CN212342659U - Piezoelectric actuator - Google Patents
Piezoelectric actuator Download PDFInfo
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- CN212342659U CN212342659U CN202020964311.0U CN202020964311U CN212342659U CN 212342659 U CN212342659 U CN 212342659U CN 202020964311 U CN202020964311 U CN 202020964311U CN 212342659 U CN212342659 U CN 212342659U
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Abstract
A piezoelectric driver includes a piezoelectric driver stack; the piezoelectric driver stack comprises a plurality of chip piezoelectric driver units which are arranged in a stacked mode, and two ends of each chip piezoelectric driver unit are respectively provided with a conducting layer; the piezoelectric actuator further comprises electrode structures respectively arranged at two ends of the piezoelectric actuator stack; each electrode structure comprises a conducting strip which is respectively connected with the corresponding conducting layer on each chip piezoelectric driver unit and a conducting connecting sheet which is connected with two adjacent conducting strips. According to the piezoelectric driver, the electrode structures are respectively arranged at the two ends of the piezoelectric driver stack, so that even if a conductive layer between two adjacent chip piezoelectric driver units cracks, the two adjacent chip piezoelectric driver units can be connected with the conductive connecting sheet through the corresponding conductive sheets, so that an open circuit can be avoided, the piezoelectric driver can be normally used, and the service life of the piezoelectric driver is prolonged; moreover, the electrode structure enhances the overall structural strength of the piezoelectric actuator, and has strong vibration resistance and deformation resistance.
Description
Technical Field
The application belongs to the field of piezoelectric drive components and parts, and more specifically relates to a piezoelectric driver.
Background
The piezoelectric actuator is a kind of elements which utilize inverse piezoelectric effect to control the mechanical deformation of piezoelectric body by electric field so as to produce linear motion, and can be extensively used in the fields of aeronautical technology, measuring technology, precision machining and medical equipment. The piezoelectric driver with large stroke is generally formed by laminating a plurality of chip piezoelectric driver units and connecting the chip piezoelectric driver units in series to form a piezoelectric driver stack, and silver conductive layers are electroplated at two ends of each chip piezoelectric driver unit to serve as outer electrode layers. However, the outer silver electrode layer between two adjacent chip piezoelectric driver units is easy to crack during long-term use, which results in open circuit, thereby affecting the normal use and service life of the piezoelectric driver.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present application is to provide a piezoelectric driver, so as to solve the problem that the outer silver layer between two adjacent chip piezoelectric driver units is prone to crack and open the circuit, thereby affecting the normal use and the service life of the piezoelectric driver.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
providing a piezoelectric driver comprising a piezoelectric driver stack; the piezoelectric driver stack comprises a plurality of chip piezoelectric driver units which are arranged in a stacked mode, two poles of each chip piezoelectric driver unit are located at two ends of the chip piezoelectric driver unit respectively, positive terminals of the chip piezoelectric driver units are located at the same end of the piezoelectric driver stack, conducting layers are arranged at two ends of each chip piezoelectric driver unit respectively, the conducting layers at each end of each chip piezoelectric driver unit are connected with the adjacent conducting layers on the adjacent chip piezoelectric driver units, and the piezoelectric driver further comprises electrode structures which are arranged at two ends of the piezoelectric driver stack respectively; each electrode structure comprises a conducting strip which is respectively connected with the conducting layer on each chip piezoelectric driver unit corresponding to the conducting layer and a conducting connecting sheet which is connected with two adjacent conducting strips.
In one embodiment, each of the conductive sheets is provided with a through hole, and the through hole is filled with curing adhesive.
In one embodiment, the piezoelectric actuator further comprises electrode leads connected to the two electrode structures, respectively.
In one embodiment, one end of each of the electrode leads is connected to one of the conductive sheets corresponding to the electrode structure.
In one embodiment, each of the conductive strips is a circular ring.
