JP2015204132A - Organic el element, lighting device and method of manufacturing organic el element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable suppression of short-circuit failure by a simple method.SOLUTION: An organic EL element 10 has a substrate 100 having light transmissivity, a first electrode 121 having light transmissivity and a second electrode 123 which are laminated in turn on the substrate 100, an organic layer 122 containing a light emission layer which is provided between the first electrode 121 and the second electrode 123, and a filling material 140 for sealing the first electrode 121, the second electrode 123 and the organic layer 122. The organic layer 122 has an inactive part 125 which is inactivated by reacting with the filling material 140 infiltrating through the second electrode 123.

Description

  The present invention relates to an organic EL (Electro-Luminescence) element, a lighting device including the organic EL element, and a method for manufacturing the organic EL element.

  Conventionally, various devices using organic EL elements, for example, lighting devices and display devices using organic EL elements have been developed. An organic EL element is a current-driven light-emitting element including a pair of electrodes and a light-emitting layer provided between the pair of electrodes. For this reason, when a foreign substance etc. mix between electrodes, between a pair of electrodes will short-circuit, an electric current will concentrate on a short circuit location, and the light emission luminance of another part will fall.

  On the other hand, for example, Patent Document 1 discloses a method of repairing a defective portion by performing laser irradiation on the defective portion due to a foreign matter or the like. Thereby, short circuit failure is suppressed and deterioration of the organic EL element is suppressed.

JP 2012-038616 A

  However, in the conventional method for manufacturing an organic EL element, it is necessary to specify a location where laser irradiation is performed. A device such as a high-definition camera or a microscope is required to specify the removal location. For this reason, there exists a problem that manufacturing cost increases. In addition, there is a risk of missing a removed portion. If the removed portion is missed, a short circuit failure or the like cannot be sufficiently suppressed.

  Therefore, the present invention provides an organic EL element, a lighting device, and a method for manufacturing the organic EL element that can suppress short-circuit defects by a simple method.

  In order to solve the above problems, an organic EL element according to one embodiment of the present invention includes a light-transmitting substrate, a light-transmitting first electrode, and a second electrode, which are sequentially stacked on the substrate. An organic layer including a light emitting layer provided between the first electrode and the second electrode, and a filler for sealing the first electrode, the second electrode, and the organic layer, The organic layer has an inactive portion that is inactivated by reacting with the filler that has permeated through the second electrode.

  In addition, in a method for manufacturing an organic EL element according to one embodiment of the present invention, a first electrode having a light-transmitting property, an organic layer having a light-emitting layer, and a second electrode are formed on a light-transmitting substrate. A step of laminating in order, a step of applying a filler for sealing the organic layer on the second electrode, and impregnating the filler into the organic layer through the second electrode, Forming an inactive part in the organic layer; and curing the filler after forming the inactive part.

  According to the present invention, it is possible to suppress short-circuit defects by a simple method.

It is a general | schematic sectional drawing which shows the organic EL element which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the foreign material periphery of the organic EL element which concerns on Embodiment 1 of this invention. It is a top view which shows the inactive part of the organic EL element which concerns on Embodiment 1 of this invention. It is a flowchart which shows the manufacturing method of the organic EL element concerning Embodiment 1 of this invention. It is a schematic sectional drawing which shows the manufacturing process of the organic EL element which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the manufacturing process of the organic EL element which concerns on Embodiment 1 of this invention. It is a schematic sectional drawing which shows the foreign material periphery of the organic EL element which concerns on Embodiment 2 of this invention. It is a schematic sectional drawing which shows the manufacturing process of the organic EL element which concerns on Embodiment 2 of this invention. It is a general-view perspective view which shows the illuminating device which concerns on Embodiment 3 of this invention. It is a schematic sectional drawing which shows the foreign material periphery of the organic EL element which concerns on the modification of embodiment of this invention. It is a schematic sectional drawing which shows the foreign material periphery of the organic EL element which concerns on another modification of embodiment of this invention. It is a schematic sectional drawing which shows the foreign material periphery of the organic EL element which concerns on another modification of embodiment of this invention.

  Below, the organic EL element which concerns on embodiment of this invention, an illuminating device, and the manufacturing method of an organic EL element are demonstrated in detail using drawing. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangements, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

(Embodiment 1)
[Outline of organic EL device]
First, the outline | summary of the organic EL element which concerns on Embodiment 1 of this invention is demonstrated using FIG.1 and FIG.2. FIG. 1 is a schematic cross-sectional view showing an organic EL element 10 according to the present embodiment. FIG. 2 is a schematic cross-sectional view showing the periphery of a foreign substance of the organic EL element 10 according to the present embodiment.

  As shown in FIG. 1, the organic EL element 10 includes a substrate 100, a counter substrate 110, an organic EL unit 120, a sealing material (seal material) 130, and a filler (fill material) 140. As shown in FIG. 2, the organic EL unit 120 includes a first electrode 121, an organic layer 122, and a second electrode 123. Further, the organic EL element 10 has a mixed foreign material 150.

  The substrate 100 is a translucent substrate having translucency. The main surface of the substrate 100 opposite to the main surface on the side where the organic EL unit 120 is provided (the lower surface in FIG. 1) is the light emitting surface of the organic EL element 10.

  The substrate 100 is, for example, a glass substrate such as soda glass or non-alkali glass, or a resin substrate made of a translucent resin material such as polycarbonate resin or acrylic resin. For example, as the substrate 100, a plate-shaped transparent substrate having a thickness of 0.03 mm to 1.2 mm can be used from the viewpoint of convenience of handling and mechanical characteristics.

