CN104617007B - Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy - Google Patents
Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy Download PDFInfo
- Publication number
- CN104617007B CN104617007B CN201510037382.XA CN201510037382A CN104617007B CN 104617007 B CN104617007 B CN 104617007B CN 201510037382 A CN201510037382 A CN 201510037382A CN 104617007 B CN104617007 B CN 104617007B
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- Prior art keywords
- glue pattern
- sealing
- motherboard
- source
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 91
- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000004033 plastic Substances 0.000 title claims abstract description 20
- 229920003023 plastic Polymers 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 87
- 238000003466 welding Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 13
- 239000005357 flat glass Substances 0.000 description 13
- 238000004513 sizing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 101150097440 PADI6 gene Proteins 0.000 description 1
- 102100035732 Protein-arginine deiminase type-6 Human genes 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a kind of method for improving packaging plastic pattern-sealing property test accuracy, in this method, when making motherboard, form the source and drain lead for being pointed to welding disking area to carry out sealedly sealing glue pattern, the substrate and cover plate of the sealing glue pattern and the motherboard are collectively forming for carrying out sealed annular seal space to source and drain lead；When the cover plate to motherboard to be tested is cut, retain the cover plate of sealing cavity region.So, the test plate (panel) to be measured that method by the present invention is obtained is put into after hot and humid environment, because the source and drain lead of welding disking area is sealed by annular seal space, source and drain lead can be avoided to be corroded, and then avoid the interference tested by the disturbing factor produced by the corrosion that glue pattern is encapsulated caused by the corrosion of source and drain lead pattern-sealing property of packaging plastic, it is possible to increase the accuracy of pattern-sealing property of packaging plastic test.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of side for improving packaging plastic pattern-sealing property test accuracy
Method, motherboard and mask plate.
Background technology
The main component of Frit (glass paste) sizing material is glass dust, and the seamless sealing-in between glass and glass can be achieved
And good seal performance, and Frit encapsulation does not need drier, goes for top emitting OLED (organic electroluminescent) display
Part, therefore Frit encapsulation is the current method for packing being relatively applicable.
, it is necessary to trust to selected Frit sizing materials and packaging technology during OLED display device is made
Property test, with test made under selected sizing material and packaging technology encapsulation glue pattern sealing.It is general, be by
Corresponding to being placed in after the cover plate excision of welding disking area in hot and humid environment in made OLED motherboards, pass through pad area afterwards
The contraction situation of the sealed pixel of PAD tests encapsulation glue pattern institute in domain.As shown in figure 1, to be put into hot and humid environment
The top view of one of panel in the OLED motherboards tested, including base plate glass and cover-plate glass 1 be base plate glass and
The laminating of cover-plate glass, and formed in base plate glass and the pixel region A/A of cover-plate glass, for entering to pixel region A/A
Row sealedly encapsulates glue pattern 2, the welding disking area outside encapsulation glue pattern 2, and integrated circuit is formed with the welding disking area
3rd, source and drain lead 4, flexible flat cable (Flexible Flat Cable, FPC) 5, PAD 6, wherein in the welding disking area
The cover-plate glass of top is removed.When being tested, corresponding signal is applied on the PAD 6 being exposed, to test
The contraction situation of pixel in pixel region A/A.
Test mode of the prior art can cause the source and drain lead of welding disking area to be corroded, and the corrosion meeting of source and drain lead
Frit packaging plastics are further resulted in be corroded, so that extraneous steam enters pixel region and causes pixel shrinkage, and it is this
Situation can't occur when OLED display device is actually used, thus cause the accuracy of the evaluation to Frit glue relatively low.
The content of the invention
It is an object of the invention to provide a kind of method that can improve packaging plastic pattern-sealing property test accuracy, motherboard
And mask plate.
The invention provides a kind of method for improving packaging plastic pattern-sealing property test accuracy, the encapsulation glue pattern is used
It is packaged in viewing area, including：
When making motherboard to be tested, form the source and drain lead for being pointed to welding disking area and carry out sealed fluid sealant
The substrate and cover plate of figure, the sealing glue pattern and the motherboard are collectively forming for sealedly being sealed to source and drain lead
Chamber；
When the cover plate to motherboard to be tested is cut, retain the cover plate of sealing cavity region.
Further, the sealing glue pattern is made by ultraviolet cured adhesive material；
After being formed for the sealing glue pattern to source and drain lead-in wire sealing, methods described also includes：Use ultraviolet light pair
The sealing glue pattern that ultraviolet cured adhesive material makes is irradiated solidification, and mask plate shielding viewing area is used in irradiation.
Further, the sealing glue pattern is connected with the encapsulation glue pattern.
Further, it is described to be formed for the sealing glue pattern to source and drain lead-in wire sealing, including：
The formation of coating fluid sealant seals glue pattern on the cover board.
