CN201717255U - Passive device and circuit board embedded with same - Google Patents
Passive device and circuit board embedded with same Download PDFInfo
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- CN201717255U CN201717255U CN201020198031XU CN201020198031U CN201717255U CN 201717255 U CN201717255 U CN 201717255U CN 201020198031X U CN201020198031X U CN 201020198031XU CN 201020198031 U CN201020198031 U CN 201020198031U CN 201717255 U CN201717255 U CN 201717255U
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- external electrode
- passive device
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- blind hole
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Abstract
The utility model provides a passive device used for manufacturing embedded circuit boards and a circuit board embedded with the same. The passive device comprises a body, an internal electrode, a first external electrode and a second external electrode, wherein the internal electrode is arranged in the body, the first external electrode and the second external electrode are connected to two ends of the internal electrode, the first external electrode extends to cover most area of the upper surface of the body, and the second external electrode extends to cover most area of the lower surface of the body. Areas of the two external electrodes covered on the upper surface and the lower surface of the passive device are enlarged on the basis of the prior art, when the passive device is used as an embedded device for manufacturing circuit boards, the problem that because the passive device is fixed in a substrate and then drilled after being laminated in the prior art, precision requirement on aligning among holes and electrodes of the passive device is high, and circuit board processing is difficult and easy to be in error when in leading-out process of the electrodes is resolved, and then, processing cost is reduced and production efficiency is increased.
Description
Technical field
The utility model relates to the electronic circuit technology field, more particularly, relates to a kind of passive device, passive device embedded circuit board.
Background technology
At present, miniaturization of electronic products and complicated development trend are promoting circuit-board industry and are entering a new developing period, and promptly the flush type direction of integrating towards height develops.In the circuit board manufacturing, imbed device, can reduce board area, shorten length of arrangement wire, thereby improve the structure dress efficient of product.But existing flush type device is general still for being used for the passive device that surface mount is used in the prior art.As shown in fig. 1, be used for surface-pasted passive device 91 for a kind of in the prior art, described passive device 91 comprises device body 911, place interior electrode 9111 in the device body 911 and the external electrode 9112 of being located at the device body two ends and being connected with interior electrode 9111 two ends, because this passive device 91 mean levels fit on the circuit board surface, and the external electrode 9112 of passive device 91 claim again electrode terminal need with circuit board on circuit turn-on, so the external electrode 9112 of passive device 91 when design on device body 911, extend on the lower surface, by last, the external electrode 9112 direct and circuit board applyings of lower surface.But as shown in fig. 1, the width of the extension of this external electrode 9112 on device body 911 is less, and (electrode width as model 0402 is 0.2mm, the electrode width of model 0201 only is 0.1mm), when being used for surface mount, can satisfy and mount requirement, when making the flush type device with it, owing to needing on outermost layer substrate and aiming at external electrode 9112 positions and hole, realize the external electrode 9112 of passive device 91 and being electrically connected of outer circuit by electroplating blind hole or electric conducting material filling blind hole formation conduction intermediary again.So the less passive device 91 of this external electrode 9112 sizes, when carrying out contraposition boring, contraposition requires high, and difficulty of processing is big, and production efficiency is low.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of passive device, with this passive device when imbedding the element manufacturing embedded circuit board, the demanding problem of aligning accuracy in hole when the electrode that efficiently solves passive device is derived, reduce difficulty of processing, improved production efficiency.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of passive device is provided, comprise device body, be located at the interior electrode in the device body and be connected in the first external electrode and the second external electrode that interior electrode two ends connect, described the first external electrode extends and covers most of zone of described device body upper surface, and described the second external electrode extends and cover most of zone of described device body lower surface.
Further, the first external electrode of described passive device and the second external electrode surface all are coated with the copper layer.
The utility model also provides a kind of passive device embedded circuit board, comprises
Superpose successively and be bonded in first substrate, adhesive sheet and second substrate of one;
The surface of described first substrate and bottom surface have one first conductive layer and first outer conducting layer respectively, place at least one passive device on described first conductive layer;
Described passive device comprises device body, is located at the interior electrode in the device body and is connected in the first external electrode and the second external electrode that interior electrode two ends connect, described the first external electrode extends and covers most of zone of described device body upper surface, and described the second external electrode extends and cover most of zone of described device body lower surface;
Described adhesive sheet is provided with first opening that is complementary with described passive device size, and described passive device is placed in described first opening;
The surface of described second substrate and bottom surface have one second outer conducting layer and second conductive layer respectively;
On described second substrate and first substrate and respectively the first external electrode of corresponding described passive device and first blind hole and second blind hole that sensible the first external electrode and the second external electrode are offered in the second external electrode position are filled with in described first blind hole and second blind hole and are respectively applied for the conducting medium that is electrically connected described second outer conducting layer and the first external electrode, first outer conducting layer and the second external electrode.
