CN215985863U - Sensor - Google Patents
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- CN215985863U CN215985863U CN202121351850.8U CN202121351850U CN215985863U CN 215985863 U CN215985863 U CN 215985863U CN 202121351850 U CN202121351850 U CN 202121351850U CN 215985863 U CN215985863 U CN 215985863U
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- 239000000919 ceramic Substances 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 89
- 238000013016 damping Methods 0.000 claims description 49
- 238000003466 welding Methods 0.000 claims description 27
- 229920001971 elastomer Polymers 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000004382 potting Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
The utility model discloses a sensor, which comprises a shell with a mounting hole, a matching layer embedded on the inner wall of the mounting hole, and a piezoelectric ceramic piece arranged on the matching layer; the matching layer is provided with a groove, and the piezoelectric ceramic piece is arranged on the bottom wall of the groove. The utility model can increase the sensitivity, reduce the residual vibration and improve the performance of the sensor, and belongs to the technical field of detection devices.
Description
Technical Field
The utility model relates to the technical field of detection devices, in particular to a sensor.
Background
Generally, a sweeping robot is provided with an ultrasonic high-frequency sensor for material identification, and particularly, when a floor material is identified, the ultrasonic high-frequency sensor of the sweeping robot needs to have very high sensitivity. In the traditional technology, the sensitivity of the high-frequency sensor is improved, the redundant vibration of the sensor is often brought, the redundant vibration is commonly called as residual vibration, and the recognition capability of the sensor is influenced by the redundant vibration.
SUMMERY OF THE UTILITY MODEL
Aiming at the technical problems in the prior art, the utility model aims to: the utility model provides a sensor, which can increase sensitivity, reduce aftervibration and improve the performance of the sensor.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a sensor comprises a shell with a mounting hole, a matching layer embedded on the inner wall of the mounting hole, and a piezoelectric ceramic piece mounted on the matching layer; the matching layer is provided with a groove, and the piezoelectric ceramic piece is arranged on the bottom wall of the groove.
Furthermore, the sensor also comprises a first damping layer, a second damping layer, a printed circuit board, a potting adhesive layer, an outer lead, a first inner lead and a second inner lead; the first damping layer, the second damping layer printed circuit board all is located in the recess and connect gradually, piezoceramics piece centre gripping is in first damping layer with between the diapire of recess, the encapsulating glue film is located in the mounting hole and with printed circuit board connects, piezoceramics piece has anodal and negative pole, the one end of first inscription wire with the anodal of piezoceramics piece is connected, the one end of second inscription wire with the negative pole of piezoceramics piece is connected, the other end of first inscription wire with the other end of second inscription wire all with printed circuit board connects, printed circuit board with outer wire connects.
Furthermore, a welding spot groove is formed in the bottom wall of the groove, a positive welding spot is arranged on the positive electrode of the piezoelectric ceramic piece, a negative welding spot is arranged on the negative electrode of the piezoelectric ceramic piece and located in the welding spot groove, and the welding spot groove is filled with the surface mount adhesive.
Furthermore, one end of the external lead is positioned outside the shell, and the other end of the external lead is inserted in the pouring sealant layer and connected with the printed circuit board.
Furthermore, the outer lead is provided with a terminal.
Further, the sensor also comprises a rubber ring; the mounting hole comprises a first hole section, a second hole section and a third hole section which are sequentially communicated; the diameter of the first hole section, the diameter of the second hole section and the diameter of the third hole section are sequentially increased, a first hole shoulder is arranged at the joint of the first hole section and the second hole section, a second hole shoulder is arranged at the joint of the second hole section and the third hole section, a fixture block is arranged on the matching layer in a fitted mode, the fixture block abuts against the inner wall of the second hole section, the rubber ring is annularly arranged on the inner wall of the third hole section and abuts against the second hole shoulder, and the fixture block is clamped between the rubber ring and the first hole shoulder.
Furthermore, the pouring sealant layer is located in the first hole section.
Furthermore, a limiting block is arranged on the side wall of the groove, and the printed circuit board is clamped between the potting adhesive layer and the limiting block.