Further, the encapsulation glue pattern is formed by glass cement.
Further, the sealing glue pattern is additionally operable to seal flexible flat cable.
Present invention also offers a kind of motherboard, including substrate and cover plate and the use that is formed between the substrate and cover plate
In the encapsulation glue pattern for being packaged viewing area, also include being used to be pointed to welding disking area between the substrate and cover plate
Source and drain lead carry out sealedly sealing glue pattern, the substrate and cover plate of the sealing glue pattern and the motherboard are collectively forming use
In to the sealed annular seal space of source and drain lead progress.
Further, the sealing glue pattern is made by ultraviolet cured adhesive.
Further, the sealing glue pattern is connected with the encapsulation glue pattern.
Further, the encapsulation glue pattern is formed by glass cement.
Further, in addition to：Flexible flat cable, the sealing glue pattern is additionally operable to seal flexible flat cable.
Present invention also offers a kind of mask plate, including the sealing glue pattern in motherboard described in any of the above-described is corresponding
Transmission region.
In the method that the present invention is provided, when making motherboard, form the source and drain lead for being pointed to welding disking area and carry out
The substrate and cover plate of sealed sealing glue pattern, the sealing glue pattern and the motherboard are collectively forming for entering to source and drain lead
The sealed annular seal space of row；When the cover plate to motherboard to be tested is cut, retain the cover plate of sealing cavity region.So, will
The test plate (panel) to be measured obtained by the method for the present invention is put into after hot and humid environment, because the source and drain lead of welding disking area is close
Chamber sealing is sealed, source and drain lead can be avoided to be corroded, and then avoids the encapsulation glue pattern caused by the corrosion of source and drain lead
The interference that disturbing factor produced by corrosion is tested pattern-sealing property of packaging plastic, it is possible to increase pattern-sealing property of packaging plastic is tested
Accuracy.
Brief description of the drawings
Fig. 1 is in the prior art for the structural representation for the test plate (panel) to be measured for testing pattern-sealing property of packaging plastic；
A kind of stream of the method for raising packaging plastic pattern-sealing property test accuracy that Fig. 2 provides for one embodiment of the invention
Journey schematic diagram；
The structural representation for being used to test the test plate (panel) to be measured of pattern-sealing property of packaging plastic that Fig. 3 provides for one embodiment of the invention
Figure；
Fig. 4 is the schematic diagram of sealing glue pattern in Fig. 3；
The structural representation for the mask plate that Fig. 5 provides for the present invention.
Embodiment
With reference to the accompanying drawings and examples, the embodiment to the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
As shown in figure 1, a kind of raising packaging plastic the pattern-sealing property test accuracy provided for one embodiment of the invention
Method, encapsulation glue pattern here is used to be packaged viewing area, and this method includes：
Step 201, when making motherboard to be tested, formed and sealed for being pointed to the source and drain lead of welding disking area
Sealing glue pattern, the substrate and cover plate of the sealing glue pattern and the motherboard are collectively forming close for being carried out to source and drain lead
The annular seal space of envelope；
Step 202, when the cover plate to motherboard to be tested is cut, the cover plate of sealing cavity region is retained.
The test plate (panel) to be measured that method by the present invention is obtained is put into after hot and humid environment, due to the source of welding disking area
Leakage lead is sealed by annular seal space, and source and drain lead can be avoided to be corroded, and then avoids the envelope caused by the corrosion of source and drain lead
The interference that disturbing factor produced by filling the corrosion of glue pattern is tested pattern-sealing property of packaging plastic, it is possible to increase encapsulation glue pattern
The accuracy of performing leak test.
In above-mentioned step 201, the process for making motherboard to be tested may be referred to prior art, with prior art not
With before cover plate is covered on substrate, being formed is used to carry out source and drain lead sealedly sealing glue pattern.So exist
After cover plate is covered on substrate, sealing glue pattern is formed together with cover plate carries out sealed annular seal space to source and drain lead.
In the specific implementation, the concrete shape of the sealing glue pattern 4 formed may be referred to Fig. 3, the figure of the fluid sealant
Shape is annular, is centered around the periphery of source and drain lead 4.In addition, in order to further improve sealing effectiveness, fluid sealant figure can also be set
Shape 7 is looped around integrated circuit 3 and FPC5 outside.In this way, the source and drain caused by FPC or IC corrosion can be avoided
The corrosion of lead 4.
In the specific implementation, in above-mentioned step 101, sealing glue pattern 7 can be made using ultra-violet curing glue material.