In one embodiment, the diameter of the conductive tab is greater than the width of the conductive tab.
In one embodiment, the diameter of the through hole is equal to the width of the conductive connection pad.
In one embodiment, the conductive tab is integrally formed with the conductive tab.
In one embodiment, the conductive layer is a coating made of a silver material.
In one embodiment, each of the chip piezoelectric driver units is a laminated structure formed by co-firing a piezoelectric ceramic material and an electrode paste.
One or more technical solutions in the embodiments of the present application have at least one of the following technical effects: this application sets up electrode structure respectively through the both ends at the piezoelectric actuator stack, and an electrode structure's conducting strip and electrically conductive connection piece can be connected a plurality of conducting layers that are in piezoelectric actuator stack one end, and another electrode structure's conducting strip and electrically conductive connection piece can be connected a plurality of conducting layers that are in the piezoelectric actuator stack other end. Even if the conducting layer between two adjacent chip piezoelectric driver units is cracked, the two adjacent chip piezoelectric driver units can be connected with the conducting connecting sheet through the corresponding conducting sheets, so that the open circuit can be avoided, the piezoelectric driver can be normally used, and the service life of the piezoelectric driver is prolonged; moreover, the electrode structure enhances the overall structural strength of the piezoelectric actuator, and has strong vibration resistance and deformation resistance.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a front view of a piezoelectric actuator according to an embodiment of the present disclosure;
fig. 2 is a side view of a piezoelectric actuator provided in an embodiment of the present application;
FIG. 3 is an enlarged schematic view at A in FIG. 2;
FIG. 4 is a front view of an electrode structure provided in an embodiment of the present application;
fig. 5 is a flowchart of a process for manufacturing a piezoelectric actuator according to an embodiment of the present disclosure.
Wherein, in the drawings, the reference numerals are mainly as follows:
1-a piezoelectric driver stack; 11-chip piezoelectric driver unit; 12-a conductive layer;
2-an electrode structure; 21-a conductive sheet; 210-a via; 22-a conductive connection pad;
31-positive lead; 32-negative electrode lead;
4-curing glue.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 to 3, a piezoelectric actuator provided in the present application will now be described. The piezoelectric driver comprises a piezoelectric driver stack 1 and electrode structures 2 respectively arranged at two ends of the piezoelectric driver stack 1. The piezoelectric driver stack 1 includes a plurality of chip piezoelectric driver units 11 stacked one on another, and the number of the chip piezoelectric driver units 11 corresponds to the number of the conductive sheets 21 in each electrode structure 2 one to one. The two ends of each chip piezoelectric driver unit 11 are respectively a positive end and a negative end, the positive ends of the plurality of chip piezoelectric driver units 11 are located on one side of the piezoelectric driver stack 1, and the negative ends of the plurality of chip piezoelectric driver units 11 are located on the other side of the piezoelectric driver stack 1. The two ends of each chip piezoelectric driver unit 11 are respectively provided with a conductive layer 12, and the conductive layer 12 at each end of the chip piezoelectric driver unit 11 is connected with the adjacent conductive layer 12 on the adjacent chip piezoelectric driver unit 11. Specifically, the positive terminal and the negative terminal of each chip piezoelectric driver unit 11 are respectively provided with a conductive layer 12, and in two adjacent chip piezoelectric driver units 11: the conductive layer 12 on the positive terminal of one chip piezoelectric driver unit 11 is connected to the conductive layer 12 on the positive terminal of the other chip piezoelectric driver unit 11; the conductive layer 12 on the negative terminal of one chip piezoelectric driver unit 11 is connected to the conductive layer 12 on the negative terminal of another chip piezoelectric driver unit 11, so that the connection between two adjacent chip piezoelectric driver units 11 is realized.
