CN101459086A - Encapsulation method and encapsulation construction for organic light emitting display device - Google Patents
Encapsulation method and encapsulation construction for organic light emitting display device Download PDFInfo
- Publication number
- CN101459086A CN101459086A CNA2008101917722A CN200810191772A CN101459086A CN 101459086 A CN101459086 A CN 101459086A CN A2008101917722 A CNA2008101917722 A CN A2008101917722A CN 200810191772 A CN200810191772 A CN 200810191772A CN 101459086 A CN101459086 A CN 101459086A
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- Prior art keywords
- organic light
- emitting display
- packaging plastic
- display device
- packing
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000005538 encapsulation Methods 0.000 title claims description 29
- 238000010276 construction Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- 239000002346 layers by function Substances 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 21
- 238000012856 packing Methods 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a packaging structure and a method of an organic luminous display device, the packaging structure of the organic luminous display device manufactured by the method can completely isolate erosion of outside water vapor and oxygen to parts of wires in a luminous area of the display device, a second packaging adhesive layer and a third packaging adhesive layer effectively recover a clearance between a packaging cover and a luminous layer, thereby effectively avoiding a screen and exposed lead wires being affected by water and oxygen in the environment during using and storing process, and simultaneously strengthening the capacity of avoiding each luminous functional layer of the screen being broken by water and oxygen.
Description
Technical field
The present invention relates to a kind of method for packing and encapsulating structure, particularly a kind of method for packing of organic light-emitting display device and encapsulating structure.
Background technology
A series of advantages such as display of organic electroluminescence (OLED) has from main light emission, low-voltage DC driven, solidifies entirely, the visual angle is wide, color is abundant have broad application prospects.Its basic structure is: a rigidity or flexible base, board, and position, luminous zone forms each layers such as anode, organic luminous layer, negative electrode successively on it, and anode, negative electrode rely in the non-light-emitting area position and draw, and focus on one side or a few limit, carry out nation with chip for driving and decide.In addition, because OLED is along with increase service time, aqueous vapor in the environment and oxygen are easy to infiltrate in the display device, make peel off between metal electrode and the organic luminous layer, material cracking and anodizing, and then the generation dim spot, this can significantly reduce luminescent quality such as the luminous intensity of display device and the luminous uniformity.Generally speaking, on the glass substrate of OLED display device, finish after the evaporation processing procedure of metal electrode and organic light emission body thin film, can be with the element of base plate for packaging packaged glass substrate surface.
With reference to shown in Figure 1, be the generalized section of the encapsulating structure of traditional OLED display device.The OLED display device includes a glass substrate 1, and a base plate for packaging 2 is that cementability by adhesive layer 7 engages with glass substrate, and then is packaged into a confined space.Glass substrate 1 surface is gone up the luminous zone and is included a laminate, is to constitute via an anode conductive layer, a luminous organic material layer (not shown) and a cathodic metal layer (not shown), and non-light-emitting area is contact conductor 4 cabling districts.Wherein, base plate for packaging 2 is to adopt metal or the glass material slightly littler than glass substrate 1 area made, can encapsulate laminate, only exposes preparation in order to the contact conductor 4 fixed with chip for driving 9 nations.
The encapsulation finish after to binding procedure, the packaging plastic outer inevitably is subjected to the pollution of steam, oxygen, metal ion or all the other foreign ions to binding between the zone exposed that part of metal lead wire and ITO lead-in wire, and existing cleaning means is difficult to reach a desirable effect, even the later stage uses fluid sealant all to cover, also can cause lead-in wire to burn or short circuit in the later stage.
Summary of the invention
The purpose of this invention is to provide and a kind ofly effectively reduce or avoid to go between, increase the service life the method for packing of the organic light-emitting display device that reduces cost because the burn into short circuit that steam and oxygen cause in the environment or burn improves display quality.
Another object of the present invention provide a kind of avoid shielding external dew lead-in wire use and storing process in be subjected to the influence of water oxygen in the environment, strengthen the encapsulating structure of organic light-emitting display device that luminous each functional layer of screen body is avoided the ability of water oxygen destruction simultaneously.
