CN210668367U - Optical device - Google Patents
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- CN210668367U CN210668367U CN201921460468.3U CN201921460468U CN210668367U CN 210668367 U CN210668367 U CN 210668367U CN 201921460468 U CN201921460468 U CN 201921460468U CN 210668367 U CN210668367 U CN 210668367U
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Abstract
The utility model relates to the technical field of optical communication, in particular to an optical device, which comprises a tube seat, an electric chip and an optical chip, wherein the tube seat comprises a base; the electric chip comprises an upper surface and a lower surface which are opposite, and the lower surface of the electric chip is attached to the base; the optical chip comprises a front surface and a back surface which are opposite, and the back surface of the optical chip is attached to the upper surface of the electric chip; the utility model provides an optical device, electric chip and optical chip adopt the heap to can shorten the transverse distance between electric chip and the optical chip, and then make the connecting lead between electric chip and the optical chip shorten, reduce signal interference, thereby strengthen optical device's signal interference killing feature.
Description
Technical Field
The utility model relates to an optical communication technical field, concretely relates to optical device.
Background
Optical devices (Optical devices) are optoelectronic devices that convert electrical signals into Optical signals or vice versa. The optical devices are divided into active devices and passive devices, the active devices can work only by being driven by external energy sources and are hearts of the optical transmission system. The passive optical device can work without being driven by external energy.
There are many packaging methods for the active optical device, but the active optical device can be roughly classified into a coaxial (TO) type package and a Butterfly (Butterfly) type package. The existing active TO optical device generally comprises an optical chip and an electric chip which are electrically connected, wherein the optical chip is used for converting an optical-electrical signal, and the electric chip is used for driving the optical chip TO work and processing an electrical signal converted by the optical chip.
In the prior art, the negative electrode of the optical chip is disposed on the back surface of the optical chip, and the back surface of the electrical chip is grounded. When the optical device is packaged, the back surfaces of the optical chip and the electric chip are respectively stuck on the TO tube seat through conductive glue. If the distance between the optical chip and the electric chip is too short, the conductive glue overflows due to the fluidity, and further the short circuit between the optical chip and the electric chip is easily caused.
And then the distance between optical chip and the electric chip is far away to lead to the overlength of lead between optical chip and the electric chip, have signal interference to the electric chip, thereby influence optical device's working property.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing an optical device that the interference killing feature is good.
In order to achieve the above technical problem, the present invention provides an optical device, including a tube seat, an electrical chip and an optical chip, wherein the tube seat includes a base; the electric chip comprises an upper surface and a lower surface which are opposite, and the lower surface of the electric chip is attached to the base; the optical chip comprises a front surface and a back surface which are opposite, and the back surface of the optical chip is attached to the upper surface of the electric chip.
Further, an insulating layer is arranged between the back surface of the optical chip and the upper surface of the electric chip.
Furthermore, the optical chip comprises a positive electrode and a negative electrode, and a first pad pin and a second pad pin are arranged on the upper surface of the electrical chip; the positive electrode of the optical chip is electrically connected with the first bonding pad pin, and the negative electrode of the optical chip is electrically connected with the second bonding pad pin.
Furthermore, the positive electrode and the negative electrode of the optical chip are both arranged on the front surface of the optical chip.
Furthermore, the positive electrode of the optical chip is electrically connected with the first pad pin through a bonding wire, and the negative electrode of the optical chip is electrically connected with the second pad pin through a bonding wire.
Furthermore, the lower surface of the electric chip is grounded, and the lower surface of the electric chip is attached to the base through a conductive adhesive.
Further, the tube socket further comprises a power pin, and the electric chip is electrically connected with the power pin.
Further, the insulating layer is a passivation film.
Further, the passivation film is silicon dioxide (SiO)2) Or silicon nitride (Si)3N4)。
The utility model also provides an above-mentioned arbitrary optical device's packaging method, include:
attaching the lower surface of the electric chip to the base of the tube seat;
the back surface of the optical chip is attached to the upper surface of the electrical chip.
The utility model provides an optical device, including tube socket, electric chip and optical chip, the tube socket includes the base. The electric chip comprises an upper surface and a lower surface which are back to back, and the lower surface of the electric chip is attached to the base. The optical chip comprises a front surface and a back surface which are opposite, and the back surface of the optical chip is attached to the upper surface of the electric chip. The electric chip and the optical chip adopt a stacked structure, so that the transverse distance between the electric chip and the optical chip can be shortened, a connecting lead between the electric chip and the optical chip is shortened, signal interference is reduced, and the signal anti-interference capability of the optical device is enhanced.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an optical device according to an embodiment of the present invention;
FIG. 2 is a top view of a tube seat in an embodiment of the present invention;
FIG. 3 is an enlarged view of area A of FIG. 2;
FIG. 4 is a schematic view of the bottom surface of an electrical chip according to an embodiment of the present invention;
fig. 5 is a cross-sectional view of an optical device in an embodiment of the invention.
