CN111540825A - Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof - Google Patents
Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof Download PDFInfo
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- CN111540825A CN111540825A CN202010549521.8A CN202010549521A CN111540825A CN 111540825 A CN111540825 A CN 111540825A CN 202010549521 A CN202010549521 A CN 202010549521A CN 111540825 A CN111540825 A CN 111540825A
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- negative electrode
- positive electrode
- piezoelectric wafer
- positive
- ultrasonic transducer
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920006335 epoxy glue Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000028161 membrane depolarization Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses an ultrasonic transducer and a method for leading out a positive electrode and a negative electrode of the ultrasonic transducer on a single surface, and belongs to the technical field of transducers. The ultrasonic transducer includes a piezoelectric wafer and an FPC film. The piezoelectric wafer comprises a flanging negative electrode coating, an insulating layer and a positive electrode coating; the FPC film comprises a positive electrode wire leading-out side and a negative electrode leading-out side; the positive wire leading-out side comprises a hollow part and an integral part; the whole part is attached to the anode coating; the cathode leading-out side is attached to the flanging cathode coating to form a public cathode. The invention increases the effective area of the ultrasonic emission receiving surface by designing the positive electrode and the negative electrode on the same side; and welding or conductive adhesive technology is not used in the whole manufacturing process, the FPC film and the piezoelectric wafer are pressed by using low-viscosity glue, and the yield and reliability of the transducer are obviously improved because an electrode layer of the piezoelectric wafer is not contacted with a high-temperature welding process. The design can realize the extraction of the positive electrode and the negative electrode on the same side surface of the piezoelectric wafer, and improve the ultrasonic transmitting and receiving performance of the transducer.
Description
Technical Field
The invention relates to the technical field of transducers, in particular to an ultrasonic transducer and a method for leading out a positive electrode single surface and a negative electrode single surface of the ultrasonic transducer.
Background
In the conventional process of manufacturing the transducer, the anode and the common cathode of the transducer are often disposed on two sides of the ceramic plate. This approach reduces the effective area of the ultrasound transmit-receive face, reducing the transmit-receive efficiency and overall acoustic performance of the transducer.
In addition, most ultrasonic transducers are welded on the surface of the piezoelectric wafer during the manufacturing process, and due to the high welding temperature, depolarization is caused, and the yield and reliability of the transducers are lowered.
Disclosure of Invention
The invention aims to provide an ultrasonic transducer and a positive and negative single-side leading-out method thereof, which aim to solve the problems of low transceiving efficiency and overall acoustic performance of the conventional transducer and low yield and reliability of the transducer.
In order to solve the above technical problem, the present invention provides an ultrasonic transducer, including:
the piezoelectric wafer comprises a flanging negative electrode coating, an insulating layer and a positive electrode coating;
an FPC film including a positive electrode line lead-out side and a negative electrode lead-out side; wherein the content of the first and second substances,
the positive electrode wire lead-out side includes:
a hollowed-out part;
the integral part is attached to the positive electrode coating of the piezoelectric wafer;
the negative electrode leading-out side is attached to the flanging negative electrode coating of the piezoelectric wafer.
Optionally, the thickness of the flanging negative electrode coating is consistent with that of the positive electrode coating; the width of the flanging negative electrode coating is consistent with that of the whole part of the FPC film.
Optionally, the negative electrode leading-out side is made of an integral copper sheet material, and the thickness of the negative electrode leading-out side is consistent with that of the integral part of the positive electrode wire leading-out side.
Optionally, the flanging negative electrode coating is a silver coating or a gold coating, and the positive electrode coating is a silver coating or a gold coating.
The invention also provides a positive and negative single-side leading-out method of the ultrasonic transducer, which comprises the following steps:
positioning the piezoelectric wafer and the FPC film;
and (3) pressing the FPC film and the piezoelectric wafer through a flat tool by using low-viscosity epoxy glue or instant adhesive, and realizing electrode conduction after the glue is cured.
The invention provides an ultrasonic transducer and a method for leading out a positive electrode and a negative electrode of the ultrasonic transducer from a single surface. The piezoelectric wafer comprises a flanging negative electrode coating, an insulating layer and a positive electrode coating; the FPC film comprises a positive electrode wire leading-out side and a negative electrode leading-out side; the positive wire leading-out side comprises a hollow part and an integral part; the whole part is attached to the anode coating; the cathode leading-out side is attached to the flanging cathode coating to form a public cathode. The invention increases the effective area of the ultrasonic emission receiving surface by designing the positive electrode and the negative electrode on the same side; and welding or conductive adhesive technology is not used in the whole manufacturing process, the FPC film and the piezoelectric wafer are pressed by using low-viscosity glue, and the yield and reliability of the transducer are obviously improved because an electrode layer of the piezoelectric wafer is not contacted with a high-temperature welding process. The design can realize the extraction of the positive electrode and the negative electrode on the same side surface of the piezoelectric wafer, avoid welding operation and improve the ultrasonic transmitting and receiving performance of the transducer.