Referring to fig. 4, each electrode structure 2 includes a conductive sheet 21 connected to the corresponding conductive layer 12 of each chip piezoelectric driver unit 11 and a conductive connecting sheet 22 connecting two adjacent conductive sheets 21. Specifically, each positive terminal is provided with a conductive sheet 21 connected with the corresponding conductive layer 12, and each negative terminal is provided with a conductive sheet 21 connected with the corresponding conductive layer 12; an electrode structure 2 at one end of the piezoelectric driver stack 1 may connect the conductive layers 12 on a plurality of positive terminals, and an electrode structure 2 at the other end of the piezoelectric driver stack 1 may connect the conductive layers 12 on a plurality of negative terminals. The conductive sheet 21 and the conductive connecting sheet 22 may be made of metal materials with excellent conductivity, such as copper sheets, and the conductivity of the electrode structure 2 may be further improved, which is not limited herein. Each conducting strip 21 is arranged in the middle of the corresponding conducting layer 12, and the conducting connecting strips 22 are located on the same straight line, so that the overall aesthetic degree of the piezoelectric actuator can be improved, the material usage amount of the electrode structure 2 can be saved, and the cost is saved. In some embodiments, the two adjacent conductive sheets 21 on the same side of the piezoelectric driver stack 1 are disposed in a crossed manner, i.e., the conductive connecting sheet 22 between the two adjacent conductive sheets 21 is disposed in an inclined manner to the horizontal plane, so as to improve the overall strength of the piezoelectric driver.
With this structure, by providing the electrode structures 2 at the two ends of the piezoelectric driver stack 1, the conductive sheet 21 and the conductive connecting sheet 22 of one electrode structure 2 can connect the conductive layers 12 at one end of the piezoelectric driver stack 1, and the conductive sheet 21 and the conductive connecting sheet 22 of the other electrode structure 2 can connect the conductive layers 12 at the other end of the piezoelectric driver stack 1. Even if the conductive layer 12 between two adjacent chip piezoelectric driver units 11 is cracked, the two adjacent chip piezoelectric driver units 11 can be connected with the conductive connecting sheet 22 through the corresponding conductive sheet 21, so that an open circuit can be avoided, the piezoelectric driver can be normally used, and the service life of the piezoelectric driver is prolonged; moreover, the electrode structure 2 enhances the overall structural strength of the piezoelectric actuator, and has strong vibration resistance and deformation resistance.
In an embodiment, referring to fig. 1 and fig. 4, as a specific implementation of the electrode structure provided by the present application, each conductive sheet 21 is provided with a through hole 210, and the through hole 210 is filled with a curing adhesive 4. In the conventional manufacturing process, the external electrodes and leads at the two ends of the piezoelectric actuator are usually connected by soldering. Soldering tin needs to firstly electroplate the conductive layer 12, and the process is complicated; moreover, the soldering is difficult to ensure good appearance, and the ceramic is easy to depolarize due to the high soldering temperature (generally greater than 300 ℃), thereby affecting the consistency and reliability of the piezoelectric actuator. According to the structure, each electrode structure 2 can be fixed on the piezoelectric driver stack 1 in a spot welding mode, and is glued and cured through the curing glue 4, so that the connection stability is improved. Therefore, the spot welding replaces the traditional soldering process, thereby not only improving depolarization caused during soldering, but also avoiding complex electroplating process. After spot welding, the curing adhesive 4 is dispensed at each through hole 210, so that the reliability and consistency of the piezoelectric actuator can be improved, and the attractiveness of the electrode structure 2 can be improved. The type of the curing adhesive 4 may be G500, which is not limited herein.