Further, the first damping layer is an integrated piece made of silicon rubber, and the second damping layer is an integrated piece made of epoxy resin.
Further, the matching layer is integrally formed.
Compared with the prior art, the utility model has the beneficial effects that: the utility model has simple structure and low production cost. The matching layer is of an integrally formed structure, the bottom wall of a groove of the matching layer is provided with a welding spot groove, the welding spot groove can contain a negative welding spot and a second internal connecting lead, the upper end surface and the lower end surface of the piezoelectric ceramic piece can be respectively used as a positive electrode and a negative electrode, and the full electrodes of the piezoelectric ceramic piece are used for transmitting and receiving signals, so that the sensitivity of the sensor is improved; the matching layer side wall forms a step part, and the rubber ring sleeved on the matching layer can increase the inward binding force, reduce the side wall vibration and further reduce the influence of residual vibration.
Drawings
Fig. 1 is a schematic diagram of the structure of a sensor.
Fig. 2 is a schematic structural view of the housing.
Fig. 3 is a schematic diagram of the structure of the matching layer.
Fig. 4 is a schematic structural view of the rubber ring.
In the figure, 1 is a shell, 2 is a matching layer, 3 is a piezoelectric ceramic sheet, 4 is a first damping layer, 5 is a second damping layer, 6 is a printed circuit board, 7 is a potting adhesive layer, 8 is an outer lead, 9 is a first inner lead, 10 is a second inner lead, 11 is a patch adhesive, 12 is a terminal, 13 is a rubber ring, 101 is a mounting hole, 201 is a groove, 202 is a fixture block, 203 is a limiting block, 204 is a welding point groove, 301 is a positive welding point, 302 is a negative welding point, 130 is an adhesive filling area, 1011 is a first hole section, 1012 is a second hole section, 1013 is a third hole section, 1014 is a first hole shoulder, and 1015 is a second hole shoulder.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For convenience of description, unless otherwise noted, the up-down direction described below coincides with the up-down direction of fig. 1 itself, the left-right direction described below coincides with the left-right direction of fig. 1 itself, and the left-right direction described below coincides with the left-right direction of fig. 1 itself.
As shown in fig. 1 to 4, the present embodiment provides a sensor, including a housing 1 having a mounting hole 101, a matching layer 2 embedded on an inner wall of the mounting hole 101, and a piezoelectric ceramic sheet 3 mounted on the matching layer 2; the mounting hole 101 is located in the central area of the shell 1 and penetrates through the shell 1 from top to bottom, and the lower end of the mounting hole 101 is isolated from the outside of the shell 1 through the matching layer 2. The matching layer 2 has a groove 201, and the matching layer 2 has a U-shape. The piezoceramics piece 3 is installed on the diapire of recess 201, and piezoceramics piece 3 is located recess 201. The piezoelectric ceramic piece 3 is fixed in the groove 201 of the matching layer 2, the matching layer 2 is embedded and fixed in the shell sleeve 1, the sensor structure is stable, and residual vibration is effectively reduced. The inner wall of the groove 201 can separate the piezoelectric ceramic piece 3, and the inner wall of the shell sleeve 1 is prevented from being touched when the piezoelectric ceramic piece 3 vibrates, so that the influence of residual vibration is further reduced.
In particular, in one embodiment, the matching layer 2, which is U-shaped, is integrally formed by an injection molding process.