The objective of the invention is to be achieved by the following technical programs: method for packing of the present invention may further comprise the steps: at first, subregion at screen luminous each functional layer side surface of body and conductive lead wire covers first packaging plastic according to program, and the periphery of first packaging plastic covers second packaging plastic; Then cap is covered on luminous zone and first, second packaging plastic, carry out chip nation after a series of processes of encapsulate shielding body then, solidify, dry by the fire the back, cutting, detect and decide; At last the 3rd packaging plastic is covered on the zone that lead-in wire is not capped.
In the described method for packing, the described first packaging plastic material is an optic-solidified adhesive, is preferably UV epoxy encapsulation glue.
In the described method for packing, described second packaging plastic is a heat-curable glue.
In the described method for packing, described first packaging plastic solidifies in the solidification process of step 2.
In the described method for packing, described second packaging plastic solidifies in the back baking process of step 2.
In the described method for packing, described the 3rd packaging plastic is UV packaging plastic or heat-curable glue.
In the described method for packing, apply first packaging plastic and second packaging plastic in the described step simultaneously, and pressing.
In the described method for packing, first packaging plastic is identical with the height of second packaging plastic in the described step.
Another object of the present invention is achieved by the following technical programs: encapsulating structure of the present invention comprises:
Substrate;
The chip that nation is fixed;
Luminescent layer: constitute by luminous each functional layer;
Conductive lead wire: connect the lead of cathode and anode and chip, be stacked on the substrate outside the luminous zone;
The first encapsulation glue-line: cover on lead-in wire and luminescent layer side surface and the conductive lead wire;
The second encapsulation glue-line: cover on the first encapsulation glue-line periphery and the conductive lead wire;
The 3rd encapsulation glue-line: the zone that is not capped on the coating electrically conductive lead-in wire;
Cap: cover on luminescent layer and first, second encapsulation glue-line.
In the described encapsulating structure, the described first adhesive layer material is an optic-solidified adhesive, is preferably UV epoxy encapsulation glue.
In the described encapsulating structure, the described second adhesive layer material is a heat-curable glue.
In the described encapsulating structure, the fringe region of the described second encapsulation glue-line adhesion bond package lid.
In the described encapsulating structure, described luminescent layer engages with substrate.
In the described encapsulating structure, described lead-in wire engages with substrate.
In the described encapsulating structure, the described first encapsulation glue-line keeps identical height with the second encapsulation glue-line.
Encapsulating structure by preparation organic light-emitting display device of the present invention, can completely cut off external steam and oxygen fully corrodes the part lead generation of display unit luminous zone, the second encapsulation glue-line and the 3rd encapsulation glue-line have effectively remedied the slit between cap and the luminescent layer, thereby effectively avoid shielding body and exposed lead wires thereof use and storing process in be subjected to the influence of water oxygen in the environment, strengthen the ability that luminous each functional layer of screen body is avoided water oxygen destruction simultaneously.
Description of drawings
Fig. 1 is this routine screen body cross-sectional view;
Fig. 2 is the screen body cross-sectional view after one embodiment of the invention coating protective layer;
Fig. 3 is the screen body structure schematic diagram after one embodiment of the invention coating protective layer.
Among the figure:
1-glass substrate, 2-base plate for packaging, 3-anode, 4-contact conductor, 5-organic function layer, 6-negative electrode, 7-the first packaging plastic, 8-the second packaging plastic, 9-chip, 10-the three layer of packaging plastic.
Embodiment
The present invention will be further described below in conjunction with drawings and Examples, and for convenience of description, embodiment is example with the organic elctroluminescent device.
With reference to Fig. 2,3.The present embodiment device architecture is glass substrate 1/ anode 3 (ITO)/contact conductor 4 (Gr)/organic function layer 5/ negative electrode 6 (Al), is the base plate for packaging 2 of fitting with glass substrate 1 afterwards.Present embodiment contact conductor 4 is monolateral drawing, and promptly the binding district of all anode taps and all cathode legs is all on same one side of glass substrate 1.
