CN111530716A - Pulse heating power glue dispensing solution hardening heater comprising arrangement plate - Google Patents
Pulse heating power glue dispensing solution hardening heater comprising arrangement plate Download PDFInfo
- Publication number
- CN111530716A CN111530716A CN201910172603.2A CN201910172603A CN111530716A CN 111530716 A CN111530716 A CN 111530716A CN 201910172603 A CN201910172603 A CN 201910172603A CN 111530716 A CN111530716 A CN 111530716A
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- CN
- China
- Prior art keywords
- heating
- camera module
- unit
- dispensing
- arrangement plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The invention relates to a pulse heating power glue solution hardening heater comprising an arrangement plate, which is used for hardening glue solution coated on a camera module and comprises: a heating part which generates heat energy transferred to the camera module; a moving unit disposed above the heating unit and configured to change a position of the heating unit; a control unit that controls the heating unit and the moving unit; and an arrangement plate on which camera modules are arranged below the heating part; the heating part further includes: a pulse heating cable supplying thermal energy to the camera module, and a heat cylinder combining the pulse heating cable at one side; the upper surface of the arrangement plate is connected with the lower surface of the hot cylinder; and supplying heat energy to the dispensing solution applied to the inside of the camera module disposed under the arrangement plate.
Description
Technical Field
The present invention relates to a heater for hardening a dispensing solution applied to a camera module, and more particularly, to a pulse heating power dispensing solution hardening heater for hardening a dispensing solution by a pulse heating method in which a camera module applied with a dispensing solution is arranged in close contact with each other and then heated instantaneously.
Background
In general, a camera module is a component that converts an image entered through a lens into a digital signal, and is mainly used to take pictures and videos on mobile devices such as smartphones.
A general manufacturing process sequence of the camera module is to attach substrates individually extracted from a wafer to a PCB and to connect them with a lead, and then attach a Flexible Printed Circuit Board (FPCB) to the PCB after bonding them with a lens.
In order to bond the plurality of structures, a Dispensing (Dispensing) process of respectively bonding the structures is performed. Dispensing refers to coating a dispensing solution as an adhesive on the bonding portion for bonding a plurality of structures.
However, simply applying a spotting solution cannot be seen as achieving a strong bond to multiple structures. It is necessary to perform a hardening operation of applying heat and pressure to the applied dispensing solution to improve the durability of the bond.
There are many methods for firmly maintaining the bonding of the camera module, and korean laid-open patent publication No. 10-2007-0115384 describes an apparatus for performing thermal hardening using pulse heating power.
The heat transfer module is characterized in that a generator for generating pulse heating power and a heating sheet having a heat transfer belt are provided at the front end of the bonding head connected to the module, and the heating sheet is in contact with the module to transfer heat energy to the module.
However, in the device of the above document, since the heating sheet contacting the module and the FPCB bonding structure to transfer heat is formed of a single plane, a phenomenon of misalignment may occur when the heating head presses the module and the FPCB bonding structure. Therefore, there is a possibility that a separate structure for fixing the position of the module, such as a separate base for fixing the module and the FPCB combined structure, needs to be added.
Prior art documents
Patent documents: korean laid-open patent publication No. 10-2007-0115384 "joining apparatus of camera module and flexible printed circuit board based on pulse heating method"
Disclosure of Invention
Technical problem to be solved
The present invention is made to solve the above-mentioned problems, and an object of the present invention is to provide a curing heater for dispensing solution, which prevents the alignment of the bonding structures from being disordered during the curing operation of the dispensing solution.
Means for solving the problems
The invention discloses a pulse heating power glue solution hardening heater comprising an arrangement plate, which is used for hardening glue solution coated on a camera module and is characterized by comprising the following components: a heating part which generates heat energy transferred to the camera module; a moving unit disposed above the heating unit and configured to change a position of the heating unit; a control unit that controls the heating unit and the moving unit; and an arrangement plate on which camera modules are arranged below the heating part; the heating part further includes: a pulse heating cable for supplying heat energy to the camera module; and a heat cylinder combined with the pulse heating cable at one side; the upper surface of the arrangement plate is in contact with the lower surface of the heat cylinder, and supplies heat energy to the dispensing solution applied in the camera module disposed below the arrangement plate.
In addition, the control unit may transmit a signal to the heating unit when a camera module is brought into contact with a lower surface of the array plate.