  The counter substrate 110 is a substrate facing the substrate 100, and is provided so that the organic EL unit 120 is positioned between the counter substrate 110 and the substrate 100. The counter substrate 110 is composed of a light-reflective or light-transmissive plate-like member. When a light-transmitting material is used for the counter substrate 110, the organic EL element 10 can be used as a double-sided light emitting type lighting device.

  For example, the counter substrate 110 is composed of a glass substrate or a resin substrate. Or the opposing board | substrate 110 may be comprised from metal materials, such as stainless steel and aluminum. For example, as the counter substrate 110, similarly to the substrate 100, a plate-shaped transparent substrate having a thickness of 0.03 mm to 1.2 mm can be used. Note that the substrate 100 and the counter substrate 110 are disposed 6 μm to 100 μm apart from each other by 20 μm, for example.

  The organic EL unit 120 is a light emitting unit that emits light in a planar shape when a voltage is applied. In the organic EL unit 120, the first electrode 121, the organic layer 122, and the second electrode 123 are stacked on the substrate 100 in this order.

  The first electrode 121 is an electrode provided on the light emitting surface side, and is provided on the substrate 100, for example. The first electrode 121 is, for example, an anode, and has a higher potential than the second electrode 123 when the organic EL element 10 emits light.

  The first electrode 121 is made of a light-transmitting conductive material. For example, the first electrode 121 is made of a transparent conductive material that transmits at least part of visible light. The first electrode 121 is made of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide doped with aluminum (AZO), or the like.

  The first electrode 121 may be a thin metal film such as silver or aluminum that can transmit light. Alternatively, Ag nanowires or Ag particles may be dispersed. Alternatively, as the first electrode 121, a conductive polymer such as PEDOT or polyaniline, a conductive polymer doped with any acceptor, or a conductive light-transmitting material such as a carbon nanotube can be used. .

  For example, the first electrode 121 is formed by forming a transparent conductive film on the substrate 100 by vapor deposition, coating, sputtering, or the like, and patterning the formed transparent conductive film. For example, the film thickness of the first electrode 121 is 60 nm to 200 nm, and is 100 nm as an example.

  The organic layer 122 is provided between the first electrode 121 and the second electrode 123. The organic layer 122 includes a light emitting layer, and emits light in a planar shape when a voltage is applied between the first electrode 121 and the second electrode 123.

  Specifically, the organic layer 122 includes a hole injection layer, a hole transport layer, a light emitting layer (organic EL layer), an electron transport layer, and an electron injection layer. The organic layer 122 such as a light emitting layer is made of an organic material such as diamine, anthracene, or metal complex. Each layer constituting the organic layer 122 is formed by an evaporation method, a spin coating method, a casting method, an ion beam assist method, or the like. For example, the thickness of the organic layer 122 is 150 nm to 350 nm, and is 210 nm as an example.

  For example, when the emission color is white, the organic layer 122 may be doped with a red, green, and blue dopant dye in the emission layer, or the blue hole-transporting emission layer and the green electron A stacked structure of a transporting light emitting layer and a red electron transporting light emitting layer may be used. The organic layer 122 may have a multi-unit structure in which red, green, and blue light-emitting units are stacked via an intermediate layer having light transmission and conductivity, and are electrically connected directly.

  The second electrode 123 is an electrode provided on the side opposite to the light emitting surface, and is provided on the organic layer 122, for example. The second electrode 123 is, for example, a cathode, and has a lower potential than the first electrode 121 when the organic EL element 10 emits light.

  The second electrode 123 is made of a conductive material having light reflectivity. The second electrode 123 reflects the light emitted from the organic layer 122 and emits it to the light emitting surface side. The second electrode 123 is made of, for example, aluminum, silver, magnesium, or an alloy containing at least one of these. For example, the second electrode 123 is formed by forming a conductive film on the organic layer 122 by an evaporation method, a coating method, a sputtering method, an ion beam assist method, or the like. For example, the thickness of the second electrode 123 is 20 nm to 200 nm, and is 100 nm as an example.

  Note that the second electrode 123 may be made of a light-transmitting conductive material. For example, the same material as the first electrode 121 can be used for the second electrode 123. In this case, if the counter substrate 110 is also made of a light transmissive material, the organic EL element 10 can be used as a double-sided illuminating device, for example, in a building or a vehicle window.

  The sealing material 130 is a connection member that connects the substrate 100 and the counter substrate 110. Specifically, the sealing material 130 is an adhesive that bonds the substrate 100 and the counter substrate 110. The sealing material 130 is provided so as to surround the organic EL unit 120 in the vicinity of the peripheral ends of the substrate 100 and the counter substrate 110 in plan view. Specifically, the sealing material 130 is provided in a frame shape along the outer peripheries of the substrate 100 and the counter substrate 110. Thereby, the space surrounded by the substrate 100, the counter substrate 110, and the sealing material 130 can be hermetically sealed.

  As the sealing material 130, for example, a photo-curing type, thermosetting type, or two-component curing type adhesive resin such as an epoxy resin, an acrylic resin, or a silicone resin can be used. Alternatively, as the sealing material 130, a thermoplastic adhesive resin made of an acid-modified product such as polyethylene or polypropylene may be used.

  Note that an inorganic filler or the like may be mixed in the sealing material 130. Thereby, the transmittance | permeability of the water | moisture content permeating from the outside can further be reduced. Examples of the inorganic filler include silica, calcium hydroxide, calcium carbonate, and other resin materials. The diameter (particle size) of the inorganic filler or the like mixed in the sealing material 130 is, for example, 6 μm to 100 μm.

  The filler 140 is a member for sealing the organic EL unit 120. For example, the filler 140 is provided between the substrate 100 and the counter substrate 110 so as to cover and cover the organic EL unit 120. Specifically, the filler 140 is a resin material that is filled and cured in a space surrounded by the substrate 100, the counter substrate 110, and the sealing material 130.