In one embodiment, referring to fig. 1 and fig. 2, as a specific implementation of the electrode structure provided by the present application, the piezoelectric actuator further includes electrode leads respectively connected to the two electrode structures 2. For convenience of description, the two electrode leads are referred to as a positive electrode lead 31 and a negative electrode lead 32, respectively. One end of the positive electrode lead 31 may be disposed at a middle position of the electrode structure 2 at one end of the piezoelectric driver stack 1, and one end of the negative electrode lead 32 may be disposed at a middle position of the electrode structure 2 at the other end of the piezoelectric driver stack 1. This structure facilitates connection of the piezoelectric actuator to other external components via the positive electrode lead 31 and the negative electrode lead 32. Wherein, the positive lead 31 and the negative lead 32 can be multi-core copper wires, and the size specification can be 0.072mm, and the rated voltage can be 250V. In other embodiments, the types, sizes, parameters, and the like of the positive electrode lead 31 and the negative electrode lead 32 may be adjusted according to actual needs, and are not limited herein.
In one embodiment, referring to fig. 1 and fig. 2, as a specific implementation of the electrode structure provided in the present application, one end of each electrode lead is connected to one conductive sheet 21 of the corresponding electrode structure 2. Specifically, one end of the positive electrode lead 31 may be connected to the conductive sheet 21 at the middle position of one electrode structure 2, and one end of the negative electrode lead 32 may be connected to the conductive sheet 21 at the middle position of the other electrode structure 2. In this structure, one end of the positive electrode lead 31 and one end of the negative electrode lead 32 are connected to the corresponding conductive sheets 21. When two adjacent conducting layers 12 are cracked to cause open circuit, the conducting layers 12 are connected by the electrode structure 2, and the normal work of the piezoelectric driver can be realized through the anode lead 31 and the cathode lead 32, so that the open circuit is effectively prevented.
In one embodiment, referring to fig. 4, as a specific implementation of the electrode structure provided in the present application, each conductive sheet 21 is a circular ring. With the structure, the conductive sheets 21 are designed into a circular ring configuration, so that the contact area between the conductive sheets 21 and the conductive layer 12 can be increased, and the subsequent spot welding and dispensing operations between the conductive sheets 21 and the corresponding conductive layer 12 are facilitated. The through hole 210 is a hole formed in the middle of the circular ring, and the center of the through hole 210 coincides with the center of the conductive sheet 21, so that the conductive sheets 21 can be processed and manufactured conveniently. In other embodiments, the cross-sectional configuration of the conductive sheet 21 and the cross-sectional configuration of the through hole 210 may be adjusted according to actual needs, such as square, rectangle, polygon, etc., which is not limited herein.
In one embodiment, referring to fig. 4, as one embodiment of the electrode structure provided by the present application, the diameter of the conductive sheet 21 is larger than the width of the conductive connecting sheet 22. With the structure, the conductive connecting sheets 22 can be respectively extended from the two ends of each conductive sheet 21, so that the contact area between each conductive sheet 21 and the corresponding conductive layer 12 can be increased, the spot welding area is increased, and the connection stability between each conductive sheet 21 and the corresponding conductive layer 12 is effectively improved. The conductive connecting sheet 22 may have a thickness of 90 μm and a width of 0.5 mm. The diameter of the conductive sheet 21 may be 1mm, the diameter of the through-holes 210 may be 0.5mm, and the distance between the centers of the two through-holes 210 may be 2 mm. In other embodiments, the sizes of the conductive connecting sheet 22, the conductive sheet 21 and the through hole 210 can be adjusted according to actual needs, and are not limited herein.
In one embodiment, referring to fig. 4, as one embodiment of the electrode structure provided herein, the diameter of the through hole 210 is equal to the width of the conductive connection pad 22. This structure facilitates the processing and fabrication of the through-hole 210. In some embodiments, the diameter of the through-hole 210 plus the width of the conductive connection pad 22 is equal to the diameter of the conductive pad 21. With the structure, the current passing through the conducting strip 21 and the conducting connecting strip 22 can be ensured to be consistent, and the working stability of the piezoelectric actuator is improved. In other embodiments, the diameter of the through hole 210 may also be larger than the width of the conductive connecting sheet 22, which may further increase the contact area between the conductive sheet 21 and the mounting surface, thereby increasing the spot welding area; the diameter of the through hole 210 may also be smaller than the width of the conductive connecting sheet 22, so as to reduce the dispensing area and improve the heat dissipation effect.
