CN111370393A - Ultraviolet LED (light-emitting diode) sterilization and disinfection device and packaging preparation method thereof - Google Patents
Ultraviolet LED (light-emitting diode) sterilization and disinfection device and packaging preparation method thereof Download PDFInfo
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- CN111370393A CN111370393A CN202010289132.6A CN202010289132A CN111370393A CN 111370393 A CN111370393 A CN 111370393A CN 202010289132 A CN202010289132 A CN 202010289132A CN 111370393 A CN111370393 A CN 111370393A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
- A61L2/08—Radiation
- A61L2/10—Ultra-violet radiation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
- A61L2/26—Accessories or devices or components used for biocidal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2202/00—Aspects relating to methods or apparatus for disinfecting or sterilising materials or objects
- A61L2202/10—Apparatus features
- A61L2202/11—Apparatus for generating biocidal substances, e.g. vaporisers, UV lamps
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2202/00—Aspects relating to methods or apparatus for disinfecting or sterilising materials or objects
- A61L2202/10—Apparatus features
- A61L2202/14—Means for controlling sterilisation processes, data processing, presentation and storage means, e.g. sensors, controllers, programs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Animal Behavior & Ethology (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
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- Veterinary Medicine (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
Abstract
The invention discloses an ultraviolet LED sterilization and disinfection device and a packaging preparation method thereof, relating to the technical field of ultraviolet sterilization; the device comprises a ceramic substrate, wherein a groove is formed in the ceramic substrate, an ultraviolet light source is installed at the bottom of the groove, an infrared detector is arranged on one side of the ultraviolet light source, and the ultraviolet light source and the infrared detector are respectively connected with a circuit layer; the glass cover plate is laid on the top of the ceramic substrate, first metal layers are arranged at the bottoms of two ends of the glass cover plate, second metal layers are arranged at the tops of two ends of the groove of the ceramic substrate, and the first metal layers and the second metal layers are fixedly connected through solder layers. The ultraviolet LED sterilization and disinfection device provided by the invention is packaged by adopting a reflow soldering bonding technology, so that the glass cover plate and the ceramic substrate are good in welding effect, and the air tightness of device packaging is improved.
Description
Technical Field
The invention relates to the technical field of ultraviolet disinfection, in particular to an ultraviolet LED (light-emitting diode) sterilization and disinfection device and a packaging preparation method thereof.
Background
The ultraviolet disinfection technology is based on modern epidemic prevention science, medicine and photodynamics, and utilizes specially designed UVC wave band ultraviolet light with high efficiency, high intensity and long service life to irradiate flowing water so as to directly kill various bacteria, viruses, parasites, algae and other pathogens in the water. The working principle is that the molecular structures of DNA (deoxyribonucleic acid) and RNA (ribonucleic acid) of microbial cells are destroyed, so that growing cells and/or regenerative cells are killed, and the effects of sterilization and disinfection are achieved. Coronaviruses belong to single-stranded positive-strand RNA viruses, so ultraviolet rays in a wave band of 240nm to 280m are the most effective sterilization and disinfection wave band. UVCLED belongs to broad-spectrum sterilization, can effectively kill common virus and bacteria, and is a high-efficiency and convenient sterilization scheme. Compared with the traditional ultraviolet light source (high-pressure mercury lamp), the handheld UV sterilization and disinfection light source has the advantages of small size, high efficiency, long service life, portability and the like, the existing ultraviolet chip packaging generally uses epoxy resin for packaging, but the light-emitting efficiency of the LED is influenced because the epoxy resin is easily aged after being irradiated by ultraviolet light for a long time, so that the efficiency and the reliability of devices are influenced. The quartz glass is an inorganic material, has good light transmission, heat resistance, corrosion resistance and ultraviolet irradiation resistance, and is a good packaging material. When the quartz glass is used for packaging, the problem of fusion bonding between the quartz glass and the substrate must be solved.