Further, the first external electrode of described passive device and the second external electrode surface all are coated with the copper layer.
Further, described conducting medium is conductive paste or electrodeposited coating.
Further, also comprise at least one the 3rd substrate, described the 3rd upper surface of base plate and lower surface all have the 3rd conductive layer, offer second opening that is complementary with described passive device size on described the 3rd substrate, described the 3rd substrate and described adhesive sheet are laminated between described first substrate and second substrate at interval, and the thickness after described each the 3rd substrate and each adhesive sheet are stacked and the thickness of passive device are complementary.
Further, comprise that also at least one single face that is bonded in described first substrate below and second substrate top respectively has the adhesive sheet of the 4th conductive layer, the surface that described adhesive sheet has the 4th conductive layer places the outside, be positioned on the described adhesive sheet and offer the 3rd blind hole with described first blind hole, the second blind hole corresponding position respectively, be filled with in described the 3rd blind hole in order to be electrically connected the conductive paste or the electrodeposited coating of conducting medium in described the 4th conductive layer and described first blind hole, second blind hole.
Two external electrodes that increased passive device in the utility model on the prior art basis are covered in the zone of passive device upper surface and lower surface, with it when imbedding the element manufacturing circuit board, solved in the prior art passive device has been fixed in the substrate, after stacked, hole the again hole that occurs when electrode derived and the electrode contraposition required precision height of passive device, be difficult to processing, be prone to the problem of error, reduced processing cost, improved production efficiency.
Description of drawings
Fig. 1 is the cutaway view of passive device of the prior art;
The cutaway view of the passive device that Fig. 2 provides for the utility model;
Fig. 3 is the cutaway view of first embodiment of the passive device embedded circuit board that provides of the utility model;
The production craft step cutaway view of first embodiment of the passive device embedded circuit board that Fig. 4 A to Fig. 4 I provides for the utility model;
Fig. 5 is the cutaway view of second embodiment of the passive device embedded circuit board that provides of the utility model.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
With reference to Fig. 2, the cutaway view of the passive device 1 that provides for the utility model.
As shown in FIG., described passive device 1, comprise device body 11, be located at the interior electrode 12 in the device body 11 and be connected in the first external electrode 13 and the second external electrode 14 that interior electrode 12 two ends connect, electrode 12 is a plurality of in described, the polarity of electrode gap setting and adjacent interior electrode 12 is opposite in a plurality of, the left end that described the first external electrode 13 is positioned at device body 11 is connected with the electrode 12 with same polarity, described the second external electrode 14 is positioned at the right-hand member of device body 11 and is connected with the electrode 12 with another polarity, described the first external electrode 13 extends also most of zone of covering device body 11 upper surfaces by the left end of device body 11, and described the second external electrode 14 is by the right-hand member extension of device body 11 and the major part zone of covering device body 11 lower surfaces.The percentage that described the first external electrode 13 and the second external electrode 14 extends the area that the back area coverages account for device body 11 upper and lower surfaces respectively greater than 50% less than 100%, here, the uncovered area 111 that leaves, not only made things convenient for the production and processing of passive device 1, also prevented from simultaneously to contact between the first external electrode 13 and the second external electrode 14 and be short-circuited.And greater than 50% less than 100% coverage, the contraposition requirement when being enough to satisfy the first external electrode 13 and the second external electrode 14 with external circuit boring conducting has reduced difficulty of processing, has improved production efficiency.
Further, in the present embodiment, the first external electrode 13 of described passive device 1 and the second external electrode 14 surfaces all are coated with copper layer 15.And the external electrode of existing passive device is generally the tin layer, though the tin layer is easy to welding, but adopt the mode of welding, can influence the stability of signal transmission, the particularly transmission of high-frequency signal, and behind the first external electrode 13 and the second external electrode 14 copper coating layers 15, signal transmitted more stable when the first external electrode 13 and the second external electrode 14 was connected with external circuit by copper layer 15.