Drawings
FIG. 1 is a schematic structural view of a piezoelectric wafer;
fig. 2 is a schematic view of the structure of the FPC film.
In the figure: 1. flanging a negative pole coating; 2. an insulating layer; 3. a positive electrode plating layer; 41. a hollowed-out part; 42. an integral part; 5. a negative electrode lead-out side; 6. a micro-element wire.
Detailed Description
The ultrasonic transducer and the method for leading out the positive and negative single-sided electrodes thereof proposed by the present invention are further described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The present invention provides an ultrasonic transducer including a piezoelectric wafer as shown in fig. 1 and an FPC film as shown in fig. 2.
Referring to fig. 1, the piezoelectric wafer includes a flanged negative electrode plating layer 1, an insulating layer 2, and a positive electrode plating layer 3; referring to fig. 2, the FPC film includes a positive electrode line lead-out side and a negative electrode lead-out side 5; the leading-out side of the positive wire comprises a hollow part 41 and an integral part 42; the integral part 42 is attached to the positive electrode plating layer 3; the negative electrode leading-out side 5 is attached to the flanging negative electrode coating 1 to form a public negative electrode.
The piezoelectric wafer comprises a flanging negative electrode coating 1, so that the opposite metal coating (namely the negative electrode of the capacitor) is connected to a positive electrode coating 3, and the positive electrode and the negative electrode are on the same side; the thickness of the flanging negative electrode coating 1 is consistent with that of the positive electrode coating 3; the width of the flanging negative electrode plating layer 1 is consistent with that of the integral part 42 of the FPC film; the negative electrode leading-out side 5 is made of an integral copper sheet material, and the thickness of the negative electrode leading-out side is consistent with that of the integral part 42 of the positive electrode wire leading-out side; the flanging negative electrode coating 1 is a silver coating or a gold coating, and the positive electrode coating 3 is a silver coating or a gold coating.
Example two
The invention provides a method for leading out a positive electrode and a negative electrode of an ultrasonic transducer from a single surface.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (5)
1. An ultrasonic transducer, comprising:
the piezoelectric wafer comprises a flanging negative electrode coating, an insulating layer and a positive electrode coating;
an FPC film including a positive electrode line lead-out side and a negative electrode lead-out side; wherein the content of the first and second substances,
the positive electrode wire lead-out side includes:
a hollowed-out part;
the integral part is attached to the positive electrode coating of the piezoelectric wafer;
the negative electrode leading-out side is attached to the flanging negative electrode coating of the piezoelectric wafer.
2. The ultrasonic transducer of claim 1, wherein the thickness of the flanged negative plating is consistent with the thickness of the positive plating; the width of the flanging negative electrode coating is consistent with that of the whole part of the FPC film.
3. The ultrasonic transducer according to claim 1, wherein said negative lead-out side is of a unitary copper sheet having a thickness corresponding to a thickness of a unitary portion of said positive lead-out side.
4. The ultrasonic transducer according to claim 1, wherein the flanging negative electrode plating layer is a silver plating layer or a gold plating layer, and the positive electrode plating layer is a silver plating layer or a gold plating layer.
5. A positive and negative single-side leading-out method of an ultrasonic transducer is characterized by comprising the following steps:
positioning the piezoelectric wafer and the FPC film;
and (3) pressing the FPC film and the piezoelectric wafer through a flat tool by using low-viscosity epoxy glue or instant adhesive, and realizing electrode conduction after the glue is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010549521.8A CN111540825A (en) | 2020-06-16 | 2020-06-16 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010549521.8A CN111540825A (en) | 2020-06-16 | 2020-06-16 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111540825A true CN111540825A (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010549521.8A Pending CN111540825A (en) | 2020-06-16 | 2020-06-16 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111540825A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101102853A (en) * | 2005-01-11 | 2008-01-09 | 皇家飞利浦电子股份有限公司 | Redistribution interconnect for microbeamformer(s) and a medical ultrasound system |
| CN110729398A (en) * | 2019-10-14 | 2020-01-24 | 无锡海鹰电子医疗系统有限公司 | Arc array ultrasonic transducer electrode wire leading-out method |
| CN210386465U (en) * | 2019-07-31 | 2020-04-24 | 深圳深超换能器有限公司 | Flexible circuit board and ultrasonic probe |
-
2020
- 2020-06-16 CN CN202010549521.8A patent/CN111540825A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101102853A (en) * | 2005-01-11 | 2008-01-09 | 皇家飞利浦电子股份有限公司 | Redistribution interconnect for microbeamformer(s) and a medical ultrasound system |
| CN210386465U (en) * | 2019-07-31 | 2020-04-24 | 深圳深超换能器有限公司 | Flexible circuit board and ultrasonic probe |
| CN110729398A (en) * | 2019-10-14 | 2020-01-24 | 无锡海鹰电子医疗系统有限公司 | Arc array ultrasonic transducer electrode wire leading-out method |
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Application publication date: 20200814 |
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