Disclosure of Invention
The invention aims to provide an ultraviolet LED sterilization and disinfection device and a packaging preparation method thereof, which are used for solving the problems in the prior art, so that the glass cover plate and the ceramic substrate are good in welding effect, and the air tightness of device packaging is improved.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides an ultraviolet LED (light emitting diode) sterilization and disinfection device which comprises a ceramic substrate, wherein a groove is formed in the ceramic substrate, an ultraviolet light source is installed at the bottom of the groove, an infrared detector is arranged on one side of the ultraviolet light source, and the ultraviolet light source and the infrared detector are respectively connected with a circuit layer; the glass cover plate is laid on the top of the ceramic substrate, first metal layers are arranged at the bottoms of two ends of the glass cover plate, second metal layers are arranged at the tops of two ends of the groove of the ceramic substrate, and the first metal layers and the second metal layers are fixedly connected through solder layers.
Optionally, the ultraviolet light source includes a plurality of ultraviolet chips with a wavelength of 255nm to 285nm and a plurality of ultraviolet chips with a wavelength of 315nm to 385nm, which are arranged at intervals.
Optionally, the ceramic substrate is an aluminum nitride ceramic substrate; the glass cover plate is a quartz glass cover plate.
Optionally, the first metal layer is a gold or silver film, and the thickness is 70-150 nm.
Optionally, the second metal layer is a gold thin film, and the thickness of the second metal layer is 70-150 nm.
Optionally, the solder layer is disposed on the second metal layer, and the solder layer is made of Sn, CuSn, AgSn, or AuSn tin-based alloy and has a thickness of 20-50 μm.
Optionally, an inert protective layer is formed between the glass cover plate and the first metal layer through magnetron sputtering, and the inert protective layer is made of molybdenum or titanium.
The invention also provides a packaging preparation method of the ultraviolet LED sterilization and disinfection device, which comprises the following steps:
step one; fixing an ultraviolet chip in a groove of a ceramic substrate through a die bonding process; an infrared detector is arranged at the edge of the ultraviolet chip;
step two; the bottom of the groove is provided with a circuit layer which is connected with a conducting strip arranged on the ceramic substrate to realize the electrical connection with the outside; electrically connecting the circuit layer with the ultraviolet chip and the infrared detector respectively;
step three; arranging a first metal layer at the edge of the glass cover plate; firstly, preparing a layer of metal molybdenum or titanium with the thickness of 100nm-500nm on a glass cover plate as an inert protective layer by sputtering; then, arranging a first metal layer;
step four; arranging a second metal layer corresponding to the first metal layer on the top of the ceramic substrate; and a solder layer is arranged on the second metal layer;
step five; butting a first metal layer on the glass cover plate with a solder layer, and placing the glass cover plate on a reflow soldering platform;
step six; setting packaging parameters; and (4) raising the temperature linearly by reflow soldering to 280 ℃, and fixedly welding the first metal layer and the second metal layer to finish packaging.
Optionally, the method for preparing the first metal layer in step three includes the following steps:
cleaning a glass cover plate, removing oil stains and dust on the surface, and drying;
secondly, evaporating a layer of gold film on the surface of the glass cover plate, wherein the thickness of the gold film is 100 +/-10 nm;
and step three, etching the redundant metal to obtain the required first metal layer.
Compared with the prior art, the invention has the following technical effects:
the packaging method provided by the invention can be used for packaging UV-LEDs, other LEDs and OLEDs, and can effectively improve the air tightness of device packaging. Various wavelength integration schemes can be used for various sterilization and disinfection, and packaging technical schemes can be used for lighting packages.
