CN210386465U - Flexible circuit board and ultrasonic probe - Google Patents
Flexible circuit board and ultrasonic probe Download PDFInfo
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- CN210386465U CN210386465U CN201921248589.1U CN201921248589U CN210386465U CN 210386465 U CN210386465 U CN 210386465U CN 201921248589 U CN201921248589 U CN 201921248589U CN 210386465 U CN210386465 U CN 210386465U
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Abstract
The utility model discloses a flexible circuit board and ultrasonic probe, wherein, the flexible circuit board sets up in ultrasonic probe and is connected with the piezoelectric wafer among the ultrasonic probe, and the piezoelectric wafer includes a plurality of piezoelectric array elements, the flexible circuit board includes negative pole adhesion zone, isolation region, anodal adhesion zone and signal line region; the isolation region is located between the negative electrode bonding region and the positive electrode bonding region and used for separating the positive electrode bonding region from the negative electrode bonding region, and the signal line region is located on one side of the positive electrode bonding region and is respectively and electrically connected with the negative electrode bonding region and the positive electrode bonding region. Adopt the utility model discloses can avoid carrying out location and welded problem alone with every piezoelectric array element, make the wiring technology more simple high-efficient.
Description
Technical Field
The utility model relates to an ultrasonic testing field, concretely relates to flexible circuit board and ultrasonic probe.
Background
An ultrasonic probe is an energy conversion device that converts alternating electrical signals into signals in the ultrasonic frequency range or converts acoustic signals in an external sound field into electrical signals.
The ultrasonic probe is generally composed of a matching layer, a piezoelectric wafer, a backing layer and a flexible circuit board, wherein the piezoelectric wafer is cut into a plurality of independent piezoelectric array elements, array element electrodes (positive and negative electrodes) are respectively arranged on two opposite sides of each piezoelectric array element, and the flexible circuit board needs to lead the array element electrodes on two sides of each piezoelectric array element respectively.
Due to the fact that the number of the piezoelectric array elements is large, the method involves too many positioning and welding operations, wiring of the piezoelectric array elements is difficult, and meanwhile, the wiring process is complicated, and production cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a flexible circuit board aims at solving the complicated problem of wiring technology between piezoelectric array element and the flexible circuit board among the prior art.
In order to achieve the above object, the present invention provides a flexible circuit board for being disposed in an ultrasonic probe and connected to a piezoelectric wafer in the ultrasonic probe, wherein the piezoelectric wafer includes a plurality of piezoelectric array elements, and the flexible circuit board includes a negative electrode bonding region, an isolation region, a positive electrode bonding region, and a signal line region;
the isolation region is positioned between the negative electrode bonding region and the positive electrode bonding region and used for separating the positive electrode bonding region from the negative electrode bonding region, and the signal line region is positioned on one side of the positive electrode bonding region and is respectively and electrically connected with the negative electrode bonding region and the positive electrode bonding region;
the positive bonding area comprises a plurality of positive bonding units arranged at intervals, the negative bonding area comprises a plurality of negative bonding units arranged at intervals, the positive bonding units are in one-to-one correspondence with the negative bonding units, and each group of corresponding positive bonding units and negative bonding units are respectively bonded with the positive electrode and the negative electrode arranged on the bottom surface of the piezoelectric array element.
Preferably, the negative electrode bonding area further comprises a negative electrode conductive area connected to each negative electrode bonding unit, and the negative electrode conductive area is located on one side of the negative electrode bonding unit away from the positive electrode bonding area.
Preferably, the signal line region includes a plurality of signal line pads, and first signal lines connecting each of the positive electrode bonding units to the corresponding signal line pad in a one-to-one correspondence, and second signal lines connecting the negative electrode conductive region to the corresponding signal line pad.
Preferably, epoxy resin is filled between two adjacent positive electrode bonding units and between two adjacent negative electrode bonding units.
The utility model also provides an ultrasonic probe, this ultrasonic probe include as above arbitrary flexible circuit board and piezoelectric wafer, piezoelectric wafer includes the piezoelectric array element that a plurality of intervals set up, piezoelectric array element with the one side that flexible circuit board connects is equipped with positive pole and negative pole, every the positive pole and the negative pole of piezoelectric array element respectively with a set of anodal bonding unit on the flexible circuit board and negative pole bonding unit position correspond and bond each other.
