CN110729398B - Electrode wire leading-out method of arc array ultrasonic transducer - Google Patents
Electrode wire leading-out method of arc array ultrasonic transducer Download PDFInfo
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- CN110729398B CN110729398B CN201910973455.4A CN201910973455A CN110729398B CN 110729398 B CN110729398 B CN 110729398B CN 201910973455 A CN201910973455 A CN 201910973455A CN 110729398 B CN110729398 B CN 110729398B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
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Abstract
The invention discloses an electrode wire leading-out method of an arc array ultrasonic transducer, and belongs to the technical field of transducers. Bonding the FPC film and the surface of the piezoelectric ceramic wafer; bonding a backing sheet to the piezoelectric ceramic wafer and the FPC film; cutting the piezoelectric ceramic wafer and bending and gluing the back lining sheet to the back lining main body; and welding the FPC film and the FPC board lead. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and directly welding the welding spots with the printed board with the socket after the welding spots are moved out of the wafer, thereby realizing the connection and insertion mode of the transducer; meanwhile, the flexible design of the FPC film has an angle bent towards two sides, so that electrode leads can be arranged at equal intervals after the transducer is molded, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the lead wires of the FPC board which are equally spaced and are in regular arc shapes, and the welding efficiency is improved.
Description
Technical Field
The invention relates to the technical field of transducers, in particular to an electrode wire leading-out method of an arc array ultrasonic transducer.
Background
The current common manufacturing method for leading out the electrode wire of the arc array ultrasonic transducer is to directly weld the electrode wire on the surface of the piezoelectric wafer, and the depolarization can be caused due to high welding temperature, so that the rate of finished products of the transducer is low.
Disclosure of Invention
The invention aims to provide an arc array ultrasonic transducer electrode wire leading-out method, which aims to solve the problem that the existing transducer electrode wire leading-out method can cause depolarization due to high welding temperature, so that the transducer yield is low.
In order to solve the technical problems, the invention provides an electrode wire leading-out method of an arc array ultrasonic transducer, which comprises the following steps:
bonding the FPC film and the surface of the piezoelectric ceramic wafer;
bonding a backing sheet to the piezoelectric ceramic wafer and the FPC film;
cutting the piezoelectric ceramic wafer and bending and gluing the back lining sheet to the back lining main body;
and welding the FPC film and the FPC board lead.
Optionally, the FPC film includes an integral portion and a hollowed-out portion, the integral portion of the FPC film is glued with the surface of the piezoelectric ceramic wafer, and the backing sheet is glued with the piezoelectric ceramic wafer and the integral portion of the FPC film.
Optionally, an integral part of the FPC film is glued to the piezoelectric ceramic wafer surface by conductive epoxy.
Optionally, the leads of the hollowed-out part of the FPC film are equidistant and bent towards two sides.
Optionally, before the FPC film is welded with the FPC board lead, the method for leading out the electrode wire of the arc array ultrasonic transducer further comprises the following steps:
and carding the lead wires of the hollowed-out parts to be in a vertical state, so that the distance and radian of the lead wires are consistent with those of the FPC board with the socket, and the lead wires and the FPC board are welded conveniently.
The invention provides an arc array ultrasonic transducer electrode wire leading-out method, which comprises the steps of gluing an FPC film with the surface of a piezoelectric ceramic wafer; bonding a backing sheet to the piezoelectric ceramic wafer and the FPC film; cutting the piezoelectric ceramic wafer and bending and gluing the back lining sheet to the back lining main body; and welding the FPC film and the FPC board lead. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and directly welding the welding spots with the printed board with the socket after the welding spots are moved out of the wafer, thereby realizing the connection and insertion mode of the transducer; meanwhile, the flexible design of the FPC film has an angle bent towards two sides, so that electrode leads can be arranged at equal intervals after the transducer is molded, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the lead wires of the FPC board which are equally spaced and are in regular arc shapes, and the welding efficiency is improved.
Drawings
FIG. 1 is a schematic flow chart of an electrode wire leading-out method of an arc array ultrasonic transducer provided by the invention;
fig. 2 is a schematic structural view of a flexible FPC film;
FIG. 3 is a schematic illustration of the bonding of the FPC film to the piezoelectric ceramic wafer surface;
FIG. 4 is a schematic illustration of the bonding of the backing sheet to the FPC film;
FIG. 5 is a schematic illustration of cutting a piezoceramic wafer and bending a backing sheet to glue to a backing body;
fig. 6 is a schematic structural view of the FPC board.
Detailed Description
The invention provides an electrode wire leading-out method of an arc array ultrasonic transducer, which is further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1
The invention provides an electrode wire leading-out method of an arc array ultrasonic transducer, which has the flow shown in figure 1 and comprises the following steps:
s21, bonding the FPC film and the surface of the piezoelectric ceramic wafer;
step S22, bonding a backing sheet with the piezoelectric ceramic wafer and the FPC film;
s23, cutting the piezoelectric ceramic wafer, and bending and gluing the back lining sheet to a back lining main body;
and step S24, welding the FPC film and the FPC board through leads.