According to the invention, the glass cover plate is used for replacing epoxy resin or silicon resin, and due to the characteristics of high temperature resistance and ultraviolet radiation resistance of glass, the risk of device failure caused by material aging due to the use of organic silicon materials is reduced. The metal solder layer is melted by the energy provided by reflow soldering, and the encapsulation airtightness is improved. The ultraviolet light is optimally matched, so that various viruses, bacteria, mites and the like can be eliminated, and the requirements of various wave bands in daily use can be met. The infrared detector intelligently detects a human body and can avoid injury caused by ultraviolet light irradiating the human body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic structural view of an ultraviolet LED sterilization and disinfection device of the present invention;
FIG. 2 is a schematic view of the structure of an ultraviolet light source of the ultraviolet LED sterilization device of the present invention;
wherein, 1 is a ceramic substrate, 2 is a groove, 3 is an ultraviolet light source, 4 is an infrared detector, 5 is a circuit layer, 6 is a glass cover plate, 7 is a first metal layer, 8 is a second metal layer, 9 is a solder layer, and 10 is an ultraviolet chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide an ultraviolet LED sterilization and disinfection device and a packaging preparation method thereof, which are used for solving the problems in the prior art, so that the glass cover plate and the ceramic substrate are good in welding effect, and the air tightness of device packaging is improved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The invention provides an ultraviolet LED sterilization and disinfection device and a packaging preparation method thereof, as shown in figures 1 and 2, the device comprises a ceramic substrate 1, a groove 2 is arranged on the ceramic substrate 1, an ultraviolet light source 3 is arranged at the bottom of the groove 2, an infrared detector 4 is arranged at one side of the ultraviolet light source 3, and the ultraviolet light source 3 and the infrared detector 4 are respectively and electrically connected with a circuit layer 5; a glass cover plate 6 is laid on the top of the ceramic substrate 1, first metal layers 7 are arranged at the bottoms of two ends of the glass cover plate 6, second metal layers 8 are arranged on the tops of two ends, located on the groove 2, of the ceramic substrate 1, the first metal layers 7 and the second metal layers 8 are fixedly connected through solder layers 9, the glass cover plate 6 is made of quartz glass or optical glass, the refractive index is 1.45-1.55, the ultraviolet band transmittance is greater than 80%, and the ceramic substrate 1 is made of an aluminum nitride ceramic substrate; prepare the metal level on glass apron 6 during processing, through the butt fusion of reflow soldering equipment with glass apron 6 and ceramic substrate 1, have the metallic coating on the ceramic substrate 1, realize glass apron 6 and the inseparable butt fusion of ceramic substrate 1, improve the gas tightness of device.
When the device of the present invention is manufactured, the glass cover plate 6 and the ceramic substrate 1 are welded together by a reflow soldering apparatus. Firstly, a layer of metal molybdenum is prepared on the glass cover plate 6 as an inert protective layer through sputtering, and then a layer of gold film is plated on the surface of the glass cover plate 6 as a first metal layer 7 by utilizing methods such as magnetron sputtering, vacuum evaporation, chemical plating and the like. The first metal layer 7 can be a gold or silver film with the thickness of 70-150nm, the second metal layer 8 can be prepared by the same method as the first metal layer 7, can be obtained by magnetron sputtering, vacuum evaporation, chemical plating and the like, can be a silver or gold film, and the invention selects the gold film which has stable chemical property, corrosion resistance and good ductility and is a good choice for film materials. The thickness of the metal film is 70-150 nm. A plurality of ultraviolet chips 10 with different wave bands are fixed in the groove 2 of the ceramic substrate 1 through a die bonding process to form an ultraviolet light source 3. The circuit layer 5 is connected to a conductive sheet provided on the ceramic substrate 1, and electrically connected to the outside. The ultraviolet chip 10 is formed by connecting gold wires to the circuit layer 5 by gold wire bonding technology. The ultraviolet light source 3 is composed of a plurality of ultraviolet chips with the wave band of 255 nm-285 nm and used for sterilization and disinfection, an ultraviolet chip with the wave band of 315 nm-385 nm and used for mite removal and a chip with the wave band of 530nm and used for indication.