Wherein the correspondence between the reference numbers and the names of the components in fig. 1 to 5 is:
1. the optical chip comprises a tube seat, 11, a base, 112, a through hole, 12, a power supply pin, 2, a tube cap, 21, an optical window, 3, an electric chip, 31, an upper surface, 311, a first pad pin, 312, a second pad pin, 313, a third pad pin, 32, a lower surface, 4, an optical chip, 40, a photosensitive area, 41, a front surface, 42, a back surface, 43, a positive electrode, 44, a negative electrode, 5, an insulating layer, 6, a bonding wire, 7 and conductive adhesive.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
The active TO optical device is an important ring in an optical communication transmission link, and whether the working performance of the active TO optical device is good or not influences the accuracy of optical information transmission.
Referring TO fig. 1, an embodiment of an optical device according TO the present invention is provided, in which the optical device is an active optical device and is a coaxial (TO) package.
Specifically, referring to fig. 2 to 4, an optical device includes a stem 1, a cap 2, an electrical chip 3, and an optical chip 4.
In the present embodiment, the electrical chip 3 is an Integrated Circuit (IC) chip, and the optical chip 4 is a Photo-Diode (PD) chip.
The pipe cap 2 is covered on the pipe seat 1 and is connected with the pipe seat in a sealing way, and a sealing space is enclosed. Electric chip 3 and optical chip 4 all are located this encapsulated space, and electric chip 3 is connected with optical chip 4 electricity, and electric chip 3 is used for driving optical chip 4 work. The cap 2 is provided with an optical window 21, the surface of the optical chip 4 is provided with a photosensitive area 40, and the photosensitive area 40 is coupled with the optical path of the optical window 21. The light window 21 is used for light transmission, and the photosensitive area 40 on the light chip 4 is used for receiving light. The optical chip 4 receives the light and then converts the optical signal into an electrical signal, the optical chip 4 transmits the electrical signal to the electric chip 3, and the electric chip 3 processes the received electrical signal. If there is signal interference, the working performance of the whole optical device will be affected, and the accuracy of information transmission of the whole optical communication transmission link will be affected.
Specifically, the stem 1 includes a base 11 and a power pin 12. The electric chip 3 comprises an upper surface 31 and a lower surface 32 which are opposite to each other, and the lower surface 32 of the electric chip 3 is attached to the base 11. The optical chip 4 includes a front surface 41 and a back surface 42 opposite to each other, and the back surface 42 of the optical chip 4 is attached to the upper surface 31 of the electrical chip 3.
Referring to fig. 5, various electronic devices and circuits are disposed on the upper surface 31 of the electrical chip 3, and an insulating layer 5 is disposed between the back surface 42 of the optical chip 4 and the upper surface 31 of the electrical chip 3 to prevent the optical chip 4 and the various electronic devices or circuits on the electrical chip 3 from being shorted.
The insulating layer 5 is a passivation film. The passivation film may be silicon dioxide (SiO)2) Or silicon nitride (Si)3N4). The passivation film may also serve to protect various electronic devices and lines on the upper surface 31 of the electrical chip 3 from corrosion, increasing the durability and stability of the electrical chip 3. The passivation film also prevents the electronic components on the electrical chip 3 from causing the upper surface 31 of the electrical chip 3 to be uneven, thereby affecting the fixing effect of the optical chip 4 attached to the electrical chip 3.
The back surface 42 of the optical chip 4 is glued to the upper surface 31 of the electrical chip 3.
The optical chip 4 includes a positive electrode 43 and a negative electrode 44, and a first pad pin 311 and a second pad pin 312 are provided on the upper surface 31 of the electrical chip 3. The positive electrode 43 of the optical chip 4 is electrically connected to the first pad pin 311, and the negative electrode 44 of the optical chip 4 is electrically connected to the second pad pin 312.
Further, the positive electrode 43 and the negative electrode 44 of the optical chip 4 are both disposed on the front surface 41 of the optical chip 4. The positive electrode 43 of the optical chip 4 is electrically connected to the first pad pin 311 through the bonding wire 6, and the negative electrode 44 of the optical chip 4 is electrically connected to the second pad pin 312 through the bonding wire 6.
The positive electrode 43 and the negative electrode 44 are both arranged on the front surface 41 of the optical chip 4, which is convenient for wire bonding, connection, operation and process manufacturing.