Specifically, in one embodiment, the sensor further includes a first damping layer 4, a second damping layer 5, a printed circuit board 6, a potting adhesive layer 7, an outer lead 8, a first inner lead 9, and a second inner lead 10; the first damping layer 4, the second damping layer 5 and the printed circuit board 6 are located in the groove 201 and connected in sequence, the piezoelectric ceramic piece 3 is clamped between the first damping layer 4 and the bottom wall of the groove 201, the pouring sealant layer 7 is located in the mounting hole 101 and connected with the printed circuit board 6, the piezoelectric ceramic piece 3 is provided with an anode and a cathode, one end of the first internal connecting wire 9 is connected with the anode of the piezoelectric ceramic piece 3, one end of the second internal connecting wire 10 is connected with the cathode of the piezoelectric ceramic piece 3, the other end of the first internal connecting wire 9 and the other end of the second internal connecting wire 10 are connected with the printed circuit board 6, and the printed circuit board 6 is connected with the outer wire 8. First damping layer 4, second damping layer 5, printed circuit board 6 all are located the recess 201 of matching layer 2, and first damping layer 4, second damping layer 5, printed circuit board 6 are arranged from up in proper order down. The potting adhesive layer 7 is filled in the mounting hole 101 above the matching layer 2.
Traditional sensor adopts the individual layer damping layer, and the vibration of piezoceramics piece 3 can be suppressed to the individual layer damping layer, adopts double-deck damping layer in this embodiment, and second damping layer 5 and piezoceramics piece 3 can be separated to first damping layer 4, through first damping layer 4 and second damping layer 5 for the beneficial vibration of sensor can not be lost too much, can not suppress piezoceramics piece 3's vibration when effectively reducing the aftervibration.
Specifically, in one embodiment, the piezoelectric ceramic plate 3 is adhered to the bottom wall of the groove 201 through the patch adhesive 11, and the left and right ends of the piezoelectric ceramic plate 3 are connected to the side wall of the groove 201 through the patch adhesive 11.
Specifically, in one embodiment, the welding point groove 204 is formed in the bottom wall of the groove 201, the negative electrode and the positive electrode of the conventional flanging electrode are on the same surface, the relative area of the positive electrode and the negative electrode is sacrificed, and the amplitude of the vibration is reduced although the vibration is reduced, so that the performance of the sensor is affected. The piezoelectric ceramic piece 3 is a full electrode, the upper end face of the piezoelectric ceramic piece 3 is a positive electrode, the lower end face of the piezoelectric ceramic piece 3 is a negative electrode, the relative area of the positive electrode and the negative electrode is guaranteed, vibration is small when the full electrode is large in amplitude, the full electrode of the piezoelectric ceramic piece 3 is used for transmitting and receiving signals, the sensitivity of a probe is increased, and the recognition performance of the sensor is improved. The positive electrode of the piezoelectric ceramic piece 3 is provided with a positive welding spot 301, the negative electrode of the piezoelectric ceramic piece 3 is provided with a negative welding spot 302, the negative welding spot 302 is positioned in the welding spot groove 204, and the welding spot groove 204 is filled with the patch glue 11.
Specifically, in one embodiment, one end of the external lead 8 is located outside the casing 1, and the other end of the external lead 8 is inserted into the potting adhesive layer 7 and connected to the printed circuit board 6. The central area of the printed circuit board 6 is provided with a wiring hole communicating with the second damping layer 5, a first internal wire 9, and a second internal wire 10 passing through the wiring hole to be connected to the upper end surface of the printed circuit board 6.
Specifically, in one embodiment, the outer conductor 8 located outside the housing 1 is provided with a terminal 12. The terminal 12 is model a 1501H-2F.
Specifically, in one embodiment, the sensor further comprises a rubber ring 13; the mounting hole 101 comprises a first hole section 1011, a second hole section 1012 and a third hole section 1013 which are communicated in sequence; the first hole section 1011, the second hole section 1012, and the third hole section 1013 are arranged in this order from top to bottom, and the diameters of the first hole section 1011, the second hole section 1012, and the third hole section 1013 are increased in this order. The junction of the first hole section 1011 and the second hole section 1012 is provided with a first hole shoulder 1014, the junction of the second hole section 1012 and the third hole section 1013 is provided with a second hole shoulder 1015, the outer side surface of the matching layer 2 is annularly provided with the fixture block 202, the side surface of the fixture block 202 abuts against the inner wall of the second hole section 1012, the rubber ring 13 is annularly arranged on the inner wall of the third hole section 1013, the upper end of the rubber ring 13 abuts against the second hole shoulder 1015, and the outer circumferential side surface of the rubber ring 13 abuts against the inner wall of the third hole section 1013. Rubber ring 13 is sleeved on the outer side of matching layer 2, rubber ring 13 is clamped between the outer side of matching layer 2 and the inner wall of third hole section 1013, and fixture block 202 is clamped between the upper end face of rubber ring 13 and first hole shoulder 1014. The rubber ring 13 is a silica gel sleeve, and the rubber ring 13 can increase inward binding force and reduce side wall vibration.