Now, after being formed for the sealing glue pattern to source and drain lead-in wire sealing, above-mentioned step 101 also includes：Use ultraviolet light
Solidification is irradiated to the sealing glue pattern that ultraviolet cured adhesive material makes, mask plate shielding viewing area is used in irradiation
Domain.In this way, sealing glue pattern can be made to be molded well, advantageously reduces the difficulty for making sealing glue pattern.When
So in actual applications, it would however also be possible to employ other materials makes above-mentioned sealing glue pattern.Resin can also be such as initially formed
Layer, forms above-mentioned sealing glue pattern by the way of photoetching afterwards.As long as the sealing to source and drain lead can be realized, using what
Plant material or technique makes above-mentioned sealing glue pattern and has no effect on protection scope of the present invention.
Further, in order to avoid when being irradiated solidification, ultraviolet causes to damage to the pixel of pixel region, can be with
Mask plate shielding viewing area is used when being irradiated.
In actual applications, can be on cover plate (being usually cover-plate glass) fluid sealant graphic application.It will be formed afterwards close
The cover plate of sealing figure is covered to be sealed on the substrate of motherboard to the formation of source and drain lead.Further, in order to improve sealing effectiveness,
When the painting of cover plate for sealing glue pattern is covered with, above-mentioned ultraviolet curing glue can be used, is just consolidated after cover-plate glass is covered
Change.
In the specific implementation, in order to improve sealing effectiveness, the fluid sealant figure being connected with the encapsulation glue pattern 2 can be formed
Shape 7.In this way, the source and drain lead outside packaging plastic graphics field can be fully sealed, improves sealing effectiveness,
Further improve the accuracy of test.
In the specific implementation, encapsulation glue pattern here can be formed by glass cement.
As shown in figure 4, sealing glue pattern 7 here can include being used to carry out sealed part 71 and position to source and drain lead
In the part 72 of whole motherboard fringe region.Now, if sealing glue pattern here is made by uv-curable glue, close to this
When sealing figure is irradiated, the mask plate used may be referred to Fig. 5.The mask plate is corresponding with 72 position corresponding to 71
Transmission region 71 ' and 72 ' is formed with, for solidifying to sealing glue pattern.
Based on identical design, present invention also offers a kind of motherboard, the motherboard can be close as test sealant figure
The motherboard of envelope property, with reference also to Fig. 3, including：Base plate glass and cover-plate glass 1, and formed in base plate glass and cover-plate glass
Pixel region A/A, for pixel region A/A carry out sealedly encapsulation glue pattern 2, encapsulation glue pattern 2 outside pad
Region, integrated circuit 3, source and drain lead 4, FPC5, PAD6, sealing glue pattern 7 are formed with the welding disking area.Cut
When, the region sealed in welding disking area outside glue pattern 7 can be cut away, PAD is only exposed.So due to welding disking area
Source and drain lead sealed by annular seal space, source and drain lead can be avoided to be corroded, and then from avoiding because the corrosion of source and drain lead causes
Encapsulation glue pattern corrosion produced by the interference tested pattern-sealing property of packaging plastic of disturbing factor, it is possible to increase packaging plastic
The accuracy of pattern-sealing property test.
In the specific implementation, the concrete shape of the sealing glue pattern 4 formed may be referred to Fig. 3, the figure of the fluid sealant
Shape is annular, is centered around the periphery of source and drain lead 4.In addition, in order to further improve sealing effectiveness, fluid sealant figure can also be set
Shape 7 is looped around integrated circuit 3 and FPC5 outside, for sealing integrated circuit 3 and FPC5.In this way, it can avoid
The corrosion of source and drain lead 4 caused by FPC or IC corrosion.
In the specific implementation, sealing glue pattern 7 can be made by ultraviolet cured adhesive.
Further, the sealing glue pattern 7 is connected with the encapsulation glue pattern 2.
Further, the encapsulation glue pattern is formed by glass cement.
Panel in the present invention can be oled panel etc..
Present invention also offers a kind of mask plate, as shown in figure 5, being formed with the mask plate suitable for the sealing in Fig. 4
The part of glue pattern 71 is exposed the transparent region 71 ' of solidification, and the part of sealing glue pattern 72 in Fig. 4 is exposed solidification
Transparent region 72 '.
Description of the invention is provided for the sake of example and description, and is not exhaustively or by the present invention
It is limited to disclosed form.Many modifications and variations are obvious for the ordinary skill in the art.Select and retouch
State embodiment and be more preferably to illustrate the principle and practical application of the present invention, and one of ordinary skill in the art is managed
The solution present invention is so as to design the various embodiments with various modifications suitable for special-purpose.
Claims (10)
1. a kind of method for improving packaging plastic pattern-sealing property test accuracy, the encapsulation glue pattern is used to enter viewing area
Row encapsulation, it is characterised in that including：
When making motherboard to be tested, source and drain lead, integrated circuit and the flexible flat for being pointed to welding disking area are formed
Cable carries out sealedly sealing glue pattern, and the substrate and cover plate of the sealing glue pattern and the motherboard are collectively forming for source
Leakage lead, integrated circuit and flexible flat cable carry out sealed annular seal space；
When the cover plate to motherboard to be tested is cut, retain the cover plate of sealing cavity region.
