CN110729398A - Arc array ultrasonic transducer electrode wire leading-out method - Google Patents
Arc array ultrasonic transducer electrode wire leading-out method Download PDFInfo
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- CN110729398A CN110729398A CN201910973455.4A CN201910973455A CN110729398A CN 110729398 A CN110729398 A CN 110729398A CN 201910973455 A CN201910973455 A CN 201910973455A CN 110729398 A CN110729398 A CN 110729398A
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- fpc
- piezoelectric ceramic
- ceramic wafer
- fpc film
- ultrasonic transducer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
Abstract
The invention discloses an arc array ultrasonic transducer electrode wire leading-out method, and belongs to the technical field of transducers. Gluing the FPC film with the surface of the piezoelectric ceramic wafer; gluing a backing sheet to the piezoelectric ceramic wafer and the FPC film; cutting the piezoelectric ceramic wafer, and bending and gluing the backing sheet to a backing main body; and welding the FPC film and the FPC board lead. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and the welding spot is directly welded with the printed board with the socket after being moved out of the wafer, so that the insertion mode of the transducer is realized; meanwhile, the FPC film is flexibly designed to have an angle bending towards two sides, so that after the transducer is formed, the electrode leads can be arranged at equal intervals, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the FPC board lead which is equidistant and also in regular arc shape, thereby improving the welding efficiency.
Description
Technical Field
The invention relates to the technical field of transducers, in particular to a method for leading out an electrode wire of an arc array ultrasonic transducer.
Background
The conventional method for manufacturing the leading-out arc array ultrasonic transducer electrode wire is to directly weld the electrode wire on the surface of a piezoelectric wafer, and due to high welding temperature, depolarization can be caused, and the yield of the transducer is lowered.
Disclosure of Invention
The invention aims to provide an arc array ultrasonic transducer electrode wire leading-out method, which aims to solve the problem that the existing transducer electrode wire leading-out method is low in transducer yield due to depolarization caused by high welding temperature.
In order to solve the technical problem, the invention provides an electrode wire leading-out method for an arc array ultrasonic transducer, which comprises the following steps:
gluing the FPC film with the surface of the piezoelectric ceramic wafer;
gluing a backing sheet to the piezoelectric ceramic wafer and the FPC film;
cutting the piezoelectric ceramic wafer, and bending and gluing the backing sheet to a backing main body;
and welding the FPC film and the FPC board lead.
Optionally, the FPC film includes an integral portion and a hollow portion, the integral portion of the FPC film is glued to the surface of the piezoelectric ceramic wafer, and the backing sheet is glued to the integral portion of the piezoelectric ceramic wafer and the FPC film.
Optionally, the integral part of the FPC film is glued to the surface of the piezoelectric ceramic wafer by conductive epoxy glue.
Optionally, the leads of the hollowed-out part of the FPC film are equidistant and bent to two sides.
Optionally, before the FPC film is soldered to the FPC board lead, the method for leading out the electrode wire of the arc array ultrasonic transducer further includes:
and the lead wires of the hollow parts are combed to be in a vertical state, so that the distance and the radian of the lead wires are consistent with those of the FPC board with the socket, and the lead wires and the FPC board can be conveniently butt-welded.
The invention provides an arc array ultrasonic transducer electrode wire leading-out method, which comprises the steps of gluing an FPC film with the surface of a piezoelectric ceramic wafer; gluing a backing sheet to the piezoelectric ceramic wafer and the FPC film; cutting the piezoelectric ceramic wafer, and bending and gluing the backing sheet to a backing main body; and welding the FPC film and the FPC board lead. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and the welding spot is directly welded with the printed board with the socket after being moved out of the wafer, so that the insertion mode of the transducer is realized; meanwhile, the FPC film is flexibly designed to have an angle bending towards two sides, so that after the transducer is formed, the electrode leads can be arranged at equal intervals, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the FPC board lead which is equidistant and also in regular arc shape, thereby improving the welding efficiency.
Drawings
FIG. 1 is a schematic flow chart of an electrode wire leading-out method of an arc array ultrasonic transducer provided by the invention;
fig. 2 is a schematic view of the structure of a flexible FPC film;
FIG. 3 is a schematic view of the FPC film glued to the surface of a piezoceramic wafer;
FIG. 4 is a schematic view of a backing sheet glued to an FPC film;
FIG. 5 is a schematic view of a piezoelectric ceramic wafer being cut and a backing sheet being bent and glued to a backing body;
fig. 6 is a schematic view of the structure of the FPC board.
Detailed Description
The method for leading out the electrode wire of the arc array ultrasonic transducer provided by the invention is further described in detail by combining the figures and the specific embodiment. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides an electrode wire leading-out method of an arc array ultrasonic transducer, the flow of which is shown in figure 1, and the method comprises the following steps:
step S11, gluing the FPC film with the surface of the piezoelectric ceramic wafer;
step S12 of gluing a backing sheet to the piezoelectric ceramic wafer and the FPC film;
step S13, cutting the piezoelectric ceramic wafer, and bending and gluing the backing sheet to a backing main body;
and step S14, welding the FPC film and the FPC board lead.