Preferably, epoxy resin is filled between two adjacent piezoelectric array elements.
Preferably, the piezoelectric chip further comprises a matching layer and a backing layer respectively positioned at two opposite sides of the piezoelectric chip, and the flexible circuit board is positioned between the piezoelectric chip and the backing layer.
Preferably, the positive electrode and the negative electrode of the piezoelectric array element adopt chromium, copper or chromium-copper alloy.
The utility model discloses divide flexible circuit board according to anodal bonding region and negative pole bonding region to keep apart with the isolation region, make the piezoelectric wafer can directly bond on flexible circuit board cutting again and can accomplish on the flexible circuit board anodal bonding unit and negative pole bonding unit and the piezoelectric array element anodal with the burden between match and the electricity be connected. The flexible circuit board can avoid the problem of respectively positioning and welding with each piezoelectric array element, so that the wiring process is simpler and more efficient.
Drawings
Fig. 1 is a schematic structural diagram of the flexible circuit board of the present invention;
fig. 2 is a schematic structural diagram of a piezoelectric wafer according to the present invention;
fig. 3 is a schematic structural diagram of the ultrasonic probe of the present invention.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same elements or elements having the same function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
The utility model provides a flexible circuit board 100, which is used for being arranged in an ultrasonic probe and connected with a piezoelectric wafer 200 in the ultrasonic probe, as shown in figure 1, the flexible circuit board 100 comprises a negative electrode bonding area 110, an isolation area 120, a positive electrode bonding area 130 and a signal line area 140;
the isolation region 120 is located between the negative electrode bonding region 110 and the positive electrode bonding region 130, and is used for isolating the positive electrode bonding region 130 from the negative electrode bonding region 110, and the signal line region 140 is located at one side of the positive electrode bonding region 130, and is electrically connected to the negative electrode bonding region 110 and the positive electrode bonding region 130 respectively;
the positive electrode bonding area 130 includes a plurality of positive electrode bonding units 131 arranged at intervals, the negative electrode bonding area 110 includes a plurality of negative electrode bonding units 111 arranged at intervals, the plurality of positive electrode bonding units 131 are in one-to-one correspondence with the plurality of negative electrode bonding units 111, and each group of corresponding positive electrode bonding units 131 and negative electrode bonding units 111 are respectively bonded with a positive electrode 211 and a negative electrode 212 (shown in fig. 2) arranged on the bottom surface of a piezoelectric array element 210.
In this embodiment, the flexible circuit board 100 is composed of an insulating substrate and a copper-clad layer, wherein the negative electrode bonding region 110, the positive electrode bonding region 130 and the signal line region 140 are all formed by cutting on the copper-clad layer, and the isolation region 120 is a hollowed region of the copper-clad layer and is used for isolating and insulating the negative electrode bonding region 110 and the positive electrode bonding region 130. The negative electrode bonding region 110, the isolation region 120, the positive electrode bonding region 130, and the signal line region 140 may be sequentially disposed along a length direction of the flexible circuit board 100.
The bonding process of the flexible circuit board 100 and the piezoelectric wafer 200 is as follows: firstly, sputtering two isolated electrodes (a positive electrode 211 and a negative electrode 212) on the bottom surface of the monolithic piezoelectric wafer 200, wherein the positive electrode 211 and the negative electrode 212 are not cut off as a whole, correspondingly adhering the bottom surface of the piezoelectric wafer 200 to the flexible circuit board 100, so that the positive electrode 211 on the piezoelectric wafer 200 corresponds to the positive electrode adhesion area 130 on the flexible circuit board 100, and the negative electrode 212 on the piezoelectric wafer 200 corresponds to the negative electrode adhesion area 110 on the flexible circuit board 100, and at this time, the positive electrode adhesion area 130 and the negative electrode adhesion area 110 on the flexible circuit board 100 are not separated as a whole respectively (i.e. the positive electrode adhesion area 130 is an uncut copper-clad layer, and the negative electrode adhesion area 110 is an uncut copper-clad layer). Each piezoelectric wafer 200 is cut along a designated position, the cutting direction is perpendicular to the flexible circuit board 100, the cutting depth is from the top surface of the piezoelectric wafer 200 to the insulating substrate of the flexible circuit board 100, that is, the piezoelectric wafer 200 is cut into a plurality of piezoelectric array elements 210, the positive bonding area 130 is cut into a plurality of positive bonding units 131, the negative bonding area 110 is cut into a plurality of negative bonding units 111, the bottom surface of each piezoelectric array element 210 is provided with a positive electrode 211 bonded with the positive bonding unit 131 and a negative electrode 212 bonded with the negative bonding unit 111, and after the cutting is completed, insulating glue is injected into the gaps between the piezoelectric array elements 210 (between the negative bonding units 111 and between the positive bonding units 131) to isolate and fix the relative positions. Each positive electrode bonding unit 131 is independently electrically connected to the signal line region 140, and the negative electrode bonding units 111 may be independently electrically connected to the signal line region 140, or may be collectively connected to the signal line region 140 by the same lead.