With reference to Fig. 3, Fig. 4 A to Fig. 4 I, the passive device embedded circuit board and the production craft step cutaway view thereof that provide for the utility model.
Among Fig. 4 A, prepare at least one above-mentioned passive device 1.Described passive device 1, comprise device body 11, be located at the interior electrode 12 in the device body 11 and be connected in the first external electrode 13 and the second external electrode 14 that interior electrode 12 two ends connect, described the first external electrode 13 extends also most of zone of covering device body 11 upper surfaces by the left end of device body 11, and described the second external electrode 14 is by the right-hand member extension of device body 11 and the major part zone of covering device body 11 lower surfaces.The percentage that described the first external electrode 13 and the second external electrode 14 extends the area that the back area coverages account for device body 11 upper and lower surfaces respectively greater than 50% less than 100%, here, the uncovered area 111 that leaves, not only made things convenient for the production and processing of passive device 1, also prevented from simultaneously to contact between the first external electrode 13 and the second external electrode 14 and be short-circuited.And greater than 50% less than 100% coverage, the contraposition requirement when being enough to satisfy the first external electrode 13 and the second external electrode 14 with external circuit boring conducting has reduced difficulty of processing, has improved production efficiency.Described the first external electrode 13 and the second external electrode 14 surfaces all are coated with copper layer 15.
Among Fig. 4 B, prepare one first substrate 2, described first substrate 2 comprises first copper foil layers 22 that first insulating barrier 21 reaches thereon, following two surfaces form.Described first insulating barrier 21 adopts glass epoxy resins, Teflon, ceramic wafer, span to come acid amides etc. to be usually used in making in the material of printed circuit board base board any and makes.
Among Fig. 4 C, first copper foil layer 22 of first substrate, 2 upper surfaces is carried out etching form first conductive layer 221.
Among Fig. 4 D, prepare at least one adhesive sheet 3 (shown in the figure being), described viscose glue film is a prepreg, offers one first opening 31 on described adhesive sheet 3, and the size of described first opening 31 and described passive device 1 size are complementary.The formation of first opening 31 can be adopted hole milling or the boring in the machining, also can adopt laser equipment such as UV laser, carbon dioxide laser, YAG laser to wait and process.
Among Fig. 4 E, prepare one second substrate 4, described second substrate 4 is and the identical substrate of first substrate, 2 materials, and difference is, second copper foil layer 42 of the lower surface of described second substrate 4 carried out etching form second conductive layer 421.
Among Fig. 4 F, prepare at least one the 3rd substrate 5 (shown in the figure being), described the 3rd substrate 5 is identical with the material of first substrate 2 and second substrate 4, and the 3rd copper foil layer of described the 3rd substrate 5 upper surfaces and lower surface all carries out etch processes and forms the 3rd conductive layer 521.Offer second opening 53 that is complementary with described passive device 1 size on described the 3rd substrate 5.
Among Fig. 4 G, place described first substrate 2 to have on the surface of first conductive layer 221 described passive device 1, and superpose successively thereon described adhesive sheet 3, the 3rd substrate 5 and second substrate 4, and described passive device 1 is fixed in second opening 53 of first opening 31 of described adhesive sheet 3 and the 3rd substrate 5, and described first substrate 2 of heating and pressurizing, adhesive sheet 3, the 3rd substrate 5 and second substrate 4 make the firstth substrate 2, adhesive sheet 3, the 3rd substrate 5 and second substrate 4 be bonded in one; In the present embodiment, described the 3rd substrate 5 is one, and described adhesive sheet 3 is two, is located at respectively between described first substrate 2 and the 3rd substrate 5, the 3rd substrate 5 and second substrate 4.The thickness after described two adhesive sheets 3 and 5 stacks of the 3rd substrate and the thickness of described passive device 1 are complementary.If the thinner thickness of described passive device 1 also can omit the 3rd substrate 5 herein, directly passive device can be fixed between first substrate 2 and second substrate 4 by an adhesive sheet 3 that has first opening 31; If the thickness of described passive device 1 is thicker, also can adopt the 3rd substrate 5 and the adhesive sheet 3 of a plurality of intervals stack herein, the 3rd substrate 5 after a plurality of stacks and the thickness of adhesive sheet 3 and the thickness of passive device 1 are complementary.
In Fig. 4 H, to the circuit board making outer circuit after the pressing.Be about to the bottom surface of described first substrate 2 and the surface of second substrate 4 and carry out graphic making, form first outer conducting layer 222 and second outer conducting layer 422 respectively.
