CN101001509A - Humidity electronic device and its packaging cover, device substrate - Google Patents
Humidity electronic device and its packaging cover, device substrate Download PDFInfo
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- CN101001509A CN101001509A CN 200610156069 CN200610156069A CN101001509A CN 101001509 A CN101001509 A CN 101001509A CN 200610156069 CN200610156069 CN 200610156069 CN 200610156069 A CN200610156069 A CN 200610156069A CN 101001509 A CN101001509 A CN 101001509A
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- electronic device
- humidity
- sensitive electronic
- cover plate
- drier
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Abstract
This invention discloses a humidity electronic device, its package cover plate and a base plate, in which, the edge of its package cover plate is set with a circle of groove for filling dryers or its base plate edge is set with a circle of groove in a continuous closed state or discontinuous state for filling dryers. At least a circle of grooves for filling dryers is set between outside of the electronic device and inside of the package glue, and this dryer can adsorb moisture infiltrated from the glue effectively so as to prolong the life time of devices, besides, the dryer is set in the groove suitable for localizing it and preventing contact with the device, further more, the adhereness of a dried liquid dryer is better than that of a solid drying plate.
Description
Technical field
The present invention relates to a kind of electronic device and encapsulation cover plate thereof, device substrate, relate in particular to a kind of humidity-sensitive electronic device and encapsulation cover plate thereof, device substrate.
Background technology
Humidity-sensitive electronic device, for example organic elctroluminescent device (OLED), CCD transducer (CCD), microelectromechanicsensors sensors (MEMS), its organic layer and electrode or device itself can be because the infiltration of moisture, make that the injection of electronics is hindered, thereby form non-luminous dim spot or produce the electrode corrosion phenomenon.Therefore, humidity-sensitive electronic device and air is isolated Sealing Technology is for improving the device luminescent lifetime and playing crucial effects useful life.
Present Sealing Technology mostly adopts the method that covers an encapsulation cover plate on device substrate, both utilize the packaging plastic seal bond, before bonding paster type drying sheet is attached to or is coated in the middle part of the encapsulation cover plate, so really, can absorb the moisture of encapsulated space inside, if but moisture enters encapsulated space through packaging plastic, in moisture is dried the process of agent absorption, moisture will absorb through the agent that just can be dried of stretch footpath, device on this section path may be influenced device lifetime by moisture damage.
Given this, a kind of drier area being increased to and the big or small approaching drying means of device area arranged, though this method can extend to drier near the packaging plastic, overcome above-mentioned moisture and infiltrated the defective that the agent that but can not in time be dried absorbs, but because the drier area is too big, peel off from cap easily,, it is caused damage with device contacts.
Other has a kind of method, be on the basis of existing subsides drying sheet, form the drier of two circle projectioies along device periphery, be used for a packaging plastic between this two circles drier, but the defective of the method is, when fitting, two substrates spreads to both sides owing to the packaging plastic pressurized, cause drier pressurized easy deformation or with glass substrate applicating property variation, and, the contraposition of the space point packaging plastic of two circles between the drier and some amount how much be to be difficult to control, in addition because the existence of protruding drier has increased the distance between substrate and encapsulation cover plate, water oxygen is easier to be penetrated in the device from this gap, and outside drier is directly exposed in the air owing to be in the packaging plastic outside, will soon be in saturation condition, can't play dry effect at all, also just lose the meaning that drier is set herein.
Summary of the invention
The object of the present invention is to provide a kind of can before moisture arrives device, just can being adsorbed, thereby prolong device lifetime, and drier is easy to location, not caducous humidity-sensitive electronic device and encapsulation cover plate thereof, device substrate.
The objective of the invention is to be achieved by the following technical programs: it is characterized in that the present invention's humidity-sensitive electronic device encapsulation cover plate edge is provided with the groove that at least one circle is used to hold drier.
Described groove is positioned at the humidity-sensitive electronic device periphery.
Described groove is positioned at the packaging plastic inboard.
Described drier can be liquid drier or paste drier, is preferably liquid drier.
Described humidity-sensitive electronic device can be organic electroluminescence device, microelectromechanicsensors sensors or CCD transducer.