In addition, the arrangement plate further includes: a quadrilateral first surface connected with the upper surface of the reinforcing rib; a plurality of second surfaces connected to a plurality of side surfaces of the reinforcing rib; the plurality of second faces meet the first face corner.
Further, the one second surface is configured to contact at least the other second surface.
Further, the alignment plate may further include a vertical moving unit that changes a vertical position of the alignment plate; the upper surface of the array plate which is lifted most by the vertical movement unit is brought into contact with the lower surface of the heat cylinder.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the mutual arrangement of the module coated with the unhardened dispensing solution and the reinforcing bar coupling structure is prevented from being disordered during the thermosetting process.
Further, the defective product occurrence rate of the finally produced camera module can be significantly reduced.
Drawings
Fig. 1 is an exemplary view illustrating a pulse heating power dispensing solution hardening heater including an alignment plate according to the present invention.
Fig. 2 is an exemplary view showing a state in which a heating part according to the present invention is lowered by a vertical moving part.
Fig. 3 is an exemplary view showing a state in which the heating part according to the present invention is lowered and the heat cylinder and the array plate are in contact with each other.
Fig. 4 is an illustrative view showing an arrangement plate according to the present invention.
Fig. 5 is an exemplary view showing the shape and structure of the first surface and the plurality of second surfaces of the array plate according to the present invention.
Wherein the reference numerals are as follows:
100: a heating section; 110: a pulse heating cable; 120: a hot cylinder; 200: arranging the plates; 210: a first side; 220: a second face; 221: any one of the second faces; 222: another second face; 300: a vertical moving section; 310: a guide rail; 320: a guide block; 400: a support; 410: a hollow portion.
Detailed Description
The terms or words used in the present specification and claims should not be construed as limited to general or dictionary meanings, but interpreted as meanings and concepts conforming to the technical idea of the present invention on the basis of the principle that the inventor can appropriately define the concept of the terms in order to explain his invention in the most preferable way.
Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferable embodiments of the present invention, and do not represent the entire technical idea of the present invention, and it should be understood that various equivalents and modifications may be possible in place of them at the time of filing this application.
In the following, before the description with reference to the drawings, it is stated in advance that the gist of the present invention is emphasized, and unnecessary matters, that is, well-known structures that can be obviously added by those skilled in the art are not illustrated or specifically described.
Fig. 1 is an exemplary view illustrating a pulse heating power dispensing solution hardening heater including an alignment plate according to the present invention. As shown in fig. 1, the present invention may include: a heating unit 100 that generates heat energy and transmits the heat energy to the camera module; a moving part that changes a position of the heating part 100; a control unit for controlling the heating unit 100 and the moving unit; and an alignment plate 200 for preventing the misalignment of the arrangement of the plurality of structures coated with the dispensing solution.
The heating part 100 generates heat energy and supplies the heat energy to the camera module coated with the dispensing solution, and may include: a heat pipe 120 for receiving heat energy and transferring the heat energy to the outside; and a pulse heating cable 110 combined with one side of the hot cylinder 120 to transfer heat energy to the hot cylinder 120.
The pulse heating cable 110 is configured to supply heat energy to the heat cylinder 120, and performs a process of converting an electric signal into heat energy according to a command of the control part.
The heat pipe 120 is configured to receive the heat energy transferred from the pulse heating cable 110, and the heat pipe is moved to the camera module side by the moving unit to transfer the heat energy to the module.
The heating part 100 is disposed above the alignment plate 200, and the thermal cylinder selectively contacts the upper side of the alignment plate 200, thereby curing the dispensing solution applied to the camera module.
Fig. 2 is an exemplary view illustrating a state in which the heating part 100 is lowered by the vertical moving part 300 according to the present invention. As shown in fig. 2, the present invention may further include a vertical moving unit 300, wherein the vertical moving unit 300 is closely attached to the heating unit 100 on the array plate 200 closely attached to the camera module disposed on the plane.
As shown in fig. 2, the vertical moving part 300 may include a guide rail and a guide block that linearly reciprocates in the guide rail, but is not particularly limited as long as the heating part 100 vertically intersects with the camera module and moves.
Fig. 2 (a) shows a state in which the heat cylinder 120 constituting the heating part 100 is spaced apart from the array plate 200 by a predetermined interval, and such a state is observed while the heater of the present invention is moved to the upper side of the camera module to which the dispensing solution is applied or while waiting for the camera module to be picked up to a position where it is hardened.