As Fig. 4 I, for the circuit board after bonding, on described second substrate 4 and the first external electrode 13 positions of corresponding described passive device 1 form one first blind hole 411 by laser drill, described first blind hole 411 connects described second substrate 4 and its bottom terminates in described the first external electrode 13, the first external electrode 13 is exposed by first blind hole, 411 places, filled conductive medium 6 in first blind hole 411, described conducting medium 6 is electrically connected described second outer conducting layer 422 and the first external electrode 13; On described first substrate 2 and the second external electrode 14 positions of corresponding described passive device 1 form one second blind hole 211 by laser drill, described second blind hole 211 connects described first substrate 2 and its bottom terminates in the second external electrode 14, the second external electrode 14 is exposed by second blind hole, 211 places, filled conductive medium 6 in second blind hole 211, described conducting medium 6 is electrically connected described first outer conducting layer 222 and the second external electrode 14.Because in the present embodiment, the first external electrode 13 of described passive device 1 and the second external electrode 14 cover most of zone of passive device 1 upper surface and lower surface respectively, so when the laser drilling blind hole, can be bigger for the zone of boring, contraposition is easier to, convenient processing.Described conducting medium 6 can be conductive paste, and described conductive paste can be any of silver paste, copper cream or tin cream or other conductive paste, and certain described conducting medium also can be for electroplating the coating that forms.The circuit board 7 of the passive device flush type that the employing said method makes promptly as shown in Figure 3.
With reference to Fig. 5, be the cutaway view of second embodiment of the passive device embedded circuit board that provides of the utility model.
The present embodiment and the first embodiment difference are, at least one adhesive sheet 3 also bonds respectively in the top of described first substrate, 2 belows and second substrate 4, one surface of described adhesive sheet 3 has the 4th conductive layer 32, and the surface with the 4th conductive layer 32 places the outside.Be positioned on the described adhesive sheet 3 and offer the 3rd blind hole 33 with described first blind hole 411, second blind hole, 211 corresponding positions respectively, be filled with in described the 3rd blind hole 33 in order to be electrically connected the conductive paste or the electrodeposited coating of conducting mediums 6 in described the 4th conductive layer 32 and described first blind hole 411, second blind hole 211.In the present embodiment, be filled in the electrodeposited coating that is in the 3rd blind hole 33.After plating is filled and finished, on the 4th conductive layer 32 of adhesive sheet 3, electroplate a copper foil layer again, and etching formation conductive layer, this is same as the prior art, does not give unnecessary details herein.By in first substrate, 2 belows and the top of second substrate 4 stack adhesive sheet 3 can increase the thickness of circuit board, in the present embodiment, described adhesive sheet 3 is two, each one of the top of the below of described first substrate 2 and second substrate 4, certainly, a plurality of adhesive sheets 3 that also can superpose according to the thickness of side circuit plate.In this circuit board 7, stack back the 4th conductive layer 32 be an outer circuit, is electrically connected with described first blind hole 411, the 211 interior conducting mediums realizations of second blind hole by the 3rd blind hole 33 respectively between the first external electrode 13 of outer circuit and passive device 1 and the second external electrode 14.
To sum up, in the method for the circuit board of the above-mentioned making flush type passive device that present embodiment provides, imbed a passive device that has increased the external electrode area, the design of this increase electrode terminal surface area, solved in the prior art passive device has been fixed in the substrate, the hole and the electrode aligning accuracy height of passive device of holing after stacked again and occurring when electrode derived are difficult to process, and are prone to the problem of error; The copper layer that while external electrode surface is coated with helps the stability of circuit board signal transmission.Passive device that employing the utility model provides and the manufacture method that provides according to the utility model, it is good to manufacture out quality fast, the passive device embedded circuit board that qualification rate is high.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (7)
1. passive device, comprise device body, be located at the interior electrode in the device body and be connected in the first external electrode and the second external electrode that interior electrode two ends connect, it is characterized in that: described the first external electrode extends and covers most of zone of described device body upper surface, and described the second external electrode extends and cover most of zone of described device body lower surface.
2. passive device as claimed in claim 1 is characterized in that: the first external electrode of described passive device and the second external electrode surface all are coated with the copper layer.