In one embodiment, the conductive sheet 21 and the conductive connecting sheet 22 are integrally formed as a specific embodiment of the electrode structure provided in the present application. This structure, with electrode structure 2 integrated into one piece, mechanical properties is excellent, convenient processing preparation, production efficiency is high. In other embodiments, the conductive sheet 21 and the conductive connecting sheet 22 may be connected by other means, such as welding, adhesion, etc., which are not limited herein.
In one embodiment, as a specific implementation of the piezoelectric actuator provided herein, the conductive layer 12 is a coating made of a silver material. With this structure, the conductive layer 12 made of silver material has excellent conductivity, and can effectively improve the current transmission efficiency and stability between the chip piezoelectric driver units 11. In other embodiments, the conductive layer 12 may be made of other materials, such as copper, gold, etc., and is not limited herein.
In one embodiment, as a specific implementation of the piezoelectric driver provided herein, each chip piezoelectric driver unit 11 is a laminated structure made by co-firing a piezoelectric ceramic material and an electrode paste. The piezoelectric ceramic material is an information functional electronic ceramic material capable of converting mechanical energy and electric energy into each other, and has good dielectric properties, piezoelectric properties and the like. The chip piezoelectric actuator unit 11 may be made of soft PZT (Lead Zirconate Titanate)) Is made of a piezoelectric ceramic having a piezoelectric constant d33>400pC/N, Curie temperature Tc>190 ℃. In other embodiments, the chip piezoelectric driver unit 11 may be made of other materials, which is not limited herein.
The application also provides a preparation method of the piezoelectric actuator. The preparation method specifically comprises the following steps:
1. s1 preparation of electrode structure 2: a plurality of through holes 210 are opened on the sheet at equal distances, and the number of the through holes 210 may be the same as the number of the chip piezoelectric driver units 11.
2. S2 electrode structure 2 spot welding: two electrode structures 2 are respectively spot-welded to both ends of the piezoelectric driver stack 1. Specifically, the electrode structures 2 are respectively disposed at two ends of the piezoelectric driver stack 1, so that the conductive sheets 21 of one electrode structure 2 are disposed in one-to-one correspondence with the conductive layer 12 on one side of the piezoelectric driver stack 1, and the conductive sheets 21 of the other electrode structure 2 are disposed in one-to-one correspondence with the conductive layer 12 on the other side of the piezoelectric driver stack 1. Spot welding is performed on each conductive piece 21 by spot welding with an external spot welder, so that each conductive piece 21 is contact-welded to the corresponding conductive layer 12. Wherein each through hole 210 is aligned with a center position of the corresponding conductive layer 12, and is not limited herein. Wherein, the spot welding technological parameters can be as follows: the voltage is 1.4V-1.6V; the pre-pressing time is 14ms-16 ms; the spot welding pressure is 36N-43N. In other embodiments, the spot welding process parameters may be adjusted according to actual needs, and are not limited herein.
3. Spot welding of electrode lead of S3: and respectively welding the two electrode leads to the corresponding electrode structures 2 by a spot welding machine. Specifically, one end of the positive electrode lead 31 is disposed on the conductive sheet 21 of one electrode structure 2, and spot welding is performed with respect to the positive electrode lead 31 and the conductive sheet 21. Similarly, one end of the negative electrode lead 32 is disposed on the conductive sheet 21 of the other electrode structure 2, and spot welding is performed on the quasi negative electrode lead 32 and the conductive sheet 21. One end of the positive electrode lead 31 may be connected to the conductive sheet 21 at the middle position of one electrode structure 2, and one end of the negative electrode lead 32 may be connected to the conductive sheet 21 at the middle position of the other electrode structure 2, so that the overall beauty of the piezoelectric actuator may be improved. Wherein, the spot welding technological parameters can be as follows: the voltage is 1.4V-1.6V; the pre-pressing time is 14ms-16 ms; the spot welding pressure is 36N-43N. In other embodiments, the spot welding process parameters may be adjusted according to actual needs, and are not limited herein.