  As the filler 140, for example, a photo-curing, thermosetting, or two-component curable adhesive resin such as an epoxy resin, an acrylic resin, or a silicone resin can be used. Alternatively, as the filler 140, a thermoplastic adhesive resin made of an acid-modified product such as polyethylene or polypropylene may be used.

  The filler 140 may contain a desiccant. The desiccant is, for example, a hygroscopic material having fine pores that adsorb moisture, and specifically, calcium oxide (CaO), zeolite, and the like. As the desiccant, it is preferable to use a material having a larger moisture absorption capacity.

  Moreover, the particle size of the desiccant contained in the filler 140 is adjusted based on the particle size of the inorganic filler mixed in the sealing material 130, for example. For example, the filler 140 includes a desiccant having a particle size smaller than that of the inorganic filler mixed in the sealing material 130.

  The sealing material 130 and the filler 140 prevent moisture and the like contained in the atmosphere from entering between the substrate 100 and the counter substrate 110. That is, the sealing material 130 and the filler 140 can suppress deterioration of the organic EL unit 120 by making it difficult for moisture entering from the outside to reach the organic EL unit 120. Thereby, the lifetime of the organic EL element 10 can be extended.

  The sealing material 130 and the filler 140 are formed by applying and curing a resin material. For example, the resin material is applied by a printing method such as roll coating, spin coating, screen printing, spray coating, slit coating, squeegee coating, or drawing coating using a dispenser, depending on the viscosity and film thickness of the resin material.

  As the sealing material 130, a material having a higher viscosity than the filler 140 is used. Thereby, the sealing material 130 functions as a dam material when the filler 140 is applied. That is, by applying the filler 140 after the sealing material 130 is applied, the filler 140 can be prevented from leaking outward from the region surrounded by the sealing material 130.

  Further, as the filler 140, a material having a relatively low viscosity can be used in order to adjust the viscosity of the resin. Specifically, the filler 140 includes a low molecular material. The low molecular weight material is a material composed of molecules lighter than the molecules of the material constituting the organic layer 122. Specifically, the low molecular weight material is an organic solvent, such as a viscosity modifier or a polymerization accelerator. The low molecular material is a material that promotes the reaction with the organic layer 122.

[Foreign matter]
Then, the influence by the foreign material 150 which concerns on this Embodiment is demonstrated.

  The foreign material 150 is mixed in the manufacturing process of the organic EL element 10. In order to suppress contamination of the foreign matter 150, purification within the manufacturing apparatus of the organic EL element 10 and enhancement of cleaning of the substrate may be performed. However, it is difficult to completely remove the foreign material 150.

  The foreign material 150 is, for example, a conductive substance such as particles. For example, the foreign substance 150 is a minute substance caused by dirt in the manufacturing apparatus, and specifically, is a residual substance of a vapor deposition material. The size of the foreign material 150 is, for example, a size on the order of submicrons, specifically, a size of 3 μm or less. Note that foreign matters larger than 3 μm are removed (almost) in, for example, a cleaning process.

  Since the film thickness of the organic layer 122 is several hundred nm, when the foreign material 150 is mixed into the organic layer 122, the foreign material 150 penetrates the organic layer 122 in the stacking direction as shown in FIG. Specifically, the foreign substance 150 protrudes from the other part of the organic layer 122 although a part of the organic layer 122 covers the foreign substance 150 thinly.

  For this reason, for example, when a conductive film is formed as the second electrode above the foreign material 150, the hole 124 is formed due to the foreign material 150. That is, the second electrode 123 has a hole 124 that penetrates in the stacking direction.

  The hole 124 is an example of a portion where the film quality of the second electrode 123 is not uniform. For this reason, a short circuit defect is likely to occur at the place where the hole 124 is formed.

  The pre-curing filler 140 applied so as to be in contact with the second electrode 123 penetrates into the organic layer 122 through the hole 124. By reacting with the filler 140 that has permeated through the hole 124, an inactive portion 125 is formed around the foreign material 150 in the organic layer 122.

  FIG. 3 is a plan view showing the inactive portion 125 of the organic EL element 10 according to the present embodiment. The hole 124 is formed above the foreign material 150, for example. Therefore, as shown in FIG. 3, the hole 124 and the inactive portion 125 overlap each other in plan view. Specifically, an inactive portion 125 is formed around the foreign material 150. That is, the organic EL element 10 has the foreign material 150 in the vicinity of the inactive portion 125.

  The inactive portion 125 is a part of the organic layer 122 and is inactivated by reacting with the filler 140 that has penetrated through the second electrode 123. Specifically, the inactive part 125 is inactivated by the reaction between the filler 140 that has penetrated through the hole 124 formed in the second electrode 123 and a part of the organic layer 122. Yes.

  For example, a part of the organic layer 122 swells when in contact with the filler 140. Specifically, a part of the organic layer 122 contacts the filler 140 and melts, or absorbs the filler 140 and expands.

  The inactive portion 125 formed by changing the film quality due to swelling does not emit light even when a voltage is applied, and is a dark spot. That is, the inactive portion 125 has an insulating property and does not emit light. The size of the inactive portion 125 in plan view is, for example, 20 μm or less in diameter.

  When the inactive portion 125 that does not emit light is large, the non-light-emitting region is conspicuous, but when the inactive portion 125 is small, the non-light-emitting region is not so conspicuous. For example, when the organic EL element 10 is used for a lighting device, a diffusion film or the like is provided on the light emitting surface side. Since the small inactive portion 125 is less noticeable by the diffusion film, the organic EL element 10 including the inactive portion 125 smaller than a predetermined size in a plan view can be used for a lighting device or the like.