The electric chip 3 and the optical chip 4 adopt a stacked mounting mode, so that the problem of the transverse distance between the electric chip 3 and the optical chip 4 is solved, the transverse distance between the electric chip 3 and the optical chip 4 is shortened, the length of a bonding wire 6 is reduced, the signal interference is reduced, and the signal interference resistance of an optical device is improved. The welding wire 6 is shortened, so that the occupied space can be saved, and the whole volume of the optical device is reduced. The welding wire 6 is shortened, so that the soldering tin consumption can be saved, and the cost is reduced.
The positive electrode 43 and the negative electrode 44 are insulated from each other. The number of the negative electrodes 44 may be one or more, and a plurality of negative electrodes 44 are arranged in an insulating manner.
The lower surface 32 of the electric chip 3 is grounded, and the lower surface 32 of the electric chip 3 is attached to the base 11 through the conductive adhesive 7.
The base 11 is provided with a through hole 112 penetrating the base 11, and the power pin 12 is inserted into the through hole 112 and one end of the power pin protrudes out of the surface of the base 11. The power supply pin 12 is insulated from the base 11. Specifically, an insulating substance is provided between the power supply pin 12 and the inner wall of the through hole 112. The electric chip 3 is electrically connected to a power supply pin 12, and the power supply pin 12 is used for supplying power to the electric chip 3 to operate the electric chip 3. Specifically, the third pad pin 313 is disposed on the upper surface 31 of the electrical chip 3, and the third pad pin 313 is electrically connected to the power supply pin 12 through the bonding wire 6.
The light window 21 is a lens and the photosensitive area 40 is arranged corresponding to the lens.
The utility model provides a pair of optical device, including tube socket 1, electric chip 3 and optical chip 4, tube socket 1 includes base 11. The electric chip 3 comprises an upper surface 31 and a lower surface 32 which are opposite to each other, and the lower surface 32 of the electric chip 3 is attached to the base 11. The optical chip 4 includes a front surface 41 and a back surface 42 opposite to each other, and the back surface 42 of the optical chip 4 is attached to the upper surface 31 of the electrical chip 3. The electric chip 3 and the optical chip 4 adopt a stacked structure, so that the transverse distance between the electric chip 3 and the optical chip 4 can be shortened, the connecting lead between the electric chip 3 and the optical chip 4 is shortened, the signal interference is reduced, and the signal anti-interference capability of the optical device is enhanced.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only for the preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. An optical device is characterized by comprising a tube seat, an electric chip and an optical chip, wherein the tube seat comprises a base; the electric chip comprises an upper surface and a lower surface which are opposite, and the lower surface of the electric chip is attached to the base; the optical chip comprises a front surface and a back surface which are opposite, and the back surface of the optical chip is attached to the upper surface of the electric chip.
2. The optical device of claim 1, wherein an insulating layer is disposed between the back surface of the optical chip and the top surface of the electrical chip.
3. The optical device according to claim 1, wherein the optical chip comprises a positive electrode and a negative electrode, and a first pad pin and a second pad pin are arranged on an upper surface of the optical chip; the positive electrode of the optical chip is electrically connected with the first bonding pad pin, and the negative electrode of the optical chip is electrically connected with the second bonding pad pin.
4. The optical device according to claim 3, wherein the positive electrode and the negative electrode of the optical chip are both disposed on the front surface of the optical chip.
5. The optical device according to claim 4, wherein the positive electrode of the optical chip is electrically connected to the first pad pin by a bonding wire, and the negative electrode of the optical chip is electrically connected to the second pad pin by a bonding wire.
6. The optical device according to claim 1, wherein the lower surface of the electrical chip is grounded, and the lower surface of the electrical chip is attached to the base through a conductive adhesive.
7. The optical device of claim 1, wherein the stem further comprises power pins, the electrical chip being electrically connected to the power pins.
8. The optical device according to claim 2, wherein the insulating layer is a passivation film.
9. The optical device according to claim 8, wherein the passivation film is silicon dioxide (SiO)2) Or silicon nitride (Si)3N4)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921460468.3U CN210668367U (en) | 2019-09-03 | 2019-09-03 | Optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921460468.3U CN210668367U (en) | 2019-09-03 | 2019-09-03 | Optical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210668367U true CN210668367U (en) | 2020-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921460468.3U Active CN210668367U (en) | 2019-09-03 | 2019-09-03 | Optical device |
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| CN (1) | CN210668367U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488455A (en) * | 2021-05-24 | 2021-10-08 | 武汉敏芯半导体股份有限公司 | Anti-interference high-speed light receiving device |
-
2019
- 2019-09-03 CN CN201921460468.3U patent/CN210668367U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488455A (en) * | 2021-05-24 | 2021-10-08 | 武汉敏芯半导体股份有限公司 | Anti-interference high-speed light receiving device |
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