4. S4 dispensing and curing: dispensing and fixing each electrode structure 2 on the piezoelectric driver stack 1. Specifically, the dispensing valve of the dispenser is aligned to the spot welding position of the spot welding to supply the curing adhesive 4 for dispensing, so that the curing adhesive 4 just covers all the spot welding and the through holes 210. And (3) placing the piezoelectric driver stack 1 in a constant-temperature drying oven at 110 ℃ for drying for 1h, so that the curing adhesive 4 is cured, and the electrode structure 2 and the piezoelectric driver stack 1 are connected and fixed.
The reliability comparison between the piezoelectric driver with the electrode structure 2 and the piezoelectric driver without the electrode structure 2 provided in the present application is shown in the following table.
| Sample (I) | Number of cycles | Status of state |
| Piezoelectric actuator without |
108-109 | |
| Piezoelectric actuator with |
>109 | Still normally work |
As can be seen from the above, the piezoelectric actuator with the electrode structure 2 can effectively solve the problem of the open circuit caused by the crack of the conductive layer 12.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A piezoelectric driver including a piezoelectric driver stack; the piezoelectric driver stack comprises a plurality of chip piezoelectric driver units which are stacked, two poles of each chip piezoelectric driver unit are respectively located at two ends of the chip piezoelectric driver unit, the positive ends of the chip piezoelectric driver units are located at the same end of the piezoelectric driver stack, two ends of each chip piezoelectric driver unit are respectively provided with a conducting layer, the conducting layer at each end of each chip piezoelectric driver unit is connected with the adjacent conducting layer on the chip piezoelectric driver unit, and the piezoelectric driver stack is characterized in that: the piezoelectric driver also comprises electrode structures which are respectively arranged at two ends of the piezoelectric driver stack; each electrode structure comprises a conducting strip which is respectively connected with the conducting layer on each chip piezoelectric driver unit corresponding to the conducting layer and a conducting connecting sheet which is connected with two adjacent conducting strips.
2. The piezoelectric actuator of claim 1, wherein: each conducting strip is provided with a through hole, and curing glue is filled in the through holes.
3. The piezoelectric actuator of claim 2, wherein: the piezoelectric driver further comprises electrode leads respectively connected with the two electrode structures.
4. The piezoelectric actuator of claim 3, wherein: one end of each electrode lead is connected with one conducting strip corresponding to the electrode structure.
5. The piezoelectric actuator of claim 1, wherein: each conducting strip is a circular ring.
6. The piezoelectric actuator of claim 1, wherein: the diameter of the conducting strip is larger than the width of the conducting connecting sheet.
7. The piezoelectric actuator of claim 2, wherein: the diameter of the through hole is equal to the width of the conductive connecting sheet.
8. The piezoelectric actuator of any one of claims 1 to 7, wherein: the conducting strip and the conducting connecting sheet are integrally formed.
9. The piezoelectric actuator of any one of claims 1 to 7, wherein: the conductive layer is a coating made of a silver material.
10. The piezoelectric actuator of any one of claims 1 to 7, wherein: each chip piezoelectric driver unit is of a laminated structure made of piezoelectric ceramic materials and electrode slurry through co-firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020964311.0U CN212342659U (en) | 2020-05-29 | 2020-05-29 | Piezoelectric actuator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020964311.0U CN212342659U (en) | 2020-05-29 | 2020-05-29 | Piezoelectric actuator |
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| CN212342659U true CN212342659U (en) | 2021-01-12 |
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| CN202020964311.0U Active CN212342659U (en) | 2020-05-29 | 2020-05-29 | Piezoelectric actuator |
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