Specifically, in one embodiment, the potting adhesive layer 7 is located in the first hole section 1011, and the potting adhesive layer 7 is filled in the first hole section 1011.
Specifically, in one embodiment, the sidewall of the groove 201 has a stopper 203, and the stopper 203 is disposed around the inner wall of the groove 201. The printed circuit board 6 is clamped between the potting adhesive layer 7 and the stopper 203. The lower terminal surface of printed circuit board 6 supports and leans on stopper 203 up end, has certain clearance between the up end of printed circuit board 6 and the up end of matching layer 2, and the up end of printed circuit board 6 is equipped with the welding point and the welding point is located the clearance, and the packing has encapsulating glue layer 7 in the clearance and above the clearance.
Specifically, in one embodiment, the first damping layer 4 is a unitary piece of silicone rubber and the second damping layer 5 is a unitary piece of epoxy. The first damping layer 4 connected with the piezoelectric ceramic piece 3 is made of silicon rubber, and the second damping layer 5 adjacent to the silicon rubber is made of epoxy resin. The first damping layer 4 of silicon rubber can ensure that the epoxy resin layer above is separated from the piezoelectric ceramic piece 3, the loss of beneficial vibration is reduced, the hardness of the first damping layer 4 is greater than that of the second damping layer 5, and the silicon rubber can be replaced by other media with hardness higher than that of the epoxy resin.
Specifically, in one embodiment, the thickness of the first damping layer 4 is less than the thickness of the second damping layer 5, and the thickness of the first damping layer 4 gradually decreases from the edge region to the central region. The first damping layer 4 is connected with the piezoelectric ceramic piece 3, and because the amplitude of the edge of the piezoelectric ceramic piece 3 is larger than that of the central area of the piezoelectric ceramic piece 3 when the piezoelectric ceramic piece 3 vibrates, the thickness of the first damping layer 4 is gradually reduced from the edge area to the central area, so that the amplitudes of the edge of the piezoelectric ceramic piece 3 and the central area are kept consistent, the sensitivity of the sensor is increased, and the performance of the sensor is ensured.
Specifically, in one embodiment, the rubber ring 13 is annular, the outer circumferential side surface of the rubber ring 13 is divided into a fitting portion and a sealing portion, the fitting portion is located above the sealing portion, the sealing portion abuts against the inner wall of the third hole section 1013 of the mounting hole 101, the fitting portion and the inner wall of the third hole section 1013 together form the glue filling area 130, a plurality of protrusions in a spherical shape are arranged on the side wall of the fitting portion, the glue filling area 130 is filled with the adhesive, and the fitting portion of the rubber ring 13 is fitted to the inner wall of the third hole section 1013 through the adhesive.
The assembly method of the utility model comprises the following steps: the first step is as follows: firstly, printing electrodes on the upper end and the lower end of a silver sheet, and then respectively leading out a positive welding spot and a negative welding spot, thereby obtaining the piezoelectric ceramic sheet. The second step is that: the negative pole of preferred selection pastes the recess diapire of tight matching layer, and the solder joint groove of recess diapire is aimed at to the negative solder joint, and the solder joint inslot of recess diapire is filled in advance and is glued, and the paster is glued and is had prepositioning effect to piezoceramics piece. The third step: after the piezoelectric ceramic piece is placed, a first internal connecting lead and a second internal connecting lead are arranged, and a first damping layer and a second damping layer are sequentially coated; covering the PCB (printed circuit board) above the second damping layer, laying external leads, and finally filling the potting adhesive layer; the fourth step: the outer side wall of the matching layer is sleeved with a rubber ring; the fifth step: the probe is engaged with the housing.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A sensor, characterized by: the piezoelectric ceramic chip comprises a shell with a mounting hole, a matching layer embedded on the inner wall of the mounting hole, and a piezoelectric ceramic chip arranged on the matching layer; the matching layer is provided with a groove, and the piezoelectric ceramic piece is arranged on the bottom wall of the groove.