In this embodiment, the flexible circuit board 100 is divided into the positive electrode bonding region 130 and the negative electrode bonding region 110, and is isolated by the isolation region 120, so that the piezoelectric wafer 200 can be directly bonded to the flexible circuit board 100 and then cut, thereby completing the electrical connection between the positive electrode bonding unit 131 and the negative electrode bonding unit 111 of the flexible circuit board 100 and the positive electrode 211 and the negative electrode 212 of the piezoelectric array element 210. The flexible circuit board 100 of the embodiment can avoid the problems of welding and multiple positioning, so that the wiring process is simpler and more efficient.
In a preferred embodiment, as shown in fig. 1, the negative bonding area 110 further includes a negative conductive area 112 connected to each negative bonding unit 111, and the negative conductive area 112 is located on a side of the negative bonding unit 111 away from the positive bonding area 130.
The negative conductive area 112 is a copper-clad layer, and is located on the side of the negative bonding unit 111 away from the positive bonding unit 131, when cutting, part of the negative bonding area 110 is cut to form a plurality of negative bonding units 111, and the other part of the negative bonding area 110 is not cut to form the negative conductive area 112 integrally connected with each negative bonding unit 111, and the negative conductive area 112 connects each negative bonding unit 111 together and is connected to the signal line area 140 by a lead, so that independent leads for each negative bonding unit 111 can be avoided.
Preferably, the width of the negative electrode bonding region 110 is much smaller than that of the positive electrode bonding region 130, for example, the width of the piezoelectric wafer 200 is 14.5mm, the width of the positive electrode bonding region 130 is preferably 13mm, the isolation region 120 is a slit, and the total width of the isolation region 120 and the negative electrode bonding region 110 is 1.5 mm.
In a preferred embodiment, as shown in fig. 1, the signal line region 140 includes a plurality of signal line pads 141, and first signal lines 142 for connecting each of the positive bonding units 131 to the corresponding signal line pad 141 in a one-to-one correspondence, and second signal lines 143 for connecting the negative conductive regions 112 to the corresponding signal line pad 141 in a one-to-one correspondence.
In this embodiment, the second signal line 143 may be routed from the edge of the positive electrode bonding region 130 and the signal line region 140, or from the back side of the flexible circuit board 100, one end of the second signal line 143 is connected to the negative electrode conductive region 112, and the other end is connected to the corresponding signal line pad 141, and one or more signal line pads 141 corresponding to the second signal line 143 may be provided. The two ends of the pad 141 of the first signal line 142 are respectively connected to a positive bonding unit 131 and a signal line pad 141, each positive bonding unit 131 is connected to a corresponding signal line pad 141 through a signal line, and the signal line pad 141 is used for being connected to an external cable or a wiring board to receive corresponding alternating current, control the vibration frequency of each piezoelectric array element 210 connected to the positive bonding unit 131 and the negative bonding unit 111, and receive an electrical signal fed back by each piezoelectric array element 210.
In a preferred embodiment, epoxy resin is filled between two adjacent positive bonding units 131 and between two adjacent negative bonding units 111.
The epoxy resin is an insulating material, and is filled in the gaps of the piezoelectric wafer 200, namely between two adjacent piezoelectric array elements 210, and between two adjacent positive electrode bonding units 131 and two adjacent negative electrode bonding units 111, so that two adjacent objects can be isolated and insulated, and the positions of the two adjacent objects are connected and fixed, thereby preventing loosening.