Specifically, as shown in fig. 2, the FPC film 1 includes an integral part 11 and a hollow part 12, the integral part 11 of the FPC film is glued to the surface of the piezoelectric ceramic wafer 2 by conductive epoxy glue, and the leads of the hollow part 12 of the FPC film are at equal intervals and are bent to both sides, as shown in fig. 3;
gluing a backing sheet 3 to a piezoelectric ceramic wafer 2 and an integral part 11 of the FPC film, as shown in fig. 4;
cutting the piezoelectric ceramic wafer 2, cutting slots 21 as shown in fig. 5, cutting through the piezoelectric ceramic wafer 2 without cutting the backing sheet 3, forming a plurality of vibration elements 22 by cutting, and bending and gluing the backing sheet 3 to the backing main body 4;
and (3) combing the leads of the hollow parts 12 to be in a vertical state, enabling the space and radian of the leads to be consistent with those of the FPC board 5 with a socket, and welding the FPC film 1 with the leads of the FPC board 5. As shown in fig. 6, the FPC board 5 includes bonding wires 51, a socket lead 52, and a socket 53.
The electrode layer of the piezoelectric ceramic wafer is not contacted with the high-temperature welding process, so that the yield of the transducer can be obviously improved. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and the welding spot is directly welded with the printed board with the socket after being moved out of the wafer, so that the insertion mode of the transducer is realized; meanwhile, the FPC film is flexibly designed to have an angle bending towards two sides, so that after the transducer is formed, the electrode leads can be arranged at equal intervals, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the FPC board lead which is equidistant and also in regular arc shape, thereby improving the welding efficiency.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (5)
1. An arc array ultrasonic transducer electrode wire leading-out method is characterized by comprising the following steps:
gluing the FPC film with the surface of the piezoelectric ceramic wafer;
gluing a backing sheet to the piezoelectric ceramic wafer and the FPC film;
cutting the piezoelectric ceramic wafer, and bending and gluing the backing sheet to a backing main body;
and welding the FPC film and the FPC board lead.
2. The method for extracting electrode lines from an arc array ultrasonic transducer according to claim 1, wherein the FPC film comprises an integral part and a hollow part, the integral part of the FPC film is glued to the surface of the piezoelectric ceramic wafer, and the backing sheet is glued to the integral part of the piezoelectric ceramic wafer and the FPC film.
3. The method for extracting electrode wires from an arc array ultrasonic transducer according to claim 2, wherein the integral part of the FPC film is glued to the surface of the piezoelectric ceramic wafer by means of a conductive epoxy glue.
4. The method for leading out electrode wires of an arc array ultrasonic transducer according to claim 2, wherein the leads of the hollowed-out parts of the FPC film are equally spaced and bent to two sides.
5. The method for extracting electrode wires from an arc array ultrasonic transducer according to claim 4, wherein before the FPC film is soldered to the FPC board leads, the method for extracting electrode wires from an arc array ultrasonic transducer further comprises:
and the lead wires of the hollow parts are combed to be in a vertical state, so that the distance and the radian of the lead wires are consistent with those of the FPC board with the socket, and the lead wires and the FPC board can be conveniently butt-welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910973455.4A CN110729398B (en) | 2019-10-14 | 2019-10-14 | Electrode wire leading-out method of arc array ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910973455.4A CN110729398B (en) | 2019-10-14 | 2019-10-14 | Electrode wire leading-out method of arc array ultrasonic transducer |
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| Publication Number | Publication Date |
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| CN110729398A true CN110729398A (en) | 2020-01-24 |
| CN110729398B CN110729398B (en) | 2023-04-25 |
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| CN201910973455.4A Active CN110729398B (en) | 2019-10-14 | 2019-10-14 | Electrode wire leading-out method of arc array ultrasonic transducer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540825A (en) * | 2020-06-16 | 2020-08-14 | 无锡海鹰电子医疗系统有限公司 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
| CN112162168A (en) * | 2020-09-29 | 2021-01-01 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Signal extraction method and system of multi-channel high-frequency receiving transducer array |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07236638A (en) * | 1994-02-28 | 1995-09-12 | Toshiba Corp | Ultrasonic probe |
| JPH1071145A (en) * | 1996-08-29 | 1998-03-17 | Toshiba Corp | Ultrasonic transducer and production thereof |
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN106098928A (en) * | 2016-07-25 | 2016-11-09 | 北京信息科技大学 | A kind of preparation method of Two-dimensional Surfaces piezo-electricity composite material element |
-
2019
- 2019-10-14 CN CN201910973455.4A patent/CN110729398B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07236638A (en) * | 1994-02-28 | 1995-09-12 | Toshiba Corp | Ultrasonic probe |
| JPH1071145A (en) * | 1996-08-29 | 1998-03-17 | Toshiba Corp | Ultrasonic transducer and production thereof |
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN106098928A (en) * | 2016-07-25 | 2016-11-09 | 北京信息科技大学 | A kind of preparation method of Two-dimensional Surfaces piezo-electricity composite material element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540825A (en) * | 2020-06-16 | 2020-08-14 | 无锡海鹰电子医疗系统有限公司 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
| CN112162168A (en) * | 2020-09-29 | 2021-01-01 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Signal extraction method and system of multi-channel high-frequency receiving transducer array |
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| CN110729398B (en) | 2023-04-25 |
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