The light emitting surface of the ultraviolet light source 3 is provided with a human body infrared detector, the human body is intelligently detected, when the infrared detector 4 detects the human body, the internal sensor can automatically close the power supply of the ultraviolet light source 3, and the ultraviolet light is prevented from damaging the human body. Plating a solder layer 9 on the surface of the second metal layer 8, wherein the solder layer is made of Sn, CuSn, AgSn, AuSn and other tin-based alloys, and the thickness of the solder layer is 20-50 μm. The solder layer 9 is melted by heating with a reflow soldering device, and the glass cover plate 6 and the ceramic substrate 1 are welded together. After all the metal layers are manufactured, annealing heat treatment needs to be carried out on the film to eliminate the thermal stress of the interface.
The invention totally adopts inorganic materials, uses quartz glass to replace epoxy resin, and reduces the failure caused by the aging of the epoxy resin. The metal layer is arranged on the surface of the glass and the surface of the ceramic, and the reflow soldering equipment is used for realizing welding, so that bubbles at a welding interface are reduced, and the moisture resistance and the air tightness of the device are improved. Meanwhile, an ultraviolet light source is formed by combining uvc and uvb ultraviolet chips, the wave band is wide, formaldehyde, benzene and xylene in the air of an office and viruses, bacteria and peculiar smell in the air of a daily office can be effectively removed, virus infection is prevented, and disease transmission is reduced. An infrared detector is arranged, ultraviolet light can be detected to face a human body, an ultraviolet light source is automatically turned off, and unnecessary damage is reduced.
The principle and the implementation mode of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (9)
1. An ultraviolet LED sterilization and disinfection device is characterized in that: the ultraviolet detector comprises a ceramic substrate, wherein a groove is formed in the ceramic substrate, an ultraviolet light source is installed at the bottom of the groove, an infrared detector is arranged on one side of the ultraviolet light source, and the ultraviolet light source and the infrared detector are respectively connected with a circuit layer; the glass cover plate is laid on the top of the ceramic substrate, first metal layers are arranged at the bottoms of two ends of the glass cover plate, second metal layers are arranged at the tops of two ends of the groove of the ceramic substrate, and the first metal layers and the second metal layers are fixedly connected through solder layers.
2. The ultraviolet LED germicidal device as claimed in claim 1 wherein: the ultraviolet light source comprises a plurality of ultraviolet chips with the wave band of 255 nm-285 nm and a plurality of ultraviolet chips with the wave band of 315 nm-385 nm which are arranged at intervals.
3. The ultraviolet LED germicidal device as claimed in claim 1 wherein: the ceramic substrate is an aluminum nitride ceramic substrate; the glass cover plate is a quartz glass cover plate.
4. The ultraviolet LED germicidal device as claimed in claim 1 wherein: the first metal layer is a gold or silver film, and the thickness of the first metal layer is 70-150 nm.
5. The ultraviolet LED germicidal device as claimed in claim 1 wherein: the second metal layer is a gold film with the thickness of 70-150 nm.
6. The ultraviolet LED germicidal device as claimed in claim 1 wherein: the solder layer is arranged on the second metal layer, the solder layer is made of Sn, CuSn, AgSn or AuSn tin-based alloy, and the thickness of the solder layer is 20-50 mu m.
7. The ultraviolet LED germicidal device as claimed in claim 1 wherein: an inert protective layer is formed between the glass cover plate and the first metal layer through magnetron sputtering, and the inert protective layer is made of molybdenum or titanium.