2. A sensor according to claim 1, wherein: the damping structure further comprises a first damping layer, a second damping layer, a printed circuit board, an encapsulating adhesive layer, an outer lead, a first inner lead and a second inner lead; the first damping layer, the second damping layer printed circuit board all is located in the recess and connect gradually, piezoceramics piece centre gripping is in first damping layer with between the diapire of recess, the encapsulating glue film is located in the mounting hole and with printed circuit board connects, piezoceramics piece has anodal and negative pole, the one end of first inscription wire with the anodal of piezoceramics piece is connected, the one end of second inscription wire with the negative pole of piezoceramics piece is connected, the other end of first inscription wire with the other end of second inscription wire all with printed circuit board connects, printed circuit board with outer wire connects.
3. A sensor according to claim 2, wherein: the bottom wall of the groove is provided with a welding spot groove, the positive pole of the piezoelectric ceramic piece is provided with a positive welding spot, the negative pole of the piezoelectric ceramic piece is provided with a negative welding spot, the negative welding spot is positioned in the welding spot groove, and the welding spot groove is filled with a paster glue.
4. A sensor according to claim 2, wherein: one end of the outer lead is positioned outside the shell, and the other end of the outer lead is inserted in the pouring sealant layer and is connected with the printed circuit board.
5. A sensor according to claim 2, wherein: and the outer lead is provided with a terminal.
6. A sensor according to claim 2, wherein: the rubber ring is also included; the mounting hole comprises a first hole section, a second hole section and a third hole section which are sequentially communicated; the diameter of the first hole section, the diameter of the second hole section and the diameter of the third hole section are sequentially increased, a first hole shoulder is arranged at the joint of the first hole section and the second hole section, a second hole shoulder is arranged at the joint of the second hole section and the third hole section, a fixture block is arranged on the matching layer in a fitted mode, the fixture block abuts against the inner wall of the second hole section, the rubber ring is annularly arranged on the inner wall of the third hole section and abuts against the second hole shoulder, and the fixture block is clamped between the rubber ring and the first hole shoulder.
7. A sensor according to claim 6, wherein: the pouring sealant layer is located in the first hole section.
8. A sensor according to claim 2, wherein: the side wall of the groove is provided with a limiting block, and the printed circuit board is clamped between the potting adhesive layer and the limiting block.
9. A sensor according to claim 2, wherein: the first damping layer is an integrated piece made of silicon rubber, and the second damping layer is an integrated piece made of epoxy resin.
10. A sensor according to any one of claims 1 to 9, wherein: the matching layer is integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121351850.8U CN215985863U (en) | 2021-06-17 | 2021-06-17 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121351850.8U CN215985863U (en) | 2021-06-17 | 2021-06-17 | Sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215985863U true CN215985863U (en) | 2022-03-08 |
Family
ID=80578502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121351850.8U Active CN215985863U (en) | 2021-06-17 | 2021-06-17 | Sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215985863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825963A (en) * | 2022-12-14 | 2023-03-21 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
-
2021
- 2021-06-17 CN CN202121351850.8U patent/CN215985863U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115825963A (en) * | 2022-12-14 | 2023-03-21 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
| CN115825963B (en) * | 2022-12-14 | 2024-03-15 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A sensor Effective date of registration: 20230427 Granted publication date: 20220308 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Panyu branch Pledgor: AUDIOWELL ELECTRONICS (GUANGDONG) Co.,Ltd. Registration number: Y2023980039506 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220308 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Panyu branch Pledgor: AUDIOWELL ELECTRONICS (GUANGDONG) Co.,Ltd. Registration number: Y2023980039506 |