3. a passive device embedded circuit board is characterized in that: comprise
Superpose successively and be bonded in first substrate, adhesive sheet and second substrate of one;
The surface of described first substrate and bottom surface have one first conductive layer and first outer conducting layer respectively, place at least one passive device on described first conductive layer;
Described passive device comprises device body, is located at the interior electrode in the device body and is connected in the first external electrode and the second external electrode that interior electrode two ends connect, described the first external electrode extends and covers most of zone of described device body upper surface, and described the second external electrode extends and cover most of zone of described device body lower surface;
Described adhesive sheet is provided with first opening that is complementary with described passive device size, and described passive device is placed in described first opening;
The surface of described second substrate and bottom surface have one second outer conducting layer and second conductive layer respectively;
On described second substrate and first substrate and respectively the first external electrode of corresponding described passive device and first blind hole and second blind hole that sensible the first external electrode and the second external electrode are offered in the second external electrode position are filled with in described first blind hole and second blind hole and are respectively applied for the conducting medium that is electrically connected described second outer conducting layer and the first external electrode, first outer conducting layer and the second external electrode.
4. passive device embedded circuit board as claimed in claim 3 is characterized in that: the first external electrode of described passive device and the second external electrode surface all are coated with the copper layer.
5. as claim 3 or 4 described passive device embedded circuit boards, it is characterized in that: described conducting medium is conductive paste or electrodeposited coating.
6. passive device embedded circuit board as claimed in claim 3, it is characterized in that: also comprise at least one the 3rd substrate, described the 3rd upper surface of base plate and lower surface all have the 3rd conductive layer, offer second opening that is complementary with described passive device size on described the 3rd substrate, described the 3rd substrate and described adhesive sheet are laminated between described first substrate and second substrate at interval, and the thickness after described each the 3rd substrate and each adhesive sheet are stacked and the thickness of passive device are complementary.
7. as claim 3 or 6 described passive device embedded circuit boards, it is characterized in that: comprise that also at least one single face that is bonded in described first substrate below and second substrate top respectively has the adhesive sheet of the 4th conductive layer, the surface that described adhesive sheet has the 4th conductive layer places the outside, be positioned on the described adhesive sheet and respectively with described first blind hole, the 3rd blind hole is offered in the second blind hole corresponding position, is filled with in described the 3rd blind hole in order to be electrically connected described the 4th conductive layer and described first blind hole, the conductive paste or the electrodeposited coating of conducting medium in second blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020198031XU CN201717255U (en) | 2010-05-20 | 2010-05-20 | Passive device and circuit board embedded with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020198031XU CN201717255U (en) | 2010-05-20 | 2010-05-20 | Passive device and circuit board embedded with same |
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| Publication Number | Publication Date |
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| CN201717255U true CN201717255U (en) | 2011-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201020198031XU Expired - Fee Related CN201717255U (en) | 2010-05-20 | 2010-05-20 | Passive device and circuit board embedded with same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254885A (en) * | 2010-05-20 | 2011-11-23 | 深南电路有限公司 | Passive device, passive device-embedded circuit board and manufacturing method |
| CN104244582A (en) * | 2013-06-13 | 2014-12-24 | 宏启胜精密电子(秦皇岛)有限公司 | Embedded type high-density interconnection printed circuit board and manufacturing method of embedded type high-density interconnection printed circuit board |
| CN104392943A (en) * | 2014-12-05 | 2015-03-04 | 常州瑞华电力电子器件有限公司 | Preparation method of low-stress high-weldability nickel-plated electrode |
| WO2024041486A1 (en) * | 2022-08-23 | 2024-02-29 | 矽磐微电子(重庆)有限公司 | Method for packaging chip on board having embedded passive device, and package structure |
-
2010
- 2010-05-20 CN CN201020198031XU patent/CN201717255U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254885A (en) * | 2010-05-20 | 2011-11-23 | 深南电路有限公司 | Passive device, passive device-embedded circuit board and manufacturing method |
| CN104244582A (en) * | 2013-06-13 | 2014-12-24 | 宏启胜精密电子(秦皇岛)有限公司 | Embedded type high-density interconnection printed circuit board and manufacturing method of embedded type high-density interconnection printed circuit board |
| CN104392943A (en) * | 2014-12-05 | 2015-03-04 | 常州瑞华电力电子器件有限公司 | Preparation method of low-stress high-weldability nickel-plated electrode |
| WO2024041486A1 (en) * | 2022-08-23 | 2024-02-29 | 矽磐微电子(重庆)有限公司 | Method for packaging chip on board having embedded passive device, and package structure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20130520 |