The present invention also comprises following technical scheme: it is characterized in that the present invention's humidity-sensitive electronic device device substrate edge is provided with the groove that at least one circle is used to hold drier, described groove is continuous closed or discontinuous shape.
Described groove is positioned at the humidity-sensitive electronic device periphery.
Described groove is positioned at encapsulation cover plate coating packaging plastic inboard.
Described drier can be liquid drier or paste drier, is preferably liquid drier.
Described humidity-sensitive electronic device can be organic electroluminescence device, microelectromechanicsensors sensors or CCD transducer.
The present invention also comprises following technical scheme: it is characterized in that the present invention's humidity-sensitive electronic device comprises aforesaid encapsulation cover plate and/or aforesaid humidity-sensitive electronic device device substrate.
The present invention's encapsulation cover plate and device substrate, in its humidity-sensitive electronic device body periphery, edge, be provided with the groove that at least one circle is used to hold drier between the packaging plastic inboard, the moisture that infiltrates from packaging plastic can be effectively adsorbed in this drier setting, just can be adsorbed at once at it, prolong the useful life of device once entering encapsulated space; In addition, drier is located in the groove, is convenient to the drier location, prevents and device contacts, avoids scratching device; And the curing of the liquid drier in preferred version back is stronger than the applicating property of solid drying sheet with the applicating property of encapsulation cover plate, can not peel off from encapsulation cover plate or device substrate easily.
Description of drawings
Fig. 1 is encapsulation cover plate (the scribbling packaging plastic) front view of the embodiment of the invention 1;
Fig. 2 is encapsulation cover plate (scribbling packaging plastic) the A-A direction cutaway view of the embodiment of the invention 1;
Fig. 3 is a sectional view after the two substrates of the embodiment of the invention 1 is fitted;
Fig. 4 is the encapsulation cover plate sectional view of the embodiment of the invention 2;
Fig. 5 is the device substrate structural representation of the embodiment of the invention 3;
Fig. 6 is the encapsulation cover plate structural representation of Comparative Examples 1;
Fig. 7 is three embodiment of the present invention and common packaging performance comparison figure.
Embodiment
The present invention's humidity-sensitive electronic device be meant in manufacture process or make after be subject to the device of water oxygen attack, as extraneous humidity level during greater than 1000ppm, device performance takes place to measure the electronic device of reduction.
The present invention's encapsulation cover plate 1 and device substrate 2 all can adopt glass or plastics, packaging plastic 3 can adopt ultraviolet curing resin, and liquid desiccant 4 for example is made up of the blowing agent that a liquid sclerosis glue, a plurality of desiccant particle and that is scattered in the liquid sclerosis glue are scattered in the liquid sclerosis glue; The paste drier can adopt by with organic or inorganic adhesive and organic solvent etc. alkali metal oxide (calcium oxide, silver oxide etc.), alkaline-earth metals oxide, porous inorganic material (zeolite etc.) etc. being had the powder of catching the water material of wettability power or piece and carry out livering and form.
The present invention will be further described below in conjunction with drawings and Examples, is example with the display of organic electroluminescence.
Embodiment 1
With reference to Fig. 1,2,3.The organic elctroluminescent device device architecture of present embodiment is: substrate (glass)/anode (ITO)/hole transmission layer (NPB)/luminescent layer (A1q
3)/metallic cathode (Al).
Encapsulation cover plate 1 edge is provided with the groove 5 that a circle is used to hold liquid desiccant 4, this groove 5 is between 6 peripheries, organic elctroluminescent device luminous zone and encapsulation cover plate 1 coating packaging plastic 3 inboards, drier is a liquid drier 4, and it is made up of the blowing agent that a liquid sclerosis glue, a plurality of desiccant particle and that is scattered in the liquid sclerosis glue are scattered in the liquid sclerosis glue.