As shown in fig. 2, the present invention further provides an ultrasonic probe, which includes the flexible circuit board 100 and the piezoelectric wafer 200 in any of the above embodiments, the piezoelectric wafer 200 includes a plurality of piezoelectric array elements 210 arranged at intervals, the surface of the piezoelectric array element 210 connected to the flexible circuit board 100 is provided with a positive electrode 211 and a negative electrode 212, and the positive electrode 211 and the negative electrode 212 of each piezoelectric array element 210 correspond to and are bonded to a set of positive bonding unit 131 and a set of negative bonding unit 111 on the flexible circuit board.
As in the first embodiment, the piezoelectric array element 210 is cut from a piezoelectric wafer 200, and the piezoelectric wafer 200 may be any one of piezoelectric ceramics, piezoelectric single crystals, piezoelectric polymers, or piezoelectric composites, wherein the piezoelectric composites may be type 1-3 piezoelectric composites or type 2-2 piezoelectric composites, such as PZT piezoelectric ceramics. The bottom surface (i.e. the surface connected with the flexible circuit board 100) is provided with a positive electrode 211 and a negative electrode 212 which are spaced apart from each other, the positive electrode 211 and the negative electrode 212 are respectively and correspondingly adhered to a group of positive bonding units 131 and negative bonding units 111 on the flexible circuit board 100 to form electrical connection, and the positive electrode 211 and the negative electrode 212 on the piezoelectric array element 210 are spaced apart from each other and the spaced area corresponds to the isolation area 120 on the flexible circuit board 100.
In this embodiment, the positive electrode 211 and the negative electrode 212 of the piezoelectric array element 210 are disposed on the same side (bottom surface), and in the process of forming electrical connection with the flexible circuit board 100, the whole piezoelectric wafer 200 and the flexible circuit board 100 are bonded at the same position and then cut. Compared with the method that the electrodes are respectively arranged on two different sides of the piezoelectric array element 210 and the electrodes on at least one side are led to the flexible circuit board 100, the method has the advantages of simpler processing and higher efficiency.
In a preferred embodiment, as shown in fig. 2, an epoxy resin 220 is filled between two adjacent piezoelectric array elements 210. The epoxy 220 is disposed between the piezoelectric array elements 210 to isolate and fix the adjacent two piezoelectric array elements 210.
In a preferred embodiment, the piezoelectric array element 210 and the flexible circuit board 100 are also bonded by epoxy resin material, which is an insulating material but can be made conductive when pressed to a certain thickness. A layer of epoxy resin is firstly coated between the piezoelectric array elements 210 and the flexible circuit board 100, then about 6kg of pressure is applied to the piezoelectric array elements 210, most of the epoxy resin between the piezoelectric array elements 210 and the flexible circuit board 100 is extruded out to gaps between the piezoelectric array elements 210 and between bonding units, the remaining small portion between the piezoelectric array element 210 and the flexible circuit board 100 is compressed to a thickness sufficient for electrical conduction, and the piezoelectric array element 210 and the flexible circuit board 100 are bonded together, because the glue squeezed out from the piezoelectric array element 210 and the flexible circuit board 100 can serve as an isolation insulation, compared with bonding the piezoelectric array element 210 and the flexible circuit board 100 by using a conductive material, it is difficult to control the amount of conductive material to be only between the piezoelectric array elements 210 and the flexible circuit board 100 without overflowing, which affects the isolation between the piezoelectric array elements 210 and the bonded units.
In a preferred embodiment, as shown in FIG. 3, the ultrasound probe further comprises a matching layer 300 and a backing layer 400 respectively located on two opposite sides of the piezoelectric wafer 200, and the flexible circuit board 100 is located between the piezoelectric wafer 200 and the backing layer 400.
The ultrasonic probe comprises a matching layer 300, a piezoelectric wafer 200, a flexible circuit board 100 and a backing layer 400 from the probe head to the inside in sequence, wherein the matching layer 300 is adhered to the piezoelectric wafer 200 for matching acoustic impedance between the piezoelectric wafer 200 and an external object, and the matching layer 300 can be of a single-layer structure or a multi-layer structure. The backing layer 400 is used to absorb sound energy from the back surface of the piezoelectric wafer 200, and is made of an insulating material such as epoxy resin, alumina, or aluminum nitride, or a mixture of a plurality of insulating materials. An acoustic lens 500 for focusing may be further bonded to the outside of the matching layer 300.