[Method of manufacturing organic EL element]
Then, the manufacturing method of the organic EL element 10 which concerns on this Embodiment is demonstrated using FIG.4, FIG.5A and FIG.5B. FIG. 4 is a flowchart showing a method for manufacturing the organic EL element 10 according to this embodiment. 5A and 5B are schematic cross-sectional views showing the manufacturing process of the organic EL element 10 according to the present embodiment.

  First, the substrate 100 is cleaned (S100). For example, foreign substances such as dirt attached to the surface of the substrate 100 are washed away using pure water. In addition to cleaning with pure water, ultrasonic cleaning, fluid cleaning, plasma cleaning, or chemical (chemical) cleaning may be performed.

  Subsequently, the first electrode 121, the organic layer 122, and the second electrode 123 are stacked in this order on the cleaned substrate 100 (S110). In this lamination process, the foreign material 150 is mixed. A specific lamination process will be described with reference to FIG. 5A.

  First, as shown in (a) of FIG. 5A, the first electrode 121 is formed on the substrate 100. For example, the first electrode 121 is formed by forming a 100 nm ITO film by sputtering or the like and patterning as necessary.

  Here, as shown in FIG. 5A (b), after the first electrode 121 is formed, the foreign material 150 is mixed before the organic layer 122 is formed.

  Next, as illustrated in (c) of FIG. 5A, the organic layer 122 and the second electrode 123 are sequentially stacked on the first electrode 121 in a state where the foreign material 150 is mixed. For example, the organic layer 122 is formed by applying an organic material using a dispenser or the like. The second electrode 123 is formed, for example, by forming a 100 nm metal thin film and patterning as necessary. The second electrode 123 is formed above the foreign material 150.

  Since the foreign material 150 is mixed, the second electrode 123 is not formed flat in the region immediately above the foreign material 150 and in the vicinity thereof. That is, the second electrode 123 is formed with a portion having a non-uniform film quality. Specifically, a hole 124 is formed in the second electrode 123.

  Note that the timing at which the foreign substance 150 is mixed is not limited to the example shown in FIG. 5A. For example, the foreign material 150 may be mixed after the substrate 100 is cleaned and before the first electrode 121 is formed. Alternatively, the foreign material 150 may be mixed after forming the organic layer 122 and before forming the second electrode 123. Alternatively, the foreign material 150 may be mixed during the film formation of any of the first electrode 121, the organic layer 122, and the second electrode 123. Regardless of the timing of the foreign material 150 mixed in at any timing, the second electrode 123 formed above the foreign material 150 is not formed flat in the region immediately above the foreign material 150 and in the vicinity thereof, but a hole 124 is formed. sell.

  Subsequently, the sealing material 130 and the filler 140 are applied (S120). Specifically, first, a sealing material 130 is applied on the substrate 100 using a dispenser or the like so as to surround the organic EL unit 120 (the first electrode 121, the organic layer 122, and the second electrode 123). Thereafter, the filler 140 is applied to the region surrounded by the sealing material 130 using a dispenser or the like. Specifically, as shown in FIG. 5B (a), the filler 140 is applied on the second electrode 123. For example, the filler 140 is applied (dropped) in a dot shape. Alternatively, the filler 140 may be applied (drawn) in a pattern or a plane.

  Next, it waits for a predetermined period (S130). The inactive portion 125 is formed in the organic layer 122 by allowing the filler 140 to permeate the organic layer 122 through the second electrode 123 during the predetermined period. Further, during this predetermined period, the substrate 100 and the counter substrate 110 are bonded together (S130).

  Specifically, it is left for a predetermined period with the filler 140 applied on the second electrode 123. In other words, the filler 140 is left as it is for a predetermined period without being cured.

  As a result, the unfilled filler 140 penetrates into the organic layer 122 through the hole 124 of the second electrode 123. And the inactive part 125 is formed in the organic layer 122 by the low molecular material of the infiltrated filler 140 reacting with the organic layer 122 as shown in FIG. 5B (b).

  The longer the predetermined period (hereinafter referred to as the standby period), the greater the penetration amount of the filler 140 before curing, and the larger inactive portion 125 is formed. For this reason, by appropriately controlling the standby period, the inactive portion 125 can be formed only around the foreign material 150 as shown in FIG. 5B (c).

  During the standby period, for example, heat of 40 degrees to 60 degrees may be applied to the entire substrate. By heating the substrate, the penetration of the low-molecular material contained in the filler 140 is promoted, and thus the swelling reaction is promoted. Thereby, the period required for forming the inactive portion 125 can be shortened.

  The standby period is determined based on the size of the inactive portion 125 to be formed, for example. Specifically, the waiting period is determined based on at least one of the low molecular weight material included in the filler 140, the material constituting the organic layer 122, and the film thickness of the organic layer 122. Alternatively, the standby period may be a predetermined period. For example, the waiting period is approximately 30 seconds to 600 seconds.

  Note that the standby period is a period from when the filler 140 is applied to when the filler 140 is cured. Therefore, the standby period is longer than the period required for bonding the substrate 100 and the counter substrate 110 together. For this reason, for example, when a long period of time is required for bonding the substrates, the low-molecular material included in the filler 140 may be appropriately changed so that the inactive portion 125 does not become too large.

  The bonding of the substrate 100 and the counter substrate 110 is performed under a reduced pressure lower than the atmospheric pressure, for example. For example, after the inside of the vacuum chamber of the vacuum bonding apparatus is evacuated, the substrate 100 and the counter substrate 110 are bonded to each other. The vacuum state is a sufficiently reduced pressure state, for example, a state where the degree of vacuum is 0.1 Pa. By exposing the substrate 100 and the counter substrate 110 bonded together in a vacuum state to atmospheric pressure, adhesion between the substrate 100 and the counter substrate 110 can be increased by the atmospheric pressure.