Specifically, as shown in fig. 2, the FPC film 1 includes an integral part 11 and a hollowed-out part 12, the integral part 11 of the FPC film is glued with the surface of the piezoelectric ceramic wafer 2 through conductive epoxy glue, and the hollowed-out part 12 of the FPC film has leads with equal spacing and is bent towards two sides, as shown in fig. 3;
bonding a backing sheet 3 to the piezoelectric ceramic wafer 2 and to an integral part 11 of the FPC film as shown in fig. 4;
cutting the piezoelectric ceramic wafer 2, cutting the cutting groove 21 as shown in fig. 5, cutting through the piezoelectric ceramic wafer 2 but not cutting the backing sheet 3, forming a plurality of vibration elements 22 by cutting, and bending and gluing the backing sheet 3 to the backing main body 4;
and carding the lead wires of the hollowed-out parts 12 to be in a vertical state, enabling the distance and radian of the lead wires to be consistent with those of the FPC board 5 with the socket, and welding the lead wires of the FPC film 1 and the FPC board 5. As shown in fig. 6, the FPC board 5 includes bonding wires 51, a jack lead 52, and a jack 53.
As the electrode layer of the piezoelectric ceramic wafer is not contacted with the high-temperature welding process, the yield of the transducer can be obviously improved. The method provided by the invention can avoid welding on the surface of the piezoelectric ceramic wafer, and directly welding the welding spots with the printed board with the socket after the welding spots are moved out of the wafer, thereby realizing the connection and insertion mode of the transducer; meanwhile, the flexible design of the FPC film has an angle bent towards two sides, so that electrode leads can be arranged at equal intervals after the transducer is molded, and welding spots can be arranged in a regular arc shape. The arrangement mode can be directly welded with the lead wires of the FPC board which are equally spaced and are in regular arc shapes, and the welding efficiency is improved.
The above description is only illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the appended claims.
Claims (4)
1. The method for leading out the electrode wire of the arc array ultrasonic transducer is characterized by comprising the following steps of:
bonding the FPC film and the surface of the piezoelectric ceramic wafer;
bonding a backing sheet to the piezoelectric ceramic wafer and the FPC film;
cutting the piezoelectric ceramic wafer and bending and gluing the back lining sheet to the back lining main body;
welding the FPC film with the FPC board lead;
the FPC film comprises an integral part and a hollowed-out part, wherein the integral part of the FPC film is glued with the surface of the piezoelectric ceramic wafer, and the backing sheet is glued with the piezoelectric ceramic wafer and the integral part of the FPC film.
2. The method of electrode lead out of an arc array ultrasonic transducer of claim 1, wherein the integral part of the FPC film is glued to the piezoelectric ceramic wafer surface by conductive epoxy.
3. The method for extracting electrode wires of an arc array ultrasonic transducer according to claim 1, wherein the hollowed-out part of the FPC film is equally spaced and bent to two sides.
4. The method for drawing electrode wires of an arc array ultrasonic transducer according to claim 3, wherein the method for drawing electrode wires of an arc array ultrasonic transducer further comprises, before the welding of the FPC film with the FPC board leads:
and carding the lead wires of the hollowed-out parts to be in a vertical state, so that the distance and radian of the lead wires are consistent with those of the FPC board with the socket, and the lead wires and the FPC board are welded conveniently.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910973455.4A CN110729398B (en) | 2019-10-14 | 2019-10-14 | Electrode wire leading-out method of arc array ultrasonic transducer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910973455.4A CN110729398B (en) | 2019-10-14 | 2019-10-14 | Electrode wire leading-out method of arc array ultrasonic transducer |
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| CN110729398A CN110729398A (en) | 2020-01-24 |
| CN110729398B true CN110729398B (en) | 2023-04-25 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111540825A (en) * | 2020-06-16 | 2020-08-14 | 无锡海鹰电子医疗系统有限公司 | Ultrasonic transducer and positive and negative electrode single-side leading-out method thereof |
| CN112162168B (en) * | 2020-09-29 | 2022-08-16 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Signal extraction method and system of multi-channel high-frequency receiving transducer array |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07236638A (en) * | 1994-02-28 | 1995-09-12 | Toshiba Corp | Ultrasonic probe |
| JPH1071145A (en) * | 1996-08-29 | 1998-03-17 | Toshiba Corp | Ultrasonic transducer and production thereof |
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN106098928A (en) * | 2016-07-25 | 2016-11-09 | 北京信息科技大学 | A kind of preparation method of Two-dimensional Surfaces piezo-electricity composite material element |
-
2019
- 2019-10-14 CN CN201910973455.4A patent/CN110729398B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07236638A (en) * | 1994-02-28 | 1995-09-12 | Toshiba Corp | Ultrasonic probe |
| JPH1071145A (en) * | 1996-08-29 | 1998-03-17 | Toshiba Corp | Ultrasonic transducer and production thereof |
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN106098928A (en) * | 2016-07-25 | 2016-11-09 | 北京信息科技大学 | A kind of preparation method of Two-dimensional Surfaces piezo-electricity composite material element |
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| CN110729398A (en) | 2020-01-24 |
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