In a preferred embodiment, the positive electrode 211 and the negative electrode 212 of the piezoelectric array element 210 are made of chrome, copper or chrome-copper alloy, and can be formed on the bottom surface of the piezoelectric array element 210 by sputtering.
The above is only the part or the preferred embodiment of the present invention, no matter the characters or the drawings can not limit the protection scope of the present invention, all under the whole concept of the present invention, the equivalent structure transformation performed by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the protection scope of the present invention.
Claims (8)
1. A flexible circuit board, which is used for being arranged in an ultrasonic probe and connected with a piezoelectric wafer in the ultrasonic probe, wherein the piezoelectric wafer comprises a plurality of piezoelectric array elements, and is characterized in that the flexible circuit board comprises a negative pole bonding area, an isolation area, a positive pole bonding area and a signal line area;
the isolation region is positioned between the negative electrode bonding region and the positive electrode bonding region and used for separating the positive electrode bonding region from the negative electrode bonding region, and the signal line region is positioned on one side of the positive electrode bonding region and is respectively and electrically connected with the negative electrode bonding region and the positive electrode bonding region;
the positive bonding area comprises a plurality of positive bonding units arranged at intervals, the negative bonding area comprises a plurality of negative bonding units arranged at intervals, the positive bonding units are in one-to-one correspondence with the negative bonding units, and each group of corresponding positive bonding units and negative bonding units are respectively bonded with the positive electrode and the negative electrode arranged on the bottom surface of the piezoelectric array element.
2. The flexible circuit board of claim 1, wherein the negative bonding area further comprises a negative conductive area connected to each of the negative bonding units, the negative conductive area being located on a side of the negative bonding unit away from the positive bonding area.
3. The flexible circuit board of claim 2, wherein the signal line region includes a plurality of signal line pads, and a first signal line connecting each of the positive bonding units with the corresponding signal line pad in a one-to-one correspondence and a second signal line connecting the negative conductive region with the corresponding signal line pad.
4. The flexible circuit board according to claim 1, wherein epoxy resin is filled between two adjacent positive bonding units and between two adjacent negative bonding units.
5. An ultrasonic probe, characterized in that, includes the flexible circuit board and the piezoelectric wafer of any one of claims 1-4, the piezoelectric wafer includes a plurality of piezoelectric array elements that set up at intervals, the one side that the piezoelectric array element is connected with the flexible circuit board is equipped with positive pole and negative pole, positive pole and negative pole of every piezoelectric array element respectively with a set of anodal bonding unit and negative pole bonding unit position on the flexible circuit board correspond and mutual bonding.
6. The ultrasonic probe of claim 5, wherein epoxy resin is filled between two adjacent piezoelectric array elements.
7. The ultrasound probe of claim 6, further comprising a matching layer and a backing layer on opposite sides of the piezoelectric wafer, respectively, the flexible circuit board being positioned between the piezoelectric wafer and the backing layer.
8. The ultrasonic probe of claim 5, wherein the positive and negative electrodes of the piezoelectric array element are made of chromium, copper or chromium-copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921248589.1U CN210386465U (en) | 2019-07-31 | 2019-07-31 | Flexible circuit board and ultrasonic probe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921248589.1U CN210386465U (en) | 2019-07-31 | 2019-07-31 | Flexible circuit board and ultrasonic probe |
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| CN210386465U true CN210386465U (en) | 2020-04-24 |
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| CN201921248589.1U Active CN210386465U (en) | 2019-07-31 | 2019-07-31 | Flexible circuit board and ultrasonic probe |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540825A (en) * | 2020-06-16 | 2020-08-14 | 无锡海鹰电子医疗系统有限公司 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
| CN112885954A (en) * | 2021-01-11 | 2021-06-01 | 中国科学院声学研究所 | Piezoelectric interlayer |
-
2019
- 2019-07-31 CN CN201921248589.1U patent/CN210386465U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540825A (en) * | 2020-06-16 | 2020-08-14 | 无锡海鹰电子医疗系统有限公司 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
| CN112885954A (en) * | 2021-01-11 | 2021-06-01 | 中国科学院声学研究所 | Piezoelectric interlayer |
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