Present embodiment organic elctroluminescent device manufacturing process is:
1. the making of device substrate 2
The substrate 2 that will have ITO (150nm) and chromium (160nm) cleans, and cleans and ultrasonic waves for cleaning through UV; Carry out the ultraviolet irradiation exposure then, develop; Carry out etching then, the processing of removing photoresist after the etching is cleaned with pure water at last, then oven dry; The substrate for preparing figure is delivered to the evaporation workshop.Substrate 2 is put on the hoder in the layering basketry in the substrate chamber, begun to be evacuated to 1 * 10 after chamber is closed
-3Pa passes to the preliminary treatment chamber afterwards, through ozone treatment, removes on-chip impurity, imports the A chamber into and carries out evaporation hole transmission layer NPB, and evaporation speed is 0.5nm/s, and this tunic is thick to be 50nm, afterwards evaporation luminescent material 8-hydroxyquinoline aluminum Alq
3, evaporation speed is 0.5nm/s, thickness is 50nm; Evaporation negative electrode Al, thickness 15nm.So device substrate 2 completes, and waits to be packaged.
2. the processing of encapsulation cover plate 1
Etch a circle rectangular recess 5 on glass packaging cover plate 1, groove 5 degree of depth are 0.3mm, and width is 0.5mm; Etch a rectangular recess 5-1 at encapsulation cover plate 1 middle part, be used for pasting and put paster type drying sheet 7, the groove 5-1 degree of depth is 0.5mm, greater than luminous zone 6 areas; Adopt liquid quantitative distributor (dispenser) that liquid desiccant 4 is injected in the groove 5; Temperature with 200 ℃ under the vacuum environment of 10Pa was toasted 30 minutes, and liquid desiccant 4 is solidified; The encapsulation cover plate 1 that liquid desiccant 4 is had cured is delivered to from vacuum environment on the point gum machine in the extremely low nitrogen environment of water oxygen content, carries out the some glue process of ultraviolet curing glue; The encapsulation cover plate 1 that afterwards liquid desiccant 4 is had cured and put packaging plastic 3 is transported to and contains in the extremely low nitrogen chamber of oxygen, moisture, sticks paster type drying sheet 7.
3. encapsulation
Encapsulation cover plate 1 is fixed on the hoder that periphery is provided with fixing hole, import package cavity into, be provided with reference column in the package cavity, reference column is inserted in the location hole on the hoder, simultaneously, be equipped with on the hoder of device substrate 2 and also be provided with location hole, it is inserted on the reference column, realize the location of device substrate 2 and encapsulation cover plate 1, when treating two applyings, also be provided with mask plate on the device substrate 2, luminous zone 6 in correspondence is provided with the barrier layer, prevent that ultraviolet light from damaging the luminous zone, shine UV light afterwards, carry out packaging plastic 3 and solidify.
With reference to Fig. 4.The organic elctroluminescent device device architecture of present embodiment is: substrate (glass)/anode (ITO)/hole transmission layer (NPB)/luminescent layer (A1q
3)/metallic cathode (Al).
Encapsulation cover plate 1a edge is provided with groove 5a, the 5b that two circles are used to hold drier, and this groove 5a, 5b are between 6 peripheries, organic elctroluminescent device luminous zone and encapsulation cover plate 1 coating packaging plastic 3 inboards.
Device fabrication processes is similar to Example 1, does not repeat them here.
With reference to Fig. 5.The organic elctroluminescent device device architecture of present embodiment is: substrate (glass)/anode (ITO)/hole transmission layer (NPB)/luminescent layer (A1q
3)/metallic cathode (Al).
Present embodiment device substrate 2 is after having made each layer pattern, and is similar to Example 1, etches degree of depth 0.3mm on three limits, and the groove 5c of width 0.5mm is injected into liquid desiccant 4 among the groove 5c with liquid quantitative distributor (dispenser); Temperature with 200 ℃ under the vacuum environment of 10Pa was toasted 30 minutes, carried out pressurizing attaching with the encapsulation cover plate 1 that posts paster type drying sheet 7 in package cavity after liquid desiccant 4 is solidified.
Comparative Examples 1
With reference to Fig. 6.The organic elctroluminescent device device architecture of this Comparative Examples is: substrate (glass)/anode (ITO)/hole transmission layer (NPB)/luminescent layer (A1q
3)/metallic cathode (Al).
This Comparative Examples is common packaging, etches a rectangular recess 5-1 at encapsulation cover plate 1a middle part, is used for pasting and puts paster type drying sheet 7, and the groove 5-1 degree of depth is 0.5mm, greater than luminous zone 6 areas; Device substrate 2 is not provided with the drier groove yet.