  In addition, it is preferable that the vacuum chamber can adjust a vacuum degree. For example, by adjusting the degree of vacuum stepwise from the vacuum state to the atmospheric pressure after the bonding is completed, the organic EL element 10 can be prevented from being deformed or broken due to a rapid change in the atmospheric pressure.

  Further, the substrate 100 and the counter substrate 110 may be attached under atmospheric pressure. For example, the substrate 100 and the counter substrate 110 are fixed to a jig or the like, and a roller-shaped pressing portion is pressed from one end portion to the other end portion of the upper surface of the counter substrate 110, whereby the substrate 100 and the counter substrate 110 are pressed. And may be pasted together.

  And after the inactive part 125 is formed, the sealing material 130 and the filler 140 are hardened (S140). The curing method depends on the materials used as the sealing material 130 and the filler 140. For example, when a thermosetting resin is used for the sealing material 130 and the filler 140, heating is performed, and when a photocurable resin is used, light for curing such as ultraviolet rays is irradiated.

  After the filler 140 is cured, the swelling reaction is suppressed. For this reason, the inactive part 125 hardly becomes larger than the size at the time when the filler 140 is cured.

[Summary]
As described above, the method for manufacturing the organic EL element 10 according to the present embodiment includes the first electrode 121 having a light-transmitting property, the organic layer 122 having a light-emitting layer on the substrate 100 having a light-transmitting property, The step of laminating the second electrode 123 in this order, the step of applying the filler 140 for sealing the organic layer 122 on the second electrode 123, and the organic material of the filler 140 via the second electrode 123 By infiltrating the layer 122, a step of forming the inactive portion 125 in the organic layer 122 and a step of curing the filler 140 after forming the inactive portion 125 are included.

  Thereby, even if it does not perform edge cutting with a laser etc., the occurrence of a short circuit failure caused by the foreign material 150 can be achieved by a simple method in which the filler 140 and the organic layer 122 are reacted to form the inactive portion 125. Can be suppressed. That is, it is not necessary to carry out a step of identifying a defective portion, and the number of manufacturing steps can be reduced and productivity can be increased.

  For example, when performing edge cutting with a laser or the like, it is necessary to specify the portion to be irradiated with the laser. On the other hand, in the method for manufacturing the organic EL element 10 according to the present embodiment, a portion where the film quality of the second electrode 123 is non-uniform is obtained simply by applying the filler 140 so as to be in contact with the second electrode 123. Through this, the filler 140 penetrates and the inactive part 125 is formed. Therefore, the inactive portion 125 can be automatically formed at the defective portion without specifying the defective portion.

  In addition, for example, in the stacking process, the second electrode 123 is formed above the foreign material 150 located in the organic layer 122.

  Thus, by forming the second electrode 123 above the foreign material 150 that causes a short circuit failure, the film quality of the second electrode 123 becomes nonuniform in the region immediately above the foreign material 150 and in the vicinity thereof. For this reason, the hole 124 is easily formed in the region immediately above the foreign material 150. Therefore, the filler 140 can easily permeate around the foreign material 150 through the hole 124, and the inactive portion 125 can be easily formed around the foreign material 150.

  In addition, as described above, the organic EL element 10 according to the present embodiment includes the light-transmitting substrate 100, the light-transmitting first electrode 121 and the second electrode 100 that are sequentially stacked on the substrate 100. The electrode 123, the organic layer 122 including the light emitting layer provided between the first electrode 121 and the second electrode 123, and a filler for sealing the first electrode 121, the second electrode 123, and the organic layer 122 The organic layer 122 includes an inactive portion 125 that is inactivated by reacting with the filler 140 that has penetrated through the second electrode 123.

  Specifically, the organic EL element 10 according to the present embodiment has a hermetically sealed structure. As shown in FIG. 1, the hermetic sealing structure is a structure that seals the organic EL unit 120 by filling a space between the substrate 100 and the counter substrate 110 with a resin material (filler 140).

  In addition, there exists a hollow sealing structure as another structure sealed in order to protect the organic EL part 120 from the water | moisture content in air | atmosphere. In the hollow sealing structure, for example, digging glass is used as the substrate 100 or the counter substrate 110, and the organic EL portion 120 is disposed in the digging portion. However, in the hollow sealing structure, it is difficult to reduce costs because the number of steps that require complicated operations such as glass processing increases. There is also a problem that the adhesive strength between the substrates is weak.

  Therefore, in the organic EL element 10 according to the present embodiment, cost reduction can be realized by using a hermetic sealing structure. In addition, since the substrates can be firmly bonded, the organic EL element 10 according to the present embodiment can be used as a durable lighting device.

  In addition, in the organic EL element having a hermetically sealed structure like the organic EL element 10 according to the present embodiment, when a short circuit defect occurs, there is a risk of element destruction that peels off the entire organic layer in the vicinity of the shorted part. is there.

  On the other hand, since the organic EL element 10 according to the present embodiment includes the inactive portion 125 formed by reacting the filler 140 and the organic layer 122, occurrence of a short circuit failure can be suppressed. .

  Further, for example, the second electrode 123 has a hole portion 124 penetrating in the stacking direction, and the inactive portion 125 reacts with the filler 140 that has penetrated through the hole portion 124 and a part of the organic layer 122. It has been inactivated.

  Thereby, since the filler 140 penetrates into the organic layer 122 through the hole 124, the inactive portion 125 can be formed in a short period of time. For this reason, it can suppress that the inactive part 125 is formed to the area | region where it is not preferable to form the inactive part 125. FIG. For example, as illustrated in FIG. 3, it is possible to suppress an increase in the area of the non-light-emitting region due to the formation of the inactive portion 125 at the boundary between the light-emitting region and the non-light-emitting region.