Present embodiment organic elctroluminescent device manufacturing process is:
Import package cavity into preparing the glass substrate 1 of finishing complete ITO 3 and chromium lead-in wire figure 4, organic layer 5, negative electrode 6, wait for and base plate for packaging 2 encapsulation of fitting.With base plate for packaging to be packaged 2 package position coating one circle first packaging plastic 7 (UV epoxy encapsulation glue), be coated with a circle second packaging plastic 8 heat-curable epoxy resin glue again in its periphery, the glue amount of two kinds of glue of control guarantees that the height of two-layer glue is identical.
Import this base plate for packaging 2 into package cavity, with glass substrate 1 and base plate for packaging 2 location that are coated with packaging plastic 7,8, when treating two applyings, also be provided with mask plate on the substrate 1, luminous zone in correspondence is provided with the barrier layer, prevent that ultraviolet light from damaging the luminous zone, shine UV light afterwards, make the adhesive curing of UV epoxy encapsulation.Afterwards whole screen body is dried, simultaneously, the heat-curable glue in external week of screen is solidified, the screen body after the baking and curing is placed on the Cutting platform, the device of finishing the encapsulation applying is carried out cutting action.With the double layer substrate after bonding 1,2 according to cell size from carrying out the cutter cut between the unit, after power is beaten in spreading, breaking the disconnected independent unit that is separated into off with the fingers and thumb.The binding of shielding body and chip for driving 9 afterwards at first is affixed on the anisotropy conductiving glue bar screen body binding district, with the lead-in wire and the screen body of chip for driving 9 or printed circuit board (PCB) go between 4 contrapositions, add thermo-compressed, realize the binding of screen body and chip 9.The 3rd packaging plastic 10 (silica gel) is coated around nation decides chip and screen body contact, reached between the exposed lead wires, to cover exposed lead wires, more perfect avoiding goes between and exposes the influences such as corrosion that brought.
Though more than described most preferred embodiment of the present invention, technical scope of the present invention is not limited to the scope of above-mentioned discussion.The above-mentioned embodiment that provides just only is used for further explaining the present invention on the basis of summary of the invention.It should be understood that those skilled in the art can make multiple improvement to said process, but this all class improvement belongs to all in the scope of the present invention also.
Claims (14)
1, a kind of method for packing of organic light-emitting display device is characterized in that said method comprising the steps of:
Step 1: at first cover first packaging plastic in the subregion of screen luminous each functional layer side surface of body and conductive lead wire according to program, the periphery of first packaging plastic covers second packaging plastic;
Step 2: cap is covered on luminous zone and first, second packaging plastic, carry out chip nation after a series of processes of encapsulate shielding body then, solidify, dry by the fire the back, cutting, detect and decide;
Step 3: at last the 3rd packaging plastic is covered on the zone that lead-in wire is not capped.
2, the method for packing of a kind of organic light-emitting display device according to claim 1 is characterized in that: the described first packaging plastic material is optic-solidified adhesive, UV epoxy encapsulation glue.
3, the method for packing of a kind of organic light-emitting display device according to claim 1 is characterized in that: described second packaging plastic is a heat-curable glue.
4, the method for packing of a kind of organic light-emitting display device according to claim 1 and 2 is characterized in that: described first packaging plastic solidifies in the solidification process of step 2.
5, according to the method for packing of claim 1 or 3 described a kind of organic light-emitting display devices, it is characterized in that: described second packaging plastic solidifies in the back baking process of step 2.
6, the method for packing of a kind of organic light-emitting display device according to claim 1 is characterized in that: described the 3rd packaging plastic is UV packaging plastic, heat-curable glue.
7, the method for packing of a kind of organic light-emitting display device according to claim 1 is characterized in that: apply first packaging plastic and second packaging plastic in the described step 1 simultaneously, and pressing.
8, the method for packing of a kind of organic light-emitting display device according to claim 1 is characterized in that: first packaging plastic is identical with the height of second packaging plastic in the described step 1.