Then, as shown in fig. 2 (b), the heating part 100 is moved to the lower side by the vertical moving part 300, a camera module is disposed at the lower side, and the dispensing solution applied to the module is thermally cured by the heat transferred from the heat cylinder 120.
Fig. 3 is an exemplary view illustrating a state in which the heating part 100 descends and the heat cylinder 120 and the arrangement plate 200 contact each other according to the present invention. As shown in fig. 3 (a), the thermal barrel 120 is spaced apart from the alignment plate 200 by a predetermined interval in a state where the camera module does not contact the alignment plate 200, wherein the thermal barrel 120 receives thermal energy from the pulse heating cable 110.
Then, when the moving unit contacts a rib adhered to the upper side of the camera module by the dispensing solution on the lower side of the alignment plate 200, the heat cylinder 120 is lowered toward the alignment plate 200 by the vertical moving unit 300 to thermally cure the dispensing solution.
Fig. 4 is an illustrative view showing an arrangement plate 200 according to the present invention. As shown in fig. 4, a holder 400 may be provided between the heating unit 100 and the array plate 200, and a hollow portion 410 through which the heat cylinder 120 selectively passes by the vertical movement unit 300 may be formed in the holder 400.
In the case where the alignment plate 200 is disposed below the holder 400, the alignment plate 200 is preferably disposed at a position vertically aligned with the hollow portion 410. In addition, the alignment plate 200 may be coupled to or formed as an integrated body with the holder 400.
The hollow portion 410 may be formed in a shape corresponding to the heat cylinder 120, but the shape is not particularly limited as long as the heat cylinder 120 can selectively contact the alignment plate 200 by penetrating the hollow portion 410.
Since the holder 400 having the hollow portion 410 formed therein is provided between the heating part 100 and the array plate 200, it is possible to prevent a phenomenon in which the arrangement of the heat pipe 120 and the array plate 200 is finely disturbed to lower the heat transfer efficiency.
In addition, a separate structure for bonding the alignment plates 200 may be added to improve the bonding durability of the alignment plates 200.
Fig. 5 is an exemplary view showing the shape and structure of the first surface 210 and the plurality of second surfaces 220 of the alignment plate 200 according to the present invention. As shown in fig. 5, the arrangement plate 200 may include: the first surface 210 is connected with the upper surface of the reinforcing rib adhered to the upper side of the module through the glue dispensing solution; and a plurality of second faces 220 connected to a plurality of sides of the reinforcing bars.
The shape of the first surface 210 is not particularly limited, but is preferably a rectangular shape corresponding to the shape of a general camera module lens. This is to efficiently transfer heat energy to the entire surface of the dispensing solution applied to the lower side of the reinforcing bar.
In addition, the plurality of second faces 220 may meet corners of the first face 210 having a quadrangular shape.
The second surfaces 220 are configured to grip the side surfaces of the ribs, the upper surfaces of which are in contact with the first surfaces 210, and the hot cylinder 120 presses the module coated with the adhesive solution and the rib coupling structure, thereby preventing the rib coupling structure from being misaligned with each other. This can minimize the occurrence of final rejects of the produced camera modules.
In the embodiment shown in fig. 5, it is preferable that one second surface 221 of the plurality of second surfaces 220 is configured to be in contact with another second surface 222.
For example, if the one second surface 221 and the other second surface 222 are configured to face each other without contacting each other, the arrangement of the ribs and the modules may be misaligned on the side where the plurality of second surfaces 220 are not formed. The embodiment of fig. 5 is a structure for preventing the above-described problems to reduce the occurrence of defective products.
The foregoing has focused on a preferred embodiment thereof.
The embodiments described in the present specification and the configurations shown in the drawings relate to the most preferable one embodiment of the present invention, and do not represent the entire technical idea of the present invention, and it is understood that there may be various equivalents and modified examples that may replace them.
Therefore, the present invention is not limited to the embodiments disclosed, and those skilled in the art to which the present invention pertains can make various modifications and alterations within the scope of the technical idea of the present invention and the range equivalent to the technical idea described in the scope of the claims described below.