  Further, for example, the hole portion 124 and the inactive portion 125 overlap each other in plan view.

  The hole 124 is formed in a place where the film quality of the second electrode 123 is not uniform, that is, in a place where a short circuit is likely to occur. For this reason, generation | occurrence | production of a short circuit defect can be suppressed by providing the inactive part 125 so that it may overlap with the hole 124 in planar view.

  Further, for example, the organic EL element 10 further includes a foreign substance 150 in the vicinity of the inactive portion 125.

  Thereby, since the inactive part 125 is provided in the vicinity of the foreign material 150 that causes a short circuit failure, the occurrence of the short circuit failure can be suppressed.

  For example, the foreign material 150 penetrates the organic layer 122 in the stacking direction.

  Thereby, since the inactive part 125 is provided in the region where the foreign substance 150 penetrates the organic layer 122 and the short-circuit defect is more likely to occur, the occurrence of the short-circuit defect can be appropriately suppressed.

  Further, for example, the filler 140 includes a low molecular material that promotes a reaction with the organic layer 122.

  Thereby, since the low molecular material which accelerates | stimulates reaction with the organic layer 122 is included, the inactive part 125 can be formed in a short period of time.

(Embodiment 2)
Hereinafter, an organic EL element and a manufacturing method thereof according to Embodiment 2 of the present invention will be described.

[Configuration of organic EL element]
FIG. 6 is a schematic cross-sectional view showing the periphery of a foreign substance of the organic EL element 20 according to the present embodiment. The schematic configuration of the organic EL element 20 is the same as that shown in FIG. Below, it demonstrates focusing on a different point from Embodiment 1. FIG.

  The organic EL element 20 shown in FIG. 6 is different from the organic EL element 10 shown in FIG. 1 in that a filler 240 is provided instead of the filler 140.

  The filler 240 has a plurality of layers. Specifically, as illustrated in FIG. 6, the filler 240 includes a first layer 241 and a second layer 242. The first layer 241 and the second layer 242 are sequentially stacked on the second electrode 123.

  The first layer 241 is a layer provided in contact with the second electrode 123. Specifically, the first layer 241 is formed on the second electrode 123. The film thickness of the first layer 241 is, for example, 100 nm to 3 μm.

  The second layer 242 is a layer provided on the opposite side of the first layer 241 from the second electrode 123. Specifically, the second layer 242 is formed on the first layer 241. The second layer 242 is provided so as to fill a space surrounded by the substrate 100, the counter substrate 110, and the sealing material 130.

  For the first layer 241 and the second layer 242, for example, the same material as the filler 140 of Embodiment 1 can be used. However, at this time, the concentration of the low molecular material contained in the first layer 241 is higher than the concentration of the low molecular material contained in the second layer 242. In other words, the viscosity of the first layer 241 is smaller than the viscosity of the second layer 242. For example, the viscosity of the first layer 241 is 0.005 Pa · s to 1.0 Pa · s (5 cP to 1000 cP), and the viscosity of the second layer 242 is 0.2 Pa · s to 5.0 Pa · s (200 cP). ~ 5000 cP). In addition, the low molecular component to contain is about 0.5-15 mass% in the 1st layer 241, and is about 0.1-5 mass% in the 2nd layer 242.

  The low molecular weight material is a substance that promotes the reaction with the organic layer 122 as in the first embodiment, and is, for example, a viscosity modifier. Since the concentration of the low molecular weight material of the first layer 241 in contact with the second electrode 123 is large, the inactive portion 125 can be formed in a short period. Note that the low molecular weight material included in the first layer 241 may be the same as or different from the low molecular weight material included in the second layer 242. For example, the first layer 241 may include a low-molecular material (a material having a low molecular weight) than the low-molecular material included in the second layer 242.

[Method of manufacturing organic EL element]
Then, the manufacturing method of the organic EL element 20 which concerns on this Embodiment is demonstrated using FIG. FIG. 7 is a schematic cross-sectional view showing a manufacturing process of the organic EL element 20 according to the present embodiment. Note that in this embodiment, the steps from forming the second electrode 123 and applying the sealing material 130 are the same as those in Embodiment 1, and thus the description thereof is omitted below.

  After the sealing material 130 is applied, the first layer 241 is formed on the second electrode 123 as shown in FIG. Specifically, a first material containing a low molecular material is applied on the second electrode 123. For example, the first material is applied (dropped) in a dot shape. Alternatively, the first material may be applied (drawn) in a pattern or a plane. The first material is the first layer 241 before curing.

  Next, as shown in FIG. 7B, a second layer 242 (second material) before curing is formed on the first layer 241 (first material) before curing. Specifically, a second material having a lower concentration of low molecular weight material than the first material is applied onto the applied first material. For example, the second material is applied (dropped) in a dot shape. Alternatively, the second material may be applied (drawn) in a pattern or a plane. Note that the second material is the second layer 242 before curing.

  The inactive portion 125 starts to be formed after the first material is dropped. That is, the first material penetrates the organic layer 122 through the hole 124 and reacts with the organic layer 122.

  After the substrate 100 and the counter substrate 110 are bonded together, an inactive portion 125 is formed in the organic layer 122 as shown in FIG. Similar to the first embodiment, the first material and the second material are cured to stop the swelling reaction by the low molecular weight material and suppress the inactive portion 125 from spreading greatly.

  As described above, in the organic EL element 20 according to the present embodiment, the filler 240 is provided on the opposite side of the first layer 241 that contacts the second electrode 123 and the second electrode 123 of the first layer 241. The concentration of the low molecular material of the first layer 241 is greater than the concentration of the low molecular material of the second layer 242.