9, a kind of encapsulating structure of organic light-emitting display device is characterized in that comprising:
Substrate;
The chip that nation is fixed;
Luminescent layer: constitute by luminous each functional layer;
Conductive lead wire: connect the lead of cathode and anode and chip, be stacked on the outer substrate of luminescent layer;
The first encapsulation glue-line: cover on lead-in wire and luminescent layer side surface and the conductive lead wire;
The second encapsulation glue-line: cover on the first encapsulation glue-line periphery and the conductive lead wire;
The 3rd encapsulation glue-line: the zone that is not capped on the coating electrically conductive lead-in wire;
Cap: cover on luminescent layer and first, second encapsulation glue-line.
10, according to the encapsulating structure of claim 9 described a kind of organic light-emitting display devices, it is characterized in that: the described first adhesive layer material is optic-solidified adhesive, UV epoxy encapsulation glue.
11, according to the encapsulating structure of claim 9 described a kind of organic light-emitting display devices, it is characterized in that: the described second adhesive layer material is a heat-curable glue.
12, according to the encapsulating structure of claim 9 described a kind of organic light-emitting display devices, it is characterized in that: the fringe region of the described second encapsulation glue-line adhesion bond package lid.
13, according to the encapsulating structure of claim 9 described a kind of organic light-emitting display devices, it is characterized in that: described luminescent layer, conductive lead wire engage with substrate.
14, according to the encapsulating structure of claim 9 described a kind of organic light-emitting display devices, it is characterized in that: the described first encapsulation glue-line keeps identical height with the second encapsulation glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101917722A CN101459086A (en) | 2008-08-20 | 2008-12-31 | Encapsulation method and encapsulation construction for organic light emitting display device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810124653.5 | 2008-08-20 | ||
| CN200810124653 | 2008-08-20 | ||
| CNA2008101917722A CN101459086A (en) | 2008-08-20 | 2008-12-31 | Encapsulation method and encapsulation construction for organic light emitting display device |
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| Publication Number | Publication Date |
|---|---|
| CN101459086A true CN101459086A (en) | 2009-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008101917722A Pending CN101459086A (en) | 2008-08-20 | 2008-12-31 | Encapsulation method and encapsulation construction for organic light emitting display device |
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| CN (1) | CN101459086A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617007A (en) * | 2015-01-23 | 2015-05-13 | 京东方科技集团股份有限公司 | Method, mother board and mask board for improving accuracy of package resin pattern tightness testing |
| WO2020073312A1 (en) * | 2018-10-12 | 2020-04-16 | 深圳市柔宇科技有限公司 | Display device, electronic device, and manufacturing method for display device |
| CN112234093A (en) * | 2020-10-30 | 2021-01-15 | Oppo广东移动通信有限公司 | Display screen module manufacturing method, display screen module and electronic device |
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114388710A (en) * | 2021-12-31 | 2022-04-22 | 北京翌光医疗科技研究院有限公司 | Three-dimensional OLED device and preparation method thereof |
-
2008
- 2008-12-31 CN CNA2008101917722A patent/CN101459086A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617007A (en) * | 2015-01-23 | 2015-05-13 | 京东方科技集团股份有限公司 | Method, mother board and mask board for improving accuracy of package resin pattern tightness testing |
| CN104617007B (en) * | 2015-01-23 | 2017-08-01 | 京东方科技集团股份有限公司 | Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy |
| WO2020073312A1 (en) * | 2018-10-12 | 2020-04-16 | 深圳市柔宇科技有限公司 | Display device, electronic device, and manufacturing method for display device |
| CN112234093A (en) * | 2020-10-30 | 2021-01-15 | Oppo广东移动通信有限公司 | Display screen module manufacturing method, display screen module and electronic device |
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114360371B (en) * | 2021-11-30 | 2023-11-07 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114388710A (en) * | 2021-12-31 | 2022-04-22 | 北京翌光医疗科技研究院有限公司 | Three-dimensional OLED device and preparation method thereof |
| CN114388710B (en) * | 2021-12-31 | 2024-03-19 | 北京翌光医疗科技研究院有限公司 | Three-dimensional OLED device and preparation method thereof |
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Open date: 20090617 |