2. the method as described in claim 1, it is characterised in that the sealing glue pattern is made by ultraviolet cured adhesive material；
After being formed for the sealing glue pattern to source and drain lead-in wire sealing, methods described also includes：Using ultraviolet light to ultraviolet
The sealing glue pattern that optic-solidified adhesive material makes is irradiated solidification, and mask plate shielding viewing area is used in irradiation.
3. the method as described in claim 1, it is characterised in that the sealing glue pattern is connected with the encapsulation glue pattern.
4. the method as described in claim 1, it is characterised in that the formation is used for the fluid sealant figure to source and drain lead-in wire sealing
Shape, including：
The formation of coating fluid sealant seals glue pattern on the cover board.
5. the method as described in claim 1, it is characterised in that the encapsulation glue pattern is formed by glass cement.
6. a kind of motherboard, including substrate and cover plate and formation being used between the substrate and cover plate are carried out to viewing area
The encapsulation glue pattern of encapsulation, it is characterised in that also include the source for being used to be pointed to welding disking area between the substrate and cover plate
Leakage lead, integrated circuit and flexible flat cable carry out sealedly sealing glue pattern, the sealing glue pattern and the motherboard
Substrate and cover plate are collectively forming for carrying out sealed annular seal space to source and drain lead, integrated circuit and flexible flat cable.
7. motherboard as claimed in claim 6, it is characterised in that the sealing glue pattern is made by ultraviolet cured adhesive.
8. motherboard as claimed in claim 6, it is characterised in that the sealing glue pattern is connected with the encapsulation glue pattern.
9. motherboard as claimed in claim 6, it is characterised in that the encapsulation glue pattern is formed by glass cement.
10. a kind of mask plate, including the corresponding transparent area of sealing glue pattern in motherboard as described in claim any one of 6-9
Domain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037382.XA CN104617007B (en) | 2015-01-23 | 2015-01-23 | Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037382.XA CN104617007B (en) | 2015-01-23 | 2015-01-23 | Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104617007A CN104617007A (en) | 2015-05-13 |
| CN104617007B true CN104617007B (en) | 2017-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510037382.XA Expired - Fee Related CN104617007B (en) | 2015-01-23 | 2015-01-23 | Improve method, motherboard and the mask plate of packaging plastic pattern-sealing property test accuracy |
Country Status (1)
| Country | Link |
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| CN (1) | CN104617007B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773213B (en) * | 2017-01-03 | 2020-02-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW393819B (en) * | 1997-12-17 | 2000-06-11 | Nippon Electric Co | Organic thin film EL device and method for making the same |
| CN101162314A (en) * | 2007-08-16 | 2008-04-16 | 昆山维信诺显示技术有限公司 | Display device and method for manufacturing mask plate and display device |
| CN101221973A (en) * | 2006-11-10 | 2008-07-16 | 三星Sdi株式会社 | Organic light emitting display device and method for fabricating the same |
| CN101442042A (en) * | 2008-08-07 | 2009-05-27 | 昆山维信诺显示技术有限公司 | Display device, preparation method and mask board for preparing the same |
| CN101459086A (en) * | 2008-08-20 | 2009-06-17 | 昆山维信诺显示技术有限公司 | Encapsulation method and encapsulation construction for organic light emitting display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100635514B1 (en) * | 2006-01-23 | 2006-10-18 | 삼성에스디아이 주식회사 | Organic electroluminescence display device and method for fabricating of the same |
| CN202352734U (en) * | 2011-12-15 | 2012-07-25 | 京东方科技集团股份有限公司 | Organic light emitting diode (OLED) display |
| CN104090388A (en) * | 2014-06-25 | 2014-10-08 | 京东方科技集团股份有限公司 | Array substrate and display device comprising same |
-
2015
- 2015-01-23 CN CN201510037382.XA patent/CN104617007B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW393819B (en) * | 1997-12-17 | 2000-06-11 | Nippon Electric Co | Organic thin film EL device and method for making the same |
| CN101221973A (en) * | 2006-11-10 | 2008-07-16 | 三星Sdi株式会社 | Organic light emitting display device and method for fabricating the same |
| CN101162314A (en) * | 2007-08-16 | 2008-04-16 | 昆山维信诺显示技术有限公司 | Display device and method for manufacturing mask plate and display device |
| CN101442042A (en) * | 2008-08-07 | 2009-05-27 | 昆山维信诺显示技术有限公司 | Display device, preparation method and mask board for preparing the same |
| CN101459086A (en) * | 2008-08-20 | 2009-06-17 | 昆山维信诺显示技术有限公司 | Encapsulation method and encapsulation construction for organic light emitting display device |
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| CN104617007A (en) | 2015-05-13 |
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