  Moreover, in the manufacturing method of the organic EL element 20 according to the present embodiment, in the applying step, a step of applying a first material including a low molecular material that promotes a reaction with the organic layer 122 on the second electrode 123; Applying a second material having a lower concentration of the low-molecular material than the first material on the first material.

  Thereby, the selection range of the material of the filler 240 can be expanded, and for example, the protection capability of the organic EL unit 120 can be enhanced. For example, by providing a layer for promoting deactivation as the first layer 241, a material that does not contribute to the deactivation ability of the material of the second layer 242 can be freely selected. For example, a material having a high moisture absorption effect can be used as the material of the second layer 242. As a result, it is possible to delay the arrival of moisture to the organic EL unit 120 and to extend the life of the organic EL element 20.

(Embodiment 3)
Then, the illuminating device which concerns on Embodiment 3 is demonstrated using FIG.

  FIG. 8 is a schematic perspective view showing the illumination device 30 according to the present embodiment.

  The illuminating device 30 shown in FIG. 8 includes the organic EL element 10 or 20 described above. For example, the lighting device 30 includes a light emitting unit 31 composed of a plurality of organic EL elements 10, a hanging tool 32 for installing the light emitting unit 31 on the ceiling, and a power cord 33 that connects the light emitting unit 31 and the hanging tool 32. Prepare.

  For example, the light emitting unit 31 is configured by arranging a plurality of organic EL elements 10 so as to be adjacent to each other. Further, the end of the light emitting unit 31 is covered and protected by the lamp case 34. The hanger 32 has a remote control light receiving unit 35 for receiving a remote control signal transmitted from a remote control (not shown) on its surface.

  As described above, the lighting device 30 according to the present embodiment includes, for example, the organic EL element 10 or 20 according to the first or second embodiment. For this reason, the illuminating device 30 which concerns on this Embodiment has an effect similar to Embodiment 1 or 2. FIG. That is, short-circuit defects can be suppressed by a simple method.

  Note that the lighting device 30 is not limited to a configuration that is suspended from the ceiling, and the same effect can be obtained even when the illumination device 30 is configured to be installed on a wall.

(Modification)
Below, the modification of the organic EL element 10 which concerns on Embodiment 1 is demonstrated using FIG. 9A-FIG. 9C. 9A to 9C are schematic cross-sectional views showing the periphery of a foreign substance of the organic EL element according to this modification.

  For example, like the organic EL element 10a shown in FIG. 9A, the second electrode 123 may have a thin film portion 124a instead of the hole portion 124. For example, the hole 124 may not be formed in the second electrode 123 depending on the size of foreign matter mixed in the organic layer 122. When the foreign material 150a mixed in the organic layer 122 does not penetrate the organic layer 122, the thin film portion 124a is formed without forming the hole portion 124 above the foreign material 150a.

  The thin film portion 124a is a part of the second electrode 123 and is a part having a smaller film thickness than the others. As shown in FIG. 9A, the thin film portion 124a may be formed due to the foreign matter 150a, or may be formed due to a defect during film formation.

  In this case, the filler 140 before curing permeates the organic layer 122 through the thin film portion 124a. As a result, an inactive portion 125 a is formed in the organic layer 122. Since the thin film portion 124a is thinner than other portions of the second electrode 123, the filler 140 is more easily penetrated than the other portions. Therefore, an inactive portion 125a is formed around the foreign material 150 below the thin film portion 124a.

  Further, when the foreign matter 150b is mixed before the formation of the first electrode 121, the foreign matter 150b penetrates not only the organic layer 122 but also the first electrode 121 as in the organic EL element 10b shown in FIG. 9B. Moreover, the foreign material 150b is larger than the foreign material 150a which concerns on Embodiment 1, for example, and penetrates the 2nd electrode 123. FIG. That is, the foreign material 150 b forms the hole 124 b in the second electrode 123.

  In this case, as in the first embodiment, the filler 140 before curing permeates the organic layer 122 through the hole 124b, so that the inactive portion 125b is formed in the organic layer 122. Since the inactive portion 125b is formed around the foreign material 150b, a short circuit failure can be suppressed.

  Moreover, the case where the hole part 124c is formed also in the part into which a foreign material is not mixed like the organic EL element 10c shown to FIG. 9C can be considered. For example, as described above, the filler 140 may include an inorganic filler. In this case, when the substrate 100 and the counter substrate 110 are bonded to each other, the second electrode 123 may be physically pressed by the inorganic filler and damaged, and the hole 124c may be formed.

  Also in this case, since the inactive part 125c is formed through the hole 124c, a short circuit failure can be suppressed.

(Other)
As mentioned above, although the organic EL element which concerns on this invention, the illuminating device, and the manufacturing method of the organic EL element were demonstrated based on the said embodiment and its modification, this invention is limited to said embodiment. is not.

  For example, in the above embodiment, the filler 140 is applied so as to be in contact with the second electrode 123, but the present invention is not limited to this. For example, after forming a moisture-proof film such as a nitride film on the second electrode 123, the filler 140 may be applied on the moisture-proof film. Thereby, the reliability of sealing can be improved and the lifetime of an organic EL element can be made longer.

  Further, for example, in the above embodiment, as shown in FIG. 1, the filler 140 is provided so as to fill the space surrounded by the substrate 100, the counter substrate 110, and the sealing material 130. ing. That is, since the end surface of the organic EL unit 120 is covered with the filler 140, an inactive portion 125 is also formed at the end of the organic EL unit 120 as shown in FIG.

  On the other hand, for example, the end of the organic EL unit 120 may be covered with the second electrode 123 or other inorganic film. Thereby, it can suppress that the filler 140 and the organic layer 122 react with the edge part of the organic EL part 120, and can suppress that the inactive part 125 is formed. Therefore, it is possible to suppress a decrease in the light emitting region.