As seen from Figure 7, be provided with the embodiment 2 of two circle grooves, its device performance is better than being provided with the embodiment 1 of a circle groove, and the device performance of embodiment 1 is better than being provided with the embodiment 3 of 3/4 circle groove on device substrate, the device performance of embodiment 3 is better than common encapsulation, and the device of the Comparative Examples 1 of drier groove promptly is not set.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; anyly be familiar with this technology personage; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations; therefore, protection scope of the present invention is as the criterion when the claim with application defines.
Claims (11)
1. a humidity-sensitive electronic device encapsulation cover plate is characterized in that, the encapsulation cover plate edge is provided with the groove that at least one circle is used to hold drier, and described groove is continuous closed or discontinuous shape.
2. humidity-sensitive electronic device encapsulation cover plate according to claim 1 is characterized in that, described groove is positioned at corresponding humidity-sensitive electronic device periphery.
3. humidity-sensitive electronic device encapsulation cover plate according to claim 2 is characterized in that described groove is positioned at the packaging plastic inboard.
4. humidity-sensitive electronic device encapsulation cover plate according to claim 1 is characterized in that, described drier is liquid drier or paste drier.
5. each describedly has a humidity-sensitive electronic device encapsulation cover plate according to claim 1～4, it is characterized in that described humidity-sensitive electronic device is organic electroluminescence device, microelectromechanicsensors sensors or CCD transducer.
6. a humidity-sensitive electronic device device substrate is characterized in that, substrate edges is provided with the groove that at least one circle is used to hold drier, and described groove is continuous closed or discontinuous shape.
7. humidity-sensitive electronic device substrate according to claim 6 is characterized in that described groove is positioned at the humidity-sensitive electronic device periphery.
8. humidity-sensitive electronic device substrate according to claim 7 is characterized in that, described groove is positioned at corresponding to encapsulation cover plate coating packaging plastic inboard.
9. humidity-sensitive electronic device substrate according to claim 6 is characterized in that, described drier is liquid drier or paste drier.
10. according to each described humidity-sensitive electronic device substrate of claim 6～9, it is characterized in that described humidity-sensitive electronic device is organic electroluminescence device, microelectromechanicsensors sensors or CCD transducer.
11. a humidity-sensitive electronic device is characterized in that, comprises encapsulation cover plate as claimed in claim 1 and/or right 6 described humidity-sensitive electronic device device substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610156069 CN101001509A (en) | 2006-12-29 | 2006-12-29 | Humidity electronic device and its packaging cover, device substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610156069 CN101001509A (en) | 2006-12-29 | 2006-12-29 | Humidity electronic device and its packaging cover, device substrate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101386338A Division CN101592502A (en) | 2006-12-29 | 2006-12-29 | A kind of humidity-sensitive electronic device and encapsulation cover plate thereof, device substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101001509A true CN101001509A (en) | 2007-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610156069 Pending CN101001509A (en) | 2006-12-29 | 2006-12-29 | Humidity electronic device and its packaging cover, device substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106384788A (en) * | 2016-10-21 | 2017-02-08 | 纳晶科技股份有限公司 | Electroluminescent device and liquid desiccant for electroluminescence device |
| CN109343227A (en) * | 2018-11-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | A kind of light projection mould group and optical device |
| CN110540172A (en) * | 2019-09-03 | 2019-12-06 | 西安增材制造国家研究院有限公司 | bonding method of MEMS wafer in MEMS packaging process |
| CN113525933A (en) * | 2021-08-25 | 2021-10-22 | 京东方科技集团股份有限公司 | Packing case of display panel |
-
2006
- 2006-12-29 CN CN 200610156069 patent/CN101001509A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106384788A (en) * | 2016-10-21 | 2017-02-08 | 纳晶科技股份有限公司 | Electroluminescent device and liquid desiccant for electroluminescence device |
| CN109343227A (en) * | 2018-11-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | A kind of light projection mould group and optical device |
| CN110540172A (en) * | 2019-09-03 | 2019-12-06 | 西安增材制造国家研究院有限公司 | bonding method of MEMS wafer in MEMS packaging process |
| CN113525933A (en) * | 2021-08-25 | 2021-10-22 | 京东方科技集团股份有限公司 | Packing case of display panel |
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