 | 2020-04-24 | 株式会社国际电气 | Substrate processing apparatus, method for manufacturing semiconductor device, and program |
CN108336002A (en) * | 2018-03-16 | 2018-07-27 | 德淮半导体有限公司 | The method of clearing apparatus and cleaning wafer, mechanical arm |
CN208521911U (en) * | 2018-08-08 | 2019-02-19 | 德淮半导体有限公司 | From cleaning vacuum line system |
CN208848875U (en) * | 2018-11-09 | 2019-05-10 | 德淮半导体有限公司 | Mechanical arm and transmission device |
CN209551724U (en) * | 2018-12-29 | 2019-10-29 | 徐州鑫晶半导体科技有限公司 | Mechanical arm and manipulator and polissoir with it |
CN110335838A (en) * | 2019-07-05 | 2019-10-15 | 北京北方华创微电子装备有限公司 | Transmitting device, transmission chamber and the method for preventing manipulator from corroding |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12007433B2 (en) | 2021-01-26 | 2024-06-11 | Changxin Memory Technologies, Inc. | Mechanical arm and mechanical arm assembly, test system and method, storage medium and electronic device |
CN118073264A (en) * | 2024-04-25 | 2024-05-24 | 常州九天未来微电子有限公司 | Semiconductor packaging chip pickup device |
Also Published As
Publication number | Publication date |
---|---|
CN111554595B (en) | 2021-03-23 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Device for preparing semiconductor chip Effective date of registration: 20220610 Granted publication date: 20210323 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2022310000053 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230615 Granted publication date: 20210323 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2022310000053 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Preparation device for semiconductor chips Effective date of registration: 20230628 Granted publication date: 20210323 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Shanghai pilot Free Trade Zone Lingang xinpian District sub branch Pledgor: Shanghai guona Semiconductor Technology Co.,Ltd. Registration number: Y2023310000319 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |