CN111416488B - Processing method of red copper coil for special motor - Google Patents
Processing method of red copper coil for special motor Download PDFInfo
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- CN111416488B CN111416488B CN202010251879.2A CN202010251879A CN111416488B CN 111416488 B CN111416488 B CN 111416488B CN 202010251879 A CN202010251879 A CN 202010251879A CN 111416488 B CN111416488 B CN 111416488B
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- red copper
- copper coil
- plate
- processing method
- coil
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/04—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings, prior to mounting into machines
- H02K15/0407—Windings manufactured by etching, printing or stamping the complete coil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Abstract
The invention discloses a processing method of a red copper coil for a special motor, which is characterized in that a PCB (printed Circuit Board) manufacturing process is adopted to manufacture the red copper coil, firstly, a circuit graph of the red copper coil is designed, a plurality of copper wires are arranged in a rotating mode along 360 degrees to form a circuit graph with a small circle at the center and a large circle pattern at the periphery, and a film is drawn after sectional compensation is carried out on a graph line segment of a single copper wire on the circuit graph of the red copper coil; cutting and cutting a large copper plate, and removing a surface oxidation layer through an inner layer pretreatment line; and then drying, exposing, developing and etching the double-sided coated wet film to form a large red copper coil plate, and finally dividing the plate to form a single red copper coil unit plate. The invention is produced by using partial manufacture procedure of the PCB, the required copper wires are covered by the wet film, and the redundant copper is removed by chemical etching to form single copper wires arranged in a 360-degree rotation manner, so that the production efficiency is high, the cost is low relative to laser processing, and simultaneously, all parameters of a finished product completely meet the requirements of customers.
Description
Technical Field
The invention relates to a processing method of a red copper coil, in particular to a processing method of a red copper coil for a special motor.
Background
With the increasing demand of various special motor (flat motor) products and the gradual development towards high performance (such as light weight, small volume, sensitive acceleration and deceleration reaction, low energy consumption and the like), the internal traditional enameled wire coil can not meet the demand, and the red copper (pure copper) strip is well applied in the field because the red copper strip has the advantages of good electric conduction, heat conduction, plasticity and the like. The thickness of the red copper (pure copper) strip is between 0.2mm and 0.4mm (selected according to different motor powers), the line widths of all line sections are unequal, if the existing laser cutting is adopted, the reflection interference can be generated to laser along with the melting of copper in the cutting process, the line width dimensional tolerance of a finished product can be only controlled within the range of +0.2/-0.2mm, the line edges are not parallel and level, and unfixed position copper nodules can be generated, so that the use requirement can not be met, and the processing efficiency is extremely low.
Disclosure of Invention
In order to overcome the defects, the invention provides the processing method of the red copper coil for the special motor, and the red copper coil is processed by using partial manufacture procedure of a PCB (printed Circuit Board), so that not only can each performance index of the product meet the use requirement, but also the processing efficiency is greatly improved.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a processing method of a red copper coil for a special motor adopts a PCB manufacture procedure to manufacture the red copper coil, and specifically comprises the following steps:
step 1: designing a circuit pattern of the red copper coil, arranging a plurality of copper wires in a rotating mode along 360 degrees to form a circuit pattern with a small circle in the center and a large circle pattern on the periphery, and drawing a film after sectional compensation is carried out on a pattern line segment of a single copper wire on the circuit pattern of the red copper coil;
step 2: cutting a large copper plate with a corresponding size according to the size of the cut material, and removing a surface oxidation layer through an inner layer pretreatment line;
and step 3: transversely clamping the edges of the large copper plate by an inner-layer wet film coating machine, coating wet films on the two sides of the large copper plate, and drying;
and 4, step 4: erecting the films manufactured in the step 1 on the upper side surface and the lower side surface of the large copper plate by using a semi-automatic exposure machine, and then carrying out exposure operation;
and 5: developing and etching the exposed large copper plate, and adjusting corresponding etching speed according to different copper thicknesses during etching to form a large red copper coil plate containing a plurality of red copper coil unit plates;
step 6: and (4) manually dividing the plate, and cutting off the connecting copper wires between the plates of the large red copper coil plate to form a single red copper coil unit plate.
As a further improvement of the invention, in the step 1, the sectional compensation of the graphic line segment of the red copper coil is to add less compensation in the dense area with the spacing less than 0.015mm and add more compensation in the sparse area with the spacing more than 0.015 mm.
As a further improvement of the present invention, in step 1, the line segment of the pattern of the red copper coil is compensated by segments to be 0.025mm outward at two sides of the pattern of the red copper coil in the dense area, and 0.075mm outward at two sides of the pattern of the red copper coil in the sparse area.
As a further improvement of the invention, in the step 2, after the cut large copper plate is leveled, an inner layer pretreatment is performed to remove a surface oxide layer.
As a further improvement of the invention, in the step 4, a semi-automatic exposure machine is adopted for production, and the exposure operation is carried out after the alignment degree parameter is adjusted to +/-0.025mm when the upper film and the lower film are erected.
As a further improvement of the invention, in the step 5, the etching speed is 1.0-2.0 m/min.
As a further improvement of the invention, in the step 6, the plate is divided, and then packaged after being qualified by FQC inspection and FQA sampling inspection.
The invention has the beneficial effects that: the invention is produced by using partial manufacture procedure of the PCB, the required copper wires are covered by the wet film, and the redundant copper is removed by chemical etching to form single copper wires arranged in a 360-degree rotation manner, so that the production efficiency is high, the cost is low relative to laser processing, and simultaneously, all parameters of a finished product completely meet the requirements of customers.
Drawings
FIG. 1 is a supplementary view of a single red copper coil according to the present invention;
FIG. 2 is a schematic view of a single red copper coil according to the present invention;
FIG. 3 is a cut size diagram according to the present invention;
FIG. 4 is a schematic view of a large copper plate according to the present invention;
FIG. 5 is a schematic view showing the connection between the single copper plates according to the present invention;
fig. 6 is a schematic view of a monolithic red copper coil of the present invention.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
A processing method of a red copper coil for a special motor adopts a PCB manufacture procedure to manufacture the red copper coil, and specifically comprises the following steps:
a processing method of a red copper coil plate for a special motor comprises the following steps:
step 1: firstly, compensating the line segments of the graph in a segmented manner in a design stage (see figure 1), wherein the line width of each segment of a single line is gradually changed, less compensation (compensation of 0.025mm) is added in a dense area 1 with the distance smaller than 0.015mm, more compensation (compensation of 0.075mm) is added in a sparse area 2 with the distance larger than 0.015mm, and a special film for an inner exposure machine is drawn after the design is finished;
step 2: cutting large copper plates (shown in figure 3) with corresponding sizes according to the cutting size, properly leveling after cutting because the plates are provided in coils, and removing a surface oxidation layer through an inner layer pretreatment line;
and step 3: coating a wet film on an inner layer coating machine, wherein the edges of a transverse clamping plate are needed, and drying treatment is carried out after the wet film is coated on the two sides of the plate;
and 4, step 4: the semi-automatic exposure machine is adopted for production, when upper and lower films are erected, exposure operation is carried out after alignment parameters are adjusted to +/-0.025mm, and when the alignment precision deviation is large, the edges of etched lines are not parallel and level, so that the line width is influenced;
and 5: after the conventional parameter is imaged, special etching parameters (the etching speed is reduced to 1.5m/min, and the etched large plate is shown in figure 4) are adopted, the final line width and the line edge are adjusted to meet the requirements, the etching speed is a key influence parameter because the copper plate is thicker than the copper on the surface of the conventional plate and the non-reserved area needs to be etched through, and whether the line width of each section shown in figure 2 meets the requirements or not needs to be confirmed after etching;
step 6: manually separating plates, cutting connecting copper wires (shown in figure 5) between PCS (PCS) to form a delivery unit plate (a finished single PCS picture is shown in figure 3), wherein the unit is not damaged in the cutting process, the periphery is leveled, and packaging and delivery can be carried out after the FQC inspection and the FQA sampling inspection are qualified;
therefore, the invention is produced by applying partial manufacture procedure of the PCB, the required copper wires are covered by the wet film, the redundant copper is removed by chemical etching to form single copper wires (shown in figure 6) which are arranged in a 360-degree rotation manner, the production efficiency is high, the cost is low relative to laser processing, and all parameters of a finished product completely meet the requirements of customers.
In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. The foregoing description is only a preferred embodiment of the invention, which can be embodied in many different forms than described herein, and therefore the invention is not limited to the specific embodiments disclosed above. And that those skilled in the art may, using the methods and techniques disclosed above, make numerous possible variations and modifications to the disclosed embodiments, or modify equivalents thereof, without departing from the scope of the claimed embodiments. Any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (7)
1. A processing method of a red copper coil for a special motor is characterized in that a PCB manufacturing process is adopted to manufacture the red copper coil, and the processing method specifically comprises the following steps:
step 1: designing a circuit pattern of the red copper coil, arranging a plurality of copper wires in a rotating mode along 360 degrees to form a circuit pattern with a small circle in the center and a large circle pattern on the periphery, and drawing a film after sectional compensation is carried out on a pattern line segment of a single copper wire on the circuit pattern of the red copper coil;
step 2: cutting a large copper plate with a corresponding size according to the size of the cut material, and removing a surface oxidation layer through an inner layer pretreatment line;
and step 3: transversely clamping the edges of the large copper plate by an inner-layer wet film coating machine, coating wet films on the two sides of the large copper plate, and drying;
and 4, step 4: erecting the films manufactured in the step 1 on the upper side surface and the lower side surface of the large copper plate by using a semi-automatic exposure machine, and then carrying out exposure operation;
and 5: developing and etching the exposed large copper plate, and adjusting corresponding etching speed according to different copper thicknesses during etching to form a large red copper coil plate containing a plurality of red copper coil unit plates;
step 6: and (4) manually dividing the plate, and cutting off the connecting copper wires between the plates of the large red copper coil plate to form a single red copper coil unit plate.
2. The processing method of the red copper coil for the special motor according to claim 1, characterized in that: in the step 1, the sectional compensation of the graph line segments of the red copper coil is to add less compensation in a dense area with the spacing less than 0.015mm and add more compensation in a sparse area with the spacing more than 0.015 mm.
3. The processing method of the red copper coil for the special motor according to claim 2, characterized in that: in the step 1, the sectional compensation of the graph line segments of the red copper coil is that the two sides of the graph of the red copper coil in the dense area are outwardly compensated by 0.025mm, and the two sides of the graph of the red copper coil in the sparse area are outwardly compensated by 0.075 mm.
4. The processing method of the red copper coil for the special motor according to claim 1, characterized in that: and in the step 2, after the cut large copper plate is leveled, inner layer pretreatment is carried out to remove a surface oxide layer.
5. The processing method of the red copper coil for the special motor according to claim 1, characterized in that: in the step 4, a semi-automatic exposure machine is adopted for production, and exposure operation is carried out after the alignment degree parameter is adjusted to +/-0.025mm when the upper film and the lower film are erected.
6. The processing method of the red copper coil for the special motor according to claim 1, characterized in that: in the step 5, the etching speed is 1.0-2.0 m/min.
7. The processing method of the red copper coil for the special motor according to claim 1, characterized in that: and 6, packaging after the plates are subjected to FQC inspection and FQA spot inspection qualification after the plates are separated.
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CN111913072B (en) * | 2020-07-24 | 2023-01-03 | 胜宏科技(惠州)股份有限公司 | Method for identifying waste coil plate reporting |
CN113993285A (en) * | 2021-11-02 | 2022-01-28 | 恩达电路(深圳)有限公司 | Production method of low-resistance test coil circuit board |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6323532A (en) * | 1986-02-27 | 1988-01-30 | Hokuto Seisakusho:Kk | Armature coil for plane-opposition type motor |
JP4699961B2 (en) * | 2006-08-30 | 2011-06-15 | 本田技研工業株式会社 | Rotating electrical machine coil and manufacturing method thereof, and rotating electrical machine and manufacturing method thereof |
JP2013078189A (en) * | 2011-09-30 | 2013-04-25 | Hitachi Koki Co Ltd | Disk motor, electric working machine including the same, and method for adjusting balance of disk motor |
CN203119643U (en) * | 2013-02-07 | 2013-08-07 | 建准电机工业股份有限公司 | Thin stator and motor formed by same |
CN103348569A (en) * | 2011-01-31 | 2013-10-09 | 日立工机株式会社 | Disk motor, electric working machine including disk motor and method for manufacturing disk motor |
CN105792401A (en) * | 2014-12-23 | 2016-07-20 | 北京有色金属研究总院 | Induction coil and fabrication method thereof |
CN108141089A (en) * | 2015-10-02 | 2018-06-08 | 电路电机有限公司 | For controlling the structures and methods of the loss in printed circuit board |
-
2020
- 2020-04-01 CN CN202010251879.2A patent/CN111416488B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6323532A (en) * | 1986-02-27 | 1988-01-30 | Hokuto Seisakusho:Kk | Armature coil for plane-opposition type motor |
JP4699961B2 (en) * | 2006-08-30 | 2011-06-15 | 本田技研工業株式会社 | Rotating electrical machine coil and manufacturing method thereof, and rotating electrical machine and manufacturing method thereof |
CN103348569A (en) * | 2011-01-31 | 2013-10-09 | 日立工机株式会社 | Disk motor, electric working machine including disk motor and method for manufacturing disk motor |
JP2013078189A (en) * | 2011-09-30 | 2013-04-25 | Hitachi Koki Co Ltd | Disk motor, electric working machine including the same, and method for adjusting balance of disk motor |
CN203119643U (en) * | 2013-02-07 | 2013-08-07 | 建准电机工业股份有限公司 | Thin stator and motor formed by same |
CN105792401A (en) * | 2014-12-23 | 2016-07-20 | 北京有色金属研究总院 | Induction coil and fabrication method thereof |
CN108141089A (en) * | 2015-10-02 | 2018-06-08 | 电路电机有限公司 | For controlling the structures and methods of the loss in printed circuit board |
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