  In addition, what is necessary is just to change the patterning shape of the 2nd electrode 123, for example, when coat | covering the edge part of the organic EL part 120 with the 2nd electrode 123. FIG. Therefore, the increase in the number of process steps can be suppressed, and the organic EL element 10 can be manufactured by a simple process.

  For example, in the above-described embodiment, the example in which the sealing material 130 and the filler 140 are applied to the substrate 100 has been described, but the present invention is not limited thereto. For example, the sealing material 130 and the filler 140 may be applied to the counter substrate 110. That is, in the step of applying the filler 140 on the second electrode 123, the filler 140 may be applied indirectly on the second electrode 123 instead of directly on the second electrode 123. .

  Specifically, first, the sealing material 130 is applied along the outer periphery of the counter substrate 110, and then the filler 140 is applied in a region surrounded by the sealing material 130. Thereafter, the substrate 100 and the counter substrate 110 may be bonded so that the substrate 100 provided with the organic EL unit 120 is immersed in the filler 140 of the counter substrate 110.

  In this case, the penetration of the filler 140 into the organic layer 122 starts from the timing of bonding. Therefore, since it is not necessary to take into account the time required for bonding in the standby period for forming the inactive portion 125, the control of the standby period (that is, the timing of curing of the filler 140) can be easily controlled. Can do.

  Further, for example, in the above-described embodiment and modification, the example in which the hole 124 or the thin film portion 124a is formed by the foreign material 150 has been described, but the present invention is not limited thereto. For example, the hole 124 or the thin film portion 124a may be positively formed.

  For example, in the step of stacking the second electrode 123 above the foreign material 150 (S110), the swelling reaction may be further promoted by adjusting the film thickness of the second electrode 123 or the deposition direction. . For example, the second electrode 123 may be formed thin.

  Further, when the location of the foreign material 150 is specified, the hole 124 may be formed after the second electrode 123 is formed. For example, a part of the second electrode 123 above the foreign material 150 is removed by ion beam sputtering or the like. Specifically, the monoatomic ion beam is accelerated at 0.5 keV or more, and is irradiated to the portion of the second electrode 123 above the foreign material 150. At this time, an inert gas such as argon gas (Ar) or xenon gas (Xe) can be used as the ion beam gas. Note that GCIB (Gas Cluster Ion Beam) having higher sputtering ability may be used.

  Further, for example, in the above embodiment, an example in which the first electrode 121 is an anode and the second electrode 123 is a cathode is shown, but the reverse may be possible. That is, the first electrode 121 may be a cathode and the second electrode 123 may be an anode.

  In addition, the planar view shape of the organic EL element which concerns on each said embodiment and modification is a rectangle, for example. Specifically, the planar view shapes of the substrate 100 and the counter substrate 110 are rectangular. Alternatively, the planar view shape of the organic EL element may be a closed shape drawn by a straight line or a curve, such as a polygon, a circle, or an ellipse.

  Further, for example, in the above embodiment, the organic EL element 10 may not include the counter substrate 110 and the sealing material 130.

  In addition, the embodiment can be realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or a form obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. Forms are also included in the present invention.

10, 10a, 10b, 10c, 20 Organic EL element 30 Lighting device 100 Substrate 121 First electrode 122 Organic layer 123 Second electrode 124, 124b, 124c Hole 125, 125a, 125b, 125c Inactive part 140, 240 Filler 150, 150a, 150b Foreign matter 241 First layer 242 Second layer

Claims (12)

A substrate having translucency;
A first electrode having translucency and a second electrode, which are sequentially stacked on the substrate;
An organic layer including a light emitting layer provided between the first electrode and the second electrode;
A filler for sealing the first electrode, the second electrode, and the organic layer;
The organic layer is
An organic EL element having an inactive portion that is inactivated by reacting with the filler that has permeated through the second electrode. The second electrode has a hole penetrating in the stacking direction,
The organic EL element according to claim 1, wherein the inactive part is inactivated by a reaction between the filler that has permeated through the hole and a part of the organic layer. The organic EL element according to claim 2, wherein the hole portion and the inactive portion overlap in a plan view. The organic EL element according to claim 1, wherein the organic EL element further has a foreign substance in the vicinity of the inactive portion. The organic EL element according to claim 4, wherein the foreign matter penetrates the organic layer in a stacking direction. The organic EL device according to claim 1, wherein the filler includes a low molecular material that promotes a reaction with the organic layer. The filler is
A first layer in contact with the second electrode;
A second layer provided on the opposite side of the first layer from the second electrode,
The organic EL element according to claim 6, wherein the concentration of the low molecular material in the first layer is higher than the concentration of the low molecular material in the second layer.   An illuminating device provided with the organic EL element of any one of Claims 1-7. A step of laminating a first electrode having a light transmitting property, an organic layer having a light emitting layer, and a second electrode in this order on a substrate having a light transmitting property;
Applying a filler for sealing the organic layer on the second electrode;
Forming an inactive part in the organic layer by allowing the filler to penetrate the organic layer through the second electrode;
And a step of curing the filler after forming the inactive portion. In the applying step,
Applying a first material including a low molecular weight material that promotes reaction with the organic layer on the second electrode;
The manufacturing method of the organic EL element of Claim 9. The process of apply | coating the 2nd material with the density | concentration of the said low molecular material smaller than the said 1st material on the said 1st material. The method for manufacturing an organic EL element according to claim 9 or 10, wherein, in the step of stacking, the second electrode is formed above a foreign substance located in the organic layer. The method of manufacturing an organic EL element according to claim 11, wherein the foreign matter penetrates the organic layer in a stacking direction.

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