8. A packaging preparation method of an ultraviolet LED sterilization and disinfection device is characterized by comprising the following steps: the method comprises the following steps:
step one; fixing an ultraviolet chip in a groove of a ceramic substrate through a die bonding process; an infrared detector is arranged at the edge of the ultraviolet chip;
step two; the bottom of the groove is provided with a circuit layer which is connected with a conducting strip arranged on the ceramic substrate to realize the electrical connection with the outside; electrically connecting the circuit layer with the ultraviolet chip and the infrared detector respectively;
step three; arranging a first metal layer at the edge of the glass cover plate; firstly, preparing a layer of metal molybdenum or titanium with the thickness of 100nm-500nm on a glass cover plate as an inert protective layer by sputtering; then, arranging a first metal layer;
step four; arranging a second metal layer corresponding to the first metal layer on the top of the ceramic substrate; and a solder layer is arranged on the second metal layer;
step five; butting a first metal layer on the glass cover plate with a solder layer, and placing the glass cover plate on a reflow soldering platform;
step six; setting packaging parameters; and (4) raising the temperature linearly by reflow soldering to 280 ℃, and fixedly welding the first metal layer and the second metal layer to finish packaging.
9. The ultraviolet LED sterilization and disinfection device package preparation method of claim 8, wherein: the preparation method of the first metal layer in the third step comprises the following steps:
cleaning a glass cover plate, removing oil stains and dust on the surface, and drying;
secondly, evaporating a layer of gold film on the surface of the glass cover plate, wherein the thickness of the gold film is 100 +/-10 nm;
and step three, etching the redundant metal to obtain the required first metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289132.6A CN111370393A (en) | 2020-04-14 | 2020-04-14 | Ultraviolet LED (light-emitting diode) sterilization and disinfection device and packaging preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289132.6A CN111370393A (en) | 2020-04-14 | 2020-04-14 | Ultraviolet LED (light-emitting diode) sterilization and disinfection device and packaging preparation method thereof |
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| CN111370393A true CN111370393A (en) | 2020-07-03 |
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| CN202010289132.6A Pending CN111370393A (en) | 2020-04-14 | 2020-04-14 | Ultraviolet LED (light-emitting diode) sterilization and disinfection device and packaging preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202198889U (en) * | 2011-08-25 | 2012-04-25 | 佛山柯维光电股份有限公司 | Multifunctional LED (Light Emitting Diode) ultraviolet air disinfection device |
| CN204468756U (en) * | 2014-12-14 | 2015-07-15 | 徐子强 | A kind of disinfection by ultraviolet light desk lamp with infrared human body induction controlling functions |
| CN105870028A (en) * | 2016-06-16 | 2016-08-17 | 电子科技大学 | Molybdenum and silicon substrate welding method in field emission device |
| CN106997879A (en) * | 2017-03-21 | 2017-08-01 | 江苏稳润光电有限公司 | A kind of adjustable ultraviolet leds and preparation method |
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| CN109640443A (en) * | 2018-12-14 | 2019-04-16 | 中国科学院苏州生物医学工程技术研究所 | A kind of Healthy Lighting lamps and lanterns and Healthy Lighting method |
| CN209638887U (en) * | 2019-05-14 | 2019-11-15 | 湖南翔拓新创实业有限公司 | A kind of lamp bar with sterilizing function |
-
2020
- 2020-04-14 CN CN202010289132.6A patent/CN111370393A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202198889U (en) * | 2011-08-25 | 2012-04-25 | 佛山柯维光电股份有限公司 | Multifunctional LED (Light Emitting Diode) ultraviolet air disinfection device |
| CN204468756U (en) * | 2014-12-14 | 2015-07-15 | 徐子强 | A kind of disinfection by ultraviolet light desk lamp with infrared human body induction controlling functions |
| CN105870028A (en) * | 2016-06-16 | 2016-08-17 | 电子科技大学 | Molybdenum and silicon substrate welding method in field emission device |
| CN106997879A (en) * | 2017-03-21 | 2017-08-01 | 江苏稳润光电有限公司 | A kind of adjustable ultraviolet leds and preparation method |
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| CN109640443A (en) * | 2018-12-14 | 2019-04-16 | 中国科学院苏州生物医学工程技术研究所 | A kind of Healthy Lighting lamps and lanterns and Healthy Lighting method |
| CN209638887U (en) * | 2019-05-14 | 2019-11-15 | 湖南翔拓新创实业有限公司 | A kind of lamp bar with sterilizing function |
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