Claims (5)
1. A pulse heating power glue solution hardening heater including an arrangement board for hardening a glue solution coated on a camera module, comprising:
a heating unit (100) that generates heat energy to be transmitted to the camera module;
a moving unit disposed above the heating unit and configured to change a position of the heating unit;
a control unit that controls the heating unit and the moving unit; and
an arrangement plate (200) on which camera modules are arranged below the heating unit;
the heating section (100) further includes: a pulse heating cable (110) supplying thermal energy to the camera module; and a heat cylinder (120) incorporating the pulse heating cable at one side;
the upper surface of the arrangement plate (200) is in contact with the lower surface of the heat cylinder, and heat energy is supplied to the dispensing solution applied in the camera module disposed below the arrangement plate (200).
2. The pulsed heating power solution-dispensing hardening heater of claim 1,
when a camera module is brought into contact with the lower surface of the array plate (200), the control unit transmits a signal to the heating unit (100).
3. The pulsed heating power solution-dispensing hardening heater of claim 1,
the alignment plate (200) further comprises:
a quadrangular first surface (210) which is connected to the upper surface of the reinforcing rib; and a plurality of second faces (220) connected to a plurality of side faces of the reinforcing ribs;
the plurality of second faces (220) meet corners of the first face (210).
4. The pulsed heating power solution-dispensing hardening heater of claim 3,
the second surface (221) is configured to be in contact with at least the second surface (222).
5. The pulsed heating power solution-dispensing hardening heater of claim 1,
further comprising a vertical moving part (300) for changing the vertical position of the heat cylinder (120);
the heat cylinder (120) lowered by the vertical movement unit (300) is brought into contact with the alignment plate (300) to apply heat to the dispensing solution.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0014295 | 2019-02-07 | ||
| KR1020190014295A KR102191179B1 (en) | 2019-02-07 | 2019-02-07 | Pulse heater power dispensing solution with alignment plate curing heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111530716A true CN111530716A (en) | 2020-08-14 |
| CN111530716B CN111530716B (en) | 2022-08-02 |
Family
ID=71974864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910172603.2A Active CN111530716B (en) | 2019-02-07 | 2019-03-07 | Pulse heating power glue dispensing solution hardening heater comprising arrangement plate |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102191179B1 (en) |
| CN (1) | CN111530716B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR910017551U (en) * | 1990-03-17 | 1991-10-28 | 삼성항공산업 주식회사 | Aligner for chip mounting head |
| TW201248750A (en) * | 2011-05-27 | 2012-12-01 | Toray Eng Co Ltd | Mounting method and mounting device |
| CN106000822A (en) * | 2015-03-27 | 2016-10-12 | 株式会社思可林集团 | Drying device, coating forming system and method thereof |
| CN106971938A (en) * | 2015-10-30 | 2017-07-21 | 东京应化工业株式会社 | Substrate heating equipment and substrate heating method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4619209B2 (en) * | 2005-06-28 | 2011-01-26 | パナソニック株式会社 | Semiconductor element mounting method and semiconductor element mounting apparatus |
| KR100787857B1 (en) | 2006-06-02 | 2007-12-24 | 송욱일 | bonding apparatus of camera module and F-PCB by pulse heating |
| KR101387295B1 (en) * | 2012-05-14 | 2014-04-18 | 삼성전기주식회사 | Apparatus and Method for Manufacturing Camera Module |
| KR101343279B1 (en) * | 2012-08-20 | 2013-12-18 | 삼성전기주식회사 | Heater tip for camera module hot-bar |
-
2019
- 2019-02-07 KR KR1020190014295A patent/KR102191179B1/en active IP Right Grant
- 2019-03-07 CN CN201910172603.2A patent/CN111530716B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR910017551U (en) * | 1990-03-17 | 1991-10-28 | 삼성항공산업 주식회사 | Aligner for chip mounting head |
| TW201248750A (en) * | 2011-05-27 | 2012-12-01 | Toray Eng Co Ltd | Mounting method and mounting device |
| CN106000822A (en) * | 2015-03-27 | 2016-10-12 | 株式会社思可林集团 | Drying device, coating forming system and method thereof |
| CN106971938A (en) * | 2015-10-30 | 2017-07-21 | 东京应化工业株式会社 | Substrate heating equipment and substrate heating method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102191179B1 (en) | 2020-12-15 |
| KR20200097044A (en) | 2020-08-18 |
| CN111530716B (en) | 2022-08-02 |
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